JP2002298629A - Light emitting device - Google Patents

Light emitting device

Info

Publication number
JP2002298629A
JP2002298629A JP2001101923A JP2001101923A JP2002298629A JP 2002298629 A JP2002298629 A JP 2002298629A JP 2001101923 A JP2001101923 A JP 2001101923A JP 2001101923 A JP2001101923 A JP 2001101923A JP 2002298629 A JP2002298629 A JP 2002298629A
Authority
JP
Japan
Prior art keywords
light
guide plate
light guide
emitting device
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001101923A
Other languages
Japanese (ja)
Other versions
JP4106876B2 (en
Inventor
Yoshinori Shimizu
義則 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Chemical Industries Ltd
Original Assignee
Nichia Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Chemical Industries Ltd filed Critical Nichia Chemical Industries Ltd
Priority to JP2001101923A priority Critical patent/JP4106876B2/en
Publication of JP2002298629A publication Critical patent/JP2002298629A/en
Application granted granted Critical
Publication of JP4106876B2 publication Critical patent/JP4106876B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide a flat light emitting device with excellent uniformity enabled to emit the light with high brightness. SOLUTION: The light emitting device comprises a light guide plate (2) having an upper surface and a lower surface facing each other, and at least one LED element (1), and makes the light from the LED element enter into the light guide plate at its lower surface and get out from the upper surface of the light guide plate. Concavities (4) facing respective LED elements are formed on the upper surface of the light guide plate, and the concavities are formed so as to gradually broaden as it comes near to the upper surface.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、液晶バックライト
やスイッチの押しボタン、表札や各種表示板など広い用
途に、効率の良い均一な発光装置を得る手段を提供する
ためになされたものである。特に、液晶バックライトに
おいて、不要な非発光部をほぼ無くすことができ、携帯
機器の小型化に貢献するとともに、光の利用効率も上が
り、明るく、低消費電力にすることができる導光板を用
いた発光装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention has been made to provide a means for obtaining an efficient and uniform light emitting device for a wide variety of uses such as a liquid crystal backlight, a push button of a switch, a nameplate and various display panels. . Particularly, in the liquid crystal backlight, unnecessary non-light-emitting portions can be almost eliminated, which contributes to the miniaturization of portable devices and increases the light use efficiency, and uses a light guide plate that can be bright and consume low power. Light emitting device.

【0002】[0002]

【従来の技術】従来、液晶のバックライトにおいては、
導光板の周辺に光源を配した、いわゆる「サイド型」と
か「エッジライト方式」と言われる物が主流であった
(図5)。一方直下型と言われる光源を有効発光部に配
した発光装置も存在するが、光源近傍の輝度むらを無く
すことが難しく、拡散シートなどを介すると輝度低下を
招くなど、輝度とむらが両立せず、しだいにサイド型に
取って代わられた経緯がある。
2. Description of the Related Art Conventionally, in a liquid crystal backlight,
The so-called “side-type” or “edge-light” type, in which a light source is arranged around the light guide plate, was the mainstream (FIG. 5). On the other hand, there is a light emitting device in which a light source called a direct type is arranged in an effective light emitting portion.However, it is difficult to eliminate uneven brightness near the light source. Notwithstanding, it has been gradually replaced by the side type.

【0003】ところが、サイド型は光源部を導光板の一
端に配するため、光源部近傍はむらのため有効発光部に
はならず、不要なスペースを必要とした。このことは携
帯電話や携帯端末など小型化が進む機器には大きな障害
となる。さらに、TFTカラー液晶のバックライトなど
に使用するとき、要求光度が高いため光源の消費電力が
大きくなるが、光源が一部に集中して配置されるため、
局所的発熱、温度上昇が大きくなり、特に半導体発光素
子光源を用いた場合、信頼性や寿命に少なからぬ影響を
与えることとなる。
However, in the side type, since the light source is disposed at one end of the light guide plate, the vicinity of the light source is uneven, so that the effective light emitting unit cannot be provided, and an unnecessary space is required. This is a major obstacle for miniaturized devices such as mobile phones and mobile terminals. Further, when used for a backlight of a TFT color liquid crystal, etc., the required luminous intensity is high, so that the power consumption of the light source is large.
Local heat generation and temperature rise become large, and particularly when a semiconductor light emitting element light source is used, reliability and life are considerably affected.

【0004】[0004]

【発明が解決しようとする課題】本発明はこのような欠
点を解決するために成されたもので、その目的とすると
ころは、LEDを用い、主としてバックライトとして利
用できる白色発光可能な発光装置を実現すると共に、均
一な白色発光を観測できる発光装置を提供することにあ
り、さらには白色以外の任意色の発光が可能な発光装置
を提供し、将来性に優れたLEDの特性を利用し、各種
操作スイッチ等に利用することにある。
SUMMARY OF THE INVENTION The present invention has been made to solve such a drawback, and an object of the present invention is to provide a light emitting device capable of emitting white light which can be mainly used as a backlight by using an LED. To provide a light-emitting device capable of observing uniform white light emission, and to provide a light-emitting device capable of emitting light of any color other than white, and to utilize the characteristics of LEDs with excellent future potential. , And various operation switches.

【0005】[0005]

【課題を解決するための手段】本発明の発光装置は、互
いに対向する上面と下面を有する導光板(2)と、少な
くとも1つのLED素子(1)を有し、該LED素子か
らの光を上記導光板の下面から入射し、上記導光板の上
面から光を出射する発光装置であって、上記導光板は、
上記LED素子と対向する上面に窪み(4)を有し、該
窪みは、上面に向かって近付くにつれ徐々に広がるよう
に形成されていることを特徴とする。これにより、下面
から出射した光は窪み部分で全反射し、進行方向を導光
板上面に対して平行方向へ進路変更する。また、上記導
光板は、上記窪みの上面角部が面取りされていることを
特徴とする。面取りすることによって輝度ムラを緩和し
ている。また、上記窪みは、上記導光板の上面から下面
へ貫通しても良い(
The light emitting device of the present invention has a light guide plate (2) having an upper surface and a lower surface facing each other, and at least one LED element (1), and emits light from the LED element. A light emitting device that enters from the lower surface of the light guide plate and emits light from the upper surface of the light guide plate, wherein the light guide plate includes:
A recess (4) is provided on the upper surface facing the LED element, and the recess is formed so as to gradually expand as approaching the upper surface. As a result, the light emitted from the lower surface is totally reflected at the concave portion, and the traveling direction is changed in a direction parallel to the upper surface of the light guide plate. Further, the light guide plate is characterized in that the upper surface corner of the depression is chamfered. By chamfering, uneven brightness is reduced. Further, the depression may penetrate from the upper surface to the lower surface of the light guide plate (

【図1】(c)参照)ことを特徴とする。窪みの斜面部
分に当たった光は周辺に向けて全反射する構成になって
いるため、導光板を上面側から見た時、窪み部分がそれ
以外の部分と比較して暗い場合がある。この現象を解決
するため本件発明は、窪みを貫通させ、下面から入射し
た光の1部を貫通部から窪み部分上部に直接出射させ
る。
1 (c)). Since the light that hits the slope of the depression is totally reflected toward the periphery, the depression may be darker than the other parts when the light guide plate is viewed from the upper surface side. In order to solve this phenomenon, according to the present invention, a part of light incident from the lower surface is directly emitted from the penetrating part to an upper part of the concave part through the concave part.

