JP4106876B2 - Light emitting device - Google Patents

Light emitting device Download PDF

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Publication number
JP4106876B2
JP4106876B2 JP2001101923A JP2001101923A JP4106876B2 JP 4106876 B2 JP4106876 B2 JP 4106876B2 JP 2001101923 A JP2001101923 A JP 2001101923A JP 2001101923 A JP2001101923 A JP 2001101923A JP 4106876 B2 JP4106876 B2 JP 4106876B2
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Prior art keywords
light
guide plate
light guide
emitting device
led
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JP2002298629A (en
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義則 清水
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Nichia Corp
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Nichia Corp
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Description

【0001】
【発明の属する技術分野】
本発明は、液晶バックライトやスイッチの押しボタン、表札や各種表示板など広い用途に、効率の良い均一な発光装置を得る手段を提供するためになされたものである。特に、液晶バックライトにおいて、不要な非発光部をほぼ無くすことができ、携帯機器の小型化に貢献するとともに、光の利用効率も上がり、明るく、低消費電力にすることができる導光板を用いた発光装置に関する。
【0002】
【従来の技術】
従来、液晶のバックライトにおいては、導光板の周辺に光源を配した、いわゆる「サイド型」とか「エッジライト方式」と言われる物が主流であった(図5)。一方直下型と言われる光源を有効発光部に配した発光装置も存在するが、光源近傍の輝度むらを無くすことが難しく、拡散シートなどを介すると輝度低下を招くなど、輝度とむらが両立せず、しだいにサイド型に取って代わられた経緯がある。
【0003】
ところが、サイド型は光源部を導光板の一端に配するため、光源部近傍はむらのため有効発光部にはならず、不要なスペースを必要とした。このことは携帯電話や携帯端末など小型化が進む機器には大きな障害となる。
さらに、TFTカラー液晶のバックライトなどに使用するとき、要求光度が高いため光源の消費電力が大きくなるが、光源が一部に集中して配置されるため、局所的発熱、温度上昇が大きくなり、特に半導体発光素子光源を用いた場合、信頼性や寿命に少なからぬ影響を与えることとなる。
【0004】
【発明が解決しようとする課題】
本発明はこのような欠点を解決するために成されたもので、その目的とするところは、LEDを用い、主としてバックライトとして利用できる白色発光可能な発光装置を実現すると共に、均一な白色発光を観測できる発光装置を提供することにあり、さらには白色以外の任意色の発光が可能な発光装置を提供し、将来性に優れたLEDの特性を利用し、各種操作スイッチ等に利用することにある。
【0005】
【課題を解決するための手段】
本発明の発光装置は、互いに対向する上面と下面を有する導光板(2)と、少なくとも1つのLED素子(1)を有し、該LED素子からの光を上記導光板の下面から入射し、上記導光板の上面から光を出射する発光装置であって、上記導光板は、上記LED素子と対向する上面に窪み(4)を有し、該窪みは、上面に向かって近付くにつれ徐々に広がるように形成されていることを特徴とする。これにより、下面から出射した光は窪み部分で全反射し、進行方向を導光板上面に対して平行方向へ進路変更する。
また、上記導光板は、上記窪みの上面角部が面取りされていることを特徴とする。面取りすることによって輝度ムラを緩和している。
また、上記窪みは、上記導光板の上面から下面へ貫通しても良い(【図1】(c)参照)ことを特徴とする。窪みの斜面部分に当たった光は周辺に向けて全反射する構成になっているため、導光板を上面側から見た時、窪み部分がそれ以外の部分と比較して暗い場合がある。この現象を解決するため本件発明は、窪みを貫通させ、下面から入射した光の1部を貫通部から窪み部分上部に直接出射させる。
【0006】
さらに、上記窪みは、少なくとも2以上のLED素子にわたって対向するように線状に形成(5)されていることを特徴とする。本発明は窪みの数とLED素子の数を一致させる必要はなく、LED素子と対向する導光板の上面に窪みがあればよく、1つの窪みが2つ以上のLED素子に渡って形成させることで窪み形成工程を簡易にすることができる。
【0007】
その上、上記導光板は、上面から下面に貫通し、上面に向かって近付くにつれ徐々に広がるように形成されている線状の切り込み(9)を有し、該切り込みを介して、互いに異なる波長のLED素子を配置していることを特徴とする。この切り込みの面において導光板の上面と平行方向に進んでいる光が全反射し、切り込み内に閉じ込められるため、導光板内で異なる波長の光が交じり合わない。
【0008】
