KR20170033972A - Light-Emitting Apparatus and Backlight Unit having the same - Google Patents

Light-Emitting Apparatus and Backlight Unit having the same Download PDF

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Publication number
KR20170033972A
KR20170033972A KR1020150131874A KR20150131874A KR20170033972A KR 20170033972 A KR20170033972 A KR 20170033972A KR 1020150131874 A KR1020150131874 A KR 1020150131874A KR 20150131874 A KR20150131874 A KR 20150131874A KR 20170033972 A KR20170033972 A KR 20170033972A
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KR
South Korea
Prior art keywords
light source
light
disposed
chip
region
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KR1020150131874A
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Korean (ko)
Inventor
김일수
김기성
박관훈
정동열
이규환
Original Assignee
엘지디스플레이 주식회사
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Priority to KR1020150131874A priority Critical patent/KR20170033972A/en
Publication of KR20170033972A publication Critical patent/KR20170033972A/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033—Means for improving the coupling-out of light from the light guide
    • G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
    • G02B6/0055—Reflecting element, sheet or layer
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2203/00—Function characteristic
    • G02F2203/02—Function characteristic reflective

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Planar Illumination Modules (AREA)

Abstract

The present invention relates to a light source device and a backlight unit including the light source device, and more particularly, to a fluorescent light source device including a blue light source (LED) chip and a phosphor region, in which a light conversion unit formed on a light source chip is offset It is possible to prevent deterioration of the phosphor due to heat generated in the light source and increase the driving current of the individual light source chip.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a light source device and a backlight unit including the light source device.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light source device for a display device and a backlight unit including the same, more specifically, a light source device for a display device in which a light conversion part is offset from an upper side of a light source to prevent deterioration due to heat, will be.

2. Description of the Related Art [0002] As an information-oriented society develops, there have been various demands for display devices for displaying images. Recently, liquid crystal displays (LCDs), plasma display panels (PDPs) Various display devices such as an OLED (Organic Light Emitting Diode Display Device) have been utilized.

Among these display devices, a liquid crystal display (LCD) has an array substrate including a thin film transistor, which is a switching element for controlling on / off each pixel region, and an array substrate including a color filter and / or a black matrix A display panel including a top substrate, a liquid crystal material layer formed therebetween, a driving unit for controlling the thin film transistor, a backlight unit (BLU) for providing light to the display panel, and the like , A pixel (PXL) electrode provided in a pixel region, and a common voltage (Vcom) electrode, and the transmittance of light is adjusted accordingly, thereby displaying an image.

In the case of such a liquid crystal display device, a backlight unit for providing light to the display panel is included, and the backlight unit may be an edge-type or a direct-type, depending on the arrangement of light sources and the transmission mode of light. Can be distinguished.

In the edge type backlight unit, a light source module or a light source device including a light source such as an LED, a holder or a housing for fixing a light source, and a light source driving circuit or the like is disposed on one side of the display device, A light guide plate (LGP) for reflecting the light toward the display panel, a reflection plate for reflecting the light toward the display panel, and at least one optical sheet disposed on the light guide plate for the purpose of improving brightness, have.

The light source device used in such an edge type backlight unit may include a light source package as a unit light source including an LED or the like, a light source PCB including a plurality of light source packages and a circuit element for driving the same.

On the other hand, a phosphor light source package having a structure using a blue LED that emits blue light and a light conversion layer or a phosphor material layer that converts blue light into red, green, or the like is used as a light source package in addition to the case of using a white light LED.

As the material of the light conversion layer used in the light source package having such a structure, various phosphor materials which are excited by blue light and emit red or green light may be used. Such a phosphor material is usually vulnerable to heat, The color conversion efficiency can not be achieved in many cases.

However, in the conventional phosphor light source package, since the phosphor layer is directly disposed on the upper part of the blue LED, heat from the LED is exposed to the phosphor as it is and is not only vulnerable to deterioration of the phosphor, There was a problem that I could not do.

In view of the foregoing, it is an object of the present invention to provide a light source device for use in an edge-type backlight unit, which can minimize deterioration due to heat of a phosphor region, and a backlight unit including the light source device.

It is another object of the present invention to provide a fluorescent light source device including a blue LED and a phosphor region by forming a phosphor region only in a part of the upper region between the blue LED chips and separating the blue LED and the phosphor from each other, A light source device capable of being minimized, a backlight unit including the same, and the like.

Another object of the present invention is to provide a fluorescent light source device including a blue LED and a phosphor region in which a phosphor region is formed only in a part of the upper region (first region) between the blue LED chips and the remaining portion (second region) A light source device capable of maximizing light output of individual LEDs while minimizing thermal degradation of the phosphor region by providing a reflective layer, and a backlight unit including the light source device.

According to an aspect of the present invention, there is provided a light source device for use in a backlight unit of a display device, comprising: a light source PCB extending along one side of a display device; A plurality of light source chips spaced apart from each other by a first interval (P) on the light source PCB; Side walls disposed on both sides of the light source PCB; A reflective portion disposed in a second region covering an upper portion of each of the light source chips among an upper region between the side wall portions; And a light converting unit disposed in a first area between the reflectors to convert the light from the light source chip into light in a different frequency band among the upper areas between the side wall parts and to emit the light from the light source chip to the outside of the light source device. A light source device for use is provided.

