JP6717421B1 - Light emitting module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting module which can be made thin. A light guide plate (10) having a first main surface (11), a second main surface (12) opposite to the first main surface, and a light source member (20) arranged on the second main surface side, which is a main light emitting surface. And a light emitting element having an electrode forming surface located on the opposite side of the main light emitting surface and a side surface between the main light emitting surface and the electrode forming surface, and a wavelength conversion member covering the main light emitting surface and the side surface of the light emitting element. A plurality of light source members and a sealing member 50 that covers the light source member and the second main surface of the light guide plate are provided, and the light guide plate has a plurality of first recesses 121 located on the second main surface, and is viewed in cross section. In the light emitting module 100, the light emitting element is arranged such that at least a part of a side surface of the light emitting element is located in the first recess. [Selection diagram] Fig. 1B

Description

The present disclosure relates to a light emitting module.

A light emitting device using a light emitting element such as a light emitting diode is widely used as various light sources such as a backlight of a liquid crystal display and a display.
For example, the light source device disclosed in Patent Document 1 includes a plurality of light emitting elements mounted on a mounting substrate, a hemispherical lens member that seals each of the plurality of light emitting elements, and a light emitting element arranged on the hemispherical lens member. Is provided with a diffusing member.

JP, 2015-32373, A

However, in the light source device as in Patent Document 1, it is necessary to make the distance between the mounting substrate and the diffusion plate larger than the thickness of the lens member, and there is a possibility that sufficient thinning cannot be achieved.

Therefore, it is an object of the present disclosure to provide a light emitting module including a light guide plate and a light emitting element that can be thinned.

A method for manufacturing a light emitting module according to the present disclosure has the following configuration.
A light guide plate having a first main surface and a second main surface opposite to the first main surface, and a light source member arranged on the second main surface side, the main light emitting surface being opposite to the main light emitting surface. A plurality of light source members including a light emitting element having an electrode forming surface and a side surface between the main light emitting surface and the electrode forming surface, and a wavelength conversion member covering the main light emitting surface and the side surface of the light emitting element, and a light source member. And a sealing member that covers the second main surface of the light guide plate, the light guide plate has a plurality of first recesses located on the second main surface, and at least a part of a side surface of the light emitting element in a cross-sectional view. The light emitting module is arranged so as to be located in the first recess.

Accordingly, it is possible to provide a light emitting module including a light guide plate and a light emitting element, which can be made thin.

FIG. 3 is a schematic plan view showing an example of a light emitting module according to the first embodiment. FIG. 3 is a partially enlarged schematic cross-sectional view of the light emitting module according to the first embodiment. FIG. 3 is a partially enlarged schematic cross-sectional view of the light emitting module according to the first embodiment. FIG. 3 is a partially enlarged schematic cross-sectional view of the light emitting module according to the first embodiment. FIG. 3 is a partially enlarged schematic plan view and a partially enlarged schematic side view showing an example of the light guide plate according to the first embodiment. FIG. 3 is a partially enlarged schematic cross-sectional view showing an example of the light guide plate according to the first embodiment. 3 is a partially enlarged schematic cross-sectional view showing an example of the light emitting module according to Embodiment 1. FIG. 3 is a partially enlarged schematic cross-sectional view showing an example of the light emitting module according to Embodiment 1. FIG. FIG. 3 is a schematic cross-sectional view showing an example of a light source member of the light emitting module according to the first embodiment. FIG. 3 is a schematic cross-sectional view showing an example of a light source member of the light emitting module according to the first embodiment. FIG. 3 is a schematic cross-sectional view showing an example of a light source member of the light emitting module according to the first embodiment. FIG. 3 is a schematic cross-sectional view showing an example of a light source member of the light emitting module according to the first embodiment. It is a partially expanded schematic cross section which shows an example of the manufacturing process of a light source member. It is a partially expanded schematic cross section which shows an example of the manufacturing process of a light source member. It is a partially expanded schematic cross section which shows an example of the manufacturing process of a light source member. It is a partially expanded schematic cross section which shows an example of the manufacturing process of a light source member. It is a partially expanded schematic cross section which shows an example of the manufacturing process of a light source member. It is a partially expanded schematic cross section which shows an example of the manufacturing process of a light source member. FIG. 3 is a partially enlarged schematic cross-sectional view showing an example of a manufacturing process of the light emitting module according to the first embodiment. FIG. 3 is a partially enlarged schematic plan view showing an example of a manufacturing process of the light emitting module according to the first embodiment. FIG. 3 is a partially enlarged schematic plan view showing an example of a manufacturing process of the light emitting module according to the first embodiment. FIG. 3 is a partially enlarged schematic cross-sectional view showing an example of a manufacturing process of the light emitting module according to the first embodiment. FIG. 3 is a partially enlarged schematic cross-sectional view showing an example of a manufacturing process of the light emitting module according to the first embodiment. FIG. 3 is a partially enlarged schematic cross-sectional view showing an example of a manufacturing process of the light emitting module according to the first embodiment. FIG. 3 is a partially enlarged schematic cross-sectional view showing an example of a manufacturing process of the light emitting module according to the first embodiment. FIG. 3 is a partially enlarged schematic cross-sectional view showing an example of a manufacturing process of the light emitting module according to the first embodiment. FIG. 3 is a partially enlarged schematic cross-sectional view showing an example of a manufacturing process of the light emitting module according to the first embodiment. FIG. 3 is a partially enlarged schematic cross-sectional view showing an example of a manufacturing process of the light emitting module according to the first embodiment. FIG. 6 is a partially enlarged schematic sectional view of a light emitting module according to a second embodiment. It is a schematic cross section which expands and shows a part of FIG. 9A. FIG. 6 is a schematic cross-sectional view showing an example of a light source member of the light emitting module according to the second embodiment. FIG. 9 is a schematic cross-sectional view of a light source member of Modification 1 of the light emitting module according to the second embodiment. FIG. 9 is a schematic cross-sectional view of a light source member of Modification 2 of the light emitting module according to the second embodiment. FIG. 9 is a schematic cross-sectional view of a light source member of Modification 3 of the light emitting module according to the second embodiment. FIG. 9 is a partially enlarged schematic cross-sectional view of a light emitting module when the light source member of Modification 3 is used in the light emitting module according to the second embodiment.

Hereinafter, the present invention will be described in detail with reference to the drawings. In the following description, terms indicating a particular direction or position (eg, “upper”, “lower”, and other terms including those terms) are used as necessary, but the use of those terms is not allowed. The purpose is to facilitate understanding of the invention with reference to the drawings, and the technical scope of the invention is not limited by the meanings of the terms. Further, the portions having the same reference numerals appearing in a plurality of drawings indicate the same or equivalent portions or members. In addition, the same name is used for each member even when the state, shape, etc. are different before and after curing, before and after cutting, and the like.

Furthermore, the embodiments described below exemplify a light emitting module for embodying the technical idea of the present invention, and the present invention is not limited to the following. Further, the dimensions, materials, shapes, relative arrangements, and the like of the components described below are not intended to limit the scope of the present invention thereto, unless specifically stated, and are merely exemplified. It was intended. Further, the contents described in one embodiment and example can be applied to other embodiments and examples. In addition, the sizes and positional relationships of members shown in the drawings may be exaggerated in order to clarify the explanation.