【発明の実施の形態】
本発明は上記種々の問題点を解決するためになされたものであり、LED素子から出た光を速やかに横方向に拡げるとともに、導光板から上面に向かって出てくる光を阻害することなく、均一で明るく、効率の良い優れた発光装置を提供することができる。また、光源を面全体に配置することにより、より明るい設計が可能となる(図1)。たとえば、光源を一辺に配すると寸法的に実装できるLED素子の数は限られるが、面全体に配置させることがにより、任意の数を用いることができる。もう一つの長所は、LEDを1辺にまとめて配置させないので、局所的発熱が押さえられ、全体の信頼性が向上するとともに、液晶の温度特性に与える影響も少なくなる。一般に半導体は信頼性が高いものの、温度の上昇には弱いのでこのようにして動作温度を下げることが信頼性の向上につながる。また液晶にも温度特性があり、面内の温度むらは表示品質に悪影響を及ぼすことがある。
【0009】
具体的には、導光板には光源部から上面に向かって近付くにつれ徐々に広がるような種々の形状を持った窪み4、5を有し、導光板の上・下面には光を散乱する手段を配し(図示せず)、全体として均一になるように構成された発光装置を形成する。この窪みの角度は、導光板の材質の屈折率により最適化される。光を拡散させる手段(通常はシボパターンであることが多いので、以下は単にシボパターンと呼ぶ)と併用されるので必ずしも対称である必要もないが、もっとも好ましいのは対称形である。窪みの形状は種々考えられるが、金型制作や設計の容易さを考慮すれば、円錐状構造が好ましい。むろん光源の形や配置によって三角錐状、四角錐状、五角錐状等の多角錐状でも良い(図1(b)の欄外参照)。全方向に光を広げるのであれば円錐状が好ましく、特定の方向へ光を広げるには三角錐状等の形の方が好ましい。目的によって形状からくる作用効果を使い分ける必要がある。いずれの形にしても鋭角の角は線状の輝度むらを生じやすいく、シボパターンに工夫を要するので、面取りすることが好ましい。同様に窪みと導光板の上面との接点も、形状に沿った輝度の高いむらを生じることがあり、なめらかに面取りすることが好ましい。
また、平面部分と窪み部分で輝度に差が生じないように、窪みの深さを調節する(図1(c)の欄外参照(貫通も含む))。これにより導光板の上面から均一な発光輝度が得られる。
図1に示すように、LED素子は回路基板上に分散させると、面内の輝度ムラが生じにくく、放熱性に優れている。
図2、3に示すように連続(直線若しくは曲線を含む)に配置させても使用できる。このようにして作られた発光装置は、ほとんど全域が有効発光部として使用できる。
【0010】
また、サイドライト型では同時に複数色を導光体の別々の部分から発光させるのは不可能であった。本発明では、図6に示すように、異なる色のLED素子を複数個使用し、その異なる色のLED素子が隣り合う部分の導光板に切り込みを入れることにより簡単に色分けできる。ここで同じ色のLED素子が隣り合う部分の導光板に切り込みを入れても問題はないし、異なる色のLEDが隣り合う部分の導光板にあえて切り込みを入れずに混色を発光させることもできる。
【0011】
以下、本発明に係る面発光装置における各要素に関する好ましい材料等について説明する。
(導光板)
本発明において導光板に用いられる材料としては、光透過性、成形性に優れたものを用いることが好ましく、アクリル樹脂、ポリカーボネート樹脂、非晶性ポリオレフィン樹脂、ポリスチレン樹脂等が挙げられる。これらの導光板用の材料はそれぞれ屈折率が異なるが、導光板上面に形成する窪みの形状、更にはその数等を選定することによって、いかなる屈折率の材料にも対応できる。
(LED光源)
本発明のLED光源において、1又は2以上のLEDチップを用いることができる。また、LEDチップからの光を直接導光板に入射するようにしても良いし、例えば紫外〜可視光の発光が可能なLEDチップと、LEDチップからの光を吸収してそれよりも長波長の可視光が発光可能な蛍光物質とを組み合わせて、LEDチップから出力される光とは波長の異なる光を導光板内に入射するようにしてもよい。
【0012】
すなわち、本発明において、LEDチップを蛍光体と組み合わせて用いることにより、発光素子と蛍光物質の組み合わせによって、様々な色調の混合色を発光させることが可能である。
【0013】
以下、液晶のバックライト等に最もよく用いられ、需要が高い白色発光LEDついて、窒化物半導体を有してなり青色の発光が可能なLEDチップと、セリウムで付活されたイットリウム・アルミニウム・ガーネット蛍光体を用いた例について説明する。
(LEDチップ)
ここで用いることができる、窒化物系化合物半導体(一般式InGaAlN、但し、0≦i、0≦j、0≦k、i+j+k=1)としては、InGaNや各種不純物がドープされたGaNをはじめ、種々のものがある。
【0014】
このLEDチップは、MOCVD法等により基板上にInGaNやGaN等の半導体を発光層として成長させることにより形成する。半導体の構造としては、MIS接合、PI接合やPN接合などを有すホモ構造、ヘテロ構造あるいはダブルヘテロ構造のものが挙げられる。この窒化物半導体層は、その材料やその混晶度によって発光波長を種々選択することができる。また、半導体活性層を量子効果が生ずる薄膜で形成した単一量子井戸構造や多量子井戸構造とすることもできる。
【0015】
本発明において、LEDチップとしては、青色発光可能な半導体発光層を有し、後述するセリウムで付活されたイットリウム・アルミニウム・ガーネット系蛍光体を効率よく励起できるLEDチップを用いることが好ましい。
(蛍光体)