According to another embodiment of the present invention, there is provided a display device comprising: a light source PCB extending long along one side of a display device; a plurality of light source chips spaced apart by a first interval (P) on the light source PCB; A reflecting portion disposed in a second region that covers an upper portion of each of the light source chips among the upper region between the sidewall portions and a second region between the reflecting regions, A light source unit disposed in the light source unit and converting light from the light source chip into light in a different frequency band and emitting the light to the outside of the light source unit; A light guide plate disposed on one side of the light source device for diffusing light emitted from the light conversion unit; A reflector disposed on a bottom surface of the light guide plate; And an optical sheet portion including at least one individual optical sheet disposed on the upper surface of the light guide plate.

According to an embodiment of the present invention as described below, there is an effect that thermal deterioration of the phosphor region in the light source device used in the edge type backlight unit can be minimized.

More specifically, in a fluorescent light source device including a blue light source chip and a phosphor region, a phosphor region (light conversion portion) is formed only in a part of the upper region between the blue light source chips, and the blue LED and the phosphor are separated from each other, The deterioration due to heat can be minimized.

In a fluorescent light source device including a blue light source (LED) chip and a phosphor region, a phosphor region (light conversion portion) is formed only in a part of the upper region (first region) between the blue light source chips, (Second region), it is possible to maximize the light output of the individual LEDs while minimizing deterioration of the phosphor by heat, and consequently, it is possible to provide a high-output light source device.

1 is a cross-sectional view of a display device including an edge-type backlight unit to which an embodiment of the present invention can be applied.
2 shows a cross section of a light source device in which a general type of phosphor light source package and a plurality of phosphor light source packages are arranged.
3 is a perspective view of a light source device according to an embodiment of the present invention.
4 is a cross-sectional view of a backlight unit and a display device including the same, in which a light source device according to an embodiment of the present invention is used.
5 is a cross-sectional view of a light source device according to an embodiment of the present invention.
6 shows a positional relationship between individual light sources and phosphor regions in the light source device according to the embodiment of the present invention.
7 shows an optical path in the light source device according to the embodiment of the present invention.
8 shows an example of a manufacturing process of a light source device according to an embodiment of the present invention.
Fig. 9 shows various arrangements of the reflection area and the phosphor area formed in the light source device.
FIG. 10 shows experimental results on the light intensity measured in the display area when the light source device according to the embodiment of the present invention is used.
FIG. 11 shows experimental results on reduction in phosphor temperature when a light source device according to an embodiment of the present invention is used, as compared with a conventional individual light source package.

Hereinafter, some embodiments of the present invention will be described in detail with reference to exemplary drawings. In the drawings, like reference numerals are used to denote like elements throughout the drawings, even if they are shown on different drawings. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

In describing the components of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are intended to distinguish the components from other components, and the terms do not limit the nature, order, order, or number of the components. When a component is described as being "connected", "coupled", or "connected" to another component, the component may be directly connected or connected to the other component, Quot; intervening "or that each component may be" connected, "" coupled, "or " connected" through other components.

1 shows a cross section of a display device including an edge-type backlight unit to which an embodiment of the present invention can be applied

1, a display device to which an embodiment of the present invention can be applied includes a display panel 140 such as a liquid crystal display panel and backlight units 120 and 160 disposed below the display panel 140 to irradiate light to the display panel, A cover bottom 110 of metal or plastic that supports the backlight unit and extends over the entire rear surface of the display device, and the like.

The liquid crystal display device further includes a guide panel 130 for supporting the light source housing 127 constituting the backlight unit at the side while supporting the display panel 140 at an upper portion thereof, A case top 150 which is enclosed and extends to a part of the front surface of the display panel, and the like.

In such a liquid crystal display device, a backlight unit for providing light to the display panel is included, and the backlight unit is classified into an edge-type or a direct-type according to the arrangement of light sources and the transmission mode of light .

1, the edge type backlight unit 120 includes a light source module 127 including a light source 128 such as an LED, a holder or a housing for fixing the light source, and a light source driving circuit, A light guide plate 124 (light guide plate) for diffusing light to the entire panel area, a reflection plate 122 for reflecting light in the direction of the display panel, and a reflection plate 122 disposed above the light guide plate to improve brightness, And one or more optical sheets 126 arranged for use such as protection.

In this edge type backlight unit, light from the light source is incident on the light guide plate entrance portion, and is totally reflected by the light guide plate and spreads toward the display panel in the direction of the display panel.

As another form, there is a direct-type backlight unit. The direct-type backlight unit includes a light source PCB disposed on the top of the cover bottom, a diffusion plate spaced apart from the light source PCB by a predetermined distance to diffuse light from the light source, And the light source PCB may be disposed over the front surface of the display device, and an LED chip or an LED package, which is a light source, may be disposed on the light source PCB, And a light diffusing lens for a light source.

Generally, since the edge type backlight unit needs only a space corresponding to the thickness of the light guide plate, it can be slim down to 10 mm or less. However, since light is provided only on the side, it is difficult to realize a high luminance, and manufacturing cost is high due to parts such as a light guide plate , It is difficult to realize a local dimming function of irradiating light only in a local region of the display device.

As described above, in the edge type backlight unit, since the light from the light source disposed only at one side of the display device must be widely dispersed in the light guide plate, a relatively strong individual light source output is required to realize a constant luminance.

2 shows a cross section of a light source device in which a general type of phosphor light source package and a plurality of phosphor light source packages are arranged.