【0006】さらに、上記窪みは、少なくとも2以上の
LED素子にわたって対向するように線状に形成(5)
されていることを特徴とする。本発明は窪みの数とLE
D素子の数を一致させる必要はなく、LED素子と対向
する導光板の上面に窪みがあればよく、1つの窪みが2
つ以上のLED素子に渡って形成させることで窪み形成
工程を簡易にすることができる。
Further, the recess is formed linearly so as to face at least two or more LED elements.
It is characterized by having been done. The present invention relates to the number of depressions and LE
It is not necessary to match the number of D elements, and it is sufficient if there is a depression on the upper surface of the light guide plate facing the LED element.
By forming the LED over one or more LED elements, the recess forming step can be simplified.

【0007】その上、上記導光板は、上面から下面に貫
通し、上面に向かって近付くにつれ徐々に広がるように
形成されている線状の切り込み(9)を有し、該切り込
みを介して、互いに異なる波長のLED素子を配置して
いることを特徴とする。この切り込みの面において導光
板の上面と平行方向に進んでいる光が全反射し、切り込
み内に閉じ込められるため、導光板内で異なる波長の光
が交じり合わない。
In addition, the light guide plate has a linear cut (9) penetrating from the upper surface to the lower surface and gradually expanding as approaching the upper surface. It is characterized in that LED elements having different wavelengths are arranged. Light traveling in a direction parallel to the upper surface of the light guide plate is totally reflected on the cut surface and confined in the cut, so that light of different wavelengths does not mix in the light guide plate.

【0008】[0008]

【発明の実施の形態】本発明は上記種々の問題点を解決
するためになされたものであり、LED素子から出た光
を速やかに横方向に拡げるとともに、導光板から上面に
向かって出てくる光を阻害することなく、均一で明る
く、効率の良い優れた発光装置を提供することができ
る。また、光源を面全体に配置することにより、より明
るい設計が可能となる(図1)。たとえば、光源を一辺
に配すると寸法的に実装できるLED素子の数は限られ
るが、面全体に配置させることがにより、任意の数を用
いることができる。もう一つの長所は、LEDを1辺に
まとめて配置させないので、局所的発熱が押さえられ、
全体の信頼性が向上するとともに、液晶の温度特性に与
える影響も少なくなる。一般に半導体は信頼性が高いも
のの、温度の上昇には弱いのでこのようにして動作温度
を下げることが信頼性の向上につながる。また液晶にも
温度特性があり、面内の温度むらは表示品質に悪影響を
及ぼすことがある。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention has been made in order to solve the above-mentioned various problems. The present invention rapidly spreads light emitted from an LED element in a lateral direction and emits light from a light guide plate toward an upper surface. An excellent light-emitting device that is uniform, bright, and efficient without obstructing incoming light can be provided. Further, by arranging the light source over the entire surface, a brighter design is possible (FIG. 1). For example, if the light source is arranged on one side, the number of LED elements that can be dimensionally mounted is limited, but an arbitrary number can be used by disposing it on the entire surface. Another advantage is that LEDs are not arranged on one side, so local heat generation is suppressed,
The overall reliability is improved and the influence on the temperature characteristics of the liquid crystal is reduced. In general, semiconductors have high reliability, but are vulnerable to temperature rise. Therefore, lowering the operating temperature in this way leads to improvement in reliability. Further, the liquid crystal also has a temperature characteristic, and in-plane temperature unevenness may adversely affect display quality.

【0009】具体的には、導光板には光源部から上面に
向かって近付くにつれ徐々に広がるような種々の形状を
持った窪み4、5を有し、導光板の上・下面には光を散
乱する手段を配し(図示せず)、全体として均一になる
ように構成された発光装置を形成する。この窪みの角度
は、導光板の材質の屈折率により最適化される。光を拡
散させる手段(通常はシボパターンであることが多いの
で、以下は単にシボパターンと呼ぶ)と併用されるので
必ずしも対称である必要もないが、もっとも好ましいの
は対称形である。窪みの形状は種々考えられるが、金型
制作や設計の容易さを考慮すれば、円錐状構造が好まし
い。むろん光源の形や配置によって三角錐状、四角錐
状、五角錐状等の多角錐状でも良い(図1(b)の欄外
参照)。全方向に光を広げるのであれば円錐状が好まし
く、特定の方向へ光を広げるには三角錐状等の形の方が
好ましい。目的によって形状からくる作用効果を使い分
ける必要がある。いずれの形にしても鋭角の角は線状の
輝度むらを生じやすいく、シボパターンに工夫を要する
ので、面取りすることが好ましい。同様に窪みと導光板
の上面との接点も、形状に沿った輝度の高いむらを生じ
ることがあり、なめらかに面取りすることが好ましい。
また、平面部分と窪み部分で輝度に差が生じないよう
に、窪みの深さを調節する(図1(c)の欄外参照(貫
通も含む))。これにより導光板の上面から均一な発光
輝度が得られる。図1に示すように、LED素子は回路
基板上に分散させると、面内の輝度ムラが生じにくく、
放熱性に優れている。図2、3に示すように連続(直線
若しくは曲線を含む)に配置させても使用できる。この
ようにして作られた発光装置は、ほとんど全域が有効発
光部として使用できる。
More specifically, the light guide plate has depressions 4 and 5 having various shapes which gradually expand as approaching from the light source toward the upper surface, and light is transmitted to the upper and lower surfaces of the light guide plate. Scattering means are provided (not shown) to form a light emitting device configured to be uniform overall. The angle of the depression is optimized by the refractive index of the material of the light guide plate. It is not necessarily required to be symmetrical because it is used in combination with a means for diffusing light (usually a textured pattern, so that it is hereinafter simply referred to as a textured pattern), but a symmetrical shape is most preferred. Although various shapes of the depression are conceivable, a conical structure is preferable in consideration of the ease of mold production and design. Needless to say, a polygonal pyramid such as a triangular pyramid, a quadrangular pyramid, or a pentagonal pyramid may be used depending on the shape and arrangement of the light source (see the margin of FIG. 1B). To spread light in all directions, a conical shape is preferable, and to spread light in a specific direction, a shape such as a triangular pyramid is more preferable. It is necessary to use the function and effect of the shape depending on the purpose. Regardless of the shape, an acute angle is likely to cause linear luminance unevenness and requires a contrivance in a grain pattern. Similarly, the contact point between the depression and the upper surface of the light guide plate may cause unevenness with high brightness along the shape, and it is preferable that the chamfer is smooth.
Further, the depth of the dent is adjusted so that there is no difference in luminance between the flat part and the dent part (see the margin of FIG. 1C (including the penetration)). Thereby, uniform light emission luminance can be obtained from the upper surface of the light guide plate. As shown in FIG. 1, when the LED elements are dispersed on a circuit board, in-plane luminance unevenness hardly occurs,
Excellent heat dissipation. As shown in FIGS. 2 and 3, it can be used even if it is arranged continuously (including a straight line or a curved line). The light-emitting device thus manufactured can be used as an effective light-emitting portion in almost the entire area.

