KR20170036969A - Light-Emitting Apparatus and Backlight Unit having the same - Google Patents

Light-Emitting Apparatus and Backlight Unit having the same Download PDF

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Publication number
KR20170036969A
KR20170036969A KR1020150135871A KR20150135871A KR20170036969A KR 20170036969 A KR20170036969 A KR 20170036969A KR 1020150135871 A KR1020150135871 A KR 1020150135871A KR 20150135871 A KR20150135871 A KR 20150135871A KR 20170036969 A KR20170036969 A KR 20170036969A
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KR
South Korea
Prior art keywords
light source
electrode
light
source chip
chip
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KR1020150135871A
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Korean (ko)
Inventor
김일수
김기성
정동열
이규환
Original Assignee
엘지디스플레이 주식회사
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Priority to KR1020150135871A priority Critical patent/KR20170036969A/en
Publication of KR20170036969A publication Critical patent/KR20170036969A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/61—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using light guides
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/65—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction specially adapted for changing the characteristics or the distribution of the light, e.g. by adjustment of parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body

Abstract

The present invention relates to a light source package and a backlight unit including the same. The present invention includes two or more light source chips and has a predetermined length ratio of major and minor axes or more. An electrode separation slope inclined surface having a predetermined inclined angle to the longitudinal direction of the light source package is formed in an electrode separation part between three electrodes for two light source chips, thereby reducing the number of light source packages required for the same brightness implementation and improving the rigidity of the light source package.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a light source package and a backlight unit including the light source package.

The present invention relates to a light source package for a display device and a backlight unit including the same, more specifically, a long light source package including two or more light source chips and having a length ratio of a short axis of a predetermined length or more, And a backlight unit including the light source package.

2. Description of the Related Art [0002] As an information-oriented society develops, there have been various demands for display devices for displaying images. Recently, liquid crystal displays (LCDs), plasma display panels (PDPs) Various display devices such as an OLED (Organic Light Emitting Diode Display Device) have been utilized.

Among these display devices, a liquid crystal display (LCD) has an array substrate including a thin film transistor, which is a switching element for controlling on / off each pixel region, and an array substrate including a color filter and / or a black matrix A display panel including a top substrate, a liquid crystal material layer formed therebetween, a driving unit for controlling the thin film transistor, a backlight unit (BLU) for providing light to the display panel, and the like , A pixel (PXL) electrode provided in a pixel region, and a common voltage (Vcom) electrode, and the transmittance of light is adjusted accordingly, thereby displaying an image.

In the case of such a liquid crystal display device, a backlight unit for providing light to the display panel is included, and the backlight unit may be an edge-type or a direct-type, depending on the arrangement of light sources and the transmission mode of light. Can be distinguished.

In the edge type backlight unit, a light source module or a light source device including a light source such as an LED, a holder or a housing for fixing a light source, and a light source driving circuit or the like is disposed on one side of the display device, A light guide plate (LGP) for reflecting the light toward the display panel, a reflection plate for reflecting the light toward the display panel, and at least one optical sheet disposed on the light guide plate for the purpose of improving brightness, have.

The light source device used in such an edge type backlight unit may include a light source package as a unit light source including an LED or the like, a light source PCB including a plurality of light source packages and a circuit element for driving the same.

The light source package generally includes one LED or light source chip and a lead frame or a mold structure in which the light source chip is accommodated and an electrode for the light source chip is formed.

Generally, there is a problem that hundreds of light source packages must be mounted on a light source PCB in order to ensure a sufficient luminance in a large-sized display device of several tens of inches or more using an edge-type backlight unit.

Accordingly, the present invention proposes a novel light source package capable of improving the rigidity of the light source package while reducing the number of light source packages required for the same luminance implementation as compared with the conventional structure.

SUMMARY OF THE INVENTION In view of the foregoing, it is an object of the present invention to provide a light source package for use in an edge type backlight unit, which comprises a long light source package including two or more light source chips, And a backlight unit including the same.

Another object of the present invention is to provide a light source package including a lead frame including two light source chips and three electrodes and including an electrode separation slope for securing rigidity of the light source package in an electrode separation portion between the electrodes, Thereby providing a backlight unit.

Another object of the present invention is to provide a light emitting device, which comprises a silicon resin structure including two light source chips and a phosphor without a lead frame or a mold structure, wherein the length of the short axis of the silicon resin structure has a certain ratio or more, A long light source package and a backlight unit including the long light source package.

In order to achieve the above object, an embodiment of the present invention includes an internal space defined by a side wall portion and a bottom portion, wherein a ratio of a length Wl of a major axis to a length Ws of a minor axis is 10: A support structure; A first light source chip and a second light source chip spaced apart from each other by a first spacing distance (P1) on a bottom surface of the support structure; And a lead frame disposed on a back surface of the bottom portion of the support structure and including a first electrode, a second electrode, and a common electrode connected to the P and N electrode pads of the first light source chip and the second light source chip, A light source package for use.

In another embodiment of the present invention, there is provided a light emitting device comprising: a support portion made of a mixed material of a phosphor and silicon (Si), wherein a ratio of a length Wl 'of a major axis to a length Ws' of a minor axis is 3.3: 1 or more; A first light source chip and a second light source chip arranged to be spaced apart from each other by a second spacing distance d2 on an inner bottom surface of the support portion and emitting blue light; A light reflection part disposed on a side surface and a bottom surface of the support part with a predetermined thickness; And an auxiliary electrode part disposed below the bottom surface of the support part and connected to the P and N electrode pads of the first light source chip and the second light source chip.

