TWI555051B - Backlight module, and lighting keyboard - Google Patents
Backlight module, and lighting keyboard Download PDFInfo
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- TWI555051B TWI555051B TW104122810A TW104122810A TWI555051B TW I555051 B TWI555051 B TW I555051B TW 104122810 A TW104122810 A TW 104122810A TW 104122810 A TW104122810 A TW 104122810A TW I555051 B TWI555051 B TW I555051B
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Description
本發明是有關於一種發光模組及發光鍵盤,尤其是有關於一種可降低發光時產生的光暈現象的發光模組及發光鍵盤。 The invention relates to a light-emitting module and an illuminated keyboard, in particular to a light-emitting module and an illuminated keyboard capable of reducing the halo phenomenon generated during illumination.
請參閱圖1,其繪示一種習知之發光鍵盤之分解圖。如圖1所示,目前發光鍵盤1的組成,由上而下可能包含按鍵組20及發光模組30等構件,其中按鍵組20具有多個由透光材料製成的透光鍵帽22及一遮光板24。一般而言,發光模組30可具有多個發光元件32,而作為發光鍵盤光源的發光元件32通常會選擇發光二極體(LED,Light-Emitting Diode)。發光模組30的導光板33可收集發光元件32所發出的光線,然後藉由導光板33的傳導和散射後向按鍵組20發出光線。另外,遮光板24係設於導光板33的上方,且在對應各個透光鍵帽22處設置透光孔26,導光板33內部傳導的光線能夠經由各透光孔26射向所對應的透光鍵帽22,而使透光鍵帽22的識別符號能夠發光。 Please refer to FIG. 1 , which illustrates an exploded view of a conventional illuminated keyboard. As shown in FIG. 1 , the composition of the light-emitting keyboard 1 may include a button group 20 and a light-emitting module 30 from top to bottom, wherein the button group 20 has a plurality of light-transmitting keycaps 22 made of a light-transmitting material and A visor 24 is provided. In general, the light-emitting module 30 can have a plurality of light-emitting elements 32, and the light-emitting elements 32, which are light source of the light-emitting keyboard, generally select a light-emitting diode (LED). The light guide plate 33 of the light-emitting module 30 collects the light emitted by the light-emitting element 32, and then emits light to the button group 20 after being guided and scattered by the light guide plate 33. In addition, the light shielding plate 24 is disposed above the light guide plate 33, and a light transmission hole 26 is disposed corresponding to each of the light transmission key caps 22, and light guided inside the light guide plate 33 can be transmitted through the respective light transmission holes 26 to the corresponding transparent The light key cap 22 allows the identification symbol of the light-transmitting keycap 22 to emit light.
請參閱圖2a及圖2b,圖2a係繪示圖1之發光鍵盤的發光模組之上視圖。圖2b係繪示依照圖2a之發光模組沿剖面線2-2’的剖視圖。如圖2a及圖2b所示,習知的發 光模組30由下而上包含電路板31、發光元件32、膠體35、反射層34及導光板33。習知的發光模組30的發光元件32固定在電路板31上的實際位置往往與原先設計預定的位置會有一定程度的偏移誤差,使得導光板33的容置孔33a與反射層34的破孔34a需要預留足夠的穿設空間,因此位置偏移的發光元件32都能順利穿設進入。如此,導光板33的容置孔33a與對應的發光元件32間就會存在間隙,因為間隙的存在,使得發光元件32的出光面32a發出的光線會部分地在空氣中散射並傳導到非屬導光板33的入光面33b的部位,而發生例如散射等光能損耗情況,使得導光板33實際接收到發光元件32的光線強度非如實際發光元件32發出的光線強度,而進一步還會影響發光鍵盤1的整體發光效果。 Please refer to FIG. 2a and FIG. 2b. FIG. 2a is a top view of the lighting module of the illuminated keyboard of FIG. 1. Figure 2b is a cross-sectional view of the lighting module of Figure 2a taken along section line 2-2'. As shown in Figure 2a and Figure 2b, the conventional hair The optical module 30 includes a circuit board 31, a light-emitting element 32, a colloid 35, a reflective layer 34, and a light guide plate 33 from bottom to top. The actual position of the light-emitting element 32 of the conventional light-emitting module 30 fixed on the circuit board 31 tends to have a certain degree of offset error from the original design predetermined position, so that the receiving hole 33a of the light guide plate 33 and the reflective layer 34 are The hole 34a needs to have enough space for the installation, so that the position-shifted light-emitting element 32 can be smoothly penetrated. Thus, there is a gap between the accommodating hole 33a of the light guide plate 33 and the corresponding illuminating element 32. Because of the gap, the light emitted from the light emitting surface 32a of the illuminating element 32 is partially scattered in the air and transmitted to the non-genuine. At the portion of the light incident surface 33b of the light guide plate 33, light energy loss such as scattering occurs, so that the light intensity of the light guide plate 33 actually received by the light-emitting element 32 is not as strong as that of the actual light-emitting element 32, and further affects The overall illumination effect of the illuminated keyboard 1.
是故,如何解決導光板4與發光元件2之間的間隙而造成光能損耗的問題,以提升發光鍵盤整體的發光效果,係為現在業界需挑戰克服的技術議題。 Therefore, how to solve the problem of light energy loss caused by the gap between the light guide plate 4 and the light-emitting element 2 to improve the overall light-emitting effect of the light-emitting keyboard is a technical issue that the industry needs to overcome.