Embodiment 1
The structure of the light emitting module of Embodiment 1 is mainly shown in FIGS. 1A to 1D.
FIG. 1A is a schematic plan view of the light emitting module 100 according to the first embodiment. FIG. 1B is a partially enlarged schematic cross-sectional view showing the light emitting module 100 according to the first embodiment, and here, a cross-sectional view taken along the line IB (IB) shown in the region S shown in FIG. 1A is shown. FIG. 1C is an enlarged view of a portion including one light source member 20 and second recess 122 of FIG. 1B, and FIG. 1D is an enlarged view of one light source member 20.

The light emitting module 100 includes a light guide plate 10, a plurality of light source members 20 joined to the light guide plate 10, and a sealing member 50. The light guide plate 10 includes a first main surface 11 serving as a light extraction surface, and a second main surface 12 opposite to the first main surface 11. The light guide plate 10 includes a plurality of first recesses 121 arranged in a matrix on the second main surface 12. The light source member 20 includes a light emitting element 21 and a wavelength conversion member 26. The plurality of light source members 20 are joined by the joining member 40 on the bottom surface 121 a of the first recess 121 of the second main surface 12 of the light guide plate 10. The sealing member 50 is arranged so as to cover the light source member 20 and the second main surface 12 of the light guide plate 10.

The light source member 20 is arranged such that at least a part of the side surface 21c of the light emitting element 21 is located in the first recess 121 in a cross-sectional view. In other words, the light source member 20 is arranged such that the main light emitting surface 21a of the light emitting element 21 is located below the second main surface 12 around the first recess 121 in a cross-sectional view.

The light emitted from the main light emitting surface 21a of the light emitting element 21 is applied to the wavelength conversion member 26 that covers the main light emitting surface 21a of the light emitting element 21. Then, the light from the light source member 20 enters the light guide plate 10 from the bottom surface 121 a of the first recess 121 as the light from the light emitting element 21 and the color-mixed light from the wavelength conversion member 26.

The light emitted from the side surface 21c of the light emitting element 21 is applied to the wavelength conversion member 26 that covers the side surface 21c of the light emitting element 21. Then, the light from the light source member 20 enters the light guide plate 10 from the side surface 121b of the first recess 121 as a mixed color light of the light from the light emitting element 21 and the light from the wavelength conversion member 26.

Since at least a part of the light emitting element 21 is located in the first recess 121 of the light guide plate 10, the light emitted from the light source member 20 can be easily and efficiently spread laterally in the light guide plate 10. Therefore, it is possible to provide a light emitting module capable of surface emission with less luminance unevenness on the entire first main surface 11 of the light guide plate 10.

In a cross-sectional view, the length To of which the side surface 21c of the light emitting element 21 and the side surface 121b of the first recess 121 face each other is the length Tc of the side surface 21c of the light emitting element 21 (the distance between the main light emitting surface 21a and the electrode forming surface 21b). 20% to 100% is preferable, and 50% to 100% is more preferable.

When the light emitting element 21 includes the semiconductor stacked body 22 including the element substrate 22s, 20% to 100% of the length of the side surface of the element substrate 22s faces the side surface 121b of the first recess 121 in a cross-sectional view. Is preferable, and more preferably 50% to 100%.

Each member constituting the light emitting module will be described in detail below.

[Light guide plate 10]
FIG. 2A is an enlarged view of a region S that is a part of the light guide plate 10 shown in FIG. 1A, and is a cross-sectional view taken along the first main surface 11, the second main surface 12, and the line IB (IB), respectively. FIG. 2B is an enlarged cross-sectional view of the cross-sectional view of FIG. 2A. The light guide plate 10 is a translucent plate-shaped member that receives light from the light source member 20 and emits light in a planar shape. The light guide plate 10 includes a first main surface 11 serving as a light extraction surface, and a second main surface 12 opposite to the first main surface 11. The first major surface 11 has a first recess 121 in which the light source member 20 is arranged.

When the light guide plate 10 has a quadrangular shape in plan view, the size in plan view may be, for example, about 1 cm to 200 cm on one side, and preferably about 3 cm to 30 cm. The thickness of the light guide plate 10 can be set to about 0.1 mm to 5 mm, preferably 0.5 mm to 3 mm. It should be noted that the term "thickness" as used herein refers to the thickness when it is assumed that the first main surface 11 and the second main surface 12 have no recesses or protrusions, for example. ..
The planar shape of the light guide plate 10 may be, for example, a substantially rectangular shape or a substantially circular shape.

As the material of the light guide plate 10, a resin material such as a thermoplastic resin such as acrylic, polycarbonate, cyclic polyolefin, polyethylene terephthalate, or polyester, a thermosetting resin such as epoxy or silicone, or an optically transparent material such as glass is used. be able to. In particular, a thermoplastic resin material is preferable because it can be efficiently manufactured by injection molding. Among them, polycarbonate, which has high transparency and is inexpensive, is preferable. When the step of attaching the wiring substrate after joining the light source member 20 to the light guide plate 10 is provided, a step of applying high temperature such as solder reflow can be omitted, so that a material having thermoplasticity and low heat resistance such as polycarbonate is used. It can be used even if there is.

The light guide plate 10 may be formed as a single layer or may be formed by stacking a plurality of translucent layers. When a plurality of translucent layers are laminated, a layer having a different refractive index, such as an air layer, may be provided between arbitrary layers. As a result, the light can be more easily diffused, and a light emitting module with reduced luminance unevenness can be obtained.

(First concave portion: light source member arrangement portion)
The light guide plate 10 includes a first recess 121 on the second main surface 12 side. The first recess 121 is a portion in which the light source member 20 is arranged.

The plurality of first recesses 121 are two-dimensionally arranged in a plan view of the light guide plate 10. Preferably, the plurality of first recesses 121 are two-dimensionally arranged along two orthogonal directions, that is, the x direction (horizontal direction) and the y direction (longitudinal direction). As shown in FIG. 1A, the arrangement pitch of the first recesses 121 in the x direction and the arrangement pitch in the y direction may be the same or different. Further, the two directions of the array may not be orthogonal to each other. Further, the arrangement pitch in the x direction or the y direction is not limited to equal intervals and may be unequal intervals. For example, the first recesses 121 may be arranged such that the distance from the center of the light guide plate 10 increases toward the periphery.

The size of the first recess 121 in plan view (area of the opening) is preferably substantially the same as or larger than the shape of the light source member 20 in plan view. For example, the size of the opening of the first recess 121 in plan view can be 100% to 200% of the area of the light source member 20 in plan view.

The plan view shape of the opening of the first recess 121 can be, for example, a substantially rectangular shape or a substantially circular shape. The plan view shape of the openings of the first recesses 121 can be adjusted according to the arrangement pitch of the first recesses 121 (the distance between the centers (optical axes) of the two first recesses 121 that are closest to each other), and the like. For example, when the arrangement pitches of the first recesses 121 are substantially uniform, a substantially circular shape or a substantially square shape is preferable. Above all, the light from the light source member 20 can be satisfactorily spread by making it substantially circular.

For example, when the opening of the first recess 121 has a quadrangular shape in plan view, the light emitting element 21 has a vertical and horizontal dimension of about 1000 μm or less in plan view, and the wavelength conversion covering the side surface 21 c of the light emitting element 21 is performed. When the thickness of the member 26 is about 0.1 mm to 5 mm, the array pitch between the first recesses 121 can be set to about 0.5 mm to 50 mm, for example, and preferably about 3 mm to 30 mm.