According to another embodiment of the present invention, there is provided a support structure including a support structure including an inner space defined by a side wall portion and a bottom portion, wherein a ratio of a length Wl of a major axis to a length Ws of a minor axis is 10: A first light source chip and a second light source chip disposed on a bottom surface of the structure and spaced apart from each other by a first spacing distance d1 and a second light source chip disposed on a back surface of the bottom surface of the support structure, A light source package including a lead frame including a first electrode, a second electrode, and a common electrode connected to an N-electrode pad; A light source substrate for mounting the plurality of light source packages; A light guide plate for diffusing light from the light source package; A reflector disposed on a bottom surface of the light guide plate; And an optical sheet portion including at least one individual optical sheet disposed on the upper surface of the light guide plate.

According to an embodiment of the present invention as described below, a light source package for use in an edge-type backlight unit includes at least two light source chips, wherein the light source chip has a length- By providing a long light source package, the number of light source packages required for realizing the same luminance can be reduced.

In addition, in the electrode separator between the three electrodes for the two light source chips included in the light source package, an electrode separation slope having a predetermined inclination angle with the longitudinal direction of the light source package is formed, .

In addition, the two light source chips mounted on the inside of the support have a constant arrangement structure, including a support portion which is a silicone resin structure including two light source chips and phosphors, There is no frame or mold structure, so that the number of light source packages required for realizing the same luminance can be reduced while simplifying the structure.

1 is a cross-sectional view of a display device including an edge-type backlight unit to which an embodiment of the present invention can be applied.
2 shows a cross section of a light source device in which a general type of phosphor light source package and a plurality of phosphor light source packages are arranged.
3 shows an example of a light source package including a general multi-light source chip
3 is a perspective view of a light source device according to an embodiment of the present invention.
FIG. 4 illustrates the occurrence of a hot spot phenomenon according to the distribution density of the light source package when the light source package as shown in FIG. 3 is used.
5 is a perspective view and a cross-sectional view of a light source package according to a first embodiment of the present invention.
6 shows a detailed structure of a lead frame used in the light source package according to the first embodiment.
FIG. 7 shows the arrangement relationship of the light source chips in the light source package according to the first embodiment of the present invention and the structure of the support structure.
FIG. 8 shows a perspective view and a cross-sectional view of a light source package according to a second embodiment of the present invention.
9 shows a light source chip placement relationship of the light source package according to the second embodiment of the present invention.
10 is a cross-sectional view of a backlight unit and a display device in which a light source package according to an embodiment of the present invention is used.

Hereinafter, some embodiments of the present invention will be described in detail with reference to exemplary drawings. In the drawings, like reference numerals are used to denote like elements throughout the drawings, even if they are shown on different drawings. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

In describing the components of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are intended to distinguish the components from other components, and the terms do not limit the nature, order, order, or number of the components. When a component is described as being "connected", "coupled", or "connected" to another component, the component may be directly connected or connected to the other component, Quot; intervening "or that each component may be" connected, "" coupled, "or " connected" through other components.

1 shows a cross section of a display device including an edge-type backlight unit to which an embodiment of the present invention can be applied

1, a display device to which an embodiment of the present invention can be applied includes a display panel 140 such as a liquid crystal display panel and backlight units 120 and 160 disposed below the display panel 140 to irradiate light to the display panel, A cover bottom 110 of metal or plastic that supports the backlight unit and extends over the entire rear surface of the display device, and the like.

The liquid crystal display device further includes a guide panel 130 for supporting the light source housing 127 constituting the backlight unit at the side while supporting the display panel 140 at an upper portion thereof, A case top 150 which is enclosed and extends to a part of the front surface of the display panel, and the like.

In such a liquid crystal display device, a backlight unit for providing light to the display panel is included, and the backlight unit is classified into an edge-type or a direct-type according to the arrangement of light sources and the transmission mode of light .

1, the edge type backlight unit 120 includes a light source module 127 including a light source 128 such as an LED, a holder or a housing for fixing the light source, and a light source driving circuit, A light guide plate 124 (light guide plate) for diffusing light to the entire panel area, a reflection plate 122 for reflecting light in the direction of the display panel, and a reflection plate 122 disposed above the light guide plate to improve brightness, And one or more optical sheets 126 arranged for use such as protection.

In this edge type backlight unit, light from the light source is incident on the light guide plate entrance portion, and is totally reflected by the light guide plate and spreads toward the display panel in the direction of the display panel.

As another form, there is a direct-type backlight unit. The direct-type backlight unit includes a light source PCB disposed on the top of the cover bottom, a diffusion plate spaced apart from the light source PCB by a predetermined distance to diffuse light from the light source, And the light source PCB may be disposed over the front surface of the display device, and an LED chip or an LED package, which is a light source, may be disposed on the light source PCB, And a light diffusing lens for a light source.

Generally, since the edge type backlight unit needs only a space corresponding to the thickness of the light guide plate, it can be slim down to 10 mm or less. However, since light is provided only on the side, it is difficult to realize a high luminance, and manufacturing cost is high due to parts such as a light guide plate , It is difficult to realize a local dimming function of irradiating light only in a local region of the display device.

As described above, in the edge type backlight unit, since the light from the light source disposed only at one side of the display device must be widely dispersed in the light guide plate, a relatively strong individual light source output is required to realize a constant luminance.

2 is a cross-sectional view of a light source device in which a light source package of a general type and a plurality of light source packages are disposed.