本發明提供了一種發光模組及一種發光鍵盤,以降低發光時產生的光暈現象以及出光能量耗損的問題。 The invention provides a light-emitting module and an illuminated keyboard, so as to reduce the halo phenomenon generated during illumination and the problem of light-emitting energy consumption.
本發明之一實施例中提供一種發光模組包含電路板、發光單元、透光膠層、導光板以及反射層。發光單元設置於電路板上,發光單元具有出光面用以發出一光線。透光膠層具有第一膠合部及第二膠合部,其中第一膠合部具有相對的第一面及第二面,第二膠合部具有相對的第三面及第四面,第一膠合部的第一面設置於電路板上,且第二膠合部的第三面黏合於發光單元的出光面。導光板具有入光面用以接收經由第二膠合部傳遞的光線。入光面面對發光單元的出光面,且導光板的入光面黏合於第二膠合部的第四面。反射 層設置於導光板下方且反射層的底面黏合於第一膠合部的第二面。 An embodiment of the present invention provides a light emitting module including a circuit board, a light emitting unit, a light transmitting adhesive layer, a light guiding plate, and a reflective layer. The light emitting unit is disposed on the circuit board, and the light emitting unit has a light emitting surface for emitting a light. The light-transmitting adhesive layer has a first bonding portion and a second bonding portion, wherein the first bonding portion has opposite first and second faces, and the second bonding portion has opposite third and fourth faces, the first bonding portion The first surface of the second bonding portion is adhered to the light emitting surface of the light emitting unit. The light guide plate has a light incident surface for receiving light transmitted through the second bonding portion. The light incident surface faces the light emitting surface of the light emitting unit, and the light incident surface of the light guide plate is adhered to the fourth surface of the second bonding portion. reflection The layer is disposed under the light guide plate and the bottom surface of the reflective layer is bonded to the second surface of the first bonding portion.
本發明之另一實施例中提供一種發光鍵盤包括發光模組以及按鍵組。發光模組包括電路板、發光單元、透光膠層、導光板以及反射層。發光單元,設置於電路板上,發光單元具有出光面用以發出光線。透光膠層具有彼此相連的第一膠合部及第二膠合部,其中第一膠合部具有相對的第一面及第二面,第二膠合部具有相對的第三面及第四面,第一膠合部的第一面設置於電路板上,第二膠合部的第三面黏合於發光單元的出光面。導光板具有入光面,用以接收經由第二膠合部傳遞的光線,入光面面對發光單元的出光面,且導光板的入光面黏合於第二膠合部的第四面。反射層設置於導光板下方,且反射層的底面黏合於第一膠合部的第二面。按鍵組設置於發光模組上,按鍵組具有數個鍵帽,每一鍵帽具有透光部,其中光線經由導光板傳遞而自透光部出光。 In another embodiment of the present invention, an illuminated keyboard includes a light emitting module and a button set. The light emitting module comprises a circuit board, a light emitting unit, a light transmissive glue layer, a light guide plate and a reflective layer. The light emitting unit is disposed on the circuit board, and the light emitting unit has a light emitting surface for emitting light. The light-transmitting adhesive layer has a first bonding portion and a second bonding portion, wherein the first bonding portion has opposite first and second faces, and the second bonding portion has opposite third and fourth faces, The first surface of the bonding portion is disposed on the circuit board, and the third surface of the second bonding portion is adhered to the light emitting surface of the light emitting unit. The light guide plate has a light incident surface for receiving light transmitted through the second bonding portion, the light incident surface faces the light emitting surface of the light emitting unit, and the light incident surface of the light guide plate is adhered to the fourth surface of the second bonding portion. The reflective layer is disposed under the light guide plate, and the bottom surface of the reflective layer is bonded to the second surface of the first bonding portion. The button group is disposed on the light-emitting module, the button group has a plurality of key caps, and each of the key caps has a light-transmitting portion, wherein the light is transmitted through the light guide plate to emit light from the light-transmitting portion.
本發明之再一實施例中提供一種發光模組包含電路板、發光單元、第二膠合部、導光板以及反射層。電路板具有電路板上表面。發光單元設置於電路板上,發光單元具有出光面,出光面發出光線,出光面與電路板上表面具有第一夾角。第二膠合部具有第三面及第四面,第二膠合部的第三面黏合於發光單元的出光面。導光板設置於電路板上方,導光板具有入光面,入光面面向出光面,入光面黏合於第二膠合部的第四面,光線自第三面進入第二膠合部內部傳遞,由第四面射出而進入入光面。反射層設置於導光板與電路板之間。反射層具有頂面、破孔與底面。發光單元穿過破孔而向上突出於反射層的頂面上,反射層的底面設置於電路板上。 In still another embodiment of the present invention, a light emitting module includes a circuit board, a light emitting unit, a second bonding portion, a light guiding plate, and a reflective layer. The board has a surface on the board. The light emitting unit is disposed on the circuit board, and the light emitting unit has a light emitting surface, and the light emitting surface emits light, and the light emitting surface has a first angle with the surface of the circuit board. The second bonding portion has a third surface and a fourth surface, and the third surface of the second bonding portion is bonded to the light emitting surface of the light emitting unit. The light guide plate is disposed above the circuit board, the light guide plate has a light incident surface, the light incident surface faces the light exit surface, and the light incident surface is adhered to the fourth surface of the second glue portion, and the light passes from the third surface into the second glue joint portion, and the light is transmitted from the third surface to the second glue portion. The fourth side is emitted and enters the entrance surface. The reflective layer is disposed between the light guide plate and the circuit board. The reflective layer has a top surface, a broken hole and a bottom surface. The light emitting unit protrudes upward through the hole and protrudes from the top surface of the reflective layer, and the bottom surface of the reflective layer is disposed on the circuit board.