本発明に利用可能な蛍光物質は、LEDから出力される光によってLED光よりも長波長の可視光を発光可能な蛍光物質ならばなにでもよく、また、発光色は紫色〜赤色までの全ての可視光のものが適用できる。具体的には、ケイ酸塩系蛍光体、リン酸塩系蛍光体、アルミン酸系蛍光体、希土類系蛍光体、酸希土類系蛍光体、硫化亜鉛系蛍光体などが挙げられる。具体的には緑色系発光蛍光体では、YSiO:Ce,Tb、MgAl1119:Ce,Tb、BaMgAl1627:Mn、(Zn,Cd)S:Ag、ZnS:Au,Cu,Al、ZnS:Cu,Al、SrAl:Eu、青色系発光蛍光体では(SrCaBa)(POCl:Eu、(BaCa)(POCl:Eu、BaMgAl1627:Eu、Sr(POCl:Eu、Sr:Eu、ZnS:Ag、Al、ZnS:Ag,Al(pigmented)、ZnS:AgCl、ZnS:AgCl(pigmented)、赤色系発光蛍光体ではYS:Eu、YS:Eu(pigmented)、Y:Eu、3.5MgO・0.5MgF・GeO:Mn、Y(PV)O:Eu、5MgO・3LiO・Sb:Mn、MgTiO:Mn、黄色系発光蛍光体ではMgLiSb13:Mn、MgTiO:Mn、(YGd1−ZAl12:Ce等が挙げられる。比較的発光効率が高いものとしては、緑色系発光蛍光体ではSrAl:Eu、青色系発光蛍光体ではSr(POCl:Eu、赤色系発光蛍光体ではYS:Eu、黄色系発光蛍光体では(YGd1−ZAl12:Ceが挙げられる。
【0016】
以下に本発明の1実施の形態である実施例を示す。しかし本発明はこれに限定されない。
【0017】
【実施例1】
例として有効サイズ1.5インチ、縦横比3:4のTFTカラー液晶用のバックライトを作った。この導光板の材料としてポリカーボネートを用い、導光板形成用の金型は、導光板上面の窪みが4カ所形成されるようにしてある。また、その金型は、導光板の下面に上面から発光される光の均一性を向上させるための凹凸(シボ)加工が施されるように作製される。導光板の成形は、まず、成形温度を280℃に設定してポリカーボネートを溶融させながら、射出圧力1000kgf/cm2、金型温度は100℃で射出成型する。そして、45秒間冷却した後、金型から取り出す。このようにして導光板を形成した。寸法としては周辺に各1mmの余裕を持たせた。すなわち、縦25mm、横33mmのサイズとした。必要輝度3000ntを得るためにLEDは4個使い、面全体を有効部とするため、LEDは等分割して分割面の中心に配置させた。LEDは表面実装型(以下SMDと略す)を用い、厚さ0.2mmのプリント基板に実装した。プリント基板は放熱を考慮して、LEDダイスが載っている導通部分のパターンを大きく取った。次に導光板は厚さ2mmでLEDの位置に図1に示す形状の連続プリズムを形成した。窪みの上面の平坦部に対する傾斜角は45度とした。角度は本発明が全反射を利用しているため材質の屈折率によって最適な角度が決まる。これは金型で行い、同時にその他の面にもシボパターンを作り均一となるようにした。シボパターンは、コンピュータによる光学シミュレーションによって設計されたが、ここでは複雑になるので触れない。この金型を用いてアクリル樹脂の射出成形を行い、導光板の完成品を得た。導光板の周辺には光の漏れを防ぐためと、液晶の取り付けのために枠が設けられる。この枠も高反射率の処理が必要である。全体を組み立て、プリズムシート2枚をクロスして重ね、弱い拡散シートを最上部において固定し製品とした。
対照として、LEDの同数をサイドに配置した有効部が同サイズのバックライトと、単純な板をおいた直下型バックライトを作った。プリズムシートは同じ構成であるが、拡散シートは面内の輝度むらがMin/Max=0.7以上になるように調整した。
このようにして得られたサンプルを比較した結果、本発明によるサンプルは電流15mA時に面輝度3400nt、LEDの信頼性の目安となるジャンクション温度は、周囲温度25度の時、37度と12度の温度上昇であった。一方、対照としたサイド型は、面輝度2800nt、ジャンクション温度は59度と本発明に比べ22度も高温になっており、しかも、光源部近傍のみが著しく上昇した。もう一方の従来方式の直下型は拡散度の高い、言い換えると透過率の低い拡散シートの使用を余儀なくされ、2000nt以下の輝度しか得られず実用性がなくなってしまった。このように本発明では、輝度と均一性、信頼性の各項目において従来の物より優れた特性を得ることができた。
【0018】
【実施例2】
実施例1と同様にして、5インチサイズのTFT液晶用バックライトを作成した。導光板の材料としてアクリル樹脂を使用し、導光板上面に42の窪みが形成されるような金型を用い、成型温度を250℃、射出圧力1100kgf/cm2、金型温度80℃、冷却時間を約30秒として成型した。LEDは6個×7個の配列とした。導光板は104mm×79mmで連続プリズムは実施例1と同形状とした。理由は円形がもっとも加工しやすいからであり、金型加工の労力をいとわなければ三角形、四角形、五角形など選択は自由である。その時でも角部は面取りしておくことがむらをさける意味で好ましい。その他の構成も同様にしてバックライトを作成した。得られたものの特性は電流15mA時に面輝度3500nt、LEDの信頼性の目安となるジャンクション温度は、周囲温度25度の時、39度と14度の温度上昇であった。一方、対照としたサイド型は、1辺にLEDを配置することができず、対向する2辺には位置させることになった。そのためバックライトのサイズとしては否発光部が7mm×2の14mmも不要なスペースを持つ結果となった。また光源部により多くのLEDが集中したため、ジャンクション温度は64度と本発明に比べ25度も高温になっており、しかも、光源部近傍のみが著しく上昇した。長期的な寿命や故障率に関して多少懸念される状態となった。明るさも面輝度2700ntと、本発明に比べて23%低く、並べて比較するとかなり見劣りのする結果となった。
【0019】
【発明の効果】