The light source package according to FIG. 2 is a phosphor light source package including a light source chip emitting blue light and a phosphor for converting the blue light into white light, such as a blue LED.

2, as the light source used in the backlight unit, a single package including a light source chip such as an LED and its peripheral structures may be used, and such a package may be expressed as a light source package or an LED package.

As shown in FIG. 2A, the light source unit of the backlight unit may include a plurality of light source packages 220 disposed on a long bar-shaped light source PCB 210.

The LED or light source chip included in the light source package constituting the light source may be a white LED outputting white light. However, as shown in FIG. 2, the blue LED chip 224 emitting blue light and the red ), Green (G), or the like, or a structure using a phosphor material or the like.

2 (b) and 2 (c), the light source package or LED package includes a printed circuit board 210 and a blue LED chip 224 mounted on the printed circuit board 210, The printed circuit board (PCB) 210 may include a printed circuit board base 211, an insulating layer 213, and a power wiring layer 215.

On the printed circuit board 210 on which the blue LED chip 224 is mounted, the light emitted from the LED chip 224 is shielded from the printed circuit board 210, A sidewall 222 or a lead frame covering the edge of the LED chip 224 to allow the space inside the sidewall to be filled with the light conversion material 225.

As another form of the light conversion region, a light conversion layer 225 'or a diffusion layer may be disposed in an opening region above the side wall 222, as shown in FIG. 2C.

The LED chip 224 in the LED package according to FIGS. 2 (b) and 2 (c) may be a blue LED disposed between the two electrodes to emit blue light, And then converted into R, G, and Y light by the light conversion layers 225 and 225 'to finally emit white light.

Meanwhile, the light source package shown in FIG. 2 is a structure in which one light source package is configured for one light source chip.

In recent years, a configuration including two or more light source chips in a single light source package has been proposed, and Fig. 3 shows an example of a light source package including such a multi-light source chip.

3, the light source package 300 including the multi-light source chip includes two light source chips 310, a lead frame 320 having a light source chip and including an electrode portion of the light source chip, And a resin mold 330 formed around the light source.

The light source package 300 as shown in FIG. 3 is generally formed in a rectangular shape having a length of about 70 mm to about 80 mm and a width of about 20 mm, and a plurality of light source packages are mounted on the light source PCB to be used as a light source of the edge type backlight unit.

On the other hand, recently, a large-sized display device exceeding 40 inches has been widely used. In the case of using the light source package as shown in FIG. 3, there is a problem that too many light source packages are used to constitute the light source portion.

In addition, when the distance between the light source packages mounted on the light source PCB is increased in order to reduce the number of the light source packages in the large display device, a so-called hot spot phenomenon in which a dark dark portion is formed in the space between the light source packages .

FIG. 4 illustrates the occurrence of a hot spot phenomenon according to the distribution density of the light source package when the light source package as shown in FIG. 3 is used.

4A shows a case where the multi-light source chip light source package 300 having the structure as shown in FIG. 3 is densely arranged on the light source PCB. When the arrangement interval S1 between the light source packages 300 is small, The light emitting lobes 340 of the light source package are overlapped with each other, so that no hot spot is generated in the spaces between the light source packages.

However, in order to use the structure of FIG. 4A, the number of the use of the light source package 300 according to FIG. 3 increases, and the light source package 300 having a size of 70 * ), About 144 light source packages were required based on a 55-inch high-definition (UHD) display device.

In order to reduce the number of the light source packages, when the spacing distance as the arrangement interval of the light source package 300 is increased to S2 as shown in FIG. 4 (b), the light emitting lobes 340 ' And a hot spot area 350 in which the space between the light emitting lobes of each light source package is dark is generated.

Therefore, when the light source package having the structure as shown in FIG. 2 or 3 is used in the edge type backlight unit, there is a problem that the number of the light source packages required for realizing a constant luminance increases or hot spots are generated.

Accordingly, it is an object of the present invention to provide a super-rectangular light source package including two or more light source chips, wherein a length ratio between a major axis and a minor axis is equal to or more than a predetermined value, wherein the arrangement of the light source chips is optimized, Thereby improving the rigidity of the lead frame including the electrodes, thereby making it possible to realize an edge type backlight unit free from hot spot generation with only a small number of light source packages.

5 is a perspective view and a cross-sectional view of a light source package according to a first embodiment of the present invention.

5, the light source package according to the first embodiment includes a support structure 530 including an inner space defined by a side wall part and a bottom part, and a light guide plate 530 having a first gap distance P1 The first light source chip 510 and the second light source chip 510 'are spaced apart from each other by a predetermined distance and a lead frame 520 disposed on the back surface of the bottom of the supporting structure and including an electrode part composed of three electrodes .

The support structure 530 has a bottom surface portion 529 on which the light source chip is mounted and a side wall portion 538 projecting upward from the edge of the bottom surface portion, wherein the ratio of the length Wl of the major axis to the length Ws of the minor axis is 10: And includes an inner space defined by the side wall portion 538 and the bottom portion 539.

The first light source chip 510 and the second light source chip 510 'may be a blue LED chip that emits blue light. In this case, in the inner space of the support structure 530, a phosphor for converting blue light into light of another frequency band A phosphor layer 540 filled with a mixture of transparent silicon (Si) may be formed.

The light source chips 510 and 510 'may be a general lateral chip or a so-called chip onboard chip mounted on a light source PCB without a mold frame or a lead frame by a surface mount technology (SMT) -On-Board (COB) or a chip scale package (CSP).