在本發明實施例的發光模組主要是藉由第二膠 合部連接導光板的入光面與發光單元的出光面,使得發光單元的光線可經由第二膠合部完整地傳遞至導光板內,以避免光線在空氣中散射而產生光暈現象,同時又可避免發出的光線在空氣中行進並產生散射而導致能量散失的問題,是故,本發明實施例可改善發光單元的光線的光能不能完整地傳遞至導光板的問題。因此,本發明實施例的發光模組的導光板可接收到光線強度可符合發光單元出光的光線強度,以提升發光模組整體的發光效果,並可進一步應用於發光鍵盤或其它發光產品。 The light emitting module in the embodiment of the invention mainly uses the second glue The merging portion is connected to the light incident surface of the light guide plate and the light emitting surface of the light emitting unit, so that the light of the light emitting unit can be completely transmitted into the light guide plate through the second bonding portion to prevent the light from being scattered in the air to generate a halo phenomenon, and at the same time The problem that the emitted light travels in the air and causes scattering to cause energy loss can be avoided. Therefore, the embodiment of the present invention can improve the problem that the light energy of the light of the light-emitting unit cannot be completely transmitted to the light guide plate. Therefore, the light guide plate of the light-emitting module of the embodiment of the invention can receive the light intensity of the light-emitting unit to meet the light-emitting intensity of the light-emitting unit, thereby improving the overall light-emitting effect of the light-emitting module, and can be further applied to the light-emitting keyboard or other light-emitting products.
1‧‧‧發光鍵盤 1‧‧‧ illuminated keyboard
20‧‧‧按鍵組 20‧‧‧ button group
22‧‧‧鍵帽 22‧‧‧Key Cap
24‧‧‧遮光板 24‧‧ ‧ visor
26‧‧‧透光孔 26‧‧‧Light hole
30‧‧‧發光模組 30‧‧‧Lighting module
31‧‧‧電路板 31‧‧‧ boards
32‧‧‧發光單元 32‧‧‧Lighting unit
32a‧‧‧出光面 32a‧‧‧Glossy
33‧‧‧導光板 33‧‧‧Light guide plate
33a‧‧‧容置孔 33a‧‧‧ accommodating holes
33b‧‧‧入光面 33b‧‧‧Into the glossy
34‧‧‧反射層 34‧‧‧reflective layer
136b‧‧‧底面 136b‧‧‧ bottom
140‧‧‧導光板 140‧‧‧Light guide plate
140a‧‧‧容置孔 140a‧‧‧ accommodating holes
140b‧‧‧入光面 140b‧‧‧Glossy
141a‧‧‧右群組 141a‧‧‧Right group
141b‧‧‧左群組 141b‧‧‧Left group
142‧‧‧底面 142‧‧‧ bottom
144‧‧‧頂面 144‧‧‧ top surface
150‧‧‧反射層 150‧‧‧reflective layer
150a‧‧‧破孔 150a‧‧‧ hole
152‧‧‧頂面 152‧‧‧ top surface
154‧‧‧底面 154‧‧‧ bottom
34a‧‧‧破孔 34a‧‧‧Breaking
35‧‧‧膠體 35‧‧‧ colloid
10‧‧‧發光鍵盤 10‧‧‧ illuminated keyboard
100‧‧‧發光模組 100‧‧‧Lighting module
110‧‧‧電路板 110‧‧‧Circuit board
112‧‧‧電路板上表面 112‧‧‧ Board surface
120‧‧‧發光單元 120‧‧‧Lighting unit
120a‧‧‧頂面 120a‧‧‧ top
122‧‧‧出光面 122‧‧‧Glossy surface
122a‧‧‧頂邊 122a‧‧‧ top side
130‧‧‧透光膠層 130‧‧‧Transparent adhesive layer
132‧‧‧第一膠合部 132‧‧‧First Gluing Department
134‧‧‧第二膠合部 134‧‧‧Second Glue
136‧‧‧第三膠合部 136‧‧‧ Third Gluing Department
156‧‧‧側面 156‧‧‧ side
200‧‧‧按鍵組 200‧‧‧ button group
210‧‧‧鍵帽 210‧‧‧Key Cap
220‧‧‧遮光板 220‧‧ ‧ visor
222‧‧‧透光孔 222‧‧‧Light hole
θ1‧‧‧第一夾角 Θ1‧‧‧ first angle
θ2‧‧‧第二夾角 Θ2‧‧‧second angle
I1‧‧‧距離 I1‧‧‧ distance
為讓本發明之敘述和其他目的、特徵、優點與實施例能更明顯易懂,所附圖式之說明如下:圖1係繪示一種習知之發光鍵盤之分解圖。 The description of the present invention and other objects, features, advantages and embodiments will be more apparent and understood. FIG. 1 is an exploded view of a conventional illuminated keyboard.