The plan view shape of the bottom surface 121a of the first recess 121 is preferably the same as the plan view shape of the opening. However, the shape of the bottom surface 121a of the first recess 121 is not limited to this, and may be different from the shape of the opening in plan view. In addition, the bottom surface 121a of the first recess 121 may have the same size as the opening or a size smaller than the opening.

The depth Tr1 of the first recess 121, that is, the distance from the bottom surface 121a of the first recess 121 to the opening (second main surface) is such that at least a part of the side surface 21c of the light emitting element 21 is located inside the first recess 121. It is preferable that the depth be such that In other words, it is preferable that at least a part of the side surface 121b of the first recess 121 is located beside the side surface 21c of the light emitting element 21.

Further, in the first recess 121, the light emitting element 21 is arranged on the bottom surface 121a of the first recess 121 via the wavelength conversion member 26 that covers the main light emitting surface 21a. Therefore, in order for the side surface 21c of the light emitting element 21 to be located in the first recess 121, the depth Tr1 of the first recess 121 is set between the main light emitting surface 21a of the light emitting element 21 and the bottom surface 121a of the first recess 121. It is preferable that the thickness is larger than the thickness of the wavelength conversion member 26.

When the translucent joining member 40 is arranged between the wavelength conversion member 26 and the bottom surface 121a of the first recess 121, the depth Tr1 of the first recess 121 is equal to the main light emitting surface 21a of the light emitting element 21. It is preferable that the thickness of the wavelength conversion member 26 between the bottom surface 121a of the first recess 121 and the total thickness of the bonding member 40 is larger than the total thickness.

For example, the length of the side surface 21c of the light emitting element 21 (distance between the main light emitting surface 21a and the electrode formation surface 21b) is about 50 μm to 200 μm, and the thickness of the wavelength conversion member 26 or the thickness of the wavelength conversion member 26 When the total thickness of the joining member 40 is about 50 μm to 600 μm, the depth Tr1 of the first recess 121 can be set to 50 μm to 5000 μm, preferably 100 μm to 350 μm. When the light guide plate 10 includes an optical function section 111 described below, the distance between the optical function section 111 and the first recess 121 can be appropriately set within a range in which the optical function section 111 and the recess 121 are separated from each other.

In addition, the side surface 121b of the first recess 121 may be a surface that is vertical or inclined with respect to the bottom surface 121a of the first recess 121. The inclination angle of the side surface 121b can be 45 degrees to 90 degrees from the bottom surface 121a. The side surface 121b of the first recess 121 can be a straight line or a curved line in a cross-sectional view.

(Second recess: reflector)
The light guide plate 10 preferably has a second recess 122 located on the second major surface 12. The second recess 122 can function as a reflector that reflects the light from the light source member 20 arranged in the first recess 121 toward the first main surface 11 side. Therefore, it is preferable that the second concave portion 122 is arranged so as to surround one first concave portion 121 in which the light source member 20 is arranged, in a top view.

When the second concave portion 122 is arranged so as to surround one first concave portion 121 in which the light source member 20 is arranged, for example, the second concave portion is provided so as to divide the second main surface of the light guide plate into a plurality of regions. You may make it provide the 1st recessed part 121 in each divided area. In this case, in a top view, a part of the second recess 122 that surrounds one first recess 121 may also serve as a part of the second recess 122 that surrounds the adjacent first recess 121. That is, in a cross-sectional view, a part of the second recess 122 is located between the two first recesses 121, and a part of the second recess 122 is shared by the two adjacent first recesses 121. For example, as shown in FIG. 2B, the side surface 122b located on the right side of the bottom portion 122a of the second recess 122 reflects light from the light source member arranged in the first recess 121 located on the right side. Similarly, the side surface 122b located on the left side of the bottom surface 122a of the second recess 122 reflects light from the light source member arranged in the first recess 121 located on the left side.

In this way, the second recess 122 surrounding one first recess 121 also functions as a part of the second recess 122 surrounding the adjacent first recess 121, so that the second recess 122 is shown in FIG. 2A. As described above, the bottom portion 122a may have a lattice shape.

The side surface 122b of the second recess 122 may be a straight line or a curved surface in a cross-sectional view, and further, these may be combined. When the side surface of the second recess 122 is a curved surface, the curvature may be constant or may have an arbitrary curvature depending on the position. For example, the second concave portion 122 shown in FIG. 1C and the like exemplifies a curved side surface 122b in which the curvature gradually changes in a portion continuous with the second main surface 12. In the case of such a second recess 122, the boundary between the second recess 122 and the second main surface 12 may not be clearly visible.

A low-refractive index member having a lower refractive index than the light guide plate 10 can be disposed in the second recess 122. As the low refractive index member, for example, air, a resin material, or a glass material can be used. Furthermore, a light-reflecting member may be arranged in the second recess 122. As the light reflecting member, the same light reflecting member as the sealing member 50 described later can be used. Further, a part of the sealing member 50 can be arranged in the second recess 122.

As shown in FIG. 1C, the depth Tr2 of the bottom portion 122a of the second recess 122 can be approximately the same as the depth Tr1 of the first recess 121. Further, the bottom portion 122a of the second recess 122 may be located at the same position as the light emitting surface 20a of the light source member 20.

(Optical function part)
The light guide plate 10 may include an optical function unit 111 on the first major surface 11 side. The optical function unit 111 can have a function of spreading light within the surface of the light guide plate 10, for example.

The optical function portion 111 is preferably provided at a position corresponding to each first recess 121, that is, at a position opposite to the light source member 20 arranged on the second main surface 12 side. In particular, it is preferable that the optical axis of the light source member 20 and the optical axis of the optical function unit 111 are substantially aligned. For example, when the recess of the optical function part 111 is a cone or a frustum, it is preferable that the top part or the central axis thereof substantially coincides with the optical axis of the light source member 20. Further, when the recess of the optical function portion 111 is a truncated cone, it is preferable that the surface corresponding to the top be located on the optical axis of the light source member 20.

The optical function unit 111 can be a conical or frustum-shaped recess provided on the first major surface 11 side. Specifically, the cone-shaped depressions include polygonal cones such as cones, quadrangular pyramids, and hexagonal pyramids, and the truncated pyramid-shaped depressions include truncated cones, quadrangular pyramids, and hexagonal pyramids. A polygonal frustum is mentioned. The side surface 111b of the optical function part 111 may be a straight line or a curved line in a cross-sectional view.

The size of the opening of the optical function unit 111 in plan view can be set appropriately. The size of the opening of the optical function unit 111 can be set to, for example, 100% to 300% of the area of the bottom surface 121a of the first recess 121. When the optical function unit 111 is a truncated cone-shaped recess, the size of the bottom surface 111a (the surface corresponding to the top of the truncated cone) in plan view is, for example, 50 times the size of the light source member 20 in plan view. % To 100%, or 20% to 100% of the area of the bottom surface 121a of the first recess 121. The optical function part 111 shown in FIGS. 1A to 1D is a truncated cone-shaped recess provided with a circular opening in the first main surface 11, the diameter of the opening is larger than that of the light source member 20, and further than the first recess 121. Also shows a large example.