以上詳述したごとく、本発明はLEDを導光板下面に分散、または連続に配置させることで、均一で、高効率、高輝度の発光装置を得ることができる。また、サイドに不要なスペースを設ける必要がないので、放熱が全面から均等に行われるため素子の温度上昇をさけることができ、結果として長寿命、高信頼性が得られるものである。また実施例では示さなかったが、バックライト以外にも表札や各種表示器、案内板やスイッチなどにも応用できるのは当然である。
また、異なる発光色のLEDを用いることによって、区画ごとの色分けなどが簡単にでき、商品デザインにおいて画期的効果を期待できる。
【図面の簡単な説明】
【図1】 本発明に係る実施の形態の発光装置である。(a)は斜視図、(b)は平面図、(c)は(b)のA−A’線における断面図である。
【図2】 本発明に係る実施の形態の発光装置である。(a)は斜視図、(b)は平面図、(c)は(b)のB−B’線における断面図である。
【図3】 本発明に係る実施の形態の発光装置である。(a)は斜視図、(b)は平面図、(c)は(b)のC−C’線における断面図である。
【図4】 本発明に係る発光装置の完成体の断面図である。
【図5】 従来技術の発光装置の完成体の断面図である。
【図6】 本発明に係る区画ごとに色分けされた発光装置である。(a)は斜視図、(b)は平面図、(c)は(b)のD−D’線における断面図である。
【符号の説明】
1…LED素子
2…導光板
3…回路基板
4…窪み
5…線状の窪み
6…プリズムシート
7…拡散シート
8…枠
9…切り込み
[0001]
BACKGROUND OF THE INVENTION
The present invention has been made to provide means for obtaining an efficient and uniform light-emitting device for a wide range of applications such as liquid crystal backlights, switch push buttons, nameplates, and various display boards. In particular, in liquid crystal backlights, unnecessary light-emitting parts can be almost eliminated, contributing to downsizing of portable devices, light utilization efficiency is increased, bright and low power consumption is used. The present invention relates to a light emitting device.
[0002]
[Prior art]
Conventionally, the so-called “side type” or “edge light type” in which the light source is arranged around the light guide plate has been the mainstream in the backlight of the liquid crystal (FIG. 5). On the other hand, there is a light-emitting device that has a light source called a direct type in the effective light-emitting part, but it is difficult to eliminate luminance unevenness in the vicinity of the light source. There was a history of being gradually replaced by the side type.
[0003]
However, in the side type, since the light source part is arranged at one end of the light guide plate, the vicinity of the light source part is uneven, so that it is not an effective light emitting part, and an unnecessary space is required. This is a major obstacle for devices that are becoming smaller, such as mobile phones and mobile terminals.
In addition, when used in TFT color liquid crystal backlights, etc., the required light intensity is high, which increases the power consumption of the light source. However, since the light source is concentrated in a part, local heat generation and temperature rise increase. In particular, when a semiconductor light-emitting element light source is used, the reliability and lifetime are significantly affected.