圖2a係繪示圖1的發光鍵盤之發光模組之上視圖。 2a is a top view of the lighting module of the illuminated keyboard of FIG. 1.
圖2b係繪示依照圖2a之發光模組沿剖面線2-2’的剖視圖。 Figure 2b is a cross-sectional view of the lighting module of Figure 2a taken along section line 2-2'.
圖3係繪示依照本發明一實施例之發光鍵盤之分解圖。 3 is an exploded view of an illuminated keyboard in accordance with an embodiment of the present invention.
圖4係繪示依照圖3之發光鍵盤的A部分之上視圖。 4 is a top view of a portion A of the illuminated keyboard in accordance with FIG.
圖5係繪示依照圖4之發光鍵盤的A部分沿剖面線5-5’的剖視圖。 Figure 5 is a cross-sectional view of portion A of the illuminated keyboard of Figure 4 taken along section line 5-5'.
圖6A~6C係繪示依照本發明再一實施例之發光鍵盤的發光模組的製造流程圖。 6A-6C are flowcharts showing the manufacture of a lighting module of an illuminated keyboard according to still another embodiment of the present invention.
圖7係繪示依照圖6B之發光鍵盤的發光模組之上視圖。 FIG. 7 is a top view of a lighting module according to the illuminated keyboard of FIG. 6B.
請參照圖3,其繪示依照本發明一實施例之發光鍵盤之分解圖。如圖3所示,本實施例的發光鍵盤10包括發光模組100以及按鍵組200,其中按鍵組200具有數個鍵帽210及一遮光板220,鍵帽210可設置在遮光板220上,其中遮光板220具有數個透光孔222,且每一鍵帽210具有透光部(圖未示),透光部可分別對應透光孔222。再者,發光模組100可朝向按鍵組200發出光線,也就是說,光線可經由發光模組100的導光板140傳遞而穿透遮光板220的透光孔222以自每一鍵帽210的透光部出光。由於每一鍵帽210可在其透光部設置對應的識別符號,藉由光線自鍵帽210的透光部出光可使得透光部上顯示對應的識別符號,而讓使用者在昏暗環境可識別按鍵組200上的每顆鍵帽210。 Please refer to FIG. 3, which is an exploded view of an illuminated keyboard in accordance with an embodiment of the present invention. As shown in FIG. 3, the illuminating keyboard 10 of the present embodiment includes a illuminating module 100 and a button set 200. The button set 200 has a plurality of key caps 210 and a visor 220. The keycap 210 can be disposed on the visor 220. The light shielding plate 220 has a plurality of light transmission holes 222, and each of the key caps 210 has a light transmitting portion (not shown), and the light transmitting portions respectively correspond to the light transmission holes 222. In addition, the light emitting module 100 can emit light toward the button group 200, that is, the light can be transmitted through the light guide plate 140 of the light emitting module 100 to penetrate the light transmission hole 222 of the light shielding plate 220 from each of the key caps 210. The light transmitting portion emits light. Since each of the keycaps 210 can be provided with a corresponding identification symbol in the light transmitting portion thereof, the light can be emitted from the light transmitting portion of the keycap 210 by the light, so that the corresponding identification symbol is displayed on the light transmitting portion, and the user can be in a dim environment. Each keycap 210 on the button set 200 is identified.
請繼續參照圖4及圖5,圖4係繪示依照圖3之發光鍵盤的A部分之上視圖。圖5係繪示依照圖4之發光鍵盤的A部分沿剖面線5-5’的剖視圖。如圖3~5所示,在本實施例中,發光模組100可包含電路板110、發光單元120、透光膠層130、導光板140以及反射層150。發光單元120設置於電路板110上,導光板140設置於反射層150上,透光膠層130位於反射層150及電路板110之間並將兩者彼此黏合,同時,透光膠層130還延伸到導光板140與發光單元120之間並將兩者彼此黏合。 4 and FIG. 5, FIG. 4 is a top view of a portion A of the illuminated keyboard according to FIG. Figure 5 is a cross-sectional view of portion A of the illuminated keyboard of Figure 4 taken along section line 5-5'. As shown in FIG. 3 to FIG. 5 , in the embodiment, the light emitting module 100 can include a circuit board 110 , a light emitting unit 120 , a light transmitting adhesive layer 130 , a light guiding plate 140 , and a reflective layer 150 . The light emitting unit 120 is disposed on the circuit board 110. The light guide plate 140 is disposed on the reflective layer 150. The light transmitting adhesive layer 130 is disposed between the reflective layer 150 and the circuit board 110 and adheres to each other. It extends between the light guide plate 140 and the light emitting unit 120 and bonds the two to each other.
詳細來說,發光單元120設置於電路板110的電路板上表面112上,發光單元120具有表面平坦的一出光面122,光線可自出光面122發出,其中出光面122與電路板上表面112具有第一夾角θ1。詳細來說,本實施例的發光單元120係為發光二極體(LED),而一般發光二極體的出光面122係為發光二極體封裝的長邊,且出光面122與發光單元120頂面120a交會處係為出光面頂邊122a,但不以此為限。另一 方面,在本實施例中,出光面122與電路板上表面112形成的第一夾角θ1可為90度,但不以此為限。 In detail, the light emitting unit 120 is disposed on the circuit board surface 112 of the circuit board 110. The light emitting unit 120 has a light emitting surface 122 having a flat surface, and the light is emitted from the light emitting surface 122. The light emitting surface 122 and the circuit board surface 112 are disposed. It has a first angle θ1. In detail, the light emitting unit 120 of the present embodiment is a light emitting diode (LED), and the light emitting surface 122 of the general light emitting diode is a long side of the light emitting diode package, and the light emitting surface 122 and the light emitting unit 120 The intersection of the top surface 120a is the top surface 122a of the light-emitting surface, but is not limited thereto. another In this embodiment, the first angle θ1 formed by the light-emitting surface 122 and the surface 112 of the circuit board may be 90 degrees, but is not limited thereto.