As shown in FIG. 3A, a material having a refractive index different from that of the light guide plate 10 (for example, air, a low refractive index member 112, etc.) can be disposed in the recess used as the optical function unit 111. Further, as shown in FIG. 3B, a first reflecting member 113 that reflects light from the light source member 20 may be arranged on the inner surface of the recess. For the first reflecting member 113, for example, a metal, a white resin material, a DBR film, or the like can be used.

[Light source member]
The light source member 20 includes a light emitting element 21 and a wavelength conversion member 26. The wavelength conversion member 26 is a member that covers the main light emitting surface 22a and the side surface 22c of the light emitting element 21, and mainly contains a resin material and a wavelength conversion substance.

As the light source member 20, a light emitting device 30 including a light emitting element 21 and a wavelength conversion member 26 as shown in FIGS. 4A to 4C in advance can be used as the light source member 20. Alternatively, the wavelength conversion member 26 may be arranged in the first recess 121 of the light guide plate 10, and the light emitting element 21 may be embedded in the wavelength conversion member 26 to form the light source member 20.

The light emitting device 30 may have a structure as shown in FIGS. 4A to 4C, for example. All the light emitting devices are common in that the wavelength conversion member 26 is arranged so as to cover the main light emitting surface 21a and the side surface 21c of the light emitting element 21.

The light emitting device 30 shown in FIG. 4A includes a wavelength conversion member 26 that covers the main light emitting surface 21a and the side surface 21c of the light emitting element 21. In this case, the electrode formation surface 21b of the light emitting element 21 is not covered with the wavelength conversion member 26 but is exposed. The bottom surfaces and side surfaces of the pair of electrodes 24 are also exposed. Since the electrode forming surface 21b is covered with the sealing member 50 after being incorporated as a part of the light emitting module, there is no problem even if it is exposed to the outside in the state of the light emitting device 30.

In the light emitting device 30A shown in FIG. 4B, in addition to the main light emitting surface 21a and the side surface 21c of the light emitting element 21, the wavelength conversion member 26 is arranged so as to cover the electrode forming surface 21b. The side surfaces of the pair of electrodes 24 are also covered with the wavelength conversion member 26. Further, the bottom surfaces of the pair of electrodes 24 are not covered with the wavelength conversion member 26, but are covered with the first metal film 25. The first metal film 25 can have an area larger than the size of the electrode 24. Thereby, for example, it is possible to easily inspect the light emission characteristics of the light emitting device 30A. Therefore, when the light emitting device is incorporated as a part of the light emitting module, the chromaticity, the luminance, and the like of the light emitting device can be easily selected, and the light emitting module having less color unevenness and luminance unevenness can be obtained.

The light emitting device 30B shown in FIG. 4C includes a wavelength conversion member 26 that covers the main light emitting surface 21a and the side surface 21c of the light emitting element 21. The electrode forming surface 21 b and the side surfaces of the pair of electrodes 24 are covered with the second reflecting member 27. The bottom surfaces of the pair of electrodes 24 are exposed without being covered with the wavelength conversion member 26 and the second reflection member 27. Then, the bottom surface of the electrode 24 exposed from these is covered with the first metal film 25. By covering the electrode forming surface 21b with the second reflecting member 27, it is possible to reduce light absorption by the electrode 24. Further, by using the first metal film 25 having an area larger than that of the electrode 24, it is possible to easily inspect the light emission characteristics and to easily obtain a light emitting module with less color unevenness and brightness unevenness, as in the light emitting device 30A shown in FIG. 4B. can do.

(Light emitting element)
As the light emitting element 21, a known semiconductor light emitting element can be used. In the first embodiment, a light emitting diode is exemplified as the light emitting element 21.

The light emitting element 21 includes, for example, a semiconductor laminated body 22 including a translucent element substrate 22s such as sapphire and a semiconductor layer laminated on the element substrate 22s. The semiconductor stacked body 22 includes a light emitting layer 22a, and an n-type semiconductor layer 22n and a p-type semiconductor layer 22p that sandwich the light-emitting layer 22a, and the n-type semiconductor layer 22n and the p-type semiconductor layer 22p have a pair of electrodes n. The electrode 24n and the p electrode 24p are electrically connected to each other. The light emitting element 21 is arranged such that the main light emitting surface 22a including the element substrate 22s faces the bottom surface 121a of the first recess 121 of the light guide plate 10.

As the light emitting element 21, an element that emits light having an arbitrary wavelength can be selected. For example, blue, as the device that emits green light, using the light emitting device using nitride semiconductor _{(In x Al y Ga 1-} x-y N, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1) be able to. The emission wavelength can be variously selected depending on the material of the semiconductor laminate and the mixed crystallinity thereof. The composition, emission color, size, number, and the like of the light emitting element to be used may be appropriately selected according to the purpose. Emitting element 21, capable of nitride semiconductor that emits light of short wavelength that can efficiently excite the wavelength converting member _{(In x Al y Ga 1-} x-y N, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1) is preferably provided.

The shape of the light emitting element 21 may be a quadrangle such as a square or a rectangle, or a polygon such as a triangle or a hexagon. The size of the light emitting element 21 is, for example, preferably 1000 μm or less in vertical and horizontal dimensions in a plan view, more preferably 500 μm or less in vertical and horizontal dimensions, and further preferably, vertical and horizontal dimensions. Is 200 μm or less. When such a light emitting element is used, a high-definition image can be realized when the liquid crystal display device is locally dimmed.

(Wavelength conversion member)
The wavelength conversion member 26 includes a wavelength conversion substance such as a phosphor that converts the wavelength of light emitted from the light emitting element 21 into light of a different wavelength. For example, the wavelength conversion member 26 can be a single layer or multiple layers.

The wavelength conversion member 26 includes a translucent material as a base material and a particulate phosphor as a wavelength conversion substance.

The translucent material has a translucent property of transmitting at least light from the light emitting element 21, and transmits 60% or more, and preferably 90% or more of light emitted from the light emitting element 21. As a material of the wavelength conversion member 26, a translucent thermosetting resin material such as an epoxy resin or a silicone resin can be used.

Examples of the phosphor include yttrium-aluminum-garnet-based phosphor (for example, Y ₃ (Al,Ga) ₅ O ₁₂ :Ce), lutetium-aluminum-garnet-based phosphor (for example, Lu ₃ (Al,Ga) ₅ O). ₁₂ :Ce), terbium aluminum garnet-based phosphor (for example, Tb ₃ (Al, Ga) ₅ O ₁₂ :Ce)-based phosphor, silicate-based phosphor (for example (Ba, Sr) ₂ SiO ₄ :Eu), chlorosilicate phosphor (e.g. _{Ca 8 Mg (SiO 4) 4} Cl 2: Eu) and the like. Furthermore, as the nitride-based phosphor, a β-sialon-based phosphor (for example, Si _6-z Al _z O _z N _8-z :Eu (0<z<4.2)), an α-sialon-based phosphor (for example, Mz( Si,Al) ₁₂ (O,N) ₁₆ (where 0<z≦2, M is Li, Mg, Ca, Y, and a lanthanide element excluding La and Ce), nitrogen-containing calcium aluminosilicate (CASN or SCASN) phosphor (e.g. _{(Sr, Ca) AlSiN 3:} . Eu) and the like general formula _{(I) Ma x Mb y Al} 3 N z: phosphor represented by Eu (provided that the general formula ( In I)), Ma is at least one element selected from the group consisting of Ca, Sr, and Ba, and Mb is at least one element selected from the group consisting of Li, Na, and K. , X, y, and z satisfy 0.5≦x≦1.5, 0.5≦y≦1.2, and 3.5≦z≦4.5), respectively. Furthermore, an SGS-based phosphor (for example, SrGa ₂ S ₄ :Eu) can be mentioned. In addition, in the manganese-activated fluoride phosphor (general formula _{(II) A 2 [M 1} -a Mn a F 6] In the phosphor represented (however, the general formula (II), A is, K, Li is at least one selected from the group consisting of Na, Rb, Cs, and NH4, M is at least one element selected from the group consisting of Group 4 elements and Group 14 elements, and a is 0 <Satisfies <a<0.2)). A typical example of the manganese-activated fluoride-based phosphor is a manganese-activated potassium fluorosilicate phosphor (for example, KSF (K ₂ SiF ₆ :Mn)).