【0010】また、サイドライト型では同時に複数色を
導光体の別々の部分から発光させるのは不可能であっ
た。本発明では、図6に示すように、異なる色のLED
素子を複数個使用し、その異なる色のLED素子が隣り
合う部分の導光板に切り込みを入れることにより簡単に
色分けできる。ここで同じ色のLED素子が隣り合う部
分の導光板に切り込みを入れても問題はないし、異なる
色のLEDが隣り合う部分の導光板にあえて切り込みを
入れずに混色を発光させることもできる。
[0010] In the sidelight type, it is impossible to simultaneously emit a plurality of colors from different portions of the light guide. In the present invention, as shown in FIG.
A plurality of elements can be used, and the LED elements of different colors can be easily color-coded by making cuts in the light guide plate of the adjacent part. Here, there is no problem even if a cut is made in the light guide plate of the adjacent part where the LED element of the same color is adjacent, and it is also possible to emit a mixed color without intentionally making a cut in the light guide plate of the adjacent part where the LEDs of different colors are adjacent.

【0011】以下、本発明に係る面発光装置における各
要素に関する好ましい材料等について説明する。 (導光板)本発明において導光板に用いられる材料とし
ては、光透過性、成形性に優れたものを用いることが好
ましく、アクリル樹脂、ポリカーボネート樹脂、非晶性
ポリオレフィン樹脂、ポリスチレン樹脂等が挙げられ
る。これらの導光板用の材料はそれぞれ屈折率が異なる
が、導光板上面に形成する窪みの形状、更にはその数等
を選定することによって、いかなる屈折率の材料にも対
応できる。 (LED光源)本発明のLED光源において、1又は2
以上のLEDチップを用いることができる。また、LE
Dチップからの光を直接導光板に入射するようにしても
良いし、例えば紫外〜可視光の発光が可能なLEDチッ
プと、LEDチップからの光を吸収してそれよりも長波
長の可視光が発光可能な蛍光物質とを組み合わせて、L
EDチップから出力される光とは波長の異なる光を導光
板内に入射するようにしてもよい。
Hereinafter, preferred materials and the like for each element in the surface emitting device according to the present invention will be described. (Light guide plate) As the material used for the light guide plate in the present invention, it is preferable to use a material having excellent light transmittance and moldability, and examples thereof include an acrylic resin, a polycarbonate resin, an amorphous polyolefin resin, and a polystyrene resin. . These materials for the light guide plate have different refractive indices. However, by selecting the shape of the depression formed on the upper surface of the light guide plate, and further, the number and the like thereof, it is possible to cope with any refractive index material. (LED light source) In the LED light source of the present invention, 1 or 2
The above LED chips can be used. Also, LE
The light from the D chip may be directly incident on the light guide plate. For example, an LED chip capable of emitting ultraviolet to visible light, and a visible light having a longer wavelength by absorbing light from the LED chip. In combination with a fluorescent substance capable of emitting light,
Light having a different wavelength from the light output from the ED chip may be incident on the light guide plate.

【0012】すなわち、本発明において、LEDチップ
を蛍光体と組み合わせて用いることにより、発光素子と
蛍光物質の組み合わせによって、様々な色調の混合色を
発光させることが可能である。
That is, in the present invention, by using an LED chip in combination with a phosphor, it is possible to emit mixed colors of various colors depending on the combination of the light emitting element and the phosphor.

【0013】以下、液晶のバックライト等に最もよく用
いられ、需要が高い白色発光LEDついて、窒化物半導
体を有してなり青色の発光が可能なLEDチップと、セ
リウムで付活されたイットリウム・アルミニウム・ガー
ネット蛍光体を用いた例について説明する。 (LEDチップ)ここで用いることができる、窒化物系
化合物半導体(一般式InGaAl N、但し、0
≦i、0≦j、0≦k、i+j+k=1)としては、I
nGaNや各種不純物がドープされたGaNをはじめ、
種々のものがある。
The following is most often used for liquid crystal backlights and the like.
For the white LED with high demand, nitride semiconductor
An LED chip having a body and capable of emitting blue light;
Yttrium aluminum gar activated with lium
An example using a net phosphor will be described. (LED chip) Nitride based that can be used here
Compound semiconductor (general formula IniGajAl kN, where 0
≦ i, 0 ≦ j, 0 ≦ k, i + j + k = 1)
Including nGaN and GaN doped with various impurities,
There are various things.

【0014】このLEDチップは、MOCVD法等によ
り基板上にInGaNやGaN等の半導体を発光層とし
て成長させることにより形成する。半導体の構造として
は、MIS接合、PI接合やPN接合などを有すホモ構
造、ヘテロ構造あるいはダブルヘテロ構造のものが挙げ
られる。この窒化物半導体層は、その材料やその混晶度
によって発光波長を種々選択することができる。また、
半導体活性層を量子効果が生ずる薄膜で形成した単一量
子井戸構造や多量子井戸構造とすることもできる。
This LED chip is formed by growing a semiconductor such as InGaN or GaN as a light emitting layer on a substrate by MOCVD or the like. Examples of the semiconductor structure include a homostructure having a MIS junction, a PI junction, and a PN junction, a heterostructure, and a double heterostructure. The emission wavelength of the nitride semiconductor layer can be variously selected depending on the material and the degree of mixed crystal thereof. Also,
A single quantum well structure or a multiple quantum well structure in which the semiconductor active layer is formed of a thin film that produces a quantum effect can also be used.