在本實施例中,發光單元120為複數個,且導光板140具有數個容置孔140a及反射層150具有數個破孔150a,容置孔140a與破孔150a位置彼此對應;因此當導光板140的底面142連接反射層150的頂面152時,容置孔140a與破孔150a彼此連通。如此,當反射層150的底面154設置於電路板110的電路板上表面112上時,發光單元120可穿過破孔150a而向上突出於反射層150的頂面152上,並容置於導光板140上對應的容置孔140a內。在本實施例中,彼此連通的容置孔140a與破孔150a的尺寸形狀相同,但不以此為限。同時,導光板140的容置孔140a內設有入光面140b,入光面140b分別面對其對應發光單元120的出光面122。 In this embodiment, the light-emitting unit 120 has a plurality of light-emitting units 120, and the light-guiding plate 140 has a plurality of receiving holes 140a and the reflective layer 150 has a plurality of holes 150a. The positions of the receiving holes 140a and the holes 150a correspond to each other; When the bottom surface 142 of the light plate 140 is connected to the top surface 152 of the reflective layer 150, the receiving hole 140a and the broken hole 150a communicate with each other. As such, when the bottom surface 154 of the reflective layer 150 is disposed on the circuit board surface 112 of the circuit board 110, the light emitting unit 120 can protrude upward through the broken hole 150a on the top surface 152 of the reflective layer 150 and be accommodated in the guide. The light receiving plate 140 has a corresponding receiving hole 140a. In this embodiment, the receiving holes 140a that communicate with each other have the same size and shape as the broken holes 150a, but are not limited thereto. At the same time, the light-receiving surface 140b is disposed in the accommodating hole 140a of the light guide plate 140, and the light-incident surface 140b faces the light-emitting surface 122 of the corresponding light-emitting unit 120.
在本實施例中,發光模組100的發光單元120的數目為複數個,但不以此為限,在其他實施例中,發光模組100的發光單元120的數目可僅為一個,即可據以實施本發明。 In this embodiment, the number of the light emitting units 120 of the light emitting module 100 is plural, but not limited thereto. In other embodiments, the number of the light emitting units 120 of the light emitting module 100 may be only one. The invention has been implemented.
詳細而言,請回到圖3,容置孔140a設置於導光板140的中間部位,容置孔140a係可區分成右群組141a(圖3所示其中三個容置孔140a屬於右群組)與左群組141b(圖3所示其中三個容置孔140a屬於左群組)。一般而言,屬於左群組141b的容置孔140a係位在屬於右群組141a的容置孔140a的左方。同時,位於左群組141b的容置孔140a內的發光單元120的出光面122大致地朝向左群組141b整體的左方出光,位於右群組141a的容置孔140a內的發光單元120的出光面122大致地朝向右群組141a整體的右方出光。也就是說,位於左群組141b的發光單元120的出光面122與位於右群組141a的發光單元120的出光面122彼此背對。 In detail, returning to FIG. 3, the accommodating hole 140a is disposed at an intermediate portion of the light guide plate 140, and the accommodating hole 140a is divided into a right group 141a (the three accommodating holes 140a shown in FIG. 3 belong to the right group) Group) and the left group 141b (the three housing holes 140a shown in FIG. 3 belong to the left group). In general, the accommodating hole 140a belonging to the left group 141b is located to the left of the accommodating hole 140a belonging to the right group 141a. At the same time, the light-emitting surface 122 of the light-emitting unit 120 located in the accommodating hole 140a of the left group 141b is substantially directed toward the left side of the entire left group 141b, and is located in the light-emitting unit 120 in the accommodating hole 140a of the right group 141a. The light-emitting surface 122 is substantially directed toward the right of the entire right group 141a. That is, the light-emitting surface 122 of the light-emitting unit 120 located in the left group 141b and the light-emitting surface 122 of the light-emitting unit 120 located in the right group 141a are opposite to each other.