One wavelength conversion member can include one type or a plurality of types of phosphors. Plural kinds of phosphors may be mixed and used, or may be laminated and used. For example, the light-emitting element 21 that emits blue light is used, and the phosphor includes a β-sialon phosphor that emits green light and a fluoride phosphor such as a KSF phosphor that emits red light. it can. By using such two types of phosphors, the color reproduction range of the light emitting module can be expanded. Further, the phosphor may be a quantum dot.

The phosphor may be arranged in any manner inside the wavelength conversion member. For example, the phosphor may be substantially uniformly distributed inside the wavelength conversion member, or may be partially distributed.

The wavelength conversion member may include a light diffusing substance. Examples of the light diffusing substance include fine particles such as SiO ₂ , TiO ₂ , Al ₂ O ₃ , and ZnO.

In the light emitting device shown in FIGS. 4A to 4C, the thickness of the wavelength conversion member 26 that covers the main light emitting surface 21a of the light emitting element 21 can be 30 μm to 50 μm. The thickness of the wavelength conversion member 26 that covers the side surface 21c of the light emitting element 21 can be 10 μm to 1000 μm. It is preferable that the thickness of the wavelength conversion member 26 that covers the main light emitting surface 21a of the light emitting element 21 and the thickness of the wavelength conversion member 26 that covers the side surface 21c of the light emitting element 21 are the same. However, the thickness is not limited to this and may be different.

In the light emitting device 30A shown in FIG. 4B, the thickness of the wavelength conversion member 26 that covers the electrode forming surface 21b of the light emitting element 21 can be about 5 μm to 50 μm. In addition, the thickness of the wavelength conversion member 26 that covers the electrode forming surface 21b of the light emitting element 21 can be made approximately the same as the thickness of the pair of electrodes 24.

The wavelength conversion member 26 in the case of disposing the wavelength conversion member 26 in the first recess 121 of the light guide plate 10 without using the light emitting device 30 as the light source member 20 will be described.

As shown in FIG. 5, the wavelength conversion member 26 is preferably arranged in the entire region sandwiched between the main light emitting surface 21 a of the light emitting element 21 and the bottom surface 121 a of the first recess 121. Furthermore, it is preferable that the wavelength conversion member 26 is arranged so as to cover the entire bottom surface 121 a of the first recess 121. It is preferably arranged in the entire area sandwiched between the side surface 21c of the light emitting element 21 and the side surface 121b of the first recess 121.

(Second reflective member)
When the light emitting device 30B as shown in FIG. 4C is used as the light source member 20, a second reflecting member 27 that covers the electrode forming surface 22b of the light emitting element 21 and the side surfaces of the pair of electrodes 24 is provided. The thickness of the second reflecting member 27 can be, for example, about 5 μm to 200 μm. In addition, the second reflecting member 27 can be set to have the same height as the pair of electrodes 24.

The second reflecting member 27 has a reflectance of 60% or more, preferably 90% or more, with respect to the light emitted from the light emitting element 21. The material of the second reflecting member 27 is preferably a resin material containing a white pigment or the like. In particular, a silicone resin containing titanium oxide is preferable.

(First metal film)
When the light emitting devices 30A and 30B as shown in FIGS. 4B and 4C are used as the light source member 20, that is, when the electrode formation surface 21b of the light emitting element 21 is covered with the wavelength conversion member 26 or the second reflection member 27. The light emitting devices 30A and 30B may include metal films 25 that are electrically connected to the pair of electrodes 24 and cover the bottom surfaces of the pair of electrodes 24, respectively. The material of the metal film 25 may have a laminated structure in which Cu/Ni/Au are laminated in this order. The metal film 25 may be arranged so as to continuously cover the electrodes 24 and the second reflection member 27 or the wavelength conversion member 26 that covers the side surfaces of the pair of electrodes 24.

[Joining member]
When the light emitting device shown in FIGS. 4A to 4C is used as the light source member 20, the light emitting device and the light guide plate 10 are joined by the translucent joining member 40. The joining member 40 has a role of propagating the light emitted from the light emitting device 30, which is the light source member 20, to the light guide plate 10. The joining member 40 is arranged between the light emitting device 30 and the bottom surface 121 a of the first recess 121 on the second main surface 12 side of the light guide plate 10. Further, it is arranged between the light emitting device 30 and the side surface 121b of the first recess 121. Furthermore, the joining member 40 may extend to the second major surface 12 of the light guide plate 10.

The joining member 40 is translucent and transmits 60% or more of the light emitted from the light source member 20 (light emitting device 30), preferably 90% or more. Further, the joining member 40 is preferably made of a material having a refractive index similar to that of the material of the light guide plate 10. For example, as the material of the base material, an epoxy resin, a silicone resin, a resin in which these are mixed, or a translucent material such as glass can be used. From the viewpoint of the light resistance of the connecting member 40 and the ease of molding, it is useful to select a silicone resin as the base material of the joining member 40.

[Sealing member 50]
The sealing member 50 is a light-reflecting member that covers the plurality of light source members 20 and the second main surface 12 of the light guide plate 10. By using the light-reflecting member as the sealing member 50, the light emitted from the light source member 20 can be efficiently taken into the light guide plate 10.

The sealing member 50 has a reflectance of 60% or more, preferably 90% or more, with respect to the light emitted from the light source member 20. The material of the sealing member 50 is preferably a resin material containing a white pigment or the like. In particular, a silicone resin containing titanium oxide is preferable. Accordingly, the light emitting module 100 can be made inexpensive by using a large amount of inexpensive raw materials such as titanium oxide as a material used in a relatively large amount to cover one surface of the light guide plate 10.

[Second metal film]
In the light emitting module 100, the second metal film 60 electrically connected to the electrodes 24 of the plurality of light source members 20 may be provided on the sealing member 50. The second metal film 60 may be arranged on the sealing member 50. When a light emitting device including the first metal film 25 as shown in FIGS. 4B and 4C is used as the light source member 20, the second metal film 60 is arranged so as to be electrically connected to the first metal film 25. You may. Even when the light emitting device including the first metal film 25 is used, the second metal film 60 may be formed in contact with the electrode 24 after removing the first metal film 25 in the process. The material of the second metal film 60 can be, for example, a laminated structure in which Cu/Ni/Au are laminated in this order.