【0015】本発明において、LEDチップとしては、
青色発光可能な半導体発光層を有し、後述するセリウム
で付活されたイットリウム・アルミニウム・ガーネット
系蛍光体を効率よく励起できるLEDチップを用いるこ
とが好ましい。 (蛍光体)本発明に利用可能な蛍光物質は、LEDから
出力される光によってLED光よりも長波長の可視光を
発光可能な蛍光物質ならばなにでもよく、また、発光色
は紫色〜赤色までの全ての可視光のものが適用できる。
具体的には、ケイ酸塩系蛍光体、リン酸塩系蛍光体、ア
ルミン酸系蛍光体、希土類系蛍光体、酸希土類系蛍光
体、硫化亜鉛系蛍光体などが挙げられる。具体的には緑
色系発光蛍光体では、YSiO:Ce,Tb、Mg
Al1119:Ce,Tb、BaMgAl 16
27:Mn、(Zn,Cd)S:Ag、ZnS:Au,
Cu,Al、ZnS:Cu,Al、SrAl:E
u、青色系発光蛍光体では(SrCaBa)(P
Cl:Eu、(BaCa)(PO
l:Eu、BaMgAl1627:Eu、Sr
(POCl:Eu、Sr:Eu、Z
nS:Ag、Al、ZnS:Ag,Al(pigmen
ted)、ZnS:AgCl、ZnS:AgCl(pi
gmented)、赤色系発光蛍光体ではYS:
Eu、YS:Eu(pigmented)、Y
:Eu、3.5MgO・0.5MgF・Ge
:Mn、Y(PV)O:Eu、5MgO・3Li
O・Sb:Mn、MgTiO:Mn、黄色
系発光蛍光体ではMgLiSb13:Mn、M
TiO:Mn、(YGd1−ZAl
12:Ce等が挙げられる。比較的発光効率が高いもの
としては、緑色系発光蛍光体ではSrAl:E
u、青色系発光蛍光体ではSr(POCl:E
u、赤色系発光蛍光体ではYS:Eu、黄色系発
光蛍光体では(YGd1−ZAl12:Ce
が挙げられる。
In the present invention, as the LED chip,
Having a semiconductor light emitting layer capable of emitting blue light,
Yttrium aluminum garnet activated by
Use an LED chip that can efficiently excite the phosphor
Is preferred. (Phosphor) Phosphors that can be used in the present invention include LEDs
Depending on the output light, visible light with a longer wavelength than LED light
Any fluorescent substance that can emit light,
All visible light from purple to red can be used.
Specifically, silicate-based phosphors, phosphate-based phosphors,
Luminic acid based phosphor, rare earth phosphor, acid rare earth phosphor
And a zinc sulfide-based phosphor. Specifically green
In the case of a color light-emitting phosphor, Y2SiO5: Ce, Tb, Mg
Al11O19: Ce, Tb, BaMg2Al 16O
27: Mn, (Zn, Cd) S: Ag, ZnS: Au,
Cu, Al, ZnS: Cu, Al, SrAl2O4: E
u, (SrCaBa)5(P
O4)3Cl: Eu, (BaCa)5(PO4)3C
1: Eu, BaMg2Al16O27: Eu, Sr
5(PO4)3Cl: Eu, Sr2P2O7: Eu, Z
nS: Ag, Al, ZnS: Ag, Al (pigmen
ted), ZnS: AgCl, ZnS: AgCl (pi
gmented), and Y for the red light-emitting phosphor.2O2S:
Eu, Y2O2S: Eu (pigmented), Y2
O3: Eu, 3.5MgO.0.5MgF2・ Ge
O2: Mn, Y (PV) O4: Eu, 5MgO ・ 3Li
2O ・ Sb2O5: Mn, Mg2TiO4: Mn, yellow
Mg for system-based phosphors5Li6Sb6O13: Mn, M
g2TiO4: Mn, (YZGd1-Z)3Al5O
12: Ce and the like. Relatively high luminous efficiency
As the green light emitting phosphor, SrAl2O4: E
u, Sr for blue light emitting phosphor5(PO4)3Cl: E
u, Y for the red light emitting phosphor2O2S: Eu, yellowish
In the photophosphor, (YZGd1-Z)3Al5O12: Ce
Is mentioned.

【0016】以下に本発明の1実施の形態である実施例
を示す。しかし本発明はこれに限定されない。
An example which is an embodiment of the present invention will be described below. However, the present invention is not limited to this.

【0017】[0017]

【実施例1】例として有効サイズ1.5インチ、縦横比
3:4のTFTカラー液晶用のバックライトを作った。
この導光板の材料としてポリカーボネートを用い、導光
板形成用の金型は、導光板上面の窪みが4カ所形成され
るようにしてある。また、その金型は、導光板の下面に
上面から発光される光の均一性を向上させるための凹凸
(シボ)加工が施されるように作製される。導光板の成
形は、まず、成形温度を280℃に設定してポリカーボ
ネートを溶融させながら、射出圧力1000kgf/c
m2、金型温度は100℃で射出成型する。そして、4
5秒間冷却した後、金型から取り出す。このようにして
導光板を形成した。寸法としては周辺に各1mmの余裕を
持たせた。すなわち、縦25mm、横33mmのサイズとした。
必要輝度3000ntを得るためにLEDは4個使い、面全体を
有効部とするため、LEDは等分割して分割面の中心に
配置させた。LEDは表面実装型(以下SMDと略す)
を用い、厚さ0.2mmのプリント基板に実装した。プリン
ト基板は放熱を考慮して、LEDダイスが載っている導
通部分のパターンを大きく取った。次に導光板は厚さ2m
mでLEDの位置に図1に示す形状の連続プリズムを形
成した。窪みの上面の平坦部に対する傾斜角は45度と
した。角度は本発明が全反射を利用しているため材質の
屈折率によって最適な角度が決まる。これは金型で行
い、同時にその他の面にもシボパターンを作り均一とな
るようにした。シボパターンは、コンピュータによる光
学シミュレーションによって設計されたが、ここでは複
雑になるので触れない。この金型を用いてアクリル樹脂
の射出成形を行い、導光板の完成品を得た。導光板の周
辺には光の漏れを防ぐためと、液晶の取り付けのために
枠が設けられる。この枠も高反射率の処理が必要であ
る。全体を組み立て、プリズムシート2枚をクロスして
重ね、弱い拡散シートを最上部において固定し製品とし
た。対照として、LEDの同数をサイドに配置した有効
部が同サイズのバックライトと、単純な板をおいた直下
型バックライトを作った。プリズムシートは同じ構成で
あるが、拡散シートは面内の輝度むらがMin/Max=0.7
以上になるように調整した。このようにして得られたサ
ンプルを比較した結果、本発明によるサンプルは電流15
mA時に面輝度3400nt、LEDの信頼性の目安となるジャ
ンクション温度は、周囲温度25度の時、37度と12度の温
度上昇であった。一方、対照としたサイド型は、面輝度
2800nt、ジャンクション温度は59度と本発明に比べ22度
も高温になっており、しかも、光源部近傍のみが著しく
上昇した。もう一方の従来方式の直下型は拡散度の高
い、言い換えると透過率の低い拡散シートの使用を余儀
なくされ、2000nt以下の輝度しか得られず実用性がなく
なってしまった。このように本発明では、輝度と均一
性、信頼性の各項目において従来の物より優れた特性を
得ることができた。
EXAMPLE 1 As an example, a backlight for a TFT color liquid crystal having an effective size of 1.5 inches and an aspect ratio of 3: 4 was manufactured.
Polycarbonate is used as a material of the light guide plate, and a mold for forming the light guide plate has four recesses formed on the upper surface of the light guide plate. Further, the mold is manufactured such that the lower surface of the light guide plate is subjected to unevenness (texture) processing for improving the uniformity of light emitted from the upper surface. The molding of the light guide plate is performed by first setting the molding temperature to 280 ° C. and melting the polycarbonate while injecting an injection pressure of 1000 kgf / c.
Injection molding is performed at m2 and a mold temperature of 100 ° C. And 4
After cooling for 5 seconds, remove from the mold. Thus, a light guide plate was formed. As for the dimensions, a margin of 1 mm was provided around each. That is, the size was 25 mm in length and 33 mm in width.
Four LEDs were used to obtain the required luminance of 3000 nt, and the LEDs were equally divided and arranged at the center of the divided surface to make the entire surface an effective part. LED is a surface mount type (hereinafter abbreviated as SMD)
Was mounted on a printed circuit board having a thickness of 0.2 mm. In consideration of heat radiation, the printed board has a large pattern of the conductive portion on which the LED dice is mounted. Next, the light guide plate is 2m thick
At m, a continuous prism having the shape shown in FIG. 1 was formed at the position of the LED. The inclination angle of the upper surface of the depression with respect to the flat portion was 45 degrees. Since the present invention utilizes total reflection, the optimum angle is determined by the refractive index of the material. This was performed with a mold, and at the same time, a grain pattern was formed on the other surface so as to be uniform. The grain pattern was designed by computer-based optical simulation, but is not described here because it is complicated. Injection molding of acrylic resin was performed using this mold to obtain a completed light guide plate. A frame is provided around the light guide plate to prevent light leakage and to attach a liquid crystal. This frame also needs high reflectance processing. The whole was assembled, two prism sheets were crossed and overlaid, and a weak diffusion sheet was fixed at the top to make a product. As a control, a backlight in which the same number of LEDs were arranged on the side and the effective portion was the same size, and a direct-type backlight in which a simple plate was placed were made. The prism sheet has the same configuration, but the diffusion sheet has in-plane luminance unevenness of Min / Max = 0.7.
It was adjusted to be above. Comparison of the samples obtained in this way shows that the sample according to the invention has a current of 15%.
The surface temperature was 3400 nt at mA, and the junction temperature, which is a measure of the reliability of the LED, was 37 degrees and 12 degrees when the ambient temperature was 25 degrees. On the other hand, the side type used as a control
The junction temperature was 2800 nt, the junction temperature was 59 degrees, which was 22 degrees higher than that of the present invention, and only the vicinity of the light source part was significantly increased. On the other hand, the direct type of the conventional method has to use a diffusion sheet having a high degree of diffusion, in other words, a low transmittance, resulting in a luminance of 2,000 nt or less, and the practicality is lost. As described above, in the present invention, in each item of luminance, uniformity, and reliability, characteristics superior to those of the related art could be obtained.