2, as the light source used in the backlight unit, a single package including a light source chip such as an LED and its peripheral structures may be used, and such a package may be expressed as a light source package or an LED package.

As shown in FIG. 2A, the light source unit of the backlight unit may include a plurality of light source packages 220 disposed on a long bar-shaped light source PCB 210.

The LED or light source chip included in the light source package constituting the light source may be a white LED outputting white light. However, as shown in FIG. 2, the blue LED chip 224 emitting blue light and the red ), Green (G), or the like, or a structure using a phosphor material or the like.

2 (b) and 2 (c), the light source package or LED package includes a printed circuit board 210 and a blue LED chip 224 mounted on the printed circuit board 210, The printed circuit board (PCB) 210 may include a printed circuit board base 211, an insulating layer 213, and a power wiring layer 215.

On the printed circuit board 210 on which the blue LED chip 224 is mounted, the light emitted from the LED chip 224 is shielded from the printed circuit board 210, A sidewall 222 or a lead frame covering the edge of the LED chip 224 to allow the space inside the sidewall to be filled with the light conversion material 225.

As another form of the light conversion region, a light conversion layer 225 'or a diffusion layer may be disposed in an opening region above the side wall 222, as shown in FIG. 2C.

The LED chip 224 in the LED package according to FIGS. 2 (b) and 2 (c) may be a blue LED disposed between the two electrodes to emit blue light, And then converted into R, G, and Y light by the light conversion layers 225 and 225 'to finally emit white light.

On the other hand, the material of the light conversion layer or the phosphor layer used in the light source package as shown in FIG. 2 has a disadvantage that it is vulnerable to heat.

As an example, the fluoride compound KSF (K 2 SiF 6 ), which is a Mn 4 + activator phosphor widely used as a phosphor material, is a non-rare-earth red phosphor and has a difficult synthesis process condition. However, And has excellent performance as a phosphor for a white LED.

However, such a KSF phosphor has a disadvantage that it is vulnerable to heat, and when used as a backlight unit of a display device, there is a high possibility that it will cause a problem when it is used for a high-power LED or an AC-applied LED due to a long afterglow time.

In fact, the KSF phosphor is discolored at a temperature of about 90 degrees Celsius or more, and the light conversion efficiency is lowered.

Therefore, in the light source package shown in FIG. 2 (b), since the LED chip 224, which mainly generates heat, directly contacts the phosphor material, it is exposed to the same high temperature as the temperature of the LED chip, Structure, the photoconversion layer 225 'is exposed to a relatively high temperature and is deteriorated.

The heat generated by the LED chip 224 is proportional to the current applied to the LED chip. In order for the LED chip, which is an individual light source, to have a strong luminance, the applied current of the LED chip must be increased. However, You are subject to restrictions.

When a light source package having a size of 70 * 30 mm is used, high brightness must be realized by setting the current applied to the blue LED chip 224 to about 300 mA or more. However, when the applied current is about 300 mA, the temperature of the LED chip and the temperature Is about 90 degrees and the phosphor is deteriorated. Therefore, in reality, only a current of about 160 mA is applied so that the temperature of the LED chip becomes 70 degrees or less.

Therefore, the present embodiment proposes a light source device structure capable of preventing the phosphor from being denatured or deteriorated by heat while achieving high brightness by increasing the applied current of the individual light source.

FIG. 3 is a perspective view of a light source device according to an embodiment of the present invention, and FIG. 4 is a cross-sectional view of a backlight unit and a display device including the same, in which a light source device according to an embodiment of the present invention is used.

3, the light source device according to an embodiment of the present invention includes a light source PCB 310, a plurality of light source chips 330 spaced apart by a first distance P from the light source PCB, A reflective portion 350 disposed in a second region 352 covering an upper portion of each of the light source chips among the upper region between the side wall portions, And a light converting unit 340 disposed in the first region 342 between the reflective portions to convert the light from the light source chip into light in the other frequency band and emit the light to the outside of the light source device.

6, the distance d between the projection point Q and the center of the light source chip, in which one end of the light conversion unit 340 is projected onto the light source PCB 310, 2.5 mm.

6, in the light source device according to the present embodiment, the distance between the light source chip 330 as a heat source and the light conversion portion 340 as a phosphor is larger than the maximum separation distance OG in the conventional light source package Therefore, by preventing the heat from the light source chip from being transmitted to the phosphor of the light converting portion, deterioration of the phosphor by heat can be prevented.

As a result, compared with the light source package having the structure as shown in FIG. 2, the current applied to the light source chip 330, that is, the light output intensity of the individual light source chip, can be increased to realize high luminance.

Experimental results of the detailed configuration of the optical device according to the present embodiment and the effects thereof will be described in more detail below with reference to FIG. 5 to FIG.

The light source PCB 310 constituting the light source device according to the present embodiment is a printed circuit board extending long along one or more sides of the display device or the backlight unit and may be composed of a printed circuit board base, have.

The light source chip 330 is disposed on the light source PCB 310 with a first gap P and is mounted on the light source PCB without a mold frame or a lead frame by a surface mount technology It may be a chip in the form of a so-called chip-on-board (COB) or chip scale package (CSP).

The light source chip 330 may be formed of a light emitting layer disposed between the two electrode layers on the growth substrate layer, and may be a chip called a flip-chip.