[Wiring board]
The light emitting module 100 may include a wiring board 70 as shown in FIG. 1B. The wiring board 70 is a board including an insulating base material 71 and wirings 72 electrically connected to the plurality of light source members 20. By providing the wiring board 70, complicated wiring required for local dimming or the like can be easily formed. This wiring board 70 connects the light source member 20 to the light guide plate 10, forms the sealing member 50 and the second metal film 60, and then separately connects the wiring 72 of the wiring board 70 and the second metal film 60. , Can be joined.

The wiring board 70 includes, for example, a conductive member filled in a plurality of via holes provided in an insulating base material 71, and a wiring 72 electrically connected to the conductive member on both surface sides of the base material 71. , Is provided.

The wiring board 70 may have a laminated structure. For example, as the wiring board 70, a metal plate having an insulating layer on the surface may be used. The wiring board 70 may be a TFT board having a plurality of TFTs (Thin-Film Transistors).

As a material of the base material 71 of the wiring board 70, for example, ceramics or resin can be used. A resin may be selected as the material of the base material 71 from the viewpoints of low cost and ease of molding. Examples of the resin include phenol resin, epoxy resin, polyimide resin, BT resin, polyphthalamide (PPA), polyethylene terephthalate (PET), unsaturated polyester, and composite materials such as glass epoxy. Further, it may be a rigid substrate or a flexible substrate.

The wiring 72 is, for example, a conductive foil (conductor layer) provided on the base material 71, and is electrically connected to the plurality of light source members 20. The material of the wiring 72 preferably has high thermal conductivity. Examples of such a material include a conductive material such as copper. The wiring 72 can be formed by plating, applying a conductive paste, printing or the like, and the thickness of the wiring 62 is, for example, about 5 to 50 μm.

The wiring board 70 may be joined to the light guide plate 10 and the like by any method. For example, a sheet-shaped adhesive sheet can be bonded by arranging it between the surface of the sealing member 50 provided on the opposite side of the light guide plate 10 and the surface of the wiring board 70 and pressure bonding. The electrical connection between the wiring 72 of the wiring board 70 and the light source member 20 may be performed by any method. For example, a conductive member, which is a metal embedded in the via hole, can be melted by pressurizing and heating to be bonded to the second metal film 60.

The following steps can be given as an example of a method for manufacturing such a light emitting module.
(1) Step of preparing a light source member including a light emitting element and a wavelength conversion member that covers a main light emitting surface and a side surface of the light emitting element (2) A first main surface serving as a light extraction surface, and a surface opposite to the first main surface Of the light guide plate having the second main surface having the plurality of recesses which is the second main surface on the side (3) The bottom surface of the recess so that the side surface of the recess and the side surface of the light emitting element at least face each other. Step of placing light source member on top (4) Step of arranging light source member and sealing member covering second main surface

Each step of the method for manufacturing the light emitting module 100 will be described in detail below.

(1) Step of preparing a light source member (light emitting device) including a light emitting element and a wavelength conversion member

The light source member 20 can be manufactured, for example, by the steps shown in FIGS. 6A to 6D, 7A, and 7B. First, as shown in FIG. 6A, a plurality of light emitting elements 21 are arranged on a support 80 with a pair of electrodes facing down. Then, the wavelength conversion member 26 is formed so as to fill the light emitting element 21. The wavelength conversion member 26 can be formed by, for example, arranging the wavelength conversion member 26 before curing on the support 80, printing using a squeegee 81 or the like, and then curing.

Further, as shown in FIG. 7A, the wavelength conversion member 26 is formed by spraying the wavelength conversion member 26 before curing using the spray nozzle 83 to fill the light emitting element 21 as shown in FIG. 7B. It can be formed by a curing method.

Next, as shown in FIG. 6C, the wavelength conversion member 26 can be cut using a cutting blade 82 such as a dicer to obtain the light emitting device 30 that becomes the light source member 20.

(2) A step of preparing a light guide plate having a first main surface to be a light emitting surface and a second main surface opposite to the first main surface and having a plurality of recesses

The light guide plate 10 is prepared. As shown in FIG. 8A, the second main surface 12 of the light guide plate 10 is provided with a plurality of first recesses 121 each having an opening having a substantially square shape. Further, the second main surface 12 is provided with the second recess 122 between the adjacent first recesses 121. As shown in FIG. 2A, the second recess 122 is arranged so as to surround the first recess 121 in a top view. The first main surface 11 opposite to the second main surface 12 is provided with an optical function portion 111 which is a truncated cone-shaped recess.

Such a light guide plate 10 can be prepared, for example, by molding by injection molding, transfer molding, thermal transfer, or the like. Further, the first recess 121, the second recess 122 of the light guide plate 10 and the optical function part 111 can be collectively formed by a mold when the light guide plate 10 is molded. This can reduce the positional deviation during molding. Alternatively, the light guide plate 10 may be prepared by preparing and processing a plate that does not have the first recess 121, the second recess 122, and the optical function part 111. Alternatively, the light guide plate 10 including the first recess 121, the second recess 122, and the optical function unit 111 may be purchased and prepared.

(3) Step of placing the light source member (light emitting device) on the bottom surface of the recess so that the side surface of the first recess and the side surface of the light emitting element at least face each other. Next, as shown in FIG. The liquid bonding member 40 is arranged on the bottom surface 121 a of the recess 121. The joining member 40 can be applied by a method such as potting, transferring, or printing. FIG. 8B illustrates a case where the joining member 40 is arranged by potting using the dispense nozzle 84. The joining member 40 may be provided on the light emitting device 30 side. For example, a method may be used in which the light emitting device 30 is picked up by a suction member such as a suction collet, and the light emitting surface of the light emitting device 30 is immersed in the liquid bonding member 40 to attach the bonding member 40.

Next, as shown in FIG. 8C, the light emitting device 30 is placed on the joining member 40 in the first recess 121. At this time, the light emitting device 30 is placed with the electrode 24 facing upward. At this time, at least part of the side surface of the light emitting element 21 of the light emitting device 30 faces the side surface of the first recess 121. That is, the bonding member 40 is arranged so as to embed a part of the light emitting device 30. Then, the light emitting device 30 and the light guide plate 10 are joined by hardening the joining member 40.

(4) Step of Arranging Light Source Member and Sealing Member Covering Second Main Surface Next, as shown in FIG. 8D, a seal covering the second main surface 12 of the light guide plate 10 and the plurality of light emitting devices 30. The stop member 50 is formed. The sealing member 50 can be formed by a method such as transfer molding, potting, printing or spraying. FIG. 8D shows an example in which the dispensing nozzle 84 is used to thickly form the sealing member 50 so as to also cover the electrode 24 of the light emitting device 320. The sealing member 50 may be formed so as not to fill the electrode 24, in other words, at least a part of the electrode 24 is exposed.

(5) Step of removing the sealing member until the electrodes are exposed Next, as shown in FIG. 8E, the entire surface of the sealing member 50 is removed. This exposes the electrode 24 of the light emitting device 30 from the sealing member 50, as shown in FIG. 8G. Examples of the grinding method include a method of grinding the sealing member 50 into a planar shape by using a grinding member 90 such as a grindstone. Alternatively, as shown in FIG. 8F, the blast nozzle 91 may be used to eject the hard particles 92 to remove a part of the sealing member 50.