【0018】[0018]

【実施例2】実施例1と同様にして、5インチサイズの
TFT液晶用バックライトを作成した。導光板の材料と
してアクリル樹脂を使用し、導光板上面に42の窪みが
形成されるような金型を用い、成型温度を250℃、射
出圧力1100kgf/cm2、金型温度80℃、冷却
時間を約30秒として成型した。LEDは6個×7個の配
列とした。導光板は104mm×79mmで連続プリズムは実施
例1と同形状とした。理由は円形がもっとも加工しやす
いからであり、金型加工の労力をいとわなければ三角
形、四角形、五角形など選択は自由である。その時でも
角部は面取りしておくことがむらをさける意味で好まし
い。その他の構成も同様にしてバックライトを作成し
た。得られたものの特性は電流15mA時に面輝度3500nt、
LEDの信頼性の目安となるジャンクション温度は、周
囲温度25度の時、39度と14度の温度上昇であった。一
方、対照としたサイド型は、1辺にLEDを配置するこ
とができず、対向する2辺には位置させることになっ
た。そのためバックライトのサイズとしては否発光部が
7mm×2の14mmも不要なスペースを持つ結果となった。ま
た光源部により多くのLEDが集中したため、ジャンクシ
ョン温度は64度と本発明に比べ25度も高温になってお
り、しかも、光源部近傍のみが著しく上昇した。長期的
な寿命や故障率に関して多少懸念される状態となった。
明るさも面輝度2700ntと、本発明に比べて23%低く、並
べて比較するとかなり見劣りのする結果となった。
Example 2 In the same manner as in Example 1, a 5-inch backlight for a TFT liquid crystal was prepared. Acrylic resin was used as the material of the light guide plate, a mold was used in which 42 depressions were formed on the upper surface of the light guide plate, the molding temperature was 250 ° C., the injection pressure was 1100 kgf / cm 2, the mold temperature was 80 ° C., and the cooling time was Molding was performed for about 30 seconds. The LEDs were arranged in a 6 × 7 array. The light guide plate was 104 mm x 79 mm, and the continuous prism had the same shape as in Example 1. The reason is that a circular shape is the easiest to process, and a triangle, a quadrangle, a pentagon, or the like can be freely selected unless labor for die processing is given. Even at that time, it is preferable to chamfer the corners in order to avoid unevenness. In other configurations, a backlight was created in the same manner. The characteristics of the obtained one are that the surface luminance is 3500 nt when the current is 15 mA,
The junction temperature, which is a measure of the reliability of the LED, was 39 degrees and 14 degrees when the ambient temperature was 25 degrees. On the other hand, in the side type as a control, the LEDs could not be arranged on one side, and were located on two opposing sides. Therefore, the size of the backlight is not
14mm of 7mm x 2 resulted in unnecessary space. Also, since more LEDs were concentrated on the light source, the junction temperature was 64 ° C., which was 25 ° C. higher than that of the present invention, and only the vicinity of the light source significantly increased. There was some concern about long-term life and failure rates.
The surface brightness was 2700 nt, 23% lower than that of the present invention, and the results were considerably inferior when compared side by side.

【0019】[0019]

【発明の効果】以上詳述したごとく、本発明はLEDを
導光板下面に分散、または連続に配置させることで、均
一で、高効率、高輝度の発光装置を得ることができる。
また、サイドに不要なスペースを設ける必要がないの
で、放熱が全面から均等に行われるため素子の温度上昇
をさけることができ、結果として長寿命、高信頼性が得
られるものである。また実施例では示さなかったが、バ
ックライト以外にも表札や各種表示器、案内板やスイッ
チなどにも応用できるのは当然である。また、異なる発
光色のLEDを用いることによって、区画ごとの色分け
などが簡単にでき、商品デザインにおいて画期的効果を
期待できる。
As described above in detail, according to the present invention, a uniform, high-efficiency, and high-luminance light-emitting device can be obtained by dispersing or continuously arranging LEDs on the lower surface of the light guide plate.
Further, since there is no need to provide an unnecessary space on the side, heat is radiated evenly from the entire surface, so that the temperature of the element can be prevented from rising. As a result, a long life and high reliability can be obtained. Although not shown in the embodiments, it goes without saying that the present invention can also be applied to a nameplate, various display devices, information boards, switches, and the like in addition to the backlight. In addition, by using LEDs of different emission colors, it is possible to easily color-code each section, and it is possible to expect a breakthrough effect in product design.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 本発明に係る実施の形態の発光装置である。
(a)は斜視図、(b)は平面図、(c)は(b)のA
−A’線における断面図である。
FIG. 1 is a light emitting device according to an embodiment of the present invention.
(A) is a perspective view, (b) is a plan view, (c) is A in (b).
It is sectional drawing in the -A 'line.