 Meanwhile, the light source chip 330 may be a blue LED that emits blue light having a wavelength of about 430 to 450 nm, and the emitted blue light is converted into red (R), green (G), and yellow Y) frequency band and the light emitted from the light converting unit 340 can form white light.

The side wall part 320 may be formed of a white reflector material which is formed by extending vertically from both sides of the light source PCB, that is, both sides in the short width direction of the light source PCB, and has a reflection characteristic.

The side wall 320 may be a molding structure formed by dispensing and curing any one of a silicone resin, an epoxy resin, and an epoxy molding compound (EMC) to a certain mold, It is preferable that the inner surface of the portion is formed of a material having a reflection characteristic with a reflectance of 90% or more.

The sidewall 320 reflects the light emitted from the light source chip 330 and directs the light toward the light conversion layer 340. The inner space of the sidewall 320 is filled with a transparent encapsulation material A transparent encapsulation layer 360 may be formed.

As a transparent encapsulation material filled in the side wall part, a zinc oxide (ZNO), a gallium nitride (GaN), a silicon nitride (GaN), a silicon nitride A silicon carbide (SiC), an aluminum nitride (AlN), or the like.

The side wall 320 may be formed by forming a reflective layer having a thickness of about 1 to 20 um by depositing a reflective material selected from Al, Au, and Ag on the inner surface of a transparent mold structure by sputtering or the like, .

A reflective region 350 is disposed in a second region 352 covering an upper portion of each of the light source chips 350 in the upper region between the side wall portions, A portion 340 is disposed.

The reflective portion 350 is disposed in a second region including an area immediately above the individual light source chip 330 in the upper region of the transparent encapsulation material filled in the side wall portion 320, And is formed of a light reflecting material having a reflectance of at least 95%.

The reflective portion may be composed of a reflective layer formed by depositing a reflective material selected from one or more of Al, Au, and Ag on the second region 352 of the upper region of the transparent encapsulation material, But is not limited thereto.

That is, the reflective portion 350 may be formed by attaching a film or sheet structure including a base film layer and a reflective coating layer disposed on one side thereof to the second region 352.

In this case, the parent film layer constituting the reflective portion may be formed of a material selected from the group consisting of polymethyl methacrylate (PMMA), MS (methystyrene) resin, polystyrene (PS), polypropylene (PP), polyethylene terephthalate : PET) and a light transmitting material such as polycarbonate (PC), glass, etc., and the thickness of the parent film layer may be about 0.75 to 1.25 mm.

The reflective coating layer formed on the base film layer is formed of a reflective material selected from one or more of Al, Au, and Ag. The thickness of the reflective coating layer may be about 20 to 60 um, but is not limited thereto.

The reflective portion 350 functions to reflect blue light from the light source chip 330 and to direct the blue light to the region of the light converting portion 340 as a result.

That is, the blue light from the light source chip 330 is reflected by the inside of the side wall portion and the reflection surface 312 on the light source PCB in addition to the reflection portion 350, is totally reflected inside the light source device, Converted into white light through the conversion unit 340, and then emitted to the outside of the light source device. The optical path in the light source apparatus according to this embodiment will be further described below with reference to Fig.

The light converting unit 340 is disposed in the first area between the reflecting units 350 in the upper area between the side walls, and converts light from the light source chip into light in another frequency band and emits the light to the outside of the light source unit.

In other words, the light-converting unit 340 is arranged so as to be offset from the light source chip 330 by a predetermined distance, and as a result, the light source chip 330 is arranged to be distant from the light source chip 330 .

The photoconversion unit 340 may be formed of a material including a fluorine compound KSF phosphor (K 2 SiF 6 ; hereinafter referred to as a KSF phosphor), which is a Mn 4+ activator phosphor, but is not limited thereto. A phosphor material containing quantum dot particles may be used.

The light converting portion 340 may be formed by dispensing or transfer molding a material in which silicon (Si) and a phosphor material are mixed in a first region between the reflective portions 350 described above But is not limited to such a process.

The phosphor material or the phosphor particles constituting the light converting portion 340 may be a yellow phosphor (Y), a red phosphor (R), a green phosphor (G), or the like which absorbs blue light and emits light of a different color frequency band And the luminescent color can be selected by controlling the blending ratio of the phosphor of each color.

The yellow phosphor Y may be a YAG: Ce (T3Al5O12: Ce) phosphor which is yttrium (Y) aluminum (Al) garnet doped with cerium with a wavelength of 530 to 570 nm, Lt; / RTI >

The red (R) phosphor is a YOX (Y2O3: EU) -based phosphor composed of yttrium oxide (Y2O3) and europium (EU) having a main wavelength of 611 nm and the green (G) (LaPo4: Ce, Tb) phosphor which is a compound of phosphorus (Po4) and lanthanum (La) and terbium (Tb) serving as a wavelength and a blue (B) phosphor is barium Ba having a main wavelength of 450 nm. And BAM blue (BaMgAl 10 O 17: EU) based phosphor which is a compound of magnesium (Mg) and aluminum oxide based materials and europium (EU) can be used.

In this case, the light conversion sheet constituting the light conversion portion may include a quantum dot layer or a quantum dot layer including light emitting nanoparticles, and other resin layers, And a coating layer, or the like.

FIG. 5 is a cross-sectional view of a light source device according to an embodiment of the present invention, FIG. 6 shows a positional relationship between individual light sources and a phosphor region in a light source device according to an embodiment of the present invention, In the light source device.