When the light emitting device 30 includes the first metal film 25 connected to the electrode 24, the sealing member 50 may be removed until the first metal film 25 is exposed. In any case, the sealing member 50 is removed until the conductive member capable of supplying power to the light emitting element 21 of the light source member 20 is exposed. Further, when the sealing member 50 is formed so as not to fill the electrode 24 in advance, this step can be omitted.

(6) Step of forming a metal film electrically connected to the plurality of light emitting elements Next, as shown in FIG. 8H, a second metal film is formed on substantially the entire surface of the electrode 24 of the light emitting device 30 and the sealing member 50. Form 60. The second metal film 60 may have a laminated structure in which Cu/Ni/Au are laminated in this order from the light guide plate 10 side, for example. Examples of the method for forming the second metal film 60 include sputtering and plating, and it is preferable to form the second metal film 60 by sputtering.

Next, as shown in FIG. 8I, the second metal film 60 is irradiated with laser light 94 from a laser light source 93, and patterning is performed by laser ablation for removing the irradiated second metal film 60. As a result, the separated second metal film 60 as shown in FIG. 8J is formed. The second metal film 60 is electrically connected to the electrode 24 of the light emitting device 30.

In this way, the light emitting module 100A can be obtained. Further, the second metal film 60 and the wiring 72 of the wiring board 70, which is separately prepared, can be adhered to each other, whereby the light emitting module 100 including the wiring board 70 as shown in FIG. 1B can be obtained.

The plurality of light source members 20 can be wired so that they are independently driven. In addition, the light guide plate 10 is divided into a plurality of ranges, and the plurality of light emitting devices 30 mounted in one range are set as one group, and the plurality of light emitting devices 30 in one group are electrically connected in series or in parallel. A plurality of such light emitting device (light source member) groups may be provided by connecting to the same circuit. By performing such grouping, a light emitting module capable of local dimming can be obtained.

Embodiment 2
Next, a light emitting module 100B according to a second embodiment of the present invention will be described with reference to FIGS. 9A to 9C. 9A is a sectional view of the light emitting module 100B, FIG. 9B is an enlarged sectional view showing one light source member and its vicinity in the sectional view of FIG. 9A, and FIG. 9C shows a configuration of the light source member 120. It is sectional drawing shown.

The light emitting module 100B of the second embodiment has the same configuration as that of the first embodiment except that the configuration of the light source member 120 is different from that of the first embodiment, as shown in FIGS. 9A to 9C. Here, in FIGS. 9A to 9C, the same members as the members described in the first embodiment are denoted by the same reference numerals, and specific description of the same members is omitted.
Hereinafter, with respect to the light emitting module 100B of the second embodiment, portions different from the first embodiment will be described.

In the light emitting module 100B of the second embodiment, the light source member 120 has the light diffusion light guide member 127 provided on the upper surface of the wavelength conversion member 126. The light diffusion light guide member 127 is a translucent member containing a light diffusion material, and diffuses the light emitted from the upper surface of the wavelength conversion member 126 in the lateral direction and emits the light.

In the example shown in FIG. 9C, the third concave portion 126r is formed on the upper surface of the wavelength converting member 126, and the light diffusing and guiding member 127 includes the wavelength converting member 126 inside the third concave portion 126r and around the third concave portion 126r. It is provided on the upper surface. Here, in the example illustrated in FIG. 9C, the upper surface of the wavelength conversion member 126 includes the inner surface of the third recess 126r and the upper surface of the wavelength conversion member 126 around the third recess 126r. Further, in FIG. 9C and the like, the size of the third recess 126r is drawn to be the same size as the main light emitting surface 21a of the light emitting element 21, but the present invention is not limited to this, and the size of the third recess 126r is not limited to this. The shape in plan view may be larger or smaller than that of the main light emitting surface 21a.

In the light emitting module 100B of the second embodiment, the light diffusion light guide member 127 has a function of spreading light within the plane of the light guide plate 10, similarly to the optical function section 111 described in the first embodiment. The light diffusing and guiding member 127 is preferably provided such that the central axis of the light diffusing and guiding member 127 coincides with the central axis of the main light emitting surface of the light emitting element 21. It is possible to spread the light uniformly in the inside, in other words, in the plane without being biased in a specific direction.

The light diffusion light guide member 127 preferably emits the light emitted from the upper surface of the wavelength conversion member 126 without absorbing it, and transmits, for example, 60% or more of the light emitted from the upper surface of the wavelength conversion member 126. , Preferably 90% or more. Since the light diffusing and guiding member 127 has the above-mentioned translucency and light diffusing property, for example, the light diffusing and guiding member 127 converts the light whose wavelength is converted by the light emitting element 21 and the wavelength converting member 126 into, for example, A light transmissive member, which is a base material made of a light transmissive material that transmits 60% or more, preferably 90% or more, contains a light diffusing substance that reflects the light without absorbing it. ..

As the translucent material forming the translucent member, a translucent thermosetting resin material such as an epoxy resin or a silicone resin can be used. Examples of the light diffusing substance include fine particles such as SiO ₂ , TiO ₂ , Al ₂ O ₃ , and ZnO.

In the light diffusing and guiding member 127, the ratio of the light diffusing substance contained in the translucent member is based on the characteristics required for the light emitting module 100B, and the light reflectivity, particle size and particle size distribution of the material used as the light diffusing substance, It is set as appropriate in consideration of the shape of the light guide plate 10.

In the light emitting module 100B configured as described above, the light wavelength-converted by the light emitting element 21 and the wavelength conversion member 126 can be uniformly spread within the surface of the light guide plate 10 without using the optical function section.
Therefore, according to the light emitting module 100B of the second embodiment, it is possible to emit light with less color unevenness and brightness unevenness from the main light emitting surface 11 of the light guide plate 10 without using the optical function section.

Further, according to the light emitting module 100B of the second embodiment, light can be uniformly spread and emitted from the light source member 120 into the surface of the light guide plate 10, so that the main light emission of the light guide plate 10 can be performed without using the optical function section. Light with less color unevenness and brightness unevenness can be emitted from the surface 11, and a thin surface emitting light source can be provided.

In addition, in the light emitting module 100B of the second embodiment, in addition to the light source member 120 including the light diffusing light guide member 127, the light guide plate 10 may be further provided with an optical function section.

The light emitting module 100B of the second embodiment described above can be manufactured by the same method as that of the light emitting module 100A of the first embodiment except that the step of forming the light diffusion member 127 is included in the step of manufacturing the light source member 120. ..

In the second embodiment, the light source member 120 is manufactured as follows, for example.
As shown in FIG. 6A referred to in the first embodiment, a plurality of light emitting elements 21 are arranged on a support 80 with a pair of electrodes facing down.
Then, the uncured wavelength conversion member 126 is formed so as to fill the light emitting element 21.
Next, the third recesses 126r are formed on the upper surface of the wavelength conversion member 126 before curing, at positions facing the light emitting elements 21, respectively, using a mold, for example. The wavelength conversion member 126 is cured while maintaining the shape of the third recess 126r.
Next, an uncured translucent resin material containing a light diffusing substance is formed on the upper surface of the cured wavelength conversion member 126 so as to fill each of the third recesses 126r.
Then, the light transmissive resin material is cured to form an integrated light reflective light guide member layer on the wavelength conversion member 126.
Next, as described with reference to FIG. 6C, cutting is performed using the cutting blade 82 such as a dicer. The light source member 120 can be obtained as described above.