【図2】 本発明に係る実施の形態の発光装置である。
(a)は斜視図、(b)は平面図、(c)は(b)のB
−B’線における断面図である。
FIG. 2 is a light-emitting device according to an embodiment of the present invention.
(A) is a perspective view, (b) is a plan view, (c) is B of (b)
It is sectional drawing in the -B 'line.

【図3】 本発明に係る実施の形態の発光装置である。
(a)は斜視図、(b)は平面図、(c)は(b)のC
−C’線における断面図である。
FIG. 3 is a light-emitting device according to an embodiment of the present invention.
(A) is a perspective view, (b) is a plan view, (c) is C in (b).
It is sectional drawing in the -C 'line.

【図4】 本発明に係る発光装置の完成体の断面図であ
る。
FIG. 4 is a cross-sectional view of a completed light emitting device according to the present invention.

【図5】 従来技術の発光装置の完成体の断面図であ
る。
FIG. 5 is a cross-sectional view of a completed light emitting device of the related art.

【図6】 本発明に係る区画ごとに色分けされた発光装
置である。(a)は斜視図、(b)は平面図、(c)は
(b)のD−D’線における断面図である。
FIG. 6 is a light-emitting device that is color-coded for each section according to the present invention. (A) is a perspective view, (b) is a plan view, and (c) is a cross-sectional view taken along line DD ′ of (b).

【符号の説明】[Explanation of symbols]

1…LED素子 2…導光板 3…回路基板 4…窪み 5…線状の窪み 6…プリズムシート 7…拡散シート 8…枠 9…切り込み DESCRIPTION OF SYMBOLS 1 ... LED element 2 ... Light guide plate 3 ... Circuit board 4 ... Depression 5 ... Linear depression 6 ... Prism sheet 7 ... Diffusion sheet 8 ... Frame 9 ... Cut

フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) G09F 9/00 336 G09F 9/00 336G 13/04 13/04 Z // F21Y 101:02 F21Y 101:02 Fターム(参考) 2H038 AA52 AA55 BA06 2H091 FA23Z FA43Z FA45Z FB02 FD06 FD12 FD22 LA11 LA15 5C096 AA05 AA16 AA22 BA01 BA04 CA22 CC06 CC24 CD11 CD22 CD27 CD32 CD42 CD58 FA01 FA03 5G435 AA01 AA04 AA18 BB04 CC12 EE26 FF08 FF11 GG23 HH02 LL19 Continuation of the front page (51) Int.Cl. 7 Identification symbol FI Theme coat II (reference) G09F 9/00 336 G09F 9/00 336G 13/04 13/04 Z // F21Y 101: 02 F21Y 101: 02 F term ( Reference) 2H038 AA52 AA55 BA06 2H091 FA23Z FA43Z FA45Z FB02 FD06 FD12 FD22 LA11 LA15 5C096 AA05 AA16 AA22 BA01 BA04 CA22 CC06 CC24 CD11 CD22 CD27 CD32 CD42 CD58 FA01 FA03 5G435 AA01 AA12 FF04 CC11

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 互いに対向する上面と下面を有する導光
板(2)と、少なくとも1つのLED素子(1)を有
し、該LED素子からの光を上記導光板の下面から入射
し、上記導光板の上面から光を出射する発光装置であっ
て、 上記導光板は、上記LED素子と対向する上面に窪み
(4)を有し、該窪みは、上面に向かって近付くにつれ
徐々に広がるように形成されていることを特徴とする発
光装置。
1. A light guide plate (2) having an upper surface and a lower surface facing each other, and at least one LED element (1), wherein light from the LED element is incident from the lower surface of the light guide plate, and A light emitting device for emitting light from an upper surface of a light plate, wherein the light guide plate has a depression (4) on an upper surface facing the LED element, and the depression gradually widens as approaching the upper surface. A light-emitting device characterized by being formed.
【請求項2】 上記導光板は、上記窪みの上面角部が面
取りされていることを特徴とする請求項1に記載の発光
装置。
2. The light-emitting device according to claim 1, wherein the light guide plate has a chamfer at an upper surface corner of the recess.
【請求項3】 上記窪みは、上記導光板の上面から下面
へ貫通していることを特徴とする請求項1又は請求項2
に記載の発光装置。
3. The light guide plate according to claim 1, wherein the recess penetrates from the upper surface to the lower surface of the light guide plate.
A light-emitting device according to claim 1.
【請求項4】 上記窪みは、少なくとも2以上のLED
素子にわたって対向するように線状に形成(5)されて
いることを特徴とする請求項1乃至請求項3に記載の発
光装置。
4. The method according to claim 1, wherein the depression has at least two or more LEDs.
The light emitting device according to claim 1, wherein the light emitting device is formed in a linear shape so as to oppose each other over the elements.
【請求項5】 上記導光板は、上面から下面に貫通し、
上面に向かって近付くにつれ徐々に広がるように形成さ
れている線状の切り込み(9)を有し、該切り込みを介
して、互いに異なる波長のLED素子を配置しているこ
とを特徴とする請求項1乃至請求項4に記載の発光装
置。
5. The light guide plate penetrates from an upper surface to a lower surface,
A linear cutout (9) formed so as to gradually widen as approaching the upper surface, and LED elements having different wavelengths are arranged via the cutout. The light emitting device according to claim 1.
JP2001101923A 2001-03-30 2001-03-30 Light emitting device Expired - Lifetime JP4106876B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001101923A JP4106876B2 (en) 2001-03-30 2001-03-30 Light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001101923A JP4106876B2 (en) 2001-03-30 2001-03-30 Light emitting device

Publications (2)

Publication Number Publication Date
JP2002298629A true JP2002298629A (en) 2002-10-11
JP4106876B2 JP4106876B2 (en) 2008-06-25

Family

ID=18955180

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001101923A Expired - Lifetime JP4106876B2 (en) 2001-03-30 2001-03-30 Light emitting device

Country Status (1)

Country Link
JP (1) JP4106876B2 (en)