請再次參照圖4及圖5,透光膠層130具有實質水平延伸的第一膠合部132及實質垂直延伸的第二膠合部134,其中第一膠合部132具有相對的第一面(底面)132a及第二面(頂面)132b,第二膠合部134具有相對的第三面(右側面)134a及第四面(左側面)134b。在本實施例中,第一膠合部132的第一面132a係黏合於電路板110的電路板上表面112上,第一膠合部132的第二面132b係黏合於反射層150的底面154。因此,第一膠合部132黏合反射層150及電路板110,進而可將發光單元120固定設置於導光板140的容置孔140a內。同時較佳設計係使發光單元120的頂面120a大致地切齊導光板140的頂面144,如此發光單元120發出的光線大部分可順利的進入導光板140內。 Referring to FIG. 4 and FIG. 5 again, the light transmissive adhesive layer 130 has a first glue portion 132 extending substantially horizontally and a second glue portion 134 extending substantially vertically, wherein the first glue portion 132 has an opposite first surface (bottom surface) 132a and second surface (top surface) 132b, the second bonding portion 134 has a third surface (right side surface) 134a and a fourth surface (left side surface) 134b. In this embodiment, the first surface 132a of the first bonding portion 132 is adhered to the circuit board surface 112 of the circuit board 110, and the second surface 132b of the first bonding portion 132 is adhered to the bottom surface 154 of the reflective layer 150. Therefore, the first bonding portion 132 is bonded to the reflective layer 150 and the circuit board 110, and the light emitting unit 120 can be fixedly disposed in the receiving hole 140a of the light guide plate 140. At the same time, the top surface 120a of the light-emitting unit 120 is substantially aligned with the top surface 144 of the light-emitting board 140, so that most of the light emitted by the light-emitting unit 120 can smoothly enter the light guide plate 140.
同時,第二膠合部134的第三面134a完全地黏合於發光單元120的出光面122,且第二膠合部134的第四面134b可完全地黏合於導光板140的入光面140b。在本實施例中,第一膠合部132與第二膠合部134可彼此連接,使得第二膠合部134的第四面134b可黏合於導光板140的入光面140b及反射層150的側面156,但不以此為限。在其他實施例中,反射層150及電路板110亦可藉由熱融方式固定,如此第一膠合部132可被省略,發光模組100可僅設置第二膠合部134,只要其第四面134b黏合於導光板140的入光面140b且其第三面134a黏合於發光單元120的出光面122,即可據以實施本發明,但不以此為限。 At the same time, the third surface 134a of the second bonding portion 134 is completely adhered to the light emitting surface 122 of the light emitting unit 120, and the fourth surface 134b of the second bonding portion 134 can be completely adhered to the light incident surface 140b of the light guide plate 140. In this embodiment, the first bonding portion 132 and the second bonding portion 134 can be connected to each other, so that the fourth surface 134b of the second bonding portion 134 can be adhered to the light incident surface 140b of the light guide plate 140 and the side surface 156 of the reflective layer 150. , but not limited to this. In other embodiments, the reflective layer 150 and the circuit board 110 can also be fixed by thermal fusion, such that the first bonding portion 132 can be omitted, and the light emitting module 100 can only be provided with the second bonding portion 134 as long as the fourth surface thereof 134b is bonded to the light incident surface 140b of the light guide plate 140 and the third surface 134a is adhered to the light exit surface 122 of the light emitting unit 120. The present invention can be implemented, but not limited thereto.
在本實施例中,透光膠層130可為聚醋基材雙面膠帶,但不以此為限。此外,第二膠合部134的厚度可為0.18mm~0.2mm;於一較佳實施例中,第二膠合部134的厚度可0.16mm~0.2mm,但不以此為限。另一方面,發光單元120的出光面122與導光板140的入光面140b的最短直線間距I1 可為0.18mm~0.2mm。也就是說,第二膠合部134的厚度可大致地填滿出光面122與入光面140b之間的間距,使得第二膠合部134的第三面134a及第四面134b可分別緊密地黏合於對應的出光面122及入光面140b。 In this embodiment, the transparent adhesive layer 130 can be a double-sided tape of a polyester substrate, but is not limited thereto. In addition, the thickness of the second bonding portion 134 may be 0.18 mm to 0.2 mm. In a preferred embodiment, the thickness of the second bonding portion 134 may be 0.16 mm to 0.2 mm, but not limited thereto. On the other hand, the shortest linear distance I1 between the light-emitting surface 122 of the light-emitting unit 120 and the light-incident surface 140b of the light guide plate 140 It can be 0.18mm~0.2mm. In other words, the thickness of the second bonding portion 134 can substantially fill the gap between the light emitting surface 122 and the light incident surface 140b, so that the third surface 134a and the fourth surface 134b of the second bonding portion 134 can be closely adhered respectively. The corresponding light emitting surface 122 and the light incident surface 140b.
另外,本實施例的第二膠合部134的折射率範圍較佳為大於空氣的折射率1且小於等於導光板140的折射率1.55。於一較佳實施例中,第二膠合部134的折射率的範圍為大於1.4且小於等於導光板140的折射率1.55。因此,發光單元120發出的光線可順利地進入第二膠合部134內,並於第二膠合部第四面134b和導光板140的入光面140b交界處順利地進入導光板140內,是故,發光單元120所發出光線可避免在進入導光板140前暴露於空氣中而朝數個方向發散,造成光暈現象並導致進入導光板140的光線的光能損耗。 In addition, the refractive index of the second bonding portion 134 of the present embodiment is preferably greater than the refractive index 1 of the air and less than or equal to the refractive index of the light guide plate 140 of 1.55. In a preferred embodiment, the refractive index of the second bonding portion 134 ranges from greater than 1.4 and less than or equal to the refractive index of the light guide plate 140 of 1.55. Therefore, the light emitted from the light-emitting unit 120 can smoothly enter the second bonding portion 134 and smoothly enter the light guide plate 140 at the boundary between the fourth surface 134b of the second bonding portion and the light-incident surface 140b of the light guide plate 140. The light emitted by the light emitting unit 120 can be prevented from being diverged in several directions before being exposed to the air before entering the light guide plate 140, causing a halo phenomenon and causing loss of light energy of the light entering the light guide plate 140.