In addition, the light source chips 510 and 510 'may be formed of a light emitting layer disposed between the electrodes, and may be a chip called a flip-chip, in which two electrode layers are formed on a growth substrate layer.

 The emitted blue light may be red (R), green (G), yellow (Y), green (G), and blue ) Frequency band and the light emitted to the outside of the light source package can form white light.

As described above, the use of the blue LED chip and the phosphor layer as the light source chip has an advantage that the light efficiency can be improved as compared with the case of using the white LED.

The support structure 530 may be comprised of a white reflector material having reflective properties.

That is, the support structure 530 may be a molding structure formed by dispensing and curing any one of a silicone resin, an epoxy resin, and an epoxy molding compound (EMC) to a certain mold, and at least the support structure 530 It is preferable that the inner surface and the bottom surface portion 539 of the side wall portion 538 are formed of a material having a reflectance of 90% or more.

The support structure 530 supports not only the light source chip 510, 510 'but also the lead frame 520 having the electrode portion as described later, and is used for accommodating the above- to be.

The support structure 530 of the light source package according to the present embodiment has a super-rectangular shape that extends longer in the major axis direction than a conventional light source package of 70 * 20 mm size.

More specifically, the ratio of the length Wl of the major axis to the length Ws of the minor axis is not less than 10: 1, the major axis length W1 of the support structure 530 is not less than 20 mm and the minor axis length Ws is not more than 2 mm, It is preferable that the first light source chip 510 and the second light source chip 510 'are spaced apart from each other by about 1/4 of the major axis length Wl from both ends of the support structure.

Thus, by arranging the two light source chips in such a manner that the ratio of the major axis / minor axis length of the support structure 530 is maintained at a predetermined value or more, a smaller number of light source packages A backlight unit having sufficient brightness can be constructed.

The arrangement relationship between the support structure 530 and the light source chips 510 and 510 'will be described in more detail with reference to FIG.

The lead frame 520 is disposed on the back surface of the bottom portion 539 of the support structure 530 and is connected to the first and second light source chips 510 and 510 ' A second electrode 526, and a common electrode 524. The first electrode 522, the second electrode 526,

The lead frame 520 is formed of an electrically conductive metal plate, and includes three electrodes separated from each other as described above, and is mounted on the back surface of the support structure 530.

In particular, each electrode constituting the electrode portion of the lead frame according to the present embodiment has an electrode separation sloped surface (not shown) so as to have a first angle (? 1) of 30 degrees or more and 60 degrees or less with respect to the major axis direction, So as to increase the rigidity of the lead frame or the entire light source package.

The detailed configuration of the electrode including the electrode separation slope and the lead frame including the same will be described in more detail below with reference to FIG.

On the other hand, the inner surface of the side wall portion 538 of the support structure 530 is formed to have a constant inner inclination angle (? In Fig. 5B) with respect to the bottom surface portion, and the inner surface of the side wall portion 538 and the bottom surface portion 539 The inner inclination angle formed is preferably larger than 60 degrees but smaller than 90 degrees.

As described above, since the inner surface of the side wall portion 538 of the support structure is inclined at an inner inclination angle in the range of 60 to 90 degrees, the directivity angle of the light emitted from the light source package is kept within a certain range, Performance can be improved.

 As the phosphor material contained in the phosphor layer disposed in the inner space of the support structure 530, there are a yellow phosphor (Y), a red phosphor (R), and a green phosphor (G ) Material can be used, and the luminescent color can be selected by adjusting the compounding ratio of the phosphor of each color.

The yellow phosphor Y may be a YAG: Ce (T3Al5O12: Ce) phosphor which is yttrium (Y) aluminum (Al) garnet doped with cerium with a wavelength of 530 to 570 nm, Lt; / RTI >

The red (R) phosphor is a YOX (Y2O3: EU) -based phosphor composed of yttrium oxide (Y2O3) and europium (EU) having a main wavelength of 611 nm and the green (G) (LaPo4: Ce, Tb) phosphor which is a compound of phosphorus (Po4) and lanthanum (La) and terbium (Tb) serving as a wavelength and a blue (B) phosphor is barium Ba having a main wavelength of 450 nm. And BAM blue (BaMgAl 10 O 17: EU) based phosphor which is a compound of magnesium (Mg) and aluminum oxide based materials and europium (EU) can be used.

Further, as one of the phosphor materials, a material including a fluoride compound KSF phosphor (K 2 SiF 6 ; hereinafter referred to as KSF phosphor) which is a Mn 4+ activator phosphor favorable for high color reproduction can be used.

The support structure 530 may form the entire support structure using a white reflector material having reflective properties and may be formed only on the inner surfaces of the side wall portion 538 and the bottom surface portion 539 after molding the support structure with the light- Or by coating a reflective layer having reflective properties.

6 shows a detailed structure of a lead frame used in the light source package according to the first embodiment.

The lead frame 520 included in the light source package according to the first embodiment includes a first electrode 522 connected to one of the P or N electrode pads of the first light source chip 510 and a second electrode 522 connected to the second light source chip 510 ' A second electrode 526 connected to the N or P electrode pad of the second light source chip and a common electrode 524 connected to the remaining two electrodes of the first light source chip and the second light source chip.

6, the (-) electrode pad of the first light source chip 510 is connected to the first electrode 524 through the lead line 512, and the (+) electrode pad of the second light source chip 510 ' ) Electrode pads are connected to the second electrode 526 and the (+) electrode pads of the first light source chip 510 and the (-) electrode pads of the second light source chip 510 'are all connected to the common electrode 524 .