5 and 6, the light source device according to the present embodiment includes a light source PCB 310 which is elongated, a light source chip 330 which is a plurality of blue LEDs arranged at a predetermined interval P, And a sidewall 320, which is a mold structure having a constant height, is elongated at both sides in the width direction of the light source PCB.

In the upper region of the side wall portion 320 facing the light source PCB, a reflective portion 350 and a light-converting portion 340, which are a side-walled structure having a constant thickness, are alternately repeatedly formed. Particularly, The second region 352 is provided with a reflection portion 350 for reflecting light from the light source chip and includes a KSF phosphor in the upper first region 342 between the reflection portions, that is, between the light source chips 330 A light-converting portion 340 is formed.

That is, the light-converting unit 340 is repeatedly disposed offset from the area immediately above the light source chip 330.

6, an immediately preceding distance from the light source PCB 310 to the upper reflector is defined as an optical gap (OG), and a separation distance (first interval) of the light source chip 330 is denoted by P The distance between the light transformation unit projection point Q at which one end of the light conversion unit 340 is projected onto the light source PCB and the center of the adjacent light source chip 330 may be denoted by d.

In this case, the optical gap OG, which is the distance between the light source chip 330 and the upper reflective portion 350, is usually about 0.3 to 0.5 mm. Therefore, the light source chip 330 should be set to a value of about 1.0 to 2.5 mm larger than the distance d.

That is, according to the present embodiment, since the minimum distance between the light source chip 330 and the light converting unit 340 including the fluorescent material must be at least larger than the optical gap OG of the conventional light source chip, Q and the center of the adjacent light source chip 330 is set to about 1.0 mm or more.

As a result, each point in the light conversion portion 340 is separated from the light source chip 330 by at least D = (OG 2 + d 2 ) 1/2 or more.

Therefore, when the light conversion layer is in direct contact with the LED chip (FIG. 2B) or when the light conversion layer is separated from the LED chip by the optical gap (OG) (FIG. 2C) The deterioration of the photo-conversion material due to heat generated in the light source chip as described above can be minimized because the photo-conversion unit 340 is further away from the light source chip 330.

More specifically, when the distance d between the center of the light source chip 330 and the light transformation unit projection point Q is about 1.0 mm or less, the distance D between the light conversion unit 340 and the light source chip 330 is The effect of preventing thermal deterioration can be limited.

The distance P between the center of the light source chip 330 and the center of the light source chip 330 adjacent to the projection point Q of the light source unit 330 is determined by about 10 to 15 mm. When the distance d is 2.5 mm or more, the length W of the first area occupied by the light converting unit 340 may be reduced to about 5 mm.

When the length W of the first area occupied by the light converting part 340 is less than about 5 mm, the area of the light converting part becomes small, and sufficient light output becomes impossible. That is, since the light converting unit 340 is a unique region that reflects light arriving after being reflected by the reflecting unit 350 or the like among the blue light from the light source chip to white light and outputs the white light to the outside, The conversion unit 340 must be larger than a certain size.

In this point of view, when the distance d between the light-projecting portion Q and the center of the adjacent light-source chip 330 becomes 2.5 mm or more, the area occupied by one light-converting portion 340 becomes small, You will not be able to expect.

Therefore, in this embodiment, the distance between the light-converging portion projection point Q and the center of the adjacent light-source chip 330 in an environment where the distance (first interval) of the light source chip 330 is about 10 to 15 mm d is set in the range of 1.0 to 2.5 mm, it is possible to achieve an optimum configuration capable of providing sufficient light output while minimizing thermal denaturation of the phosphor included in the light converting portion.

Specifically, when the first interval P of the light source chips is about 10 mm, the distance d between the center of the light source chip 330 and the light-converging portion projection point Q is 1.0 to 2.5 mm, And the length W of the first region in which the light converting portion is disposed is set to 5 to 8 mm.

In addition, when the first interval P of the light source chips is about 15 mm, the distance d between the center of the light source chip 330 and the light conversion unit projection point Q is 1.0 to 2.5 mm, And the length (W) of the first region in which the conversion section is disposed is made 10 to 13 mm.

Meanwhile, in the case of using the light source device according to the present embodiment, an optical path in which light emitted from the light source chip 330 is directed to the outside of the light source device will be described as follows.

7, the blue light B emitted from the light source chip 330 is reflected by the reflecting portion 350 disposed in the second area immediately above the light source chip 330, and then is reflected by the light source PCB 310 or the light source Reflected on the reflective surface 312 provided on the PCB, and propagated in the longitudinal direction of the light source device.

The light that has reached the light converting portion 340 among the light that has been propagated is converted into red, green, and the like in the phosphor in the light converting portion, and the white light W as a whole is emitted to the outside of the light converting portion.

Meanwhile, in order to increase the amount of white light output by the optical path described above, the reflective surface 312 is further disposed on a portion of the upper surface of the light source PCB 310 other than the area where the light source chip 330 is disposed The reflecting surface 312 may reflect the light directed toward the upper surface of the light source PCB to the light converting part 340 to increase the light output of the light source device as a whole.

According to the structure of this embodiment, by disposing the light converting part 340 including the KSF fluorescent material or the like as far as possible from the light source chip 330, it is possible to prevent deterioration of the phosphor due to heat generated in the light source .