在本實施例中,透光膠層130還可包含第三膠合部136,第三膠合部136連接第二膠合部134的頂部,且第三膠合部136黏合於發光單元120的頂面120a一部分。如圖4所示,覆蓋並黏合於發光單元頂面120a的第三膠合部136的X軸長度可小於發光單元120的頂面120a的X軸長度。由於第三膠合部136係自第二膠合部134向上彎折延伸而形成,當第三膠合部136黏合於部分的發光單元120的頂面120a時,可確保第二膠合部134確實向上延伸到達發光單元120的出光面122的出光面頂邊122a,亦即確保第二膠合部134的第三面134a黏合於發光單元的全部出光面122。 In this embodiment, the transparent adhesive layer 130 may further include a third bonding portion 136, the third bonding portion 136 is connected to the top of the second bonding portion 134, and the third bonding portion 136 is adhered to a portion of the top surface 120a of the light emitting unit 120. . As shown in FIG. 4, the X-axis length of the third bonding portion 136 that covers and adheres to the top surface 120a of the light emitting unit may be smaller than the X-axis length of the top surface 120a of the light emitting unit 120. Since the third bonding portion 136 is formed by bending upwardly from the second bonding portion 134, when the third bonding portion 136 is adhered to the top surface 120a of the partial light emitting unit 120, the second bonding portion 134 can be surely extended upwardly. The light-emitting surface top side 122a of the light-emitting surface 122 of the light-emitting unit 120, that is, the third surface 134a of the second bonding portion 134 is ensured to be bonded to all of the light-emitting surfaces 122 of the light-emitting unit.
另一方面,雖然第二膠合部134會吸收部分的光線的能量,但第二膠合部134可將大部分的光線經由第二膠合部134而引導入導光板140內,避免光線散逸於空氣中。經過相關實驗測量得知,設置第二膠合部134的發光模組100的導光板140內的亮度相較於沒有設置第二膠合部的發光模 組的導光板的亮度高出8%。 On the other hand, although the second bonding portion 134 absorbs the energy of a portion of the light, the second bonding portion 134 can guide most of the light into the light guide plate 140 via the second bonding portion 134 to prevent the light from being dissipated into the air. . According to the relevant experimental measurement, the brightness in the light guide plate 140 of the light-emitting module 100 in which the second bonding portion 134 is disposed is compared with the light-emitting mode in which the second bonding portion is not provided. The brightness of the light guide of the group is 8% higher.
請參照圖6A~6C,其繪示依照本發明再一實施例之發光鍵盤的發光模組100的製造流程圖。 6A-6C are flowcharts showing the manufacturing process of the light emitting module 100 of the illuminated keyboard according to still another embodiment of the present invention.
如圖6A所示,將發光單元120設置於電路板110的電路板上表面112上,其中兩發光單元120的出光面122彼此背對。 As shown in FIG. 6A, the light emitting unit 120 is disposed on the circuit board surface 112 of the circuit board 110, wherein the light emitting surfaces 122 of the two light emitting units 120 are opposite to each other.
進一步如圖6B及圖7所示,(1)先將透光膠層130下表面的離形層移除,使透光膠層130的第一膠合部132下表面黏合到電路板上表面112,(2)再施壓於透光膠層130使其變形而具有第一夾角θ1,使第二膠合部134黏合到發光單元120的出光面122上;(3)繼續施壓於透光膠層130使其變形而具有第二夾角θ2,使第三膠合部136黏合於發光單元120的至少部分頂面120a。其中第一夾角θ1與第二夾角θ2,都是透光膠層130逐段黏合過程中,配合電路板110與發光單元120的出光面122外形所形成的夾角。舉例來說,若發光單元出光面122係垂直於電路板110和頂面120a,則第一夾角θ1和第二夾角θ2可為90度,但不以此為限。另一方面,由圖7可知,第一膠合層132的內縮於電路板110內,也就是說,當第一膠合層132黏合電路板110時,電路板110部分的邊緣會露出於第一膠合層132之外,但不以此為限。 As shown in FIG. 6B and FIG. 7 , (1) the release layer of the lower surface of the transparent adhesive layer 130 is removed, and the lower surface of the first adhesive portion 132 of the transparent adhesive layer 130 is adhered to the surface of the circuit board 112. (2) applying pressure to the transparent adhesive layer 130 to deform it to have a first angle θ1, and bonding the second bonding portion 134 to the light-emitting surface 122 of the light-emitting unit 120; (3) continuing to apply pressure to the light-transmitting adhesive The layer 130 is deformed to have a second included angle θ2 to bond the third glued portion 136 to at least a portion of the top surface 120a of the light emitting unit 120. The first angle θ1 and the second angle θ2 are the angles formed by the outer shape of the light-transmitting layer 130 and the light-emitting surface 122 of the light-emitting unit 120 during the phase-by-stage bonding process. For example, if the light emitting surface 122 of the light emitting unit is perpendicular to the circuit board 110 and the top surface 120a, the first angle θ1 and the second angle θ2 may be 90 degrees, but not limited thereto. On the other hand, as can be seen from FIG. 7, the first bonding layer 132 is retracted into the circuit board 110, that is, when the first bonding layer 132 is bonded to the circuit board 110, the edge of the circuit board 110 portion is exposed to the first. The glue layer 132 is outside, but not limited to.