Cited By (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005026202A (en) * 2003-07-02 2005-01-27 Au Optronics Corp Backlight module
JP2006030910A (en) * 2004-07-21 2006-02-02 Sony Corp Back light device
JP2006049324A (en) * 2004-08-05 2006-02-16 Samsung Electronics Co Ltd Backlight for display device
JP2006091896A (en) * 2004-09-24 2006-04-06 Shogen Koden Kofun Yugenkoshi Liquid crystal display
JP2006093148A (en) * 2004-09-24 2006-04-06 Shogen Koden Kofun Yugenkoshi Lighting apparatus
KR100586968B1 (en) * 2004-05-28 2006-06-08 삼성전기주식회사 Led package and backlight assembly for lcd device comprising the same
EP1729058A1 (en) * 2005-05-30 2006-12-06 LG Electronics, Inc. Backlight unit having light emitting diodes and method for manufacturing the same
WO2006137686A1 (en) * 2005-06-21 2006-12-28 Namotek Co., Ltd. Led array type lens and backlight apparatus using the same
JP2007042320A (en) * 2005-08-01 2007-02-15 Sony Corp Planar light source device and color liquid crystal display device assemble body
JP2007095674A (en) * 2005-08-30 2007-04-12 Showa Denko Kk Plane light source device and display device
WO2007074784A1 (en) * 2005-12-27 2007-07-05 Matsushita Electric Industrial Co., Ltd. Planar lighting device and liquid crystal display device
WO2007074933A1 (en) * 2005-12-27 2007-07-05 Showa Denko K.K. Light guide member, flat light source device, and display device
EP1818606A1 (en) * 2006-02-08 2007-08-15 Zollner Elektronik AG Device for uniform illumination of a surface
JP2007213858A (en) * 2006-02-07 2007-08-23 Fujifilm Corp Flat light fixture
CN100350311C (en) * 2004-03-15 2007-11-21 统宝光电股份有限公司 Backlight module
JP2007311070A (en) * 2006-05-16 2007-11-29 Sharp Corp Light emitting device, and liquid crystal display
JP2007329114A (en) * 2006-05-12 2007-12-20 Sharp Corp Light guide plate, and planar light emitting device equipped with it
JP2008021578A (en) * 2006-07-14 2008-01-31 Koito Mfg Co Ltd Marker lamp for vehicle
JP2008078089A (en) * 2006-09-25 2008-04-03 Stanley Electric Co Ltd Led lighting apparatus
WO2008078896A1 (en) * 2006-12-22 2008-07-03 Lg Innotek Co., Ltd Light unit and display apparatus having the light unit
EP1969648A1 (en) * 2005-12-21 2008-09-17 3M Innovative Properties Company Led light confinement element
CN100437276C (en) * 2005-08-05 2008-11-26 鸿富锦精密工业(深圳)有限公司 Straight down type back light component and liquid crystal display device
CN100439998C (en) * 2004-06-25 2008-12-03 三星电子株式会社 Optical member, backlight assembly having the optical member and display apparatus having the backlight assembly
WO2009005062A1 (en) * 2007-07-02 2009-01-08 Sharp Kabushiki Kaisha Photoconductive member, light source device employing the photoconductive member, lighting device employing the photoconductive member, and light guiding method employing the photoconductive member
JP2009026660A (en) * 2007-07-20 2009-02-05 Sharp Corp Illumination device
JP2009063684A (en) * 2007-09-05 2009-03-26 Hitachi Ltd Video display device
KR100945482B1 (en) 2007-12-20 2010-03-05 삼성전기주식회사 Backlight apparatus having leds
US7726828B2 (en) 2006-01-27 2010-06-01 Opto Design, Inc. Planar illumination light source device and planar illumination light device using the planar illumination light source device
JP2010244973A (en) * 2009-04-09 2010-10-28 Nittoh Kogaku Kk Led lighting system and led light emitting device
JP2011023353A (en) * 2009-07-14 2011-02-03 Lg Innotek Co Ltd Backlight unit
JP2011155019A (en) * 2009-03-23 2011-08-11 Serata:Kk Lighting system of shelf structure
JP2011204566A (en) * 2010-03-26 2011-10-13 Sumita Optical Glass Inc Light-emitting device
JP2012109243A (en) * 2010-11-18 2012-06-07 Young Lighting Technology Inc Light source module and illumination apparatus
JP2013048117A (en) * 2012-12-03 2013-03-07 Koito Mfg Co Ltd Vehicle marker lamp
JP5279056B1 (en) * 2012-05-15 2013-09-04 株式会社エーワン Portable and wearable light emitting device
TWI418894B (en) * 2009-12-31 2013-12-11 Univ Nat Chunghsing Embedded light emitting module and its light guide plate
US8727598B2 (en) 2011-03-01 2014-05-20 Panasonic Liquid Crystal Display, Ltd. Planar light source device, liquid crystal display device, and television set
CN111384226A (en) * 2018-12-28 2020-07-07 日亚化学工业株式会社 Light emitting module
JP2021103762A (en) * 2019-12-25 2021-07-15 日亜化学工業株式会社 Light emitting module and method for manufacturing light emitting module

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019138722A1 (en) 2018-01-12 2019-07-18 富士フイルム株式会社 Backlight unit and liquid crystal display