According to the present embodiment, since the distance between the light source chip and the phosphor portion is sufficiently large, the applied current of the light source chip or the light output of the individual light source can be increased within a range that does not cause deterioration of the phosphor, It has the effect of increasing the light output or reducing the number of light source chips required for a constant light output.

4 is a cross-sectional view of a backlight unit and a display device including the same, in which a light source device according to an embodiment of the present invention is used.

4, the backlight unit according to the present embodiment includes a light source device 300 having the above-described structure, and a light guide plate (not shown) disposed on one side of the light source device and adapted to diffuse light emitted from the light conversion unit 340 of the light source device. A reflection plate 420 disposed on a bottom surface of the light guide plate, and an optical sheet unit 430 including at least one individual optical sheet disposed on the upper surface of the light guide plate.

As described above, the light source device 300 further includes a light source PCB 310 extending along one side of the display device, a plurality of light source chips 330 spaced apart by a first distance P from the light source PCB, (Not shown) disposed in a second region covering an upper portion of each of the light source chips, of the upper region between the side wall portions, and a reflection portion And a light converting unit 340 disposed in the light source unit and converting the light from the light source chip into light in a different frequency band and emitting the light to the outside of the light source unit.

The detailed configuration of the backlight unit and the remaining components of the display device according to the embodiment of the present invention will be described below.

The light source PCB 310 is a substrate on which the light source chip 330 constituting the light source device according to the present invention is mounted and may be in the form of a printed circuit board (PCB) or a flexible printed circuit board (FPCB) .

The reflecting surface 312 formed on the light source PCB is for reflecting the light reflected by the upper reflecting part 350 toward the light converting part 340. The reflecting surface 312 includes a plurality of light source chips 330 A white or silver plate member covering the entire surface of the light source PCB.

Although not shown, through-holes may be formed in the reflection surface 312 to allow the light source chips to pass through the light source chips 330. Accordingly, each of the light source chips can be exposed to the outside of the reflection surface through the through hole formed in the reflection surface 312.

The light guide plate 410 included in the backlight unit may be formed of a rectangular clear plastic sheet die-cut, extruded, or injection-molded from a plastic sheet, White light is incident on the edge of the light guide plate 410 and is totally reflected inside the light guide plate and diffused across the back surface of the display panel. Light emitted through a flat upper surface of the light guide plate functions as a backlight of the display panel.

The light guide plate 410 may be made of a material such as polymethyl methacrylate (PMMA), MS (methystyrene) resin, polystyrene (PS), polypropylene (PP), polyethylene terephthalate : PET) and polycarbonate (PC), but the present invention is not limited thereto.

The reflection plate 420 is disposed on the back surface of the light guide plate 410 and functions to improve the brightness of the light by reflecting light passing through the back surface of the light guide plate toward the display panel 500.

The optical sheet unit 430 disposed on the light guide plate 410 collects the light and allows a more uniform surface light source to be incident on the display panel 500. One or more individual optical sheets may be combined.

The optical sheet unit 430 includes a light collecting sheet or a prism sheet PS having a condensing function, a diffusing sheet DS for diffusing light, a reflective sheet type DBEF (dual brightness enhancement film) A polarizing film, and the like.

In the case of a liquid crystal display panel, the display panel 500 receiving light by the backlight unit according to the present embodiment includes a plurality of gate lines, a data line and a pixel defined in the intersection area, An array substrate including a thin film transistor which is a switching element for adjusting light transmittance, an upper substrate provided with a color filter and / or a black matrix, and a liquid crystal material layer formed therebetween.

Meanwhile, the display panel to which the light source device according to the present embodiment can be applied is not limited to such a liquid crystal display panel, but may include other types of display devices requiring a backlight unit.

As a structure for supporting the backlight unit according to the present embodiment, a cover bottom (cover bottom) 600, which is a back cover made of metal or plastic, covering the rear surface and a part of the side surface of the display device) A case top 800 for covering the outermost side of the display device and the top edge of the display panel), and the like.

FIG. 8 shows an example of a manufacturing process of the light source device according to the present embodiment.

As shown in FIG. 8, in order to manufacture the light source device according to the present embodiment, first, a plurality of light source chips 330 are mounted on the light source PCB 310 with a predetermined first gap P therebetween. In this case, the light source chip may be a chip scale package (CSP) or a flip-chip.

In this state, a side wall part 320, which is a mold structure having a constant height on both sides of the light source PCB, is formed by insert molding or the like, and the light transmitting material is dispensed or filled in the inner space surrounded by the side wall part and the light source PCB A transparent encapsulation layer 360 is formed. At this time, the material of the side wall 320 itself may have a reflection characteristic, but if necessary, the inner surface of the side wall portion may be coated with a reflective material to have a reflection characteristic.

Next, a light converting portion 340 including a phosphor is formed only on a first region, which is a space between light source chips, on the upper surface of the transparent encapsulation layer 360. For example, the light converting portion can be formed by attaching a fluorescent sheet having a predetermined size only to the first region.

Of course, it is not necessary to use a sheet in the form of a sheet or a film to form the light-converting portion 340, and it may be formed by coating or dispensing a material in which a KSF fluorescent material and silicon are mixed to a certain thickness.

Next, the reflective portion 350 is formed of a white reflector material only in a region above the transparent encapsulation layer 360 except for the light-converting portion 340, that is, a second region including an area just above the light source chip 330 do.

At this time, the process of forming the reflective portion 350 may also include a process of preparing or attaching a reflective film or a reflective sheet to the size of the second region, or a process of directly coating or dispensing the material having the reflective property only in the second region will be.