[0004]
[Problems to be solved by the invention]
The present invention has been made to solve such drawbacks, and an object of the present invention is to realize a light emitting device capable of emitting white light that can be used mainly as a backlight, using LEDs, and uniform white light emission. To provide a light-emitting device that can observe light, and to provide a light-emitting device that can emit light of any color other than white, and to use it for various operation switches, etc., utilizing the characteristics of LEDs with excellent future potential It is in.
[0005]
[Means for Solving the Problems]
The light emitting device of the present invention has a light guide plate (2) having an upper surface and a lower surface facing each other, and at least one LED element (1), and light from the LED element is incident from the lower surface of the light guide plate, A light-emitting device that emits light from the upper surface of the light guide plate, wherein the light guide plate has a recess (4) on the upper surface facing the LED element, and the recess gradually spreads toward the upper surface. It is formed as follows. As a result, the light emitted from the lower surface is totally reflected at the depression, and the traveling direction is changed in a direction parallel to the upper surface of the light guide plate.
Further, the light guide plate is characterized in that an upper surface corner portion of the depression is chamfered. Uneven brightness is reduced by chamfering.
Further, the depression may penetrate from the upper surface to the lower surface of the light guide plate (see FIG. 1 (c)). Since the light striking the sloped portion of the recess is totally reflected toward the periphery, the recess may be darker than the other portions when the light guide plate is viewed from the upper surface side. In order to solve this phenomenon, the present invention allows a recess to penetrate and emits a portion of light incident from the lower surface directly from the penetration to the upper portion of the recess.
[0006]
Furthermore, the said hollow is linearly formed (5) so that it may oppose over at least 2 or more LED element, It is characterized by the above-mentioned. In the present invention, it is not necessary to match the number of depressions with the number of LED elements, and it is sufficient that there is a depression on the upper surface of the light guide plate facing the LED element, and one depression is formed across two or more LED elements. Thus, the depression forming process can be simplified.
[0007]
In addition, the light guide plate has a linear notch (9) formed so as to penetrate from the upper surface to the lower surface and gradually spread as approaching the upper surface, and the wavelengths different from each other through the notch. The LED element is arranged. The light traveling in the direction parallel to the top surface of the light guide plate is totally reflected on the cut surface, and is confined in the cut, so that light of different wavelengths does not mix in the light guide plate.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
The present invention has been made to solve the above-described various problems, and quickly spreads the light emitted from the LED element in the lateral direction without interfering with the light emitted from the light guide plate toward the upper surface. An excellent light-emitting device that is uniform, bright, and efficient can be provided. In addition, a brighter design is possible by arranging the light source over the entire surface (FIG. 1). For example, when the light source is arranged on one side, the number of LED elements that can be dimensionally mounted is limited, but an arbitrary number can be used by arranging the light source on the entire surface. Another advantage is that the LEDs are not arranged together on one side, so that local heat generation is suppressed, the overall reliability is improved, and the influence on the temperature characteristics of the liquid crystal is reduced. In general, although semiconductors have high reliability, they are vulnerable to temperature rise, and thus lowering the operating temperature in this way leads to improvement in reliability. Liquid crystals also have temperature characteristics, and uneven temperature in the surface may adversely affect display quality.
[0009]
Specifically, the light guide plate has depressions 4 and 5 having various shapes that gradually spread as approaching the upper surface from the light source unit, and means for scattering light on the upper and lower surfaces of the light guide plate. (Not shown) to form a light-emitting device configured to be uniform as a whole. The angle of the depression is optimized by the refractive index of the light guide plate material. Since it is used in combination with a means for diffusing light (usually called a wrinkle pattern since it is often a wrinkle pattern), it is not necessarily required to be symmetric, but the most preferable is a symmetric shape. Various shapes of the recess are conceivable, but a conical structure is preferable in view of ease of mold production and design. Of course, it may be a polygonal pyramid shape such as a triangular pyramid shape, a quadrangular pyramid shape, a pentagonal pyramid shape or the like depending on the shape and arrangement of the light source (see the margin of FIG. 1B). A conical shape is preferable if light is spread in all directions, and a triangular pyramid shape or the like is preferable for spreading light in a specific direction. Depending on the purpose, it is necessary to use different effects from the shape. In any form, sharp corners are less likely to cause linear luminance unevenness, and the wrinkle pattern needs to be devised, so chamfering is preferable. Similarly, the contact between the recess and the upper surface of the light guide plate may cause uneven brightness with high shape, and is preferably chamfered smoothly.
Further, the depth of the dent is adjusted so that there is no difference in luminance between the flat portion and the dent portion (see the margin in FIG. 1C (including the penetration)). Thereby, uniform light emission luminance is obtained from the upper surface of the light guide plate.