之後,如圖6C所示,將透光膠層130上表面的離形層移除,且把導光板140的容置孔140a對正發光單元120後,如此將反射層150的底面152黏合於第一膠合部132的第二面132b上,且導光板140的容置孔140a的入光面140b黏合於第二膠合部134的第四面134b上,而組成本實施例所述的發光模組100。 Then, as shown in FIG. 6C, the release layer of the upper surface of the transparent adhesive layer 130 is removed, and after the receiving hole 140a of the light guide plate 140 is aligned with the positive light emitting unit 120, the bottom surface 152 of the reflective layer 150 is adhered thereto. The second surface 132b of the first bonding portion 132 and the light incident surface 140b of the receiving hole 140a of the light guide plate 140 are adhered to the fourth surface 134b of the second bonding portion 134 to form the light emitting mode described in this embodiment. Group 100.
由上述本發明實施例可知,應用本發明具有以下優點。在本實施例的發光模組主要是藉由第二膠合部連接導 光板的入光面與發光單元的出光面,使得發光單元的光線可經由第二膠合部完整地傳遞至導光板內,以避免光線在空氣中散射而產生光暈現象,同時又可避免發出的光線在空氣中行進並產生散射而導致能量散失的問題,是故,本發明實施例可改善發光單元的光線的光能不能完整地傳遞至導光板的問題。因此,本發明實施例的發光模組的導光板可接收到光線強度可符合發光單元出光的光線強度,以提升發光模組整體的發光效果,並可進一步應用於發光鍵盤或其它發光產品。 It will be apparent from the above-described embodiments of the present invention that the application of the present invention has the following advantages. The light-emitting module of the embodiment is mainly connected by a second glue joint. The light-incident surface of the light plate and the light-emitting surface of the light-emitting unit enable the light of the light-emitting unit to be completely transmitted into the light guide plate through the second glued portion, so as to avoid light scattering in the air to generate halo phenomenon, and at the same time avoid being emitted. The problem that the light travels in the air and causes scattering to cause energy loss is that the embodiment of the present invention can improve the problem that the light energy of the light of the light-emitting unit cannot be completely transmitted to the light guide plate. Therefore, the light guide plate of the light-emitting module of the embodiment of the invention can receive the light intensity of the light-emitting unit to meet the light-emitting intensity of the light-emitting unit, thereby improving the overall light-emitting effect of the light-emitting module, and can be further applied to the light-emitting keyboard or other light-emitting products.
雖然本發明已以實施方式揭露如上,然其並非用以限定本發明,任何熟習此技藝者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.
10‧‧‧發光鍵盤 10‧‧‧ illuminated keyboard
100‧‧‧發光模組 100‧‧‧Lighting module
110‧‧‧電路板 110‧‧‧Circuit board
120‧‧‧發光單元 120‧‧‧Lighting unit
130‧‧‧透光膠層 130‧‧‧Transparent adhesive layer
140‧‧‧導光板 140‧‧‧Light guide plate
200‧‧‧按鍵組 200‧‧‧ button group
210‧‧‧鍵帽 210‧‧‧Key Cap
220‧‧‧遮光板 220‧‧ ‧ visor
222‧‧‧透光孔 222‧‧‧Light hole
Claims (17)
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TW104122810A TWI555051B (en) | 2015-07-14 | 2015-07-14 | Backlight module, and lighting keyboard |
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TW104122810A TWI555051B (en) | 2015-07-14 | 2015-07-14 | Backlight module, and lighting keyboard |
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TWI555051B true TWI555051B (en) | 2016-10-21 |
TW201703089A TW201703089A (en) | 2017-01-16 |
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JP6717421B1 (en) * | 2018-12-28 | 2020-07-01 | 日亜化学工業株式会社 | Light emitting module |
TWI688978B (en) | 2019-09-20 | 2020-03-21 | 群光電能科技股份有限公司 | Illuminating keyboard |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201224602A (en) * | 2010-12-08 | 2012-06-16 | Au Optronics Corp | Back light module and assembly method of back light module |
TW201348817A (en) * | 2012-05-18 | 2013-12-01 | Gio Optoelectronics Corp | Light emitting module |
TW201418628A (en) * | 2012-11-07 | 2014-05-16 | Wistron Corp | Light source module and manufacturing method thereof |
TW201500815A (en) * | 2013-06-17 | 2015-01-01 | Primax Electronics Ltd | Backlight module |
US9019444B2 (en) * | 2012-03-27 | 2015-04-28 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Edge-type backlight module and liquid crystal display using the same |
TW201533507A (en) * | 2014-02-27 | 2015-09-01 | Innolux Corp | Backlight module |
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201224602A (en) * | 2010-12-08 | 2012-06-16 | Au Optronics Corp | Back light module and assembly method of back light module |
US9019444B2 (en) * | 2012-03-27 | 2015-04-28 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Edge-type backlight module and liquid crystal display using the same |
TW201348817A (en) * | 2012-05-18 | 2013-12-01 | Gio Optoelectronics Corp | Light emitting module |
TW201418628A (en) * | 2012-11-07 | 2014-05-16 | Wistron Corp | Light source module and manufacturing method thereof |
TW201500815A (en) * | 2013-06-17 | 2015-01-01 | Primax Electronics Ltd | Backlight module |
TW201533507A (en) * | 2014-02-27 | 2015-09-01 | Innolux Corp | Backlight module |
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