Of course, the process illustrated in FIG. 8 is only one example, and according to the technical idea of the present invention, it is possible to arrange the reflector in the upper region of the light source chip, One process may be used.

Fig. 9 shows various arrangements of the reflection area and the phosphor area formed in the light source device.

As shown in FIG. 9, the first region in which the light converting unit is disposed in the light source device may be formed over the entire width of the light source device, but the present invention is not limited thereto. As shown in FIG. 9B, The light converting portion 340 may be formed only in the window 350 'formed by opening a certain region of the reflecting portion 350 formed on the entire upper surface of the reflecting portion 350'.

FIG. 10 shows experimental results on the light intensity measured in the display area when the light source device according to the embodiment of the present invention is used.

The experiment shown in Fig. 10 is based on the present embodiment, in which the first interval P between the light source chips 330 is about 10 mm, the distance between the center of the light source projection point Q and the center of the adjacent light source chip 330 is d is 2.5, 3.0, and 3.5 mm, the light intensity at the edge of the active area (A / A) away from the light source by T is measured according to the position.

10B shows the results of the experiment. The distance between the center of the light-converging portion projection point Q and the center of the adjacent light-source chip 330 is 2.5 mm (i.e., the distance between the light- Is 10 mm, the length W of the first area in which the light conversion part is disposed is about 5 mm), it can be seen that light is evenly distributed at the edge of the display area A / A.

On the other hand, the distance between the light-converging portion projection point Q and the center of the adjacent light source chip 330 is increased to 3.0 mm and 3.5 mm (i.e., the first interval between the light source chips is 10 mm) The length W of the first area is reduced to 4 and 3 mm, respectively), the light intensity difference between the position of the light source chip and the adjacent position occurs at the edge of the display area A / A, .

As described above, when the distance d between the center of the light-converging portion projection point Q and the center of the adjacent light-source chip 330 is increased to 3.0 mm or more and the area of the light-converting portion is reduced, the light intensity reaching the display region as a whole decreases In addition, there arises a so-called hot spot problem in which strong light is visible only in the vicinity of the light source chip and a dark dark portion is generated in the remaining area.

10, in the optical device according to the present embodiment, by setting the distance d between the center of the light source chip 330 and the projection point Q of the light conversion unit to be about 2.5 mm or less, A sufficient optical output can be obtained without generating a problem, and an optimal configuration capable of preventing the deterioration of the phosphor by heat due to the sufficient distance from the light source to the light source can be realized.

11 shows experimental results on reduction of the temperature of a phosphor when a light source device according to an embodiment of the present invention is used, as compared with a conventional individual light source package

11A is a graph showing the relationship between the current (LED driving current) applied to each light source chip, the surface temperature Tc of the LED chip and the phosphor when the light source package in which the light source chip and the phosphor are in direct contact is used. And the temperature (Tq) of the photo-conversion layer.

As a result, when the LED driving current is increased to 80, 150, 300 or 500 mA, both the surface temperature Tc of the LED chip and the temperature Tq of the phosphor increase from about 46 degrees to 125 degrees.

In the case of a KSF phosphor capable of high reproducibility, the LED drive current is 160 mA or less so that the temperature of the phosphor (Tq) can be safely lowered to about 65 degrees or less since heat denaturation occurs at about 90 degrees or more.

On the other hand, when the light source device according to the embodiment of the present invention is used as shown in FIG. 11 (b), the temperature Tq of the phosphor is remarkably decreased.

Specifically, the first interval P between the light source chips is about 10 mm, and the distance between the center of the light source chip and the center of the light source chip adjacent to the light conversion portion projection point Q is 2.5 mm (i.e., the length of the first region in which the light conversion portion is disposed (Tc ') of the LED chip and the phosphor temperature (Tq') inside the light conversion part were measured when the LED driving current was increased to 80, 150, 300, and 500 mA under the condition that the LED driving current was about 5 mm.

As a result, the surface temperature Tc 'of the LED chip increased as in the conventional case (FIG. 11 (a)), but the increase rate of the phosphor temperature Tq' Accordingly, the phosphor temperature (Tq ') decreased to about 3 to 18 degrees.

For example, in the conventional light source package structure, when the LED driving current is 300 mA, the phosphor temperature (Tq) is about 90 degrees and thermal degeneration occurs. However, according to the embodiment of the present invention, Tq ') remained at 79 degrees, so that thermal deterioration hardly occurred.

Therefore, the LED driving current can be applied to only about 160 mA so as not to cause the thermal change of the phosphor in the conventional light source package. However, by using the light source device according to the embodiment of the present invention, the driving current of the light source chip is increased to 200 to 350 mA The temperature of the KSF phosphor can be maintained at 90 degrees or less.

Therefore, it is possible to increase the driving current of the individual light source chip while preventing deterioration of the phosphor due to heat, to provide a sufficient light output of the light source device, or at least to reduce the number of light source chips required under the same light output condition .

Particularly, in the light source apparatus according to the embodiment of the present invention, the area of the light converting unit is relatively small as compared with the structure in which the phosphor or the light converting layer is disposed on the entire upper surface of the light source chip, , Since the driving current of the individual light source chip can be made larger as described above, the optical output reduction due to the reduction of the light conversion area can be sufficiently compensated.