As shown in FIG. 1, when LED elements are dispersed on a circuit board, in-plane luminance unevenness hardly occurs and the heat dissipation is excellent.
As shown in FIGS. 2 and 3, they can be used even if they are arranged continuously (including straight lines or curves). In the light emitting device thus manufactured, almost the entire region can be used as an effective light emitting unit.
[0010]
In the side light type, it is impossible to simultaneously emit light from a plurality of colors from different portions of the light guide. In the present invention, as shown in FIG. 6, a plurality of LED elements of different colors are used, and the different color LED elements can be easily color-coded by making a cut in the light guide plate in the adjacent part. Here, there is no problem even if the LED elements of the same color are cut into adjacent light guide plates, and different color LEDs can emit mixed colors without being cut into adjacent light guide plates.
[0011]
Hereinafter, preferred materials and the like regarding each element in the surface light emitting device according to the present invention will be described.
(Light guide plate)
In the present invention, the material used for the light guide plate is preferably a material excellent in light transmittance and moldability, and examples thereof include acrylic resin, polycarbonate resin, amorphous polyolefin resin, and polystyrene resin. These light guide plate materials have different refractive indexes, but any refractive index material can be used by selecting the shape of the recess formed on the upper surface of the light guide plate, and the number of the recesses.
(LED light source)
In the LED light source of the present invention, one or two or more LED chips can be used. Further, the light from the LED chip may be directly incident on the light guide plate. For example, the LED chip capable of emitting ultraviolet to visible light, and the light from the LED chip are absorbed to have a longer wavelength than that. In combination with a fluorescent material capable of emitting visible light, light having a wavelength different from that of the light output from the LED chip may be incident on the light guide plate.
[0012]
That is, in the present invention, by using the LED chip in combination with the phosphor, it is possible to emit mixed colors having various color tones depending on the combination of the light emitting element and the fluorescent material.
[0013]
In the following, for white light-emitting LEDs that are most often used for liquid crystal backlights and the like, LED chips that have nitride semiconductors and can emit blue light, and yttrium, aluminum, and garnet activated with cerium An example using a phosphor will be described.
(LED chip)
A nitride compound semiconductor (general formula In i Ga j Al k N, where 0 ≦ i, 0 ≦ j, 0 ≦ k, i + j + k = 1) that can be used here is doped with InGaN or various impurities. There are various types including GaN.
[0014]
This LED chip is formed by growing a semiconductor such as InGaN or GaN as a light emitting layer on a substrate by MOCVD or the like. Examples of the semiconductor structure include a homostructure, a heterostructure, or a double heterostructure having a MIS junction, a PI junction, a PN junction, and the like. The nitride semiconductor layer can have various emission wavelengths depending on the material and the degree of mixed crystal. Moreover, it can also be set as the single quantum well structure and multiquantum well structure which formed the semiconductor active layer with the thin film which produces a quantum effect.
[0015]
In the present invention, it is preferable to use an LED chip that has a semiconductor light emitting layer capable of emitting blue light and can efficiently excite cerium-activated yttrium / aluminum / garnet phosphors, which will be described later.
(Phosphor)
The fluorescent material usable in the present invention may be any fluorescent material capable of emitting visible light having a wavelength longer than that of the LED light by the light output from the LED, and the emission color is all from purple to red. The visible light can be applied. Specific examples include silicate phosphors, phosphate phosphors, aluminate phosphors, rare earth phosphors, rare earth acid phosphors, and zinc sulfide phosphors. Specifically, in a green light emitting phosphor, Y 2 SiO 5 : Ce, Tb, MgAl 11 O 19 : Ce, Tb, BaMg 2 Al 16 O 27 : Mn, (Zn, Cd) S: Ag, ZnS: Au , Cu, Al, ZnS: Cu, Al, SrAl 2 O 4 : Eu, (SrCaBa) 5 (PO 4 ) 3 Cl: Eu, (BaCa) 5 (PO 4 ) 3 Cl: Eu BaMg 2 Al 16 O 27 : Eu, Sr 5 (PO 4 ) 3 Cl: Eu, Sr 2 P 2 O 7 : Eu, ZnS: Ag, Al, ZnS: Ag, Al (pigmented), ZnS: AgCl, ZnS: AgCl (pigmented), the red-emitting phosphor Y 2 O 2 S: Eu, Y 2 O 2 S: Eu (pigmented), Y 2 O 3: Eu, 3.5MgO · .5MgF 2 · GeO 2: Mn, Y (PV) O 4: Eu, 5MgO · 3Li 2 O · Sb 2 O 5: Mn, Mg 2 TiO 4: Mn, is yellow-emitting phosphor Mg 5 Li 6 Sb 6 O 13: Mn, Mg 2 TiO 4: Mn, (Y Z Gd 1-Z) 3 Al 5 O 12: Ce and the like. As for those having relatively high luminous efficiency, SrAl 2 O 4 : Eu is used for green light emitting phosphors, Sr 5 (PO 4 ) 3 Cl: Eu is used for blue light emitting phosphors, and Y 2 O 2 is used for red light emitting phosphors. For S: Eu, a yellow light-emitting phosphor, (Y Z Gd 1-Z ) 3 Al 5 O 12 : Ce is exemplified.