In other words, the lead frame used in the optical package according to the present embodiment includes three electrodes. By connecting as described above, the first light source chip 510 and the second light source chip 510 ' .

On the other hand, the three electrodes constituting the electrode unit must be electrically separated from the adjacent electrodes, and an electrode separation line or an electrode separation surface must be formed between the two electrodes.

According to this embodiment, such an electrode separation line is not formed in a direction perpendicular to the longitudinal axis of the light source package, but is inclined so as to have a constant first angle? 1 with respect to the major axis direction of the light source package.

6, the first electrode 522 and the common electrode 534 are provided with an electrode separation slope 522 'which is inclined so as to have a first angle? 1 with respect to the long axis direction at the electrode separation portion where the two electrodes are separated. , 524 'are formed.

In this case, the first angle [theta] 1 of the electrode separation slope is defined as an acute angle with respect to the long axis of the electrode separation slopes 522 'and 534', and the first angle [theta] 60 < / RTI >

6 (c), when the electrode separation surface is formed in the direction perpendicular to the long axis, when an external force F is bent along the longitudinal direction of the light source package, the electrode separation portion A), the lead frame and the supporting structure attached to the lead frame are likely to be cut.

On the other hand, when the electrode separation slopes 522 'and 524' having the long axis direction and the first angle? 1 of 60 degrees or less are formed in the electrode separation portion as shown in FIG. 6A, The bending stiffness of the lead frame is increased, and as a result, the cutting stiffness of the light source package can be improved.

On the other hand, as the first angle? 1 of the electrode separation slopes 522 'and 524' is smaller, the rigidity is increased. However, when the first angle? 1 is 30 degrees or less, The arrangement of the light source chips 510 and 510 'and the connection of the lead wires become difficult.

Therefore, by setting the first angle [theta] 1 of the electrode separation slopes of the three electrodes formed on the lead frame 520 in the light source package according to the present embodiment within the range of 30 to 60 degrees, it is possible to arrange the light source chips The rigidity of the lead frame can be maximized.

The electrode separation distance t at which the electrode separation slopes 522 'and 524' of the two electrodes are spaced apart from each other in the electrode separation portion is preferably set to 80% or more of the thickness of the lead frame.

Similarly, the electrode separation slopes 522 'and 526' inclined to have the second angle? 2 with respect to the major axis direction may be formed at the electrode separation portion between the first electrode 522 and the second electrode 526 , And the second angle 2 of the electrode separation slopes 522 'and 526' of the first electrode 522 and the second electrode 526 may be determined within a range of about 30 to 60 degrees.

6, the electrode separation inclined surfaces 522 'and 526' between the first electrode 522 and the second electrode 526 and the electrode separation inclined surface between the first electrode 522 and the common electrode 524 522 ', and 524' between the common electrode 524 and the second electrode 526 are formed to be inclined in the same direction. However, the present invention is not limited thereto, The electrode separating slopes in the three electrode separating portions may be formed in different directions.

A mold fixing hole 528 for connecting to the supporting structure is formed near both ends of the lead frame 520. The width t 'of the mold fixing hole 528 is about 80% of the thickness of the lead frame, Or more.

6 (b), one or more rounding portions 522 "and 524" may be formed in the vicinity of the electrode separation slopes of the respective electrodes at portions where the electrode separation slopes and the longitudinal direction sides of the electrodes are connected to each other have.

The rounded portions 522 "and 524" of the electrode separation slope can prevent the charges applied to the electrodes from concentrating at specific points during the operation of the light source package.

That is, in the absence of the rounding portions 522 "and 524 ", there is a possibility that electrical or thermal characteristics may deteriorate due to the concentration of charges on the edge portions where the longitudinal sides of the electrode separation slopes 522 'and 524' meet. As a result, when the rounded portions 522 "and 524" are formed on the electrode separation slope as shown in Fig.

FIG. 7 shows the arrangement relationship of the light source chips in the light source package according to the first embodiment of the present invention and the structure of the support structure.

7A, in the light source package according to the first embodiment, when the major axis length of the light source package 500 or the support structure 520 is Wl and the minor axis length is Ws, the first light source chip 510, And the second light source chip 510 'are disposed at about 1/4 and 3/4 along the longitudinal direction of the light source package.

However, considering the bonding process of the light source chip and the arrangement relationship with the electrodes, the first light source chip 510 and the second light source chip 510 'may have a length of about 1/4, 3/4 And can be arranged offset about +/- 2 mm from the point.

For example, when the major axis length Wl of the light source package 500 or the support structure 520 is about 20 mm and the minor axis length Ws is about 2 mm, the distance between the first light source chip 510 and the left end of the light source package The distance d1 between the second light source chip 510 'and the right end of the light source package is about 5 ± 2 mm. As a result, the distance d1 between the first light source chip 510' and the second light source chip 510 ' The separation distance P1 can be determined to be about 10 4 mm.

As a result of the experiment, it was confirmed that hot spots were generated between the light source chips or in the space between the light source packages when the light source package having the long and short axis length ratio of 10: 1 or more deviated from the light source chip arrangement as described above.

Therefore, by arranging the light source chip as described above, light from each light source chip of the long rectangular light source package in the longitudinal direction can be uniformly diffused into the backlight unit, and hot spots between the light source chips can be minimized.

7B is a plan view of the support structure 530 and the lead frame 520 used in the light source package according to the first embodiment.