Modification 1 of Embodiment 2
The light emitting module 100B of the second embodiment has been described by using the light source member 120 shown in FIG. 9C. However, the light emitting module 100B of the second embodiment may be configured using the light source member 120a shown in FIG. 10A. The light source member 120a illustrated in FIG. 10A includes a wavelength conversion member 126a that does not include the third recess 126r in place of the wavelength conversion member 126 that includes the third recess 126r illustrated in FIG. 9C, and the wavelength conversion member 126a is flat. 9C is different from the light source member 120 shown in FIG. 9C in that it has a light diffusion light guide member 127a having a substantially constant thickness on its upper surface.

The light emitting module 100B of the second embodiment can also be configured by using the light source member 120a configured as above.

Modification 2 of Embodiment 2
The light emitting module 100B of the second embodiment has been described by using the light source member 120 shown in FIG. 9C. However, the light emitting module 100B of the second embodiment may be configured using the light source member 120b shown in FIG. 10B. The light source member 120b shown in FIG. 10B is the same as FIG. 9C in that it has the wavelength conversion member 126 having the third recess 126r shown in FIG. 9C, but the light source member 120b shown in FIG. It differs from the light source member 120 shown in FIG. 9C in that the light diffusion light guide member 127b is provided only inside the recess 126r.

The light emitting module 100B of the second embodiment can also be configured by using the light source member 120b configured as described above.

As described in Modifications 1 and 2 above, in the light source member, the light diffusion light guide member can be formed in various forms on the upper surface of the wavelength conversion member. 9C, 10A, and 10B, for example, the third concave portion may be formed in a pyramid or frustum shape, and light may be formed so as to extend only inside or around the inside. You may make it form a diffusion light guide member.
Furthermore, the third recess may be a polygonal pyramid such as a quadrangular pyramid or a hexagonal pyramid.

Modification 3 of Embodiment 2
The light emitting module 100B of the second embodiment may be configured using the light source member 120c shown in FIG. 11A. The light source member 120c shown in FIG. 11A is different from the light source member 120b shown in FIG. 10B in that the side surface of the wavelength conversion member 126c is inclined. The light source member 120c is similar to the light source member 120b shown in FIG. 10B except that the side surface of the wavelength conversion member 126c is inclined.

More specifically, the thickness of the wavelength conversion member 126c that covers the side surface of the light emitting element 21 near the electrode formation surface of the light emitting element 21 is substantially zero, and the wavelength conversion member 126c from the electrode formation surface of the light emitting element 21 to the main light emitting surface 21a. The thickness is gradually increasing toward the end.
Further, FIG. 11B is a cross-sectional view showing an enlarged part of the cross section of the light emitting module when the light source member 120c shown in FIG. 11A is mounted.

In the light emitting module configured to include the light source member 120c of Modification 3 configured as described above, since the side surface of the wavelength conversion member 126c in the light source member 120c is inclined, the area of the side surface of the optical member 120c is small. It can be increased as compared with the case where there is no inclination. Thereby, the light emitted to the light guide plate 10 can be increased, and the brightness of the light emitting module can be increased.

One of the light emitting modules 100 of the present embodiment may be used as a backlight of one liquid crystal display device. Further, a plurality of light emitting modules 100 may be arranged and used as a backlight of one liquid crystal display device.

One light emitting module 100 may be bonded to one wiring board 70. Further, the plurality of light emitting modules 100 may be joined to one wiring board 70. Thereby, the electrical connection terminals (for example, connectors) with the outside can be integrated (that is, it is not necessary to prepare each light emitting module for each), so that the structure of the liquid crystal display device can be simplified.

Further, a plurality of one wiring board 70 to which the plurality of light emitting modules 100 are joined may be arranged to form a backlight of one liquid crystal display device. At this time, for example, a plurality of wiring boards 70 can be placed on a frame or the like, and each can be connected to an external power source using a connector or the like.

The light emitting module according to the present disclosure can be used, for example, as a backlight of a liquid crystal display device.

100, 100B... Light emitting module 10... Light guide plate 11... 1st main surface (light extraction surface)
111... Optical function part 111a... Bottom surface of optical function part 111b... Side surface of optical function part 112... Low refractive index member 113... First reflection member 12... Second main surface 121... First recess 121a... Bottom surface 121b of first recess 121b ... Side surface of first concave portion 122... Second concave portion 122a... Bottom portion of second concave portion 122b... Side surface of second concave portion 20, 120, 120a, 120b, 120c... Light source member 20a... Light emitting surface of light source member 20b... Electrode of light source member Forming surface 20c... Side surface of light source member 21... Light emitting element 21a... Main light emitting surface 21b... Electrode forming surface 21c... Side surface 22... Semiconductor laminated body 22p... P-type semiconductor layer 22n... N-type semiconductor layer 22a... Light-emitting layer 22s... Element substrate 24... Electrode 24p... P electrode 24n... N electrode 25... 1st metal film 26, 126, 126a, 126c... Wavelength conversion member 27... 2nd reflective member 30, 30A, 30B... Light-emitting device 40... Joining member 50... Sealing Member 60... Second metal film 70... Wiring substrate 71... Base material 72... Wiring 80... Support 81... Squeegee 82... Cutting blade 83... Spray nozzle 84... Dispensing nozzle 90... Grinding member 91... Blast nozzle 92... Particle 93... Laser light source 94... Laser light 126r... Third recess 127, 127a, 127b... Light diffusion light guide member

Claims (9)

A light guide plate having a first main surface and a second main surface opposite to the first main surface;
The light source member is disposed on the second main surface side, and includes a main light emitting surface, an electrode forming surface located on the opposite side of the main light emitting surface, and a side surface between the main light emitting surface and the electrode forming surface. A light emitting element having
A plurality of light source members including a wavelength conversion member that covers the main light emitting surface and the side surface of the light emitting element,
A sealing member that covers the second main surface of the light source member and the light guide plate;
Equipped with
The light emitting element has an element substrate on the main light emitting surface side,
The light guide plate has a plurality of first recesses located on the second main surface, and the light source members are arranged such that 20% or more of the side surfaces of the element substrate are located in the first recesses in a cross-sectional view. Light emitting module. The said light guide plate has a 2nd recessed part which surrounds the said 1st recessed part, and the low refractive index member whose refractive index is lower than the said light guide plate is arrange|positioned in the said 2nd recessed part. Light emitting module. The light guide plate has a second recess that divides the second main surface into a plurality of regions, the first recesses are provided in the regions that are respectively divided by the second recesses, and the sealing member is The light emitting module according to claim 1, wherein the light emitting module is also arranged in the second recess. The light-emitting module according to claim 1, wherein the light guide plate includes an optical function section that is located on the first main surface and is located at a position corresponding to the first recess. The light emitting module according to claim 4, wherein the optical function unit includes a first reflecting member. The light emitting module according to claim 4 or 5, wherein the optical function portion is a conical or frustum-shaped recess having a cross-sectional area that decreases toward a light emitting surface of the light emitting element. The light emitting module according to claim 1, wherein the light source member includes a light diffusion light guide member provided on a wavelength conversion member located on the main light emitting surface. The light emitting module according to claim 7, wherein the light diffusion light guide member includes a light diffusion material. 9. The light emitting module according to claim 1, wherein the light source member includes a second reflecting member that covers the electrode formation surface of the light emitting element.

Images