[0016]
An example which is one embodiment of the present invention will be described below. However, the present invention is not limited to this.
[0017]
[Example 1]
As an example, a backlight for TFT color liquid crystal having an effective size of 1.5 inches and an aspect ratio of 3: 4 was made. Polycarbonate is used as the material of the light guide plate, and the mold for forming the light guide plate has four depressions on the upper surface of the light guide plate. In addition, the mold is manufactured such that the lower surface of the light guide plate is subjected to unevenness (texture) processing for improving the uniformity of light emitted from the upper surface. The light guide plate is molded by first injection molding at an injection pressure of 1000 kgf / cm 2 and a mold temperature of 100 ° C. while melting the polycarbonate by setting the molding temperature to 280 ° C. And after cooling for 45 seconds, it takes out from a metal mold | die. In this way, a light guide plate was formed. As for the dimensions, a margin of 1 mm was provided around the periphery. That is, the size was 25 mm in length and 33 mm in width. In order to obtain the required brightness of 3000 nt, four LEDs were used, and the entire surface was used as an effective part, so that the LEDs were equally divided and placed at the center of the divided surface. The LED was mounted on a printed circuit board having a thickness of 0.2 mm using a surface mount type (hereinafter abbreviated as SMD). In consideration of heat dissipation, the printed circuit board has a large pattern of conductive portions on which the LED dice are mounted. Next, the light guide plate had a thickness of 2 mm, and a continuous prism having the shape shown in FIG. 1 was formed at the position of the LED. The inclination angle with respect to the flat portion of the upper surface of the depression was 45 degrees. Since the present invention uses total reflection, the optimum angle is determined by the refractive index of the material. This was done with a mold, and at the same time, a wrinkle pattern was made on the other surface to make it uniform. The wrinkle pattern was designed by optical simulation using a computer, but it is not touched here because it is complicated. Using this mold, injection molding of acrylic resin was carried out to obtain a finished light guide plate. A frame is provided around the light guide plate to prevent light leakage and to attach a liquid crystal. This frame also requires high reflectivity processing. The whole was assembled, and two prism sheets were crossed and overlapped, and a weak diffusion sheet was fixed at the top to make a product.
As a control, a backlight having the same number of LEDs arranged on the side and having an effective portion of the same size and a direct type backlight with a simple plate were made. The prism sheet has the same configuration, but the diffusion sheet was adjusted so that the in-plane luminance unevenness was Min / Max = 0.7 or more.
As a result of comparing the samples obtained in this way, the sample according to the present invention has a surface brightness of 3400 nt at a current of 15 mA, and the junction temperature that is a measure of LED reliability is 37 degrees and 12 degrees when the ambient temperature is 25 degrees. The temperature increased. On the other hand, the control side type had a surface brightness of 2800 nt and a junction temperature of 59 ° C., which was 22 ° C. higher than that of the present invention. The other direct type of the other conventional type is forced to use a diffusion sheet having a high diffusivity, in other words, a low transmittance, resulting in a luminance of 2000 nt or less, and the practicality is lost. As described above, in the present invention, it was possible to obtain characteristics superior to conventional products in each of the items of luminance, uniformity, and reliability.
[0018]
[Example 2]
In the same manner as in Example 1, a TFT liquid crystal backlight having a size of 5 inches was prepared. Acrylic resin is used as the material of the light guide plate, a mold having 42 depressions formed on the upper surface of the light guide plate, a molding temperature of 250 ° C., an injection pressure of 1100 kgf / cm 2, a mold temperature of 80 ° C., and a cooling time are set. Molded for about 30 seconds. The LEDs were arranged in a 6 × 7 array. The light guide plate was 104 mm × 79 mm, and the continuous prism had the same shape as in Example 1. The reason is that a circle is the easiest to machine, and a triangle, a quadrangle, a pentagon, etc. can be freely selected unless much effort is required for mold processing. Even at that time, it is preferable to chamfer the corners in order to avoid unevenness. Backlights were created in the same manner for other configurations. The characteristics of the obtained product were a surface brightness of 3500 nt when the current was 15 mA, and the junction temperature, which is a measure of LED reliability, was a temperature increase of 39 degrees and 14 degrees when the ambient temperature was 25 degrees. On the other hand, the side type used as a control could not place an LED on one side, and was positioned on two opposite sides. Therefore, as for the size of the backlight, the non-light emitting part has a space of 7mm x 2 14mm which is unnecessary. Further, since many LEDs were concentrated in the light source part, the junction temperature was 64 degrees, which is 25 degrees higher than the present invention, and only the vicinity of the light source part was significantly increased. There was some concern about long-term life and failure rates. The brightness was 2700 nt, which was 23% lower than that of the present invention, which was considerably inferior when compared side by side.