The support structure 530 can be made of a molded article using a PCT (polycyclohexanedimethylene terephthalate) material, which is a high heat resistant resin, and includes a side wall portion 538 and a bottom portion 539, Except for the bonding portions for connecting the lead frames 510 and 510 'and the lead frame 520. [

7 (b), chip supporting holes 531 and 531 for seating the first light source chip 510 and the second light source chip 510 'are formed in the bottom face portion 539 of the supporting structure 530, A first lead wire through hole 532 through which a lead wire for connecting one of the P and N electrode pads of the first light source chip 510 to the first electrode 522 passes, A second lead wire penetration hole 536 through which a lead wire for connecting one of the P and N electrode pads of the first light source chip 510 'to the second electrode 526 passes; And a third lead wire through hole 534 through which a lead wire connecting the electrode pad and the common electrode 524 passes is formed.

Of course, the chip seating holes 531 and 531 'for seating the one light source chip 510 and the second light source chip 510' may not be formed in some cases.

Thus, the bottom surface portion of the support structure 530 is formed in a structure that covers all of the lead frames other than the one or more lead-through holes for allowing the lead wires connecting the electrode pads of the light source chip and the electrodes to pass therethrough.

Therefore, the reflection efficiency by which the bottom surface portion 539 of the supporting structure having the reflective characteristic reflects the light from the light source chip to the upper portion of the light source package is increased, and consequently, the light efficiency of the light source package can be improved.

FIG. 8 shows a perspective view and a cross-sectional view of a light source package according to a second embodiment of the present invention.

In the first embodiment described above, the support structure and the lead frame, which are separate mold structures, are used. On the other hand, in the second embodiment shown in FIG. 8 and below, a mold structure and a lead frame-free light source package are provided.

The light source package according to the second embodiment of FIG. 8 has a support portion 820 made of a mixed material of a phosphor and silicon (Si) and having a ratio of a long axis Wl 'and a short axis length Ws' of 3.3: , A first light source chip (810) and a second light source chip (810 ') spaced apart from each other by a second spacing distance (P2) on the inner bottom surface of the support portion and emitting blue light, And an auxiliary electrode unit 840 disposed below the lower surface of the supporting unit and connected to the P and N electrode pads of the first and second light source chips.

That is, the light source package according to the second embodiment has a super short rectangular shape with a length ratio of a short axis of 3.3: 1 or more, a support portion 820 formed directly of a phosphor and a silicon material instead of a mold structure, And an auxiliary electrode unit 840 formed by extending the electrode pad of the light source chip.

The light source chips 810 and 810 'used in the second embodiment may be a chip in the form of a chip-on-board (COB) or a chip scale package (CSP) like the first embodiment, And may be a blue LED chip that emits blue light in the form of a chip (Flip-Chip).

The support portion 820 may be formed by mixing a phosphor material such as a yellow phosphor (Y), a red phosphor (R), and a green phosphor (G) material and a transparent silicon (Si) material that emits blue light and then emits light of a different color frequency band. The material may be injection molded or dispensed from a given mold to form a generally rectangular shaped square bar.

At this time, as the phosphor included in the mixed material constituting the support portion, a yellow phosphor Y (Y 2 O 3: Y 3 O 3: Y 3 O 3: Y 2 O 3: EU) series red phosphors (R), and LAP (LaPo4: Ce, Tb) green phosphors (G). It may also contain a fluoride compound KSF phosphor which is a Mn4 + activator phosphor favorable for high color reproduction.

The supporting portion has a diamond-like cross-section whose width of the upper surface is larger than the width of the lower surface, and which widens upward as a whole.

Therefore, the side surface of the support portion is inclined at a predetermined outer inclination angle? With the normal direction of the light source package, and the outer inclination angle? Can be selected at about 5 to 40 degrees.

On the other hand, a light reflection portion 830 formed to a constant thickness is formed on the side surface and the bottom surface of the support portion 820.

The light reflection part 830 is formed by depositing a reflective material selected from Al, Au, and Ag on the side surface and the bottom surface of the support part 820 of the phosphor and the silicon (Si) material by a technique such as sputtering, Or by forming a reflective layer having a thickness of 1 to 20 mu m.

Alternatively, the light reflection portion 830 may be formed by attaching a film or sheet including a base film layer and a reflection coating layer disposed on one side thereof to the side surface and the bottom surface of the support portion.

At this time, the mother film layer constituting the light reflection portion 830 may be formed of a material such as polymethyl methacrylate (PMMA), MS (methystyrene) resin, polystyrene (PS), polypropylene Transparent material such as polyethylene terephthalate (PET) and polycarbonate (PC), glass, etc., and the thickness of the parent film layer may be about 0.75 to 1.25 mm.

The reflective coating layer formed on the mother film layer constituting the light reflection portion 830 is formed of a reflective material selected from one or more of Al, Au and Ag, and its thickness may be about 20 to 60 um, but is not limited thereto .

The light reflecting portion 830 reflects / condenses the blue light emitted from the light source chips 810 and 810 'or the white light converted from the phosphor and outputs the light to the upper surface of the supporting portion 820.

In the light source package according to the second embodiment, since the lead frame having the same electrode as that of the first embodiment is not used, the auxiliary electrode unit (not shown) extending from the P and N electrode pads of the light source chips 810 and 810 ' 840).