According to the embodiment of the present invention as described above, in the fluorescent light source apparatus including the blue light source (LED) chip and the phosphor region, the light conversion unit formed on the light source chip is offset by a certain distance from the light source chip, And deterioration of the phosphor due to heat generated in the light source can be prevented.

That is, by forming a light conversion portion including a phosphor only in a part of the upper region (first region) between the blue light source chips and forming a reflection layer in the remaining portion (second region) of the upper region, And the temperature of the phosphor contained in the light conversion unit is maintained at a constant level or lower to prevent deterioration of the phosphor.

Further, since the temperature rise of the phosphor can be suppressed, the driving current of the individual light source chip can be increased more than before, and the light output of the light source device can be further improved. It is possible to compensate for the loss due to the reduction of the area of the light converting portion.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the inventions. , Separation, substitution, and alteration of the invention will be apparent to those skilled in the art. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

300: light source device 310: light source PCB
320: side wall part 330: light source chip
340: photo-conversion part 350: reflective part
342: first region 352: second region
360: transparent encapsulation layer
410: light guide plate 420: reflector
430: Optical sheet part

Claims (13)

A light source device used in a backlight unit of a display device,
A light source PCB extending along one side of the display device;
A plurality of light source chips spaced apart from each other by a first interval (P) on the light source PCB;
Side walls disposed on both sides of the light source PCB;
A reflective portion disposed in a second region covering an upper portion of each of the light source chips among an upper region between the side wall portions;
A light converting unit disposed in a first region between the reflectors to convert light from the light source chip into light in a different frequency band among the upper regions between the side wall portions and emit the light from the light source chip to the outside of the light source device;
And the light source device for the display device. The method according to claim 1,
And a distance (d) between a projection point of the light-converging portion where one end of the first region in which the light-converting portion is disposed is projected onto the light source PCB and the center of the light-source chip is 1.0 to 2.5 mm. 3. The method of claim 2,
Wherein the first spacing (P) of the light source chips is about 10 mm and the length (W) of the first region in which the light converting portion is disposed is 5 to 8 mm. 3. The method of claim 2,
Wherein the first spacing (P) of the light source chips is about 15 mm, and the length (W) of the first region in which the light converting portion is disposed is 10 mm to 13 mm. 3. The method of claim 2,
Wherein the light source chip is a blue LED that outputs blue light, and the light conversion unit includes a KSF fluorescent material. 6. The method of claim 5,
Wherein a current applied to each of the blue LEDs is about 200 to 350 mA, and a temperature (Tq) of the KSF phosphor is 90 degrees or less. 3. The method of claim 2,
And a reflection surface disposed on an area other than the light source chip on the light source PCB. A light source PCB extending along one side of the display device; a plurality of light source chips disposed on the light source PCB at a first interval (P); side walls disposed on both sides of the light source PCB; And a plurality of light sources arranged in a first area between the reflector and an upper area between the light source chip and the light source chip, A light source unit for converting light into light of another frequency band and emitting the light to the outside of the light source device;
A light guide plate disposed at one side of the light source device for diffusing light emitted from the light conversion unit;
A reflection plate disposed on a bottom surface of the light guide plate;
An optical sheet portion including at least one individual optical sheet arranged on the upper surface of the light guide plate;
And a backlight unit for a display device. 9. The method of claim 8,
And a distance (d) between a projection point of the light-converging portion where one end of the first region in which the light-converting portion is disposed is projected onto the light source PCB and the center of the light-source chip is 1.0 to 2.5 mm. 10. The method of claim 9,
Wherein the first spacing (P) of the light source chips is about 10 mm, and the length (W) of the first region where the light converting portion is disposed is 5 to 8 mm. 10. The method of claim 9,
Wherein the first spacing (P) of the light source chips is about 15 mm, and the length (W) of the first region where the light converting portion is disposed is 10 to 13 mm. 10. The method of claim 9,
Wherein the light source chip is a blue LED that outputs blue light, and the light converting unit includes a KSF fluorescent material. 13. The method of claim 12,
Wherein a current applied to each of the blue LEDs is about 200 to 350 mA, and a temperature (Tq) of the KSF phosphor is 90 degrees or less.
KR1020150131874A 2015-09-17 2015-09-17 Light-Emitting Apparatus and Backlight Unit having the same KR20170033972A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190042917A (en) * 2017-10-17 2019-04-25 삼성전자주식회사 Display apparatus
WO2019156293A1 (en) * 2018-02-07 2019-08-15 엘지전자 주식회사 Lamp using semiconductor light-emitting devices
KR20200099778A (en) * 2019-02-15 2020-08-25 김동희 LED lighting device reducing blue light for decoration

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190042917A (en) * 2017-10-17 2019-04-25 삼성전자주식회사 Display apparatus
WO2019078572A1 (en) * 2017-10-17 2019-04-25 삼성전자주식회사 Display device
CN111226073A (en) * 2017-10-17 2020-06-02 三星电子株式会社 Display device
US11125931B2 (en) 2017-10-17 2021-09-21 Samsung Electronics Co., Ltd. Display apparatus
CN111226073B (en) * 2017-10-17 2023-01-24 三星电子株式会社 Display device
WO2019156293A1 (en) * 2018-02-07 2019-08-15 엘지전자 주식회사 Lamp using semiconductor light-emitting devices
KR20200099778A (en) * 2019-02-15 2020-08-25 김동희 LED lighting device reducing blue light for decoration

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