[0019]
【The invention's effect】
As described above in detail, according to the present invention, a uniform, high-efficiency, and high-luminance light-emitting device can be obtained by dispersing or continuously arranging LEDs on the lower surface of the light guide plate. In addition, since it is not necessary to provide an unnecessary space on the side, heat radiation is performed uniformly from the entire surface, so that the temperature of the element can be prevented from increasing, and as a result, a long life and high reliability can be obtained. Although not shown in the embodiments, it is natural that the present invention can be applied to a nameplate, various displays, a guide plate, a switch and the like in addition to the backlight.
In addition, by using LEDs of different emission colors, it is possible to easily perform color coding for each section, and an epoch-making effect can be expected in product design.
[Brief description of the drawings]
FIG. 1 is a light emitting device according to an embodiment of the present invention. (A) is a perspective view, (b) is a plan view, and (c) is a cross-sectional view taken along line AA ′ of (b).
FIG. 2 is a light emitting device according to an embodiment of the present invention. (A) is a perspective view, (b) is a plan view, and (c) is a cross-sectional view taken along line BB ′ of (b).
FIG. 3 shows a light emitting device according to an embodiment of the present invention. (A) is a perspective view, (b) is a plan view, and (c) is a sectional view taken along line CC ′ of (b).
FIG. 4 is a sectional view of a completed light emitting device according to the present invention.
FIG. 5 is a cross-sectional view of a completed light emitting device according to the prior art.
FIG. 6 is a light emitting device color-coded for each section according to the present invention. (A) is a perspective view, (b) is a plan view, and (c) is a cross-sectional view taken along line DD ′ in (b).
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... LED element 2 ... Light guide plate 3 ... Circuit board 4 ... Depression 5 ... Linear depression 6 ... Prism sheet 7 ... Diffusion sheet 8 ... Frame 9 ... Notch

Claims (5)

互いに対向する上面と下面を有する導光板(2)と、少なくとも1つのLED素子(1)を有し、該LED素子からの光を上記導光板の下面から入射し、上記導光板の上面から光を出射する発光装置であって、
上記導光板は、上記LED素子と対向する上面から下面に貫通部が形成された窪み(4)を有し、該窪みは、上面に向かって近付くにつれ徐々に広がるように傾斜部が形成されており、
上記LED素子からの光は上記窪みの傾斜部によって上記導光板の上面に対して平行方向に反射されると共に、上記LED素子からの光の一部が上記窪みの貫通部から直接出射されることを特徴とする発光装置。
A light guide plate (2) having an upper surface and a lower surface facing each other, and at least one LED element (1), light from the LED element is incident from the lower surface of the light guide plate, and light is emitted from the upper surface of the light guide plate. A light emitting device that emits light,
The light guide plate has a recess (4) in which a penetrating portion is formed from the upper surface to the lower surface facing the LED element, and the recess has an inclined portion formed so as to gradually spread toward the upper surface. And
The light from the LED element is reflected in the parallel direction with respect to the upper surface of the light guide plate by the inclined portion of the recess, and a part of the light from the LED element is directly emitted from the through portion of the recess. A light emitting device characterized by the above.
上記導光板は、上記窪みの上面角部が面取りされていることを特徴とする請求項1に記載の発光装置。  The light-emitting device according to claim 1, wherein the light guide plate has a chamfered upper corner portion of the recess. 上記LED素子は、回路基板上に分散されて実装されていることを特徴とする請求項1又は2に記載の発光装置。  The light emitting device according to claim 1, wherein the LED elements are distributed and mounted on a circuit board. 上記窪みは、少なくとも2以上のLED素子にわたって対向するように線状に形成(5)されていることを特徴とする請求項1乃至請求項3に記載の発光装置。  4. The light emitting device according to claim 1, wherein the recess is linearly formed (5) so as to face over at least two or more LED elements. 5. 上記導光板は、上面から下面に貫通し、上面に向かって近付くにつれ徐々に広がるように形成されている線状の切り込み(9)を有し、該切り込みを介して、互いに異なる波長のLED素子を配置していることを特徴とする請求項1乃至請求項4に記載の発光装置。  The light guide plate has linear incisions (9) formed so as to penetrate from the upper surface to the lower surface and gradually spread toward the upper surface, and LED elements having different wavelengths from each other through the notches. The light-emitting device according to claim 1, wherein the light-emitting device is arranged.
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JP7140987B2 (en) * 2019-12-25 2022-09-22 日亜化学工業株式会社 Light-emitting module and method for manufacturing light-emitting module

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