More specifically, the auxiliary electrode unit 840 is connected to the P and N electrode pads of the light source chips 810 and 810 ', and has a chromium (Cr) bonding layer (not shown) extending to occupy a certain area below the bottom of the supporting unit 820 842) and a copper (Cu) bonding layer 844 disposed under the chromium bonding layer.

The light source package according to the second embodiment should be mounted on a separate light source PCB, and a portion of the light source package that contacts the electrode terminal of the light source PCB is preferably formed of a copper material.

The P and N electrode pads of the flip chip type light source chips 810 and 810 'are made of a UBM (Under Bumper Metalization) formed of a metal such as chromium (Cr) or titanium (Ti) When the pad is directly bonded to the terminal on the light source PCB, the adhesive force can be reduced.

Thus, according to the second embodiment, the auxiliary electrode unit 840 is formed in a double layer structure of a chromium (Cr) bonding layer 842 and a copper (Cu) bonding layer 844, The adhesion between the soldering regions can be improved.

9 shows a light source chip placement relationship of the light source package according to the second embodiment of the present invention.

In the case of the light source package according to the second embodiment, the long axis length W1 'should be at least about 10 mm, but the long axis length W1' is formed at a maximum of 15 mm or less due to limitations in the process of manufacturing the supporting portion 820 using the phosphor and the silicon mixed material. .

More specifically, it is preferable that the long axis length W1 'of the light source package according to the second embodiment is selected to be about 10 to 15 mm and the minor axis length Ws' is about 2 to 3 mm, The short axis length ratio should be 3.3: 1 or greater.

In the light source package according to the second embodiment as well as the first embodiment, the first light source chip 810 and the second light source chip 810 'are disposed at approximately 1/4 and 3/4 points along the longitudinal direction of the light source package As shown in Fig.

However, the first light source chip 810 and the second light source chip 810 'may be disposed at a distance of about 1/4, 3/4, or 1/10 along the longitudinal direction of the light source package, taking into account the bonding process of the light source chip, And can be arranged offset about +/- 2 mm from the point.

For example, when the major axis length Wl 'of the light source package or support 820 is about 12 mm and the minor axis length Ws' is about 2 mm, the distance between the first light source chip 810 and the left end of the light source package, The distance d2 between the light source chip 810 'and the right end of the light source package is about 3 ± 2 mm. As a result, the distance between the first light source chip 810' and the second light source chip 810 ' (P2) can be determined to be about 6 +/- 4 mm.

As a result of the experiment, it was confirmed that when a light source package having a short axis length ratio of 3.3: 1 or more deviates from the light source chip arrangement as described above, hot spots are generated between the light source chips or spaces between the light source packages.

Therefore, as shown in FIG. 9, by configuring the light source package according to the second embodiment, light from each light source chip of the long rectangular light source package in the longitudinal direction can be diffused evenly into the backlight unit, Can be minimized.

10 is a cross-sectional view of a backlight unit and a display device in which a light source package according to an embodiment of the present invention is used.

A light source package 1512 according to the first or second embodiment shown in FIG. 5 or 8 according to the present embodiment, a light source substrate 1514 for mounting a plurality of light source packages, A light guide plate 1520 for diffusing light, a reflection plate 1530 disposed on the bottom surface of the light guide plate, and an optical sheet unit 1540 including at least one individual optical sheet disposed on the upper surface of the light guide plate.

In this case, the light source package 1512 is the light source package according to the first embodiment shown in FIG. 5 and the like. The ratio of the length Wl of the long axis to the length Ws of the short axis is 10: 1 or more, A first light source chip and a second light source chip disposed on a bottom surface portion of the support structure by a first distance d1 and a second light source chip disposed on a back surface of the bottom surface portion of the support structure, And a lead frame including a first electrode, a second electrode, and a common electrode connected to the P and N electrode pads of the first light source chip and the second light source chip.

8, the ratio of the length Wl 'of the long axis to the length Ws' of the short axis is 3.3: 1 or more, and the ratio of the phosphor to the silicon (Si A first light source chip and a second light source chip which are arranged on the inner bottom surface of the support portion by a second spacing distance d2 and emit blue light and are arranged at a predetermined thickness on the side and bottom of the support portion; And the light reflection portion may be formed.

On the other hand, as shown in FIG. 10B, in the light source unit used in the backlight unit according to the present embodiment, a large number of the light source packages 1512 having the above-described configuration are arranged on the long bar-shaped light source PCB 1514 Lt; / RTI >

At this time, the spacing distance D between the light source packages 1512 can be set in a range of about 1 to 2 mm.

The light source PCB 1514 is a printed circuit board extending long along one or more sides of the display device or the backlight unit, and may be composed of a printed circuit board base, an insulating layer, a power wiring layer, and the like.

The light guide plate 1520 included in the backlight unit according to the embodiment of FIG. 10 may be formed of a rectangular clear plastic sheet die-cut, extruded, or injection-molded from a plastic sheet, The white light emitted from the light guide plate 1520 is incident on the edge of the light guide plate 1520 and is totally reflected within the light guide plate and diffused across the back surface of the display panel. Light emitted through the flat top surface of the light guide plate functions as a backlight of the display panel.

The light guide plate 1520 may be made of a material such as polymethyl methacrylate (PMMA), MS (methystyrene) resin, polystyrene (PS), polypropylene (PP), polyethylene terephthalate : PET) and polycarbonate (PC), but the present invention is not limited thereto.

The reflection plate 1530 is disposed on the back surface of the light guide plate 1520 and functions to improve the brightness of light by reflecting the light that has passed through the back surface of the light guide plate toward the display panel 1800.