Cited By (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7121692B2 (en) 2003-07-02 2006-10-17 Au Optronics Corp. Backlight module
JP2005026202A (en) * 2003-07-02 2005-01-27 Au Optronics Corp Backlight module
CN100350311C (en) * 2004-03-15 2007-11-21 统宝光电股份有限公司 Backlight module
KR100586968B1 (en) * 2004-05-28 2006-06-08 삼성전기주식회사 Led package and backlight assembly for lcd device comprising the same
CN100439998C (en) * 2004-06-25 2008-12-03 三星电子株式会社 Optical member, backlight assembly having the optical member and display apparatus having the backlight assembly
JP2006030910A (en) * 2004-07-21 2006-02-02 Sony Corp Back light device
JP2006049324A (en) * 2004-08-05 2006-02-16 Samsung Electronics Co Ltd Backlight for display device
JP2006091896A (en) * 2004-09-24 2006-04-06 Shogen Koden Kofun Yugenkoshi Liquid crystal display
JP2006093148A (en) * 2004-09-24 2006-04-06 Shogen Koden Kofun Yugenkoshi Lighting apparatus
JP2012142294A (en) * 2004-09-24 2012-07-26 Shogen Koden Kofun Yugenkoshi Light-emitting device
US7427145B2 (en) 2005-05-30 2008-09-23 Lg Electronics Inc. Backlight unit having light emitting diodes and method for manufacturing the same
EP1729058A1 (en) * 2005-05-30 2006-12-06 LG Electronics, Inc. Backlight unit having light emitting diodes and method for manufacturing the same
WO2006137686A1 (en) * 2005-06-21 2006-12-28 Namotek Co., Ltd. Led array type lens and backlight apparatus using the same
JP2007042320A (en) * 2005-08-01 2007-02-15 Sony Corp Planar light source device and color liquid crystal display device assemble body
JP4678256B2 (en) * 2005-08-01 2011-04-27 ソニー株式会社 Surface light source device and color liquid crystal display device assembly
CN100437276C (en) * 2005-08-05 2008-11-26 鸿富锦精密工业(深圳)有限公司 Straight down type back light component and liquid crystal display device
US7515229B2 (en) 2005-08-05 2009-04-07 Hon Hai Precision Industry Co., Ltd. Direct type backlight module and liquid crystal display using same
JP2007095674A (en) * 2005-08-30 2007-04-12 Showa Denko Kk Plane light source device and display device
EP1969648A4 (en) * 2005-12-21 2014-03-26 3M Innovative Properties Co Led light confinement element
EP1969648A1 (en) * 2005-12-21 2008-09-17 3M Innovative Properties Company Led light confinement element
TWI422918B (en) * 2005-12-27 2014-01-11 Showa Denko Kk Light guide member, flat light source device, and display device
US7942546B2 (en) 2005-12-27 2011-05-17 Showa Denko K.K. Light guide member having light mixing protrusion, flat light source device, and display device
WO2007074933A1 (en) * 2005-12-27 2007-07-05 Showa Denko K.K. Light guide member, flat light source device, and display device
WO2007074784A1 (en) * 2005-12-27 2007-07-05 Matsushita Electric Industrial Co., Ltd. Planar lighting device and liquid crystal display device
US7726828B2 (en) 2006-01-27 2010-06-01 Opto Design, Inc. Planar illumination light source device and planar illumination light device using the planar illumination light source device
US7819542B2 (en) 2006-01-27 2010-10-26 Opto Design, Inc. Planar illumination light source device and planar illumination light device using the planar illumination light source device
JP4524255B2 (en) * 2006-02-07 2010-08-11 富士フイルム株式会社 Surface lighting device
JP2007213858A (en) * 2006-02-07 2007-08-23 Fujifilm Corp Flat light fixture
EP1818606A1 (en) * 2006-02-08 2007-08-15 Zollner Elektronik AG Device for uniform illumination of a surface
JP4637803B2 (en) * 2006-05-12 2011-02-23 シャープ株式会社 Light guide plate and planar light emitting device including the same
JP2007329114A (en) * 2006-05-12 2007-12-20 Sharp Corp Light guide plate, and planar light emitting device equipped with it
JP2007311070A (en) * 2006-05-16 2007-11-29 Sharp Corp Light emitting device, and liquid crystal display
JP4693691B2 (en) * 2006-05-16 2011-06-01 シャープ株式会社 Light emitting device and liquid crystal display device
JP2008021578A (en) * 2006-07-14 2008-01-31 Koito Mfg Co Ltd Marker lamp for vehicle
JP4627287B2 (en) * 2006-09-25 2011-02-09 スタンレー電気株式会社 LED lighting device
JP2008078089A (en) * 2006-09-25 2008-04-03 Stanley Electric Co Ltd Led lighting apparatus
US8157410B2 (en) 2006-12-22 2012-04-17 Lg Innotek Co., Ltd. Light unit and display apparatus having the light unit
WO2008078896A1 (en) * 2006-12-22 2008-07-03 Lg Innotek Co., Ltd Light unit and display apparatus having the light unit
WO2009005062A1 (en) * 2007-07-02 2009-01-08 Sharp Kabushiki Kaisha Photoconductive member, light source device employing the photoconductive member, lighting device employing the photoconductive member, and light guiding method employing the photoconductive member
JP2009026660A (en) * 2007-07-20 2009-02-05 Sharp Corp Illumination device
JP2009063684A (en) * 2007-09-05 2009-03-26 Hitachi Ltd Video display device
KR100945482B1 (en) 2007-12-20 2010-03-05 삼성전기주식회사 Backlight apparatus having leds
JP2011155019A (en) * 2009-03-23 2011-08-11 Serata:Kk Lighting system of shelf structure
JP2010244973A (en) * 2009-04-09 2010-10-28 Nittoh Kogaku Kk Led lighting system and led light emitting device
US8870433B2 (en) 2009-07-14 2014-10-28 Lg Innotek Co., Ltd. Backlight unit
JP2011023353A (en) * 2009-07-14 2011-02-03 Lg Innotek Co Ltd Backlight unit
TWI418894B (en) * 2009-12-31 2013-12-11 Univ Nat Chunghsing Embedded light emitting module and its light guide plate
JP2011204566A (en) * 2010-03-26 2011-10-13 Sumita Optical Glass Inc Light-emitting device
JP2012109243A (en) * 2010-11-18 2012-06-07 Young Lighting Technology Inc Light source module and illumination apparatus
US8491173B2 (en) 2010-11-18 2013-07-23 Young Lighting Technology Inc. Light source module and illumination apparatus
US8727598B2 (en) 2011-03-01 2014-05-20 Panasonic Liquid Crystal Display, Ltd. Planar light source device, liquid crystal display device, and television set
JP5279056B1 (en) * 2012-05-15 2013-09-04 株式会社エーワン Portable and wearable light emitting device
JP2013048117A (en) * 2012-12-03 2013-03-07 Koito Mfg Co Ltd Vehicle marker lamp
CN111384226A (en) * 2018-12-28 2020-07-07 日亚化学工业株式会社 Light emitting module
CN111384226B (en) * 2018-12-28 2024-03-15 日亚化学工业株式会社 Light emitting module
JP2021103762A (en) * 2019-12-25 2021-07-15 日亜化学工業株式会社 Light emitting module and method for manufacturing light emitting module
JP7140987B2 (en) 2019-12-25 2022-09-22 日亜化学工業株式会社 Light-emitting module and method for manufacturing light-emitting module

Also Published As

Publication number Publication date
JP4106876B2 (en) 2008-06-25

Similar Documents

Publication Publication Date Title
JP2002298629A (en) Light emitting device
US7959321B2 (en) Backlight panel employing white light emitting diode having red phosphor and green phosphor
KR100958759B1 (en) Backlight and liquid crystal display using same
TWI485347B (en) A linear white light source and a backlight and a liquid crystal display device using the same
KR101143671B1 (en) Light emitting module, backlight using such light emitting module, and liquid crystal display device
US20110001693A1 (en) Backlight unit for liquid crystal display device
JP2004241282A (en) Surface light emitting device and its manufacturing method
JP2006253336A (en) Light source device
KR20120058928A (en) Liquid crystal display device
JP2005109289A (en) Light-emitting device
JP2007258620A (en) Light emitting device
KR102371290B1 (en) Light-Emitting Package and Backlight Unit having the same
JP3409666B2 (en) Surface light emitting device and display device using the same
KR20120010070A (en) Liquid crystal display device
JP4107086B2 (en) Planar light emitting device and display device using the same
KR101262092B1 (en) Structure of edge-type LED
KR101758719B1 (en) Liquid crystal display device
KR20110138966A (en) Light emitting diode and method of fabricating the same
KR20170033972A (en) Light-Emitting Apparatus and Backlight Unit having the same
KR102355584B1 (en) Backlight Unit and Display Device having the same
JP4604697B2 (en) Surface light emitting device and light guide plate for surface light emitting device
KR101844908B1 (en) Diffusion plate and liquid crystal display device including the same
KR101896684B1 (en) Light emitting module and lighting system having the same
KR100742125B1 (en) Back light unit
KR101667791B1 (en) Light emitting diode and liquid crystal display device including the same

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20041019

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20071011

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20071016

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20071217

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20080311

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20080324

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110411

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4106876

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110411

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110411

Year of fee payment: 3

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120411

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130411

Year of fee payment: 5

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130411

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140411

Year of fee payment: 6

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term