The optical sheet unit 1540 disposed on the light guide plate 1520 condenses the light so that a more uniform surface light source is incident on the display panel 1800, and one or more individual optical sheets may be combined.

The optical sheet unit 1540 includes a condensing sheet or a prism sheet PS having a light collecting function, a diffusing sheet DS for diffusing light, a reflective sheet 1510 called a dual brightness enhancement film (DBEF) A polarizing film, and the like.

In the case of a liquid crystal display panel, the display panel 1800 provided with light by the backlight unit according to the present embodiment includes a plurality of gate lines, data lines and pixels defined in the intersecting regions, An array substrate including a thin film transistor which is a switching element for adjusting light transmittance, an upper substrate provided with a color filter and / or a black matrix, and a liquid crystal material layer formed therebetween.

Meanwhile, the display panel to which the light source device according to the present embodiment can be applied is not limited to such a liquid crystal display panel, but may include other types of display devices requiring a backlight unit.

As a structure for supporting the backlight unit according to the present embodiment, a cover bottom 1600, which is a back cover made of metal or plastic, covering a rear surface and a part of a side surface of the display device) A case top 1900 covering the uppermost edge of the display device and a top edge of the display panel), and the like.

The light source package and the backlight unit according to the embodiments described above can be used as a light source package for an edge type backlight unit. The light source package includes two or more light source chips, By providing a long light source package having a certain length or more, the number of light source packages required for realizing the same luminance can be reduced.

Actually, an experiment was conducted in which the light source package according to this embodiment and the existing 70 * 20 mm light source package of the present invention were used for an edge type backlight unit of a 55-inch high definition (UHD) display device. Table 1 summarizes the results.

The existing light source package (70 * 20) The light source package 01 (150 * 20) The light source package 02 (200 * 20) Luminous efficiency (lm / W) 133 (100%) 111 (83%) 100 (75%) Number of light source packages 144 (100%) 66 (46%) 56 (39%)

As shown in Table 1, when the light source package of the structure (150 * 20, 200 * 20) according to the present embodiment is used, the light efficiency is about 25 %, But the number of necessary light source packages was reduced by 50% or more.

Since the decrease in the light efficiency can be compensated for by increasing the driving current of each light source chip, the number of light source packages required for implementing the same luminance can be reduced to less than half by using the light source package according to the present embodiment.

In addition, in the electrode separator between the three electrodes for the two light source chips included in the light source package, an electrode separation slope having a predetermined inclination angle with the longitudinal direction of the light source package is formed, .

In addition, the two light source chips mounted on the inside of the support have a constant arrangement structure, including a support portion which is a silicone resin structure including two light source chips and phosphors, There is no frame or mold structure, so that the number of light source packages required for realizing the same luminance can be reduced while simplifying the structure.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the inventions. , Separation, substitution, and alteration of the invention will be apparent to those skilled in the art. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

500, 800: Light source package 510, 510 ', 810, 810': Light source chip
520: lead frame 530: support structure
522: first electrode 524: common electrode
526: second electrode 522 ', 524', 526 ': electrode separation slope
820: Support part 830: Light reflection part

Claims (10)

A support structure including a ratio of a length (Wl) of a major axis to a length (Ws) of a minor axis of 10: 1 or more and an inner space defined by the side wall portion and the bottom portion;
A first light source chip and a second light source chip spaced apart from each other by a first spacing distance (P1) on a bottom surface of the support structure;
A lead frame disposed on a back surface of the bottom portion of the support structure, the lead frame including a first electrode, a second electrode, and a common electrode connected to the P and N electrode pads of the first light source chip and the second light source chip;
And a light source package for a display device. The method according to claim 1,
Wherein at least one of the first electrode, the second electrode, and the common electrode has an electrode separation inclined surface inclined to have a first angle (? 1) of 30 degrees or more and 60 degrees or less with respect to the major axis direction The light source package for a display device included. 3. The method of claim 2,
Wherein the support structure has a major axis length Wl of 20 mm or more and a minor axis length Ws of 2 mm or less and a distance d1 between one end of the support structure and the first light source chip, And the distance d1 between the second light source chips is 1/4 +/- 2 mm of the long axis length Wl. 3. The method of claim 2,
And a lead wire through hole through which lead wires connecting the P and N electrode pads of the first light source chip and the second light source chip to the electrodes are disposed are formed in a bottom surface portion of the support structure. 3. The method of claim 2,
Wherein an inner surface of the side wall portion of the support structure has an inner inclination angle of 90 degrees or less with respect to the bottom surface portion. 6. The method of claim 5,
The first light source chip and the second light source chip are blue LED chips emitting blue light, and the inner space of the support structure is filled with a mixed material of a phosphor for converting blue light into light of a different frequency band and silicon (Si) A light source package for a display device in which a phosphor layer is disposed. A support having a ratio of a length (W1 ') of a long axis to a length (Ws') of a short axis of 3.3: 1 or more and composed of a mixed material of a phosphor and silicon (Si);
A first light source chip and a second light source chip disposed on an inner bottom surface of the support portion with a second spacing distance P2 and emitting blue light;
A light reflection part disposed on a side surface and a bottom surface of the support part with a predetermined thickness;
An auxiliary electrode unit disposed below the bottom surface of the support unit and connected to the P and N electrode pads of the first light source chip and the second light source chip;
And a light source package for a display device. 8. The method of claim 7,
Wherein the auxiliary electrode unit includes a chromium (Cr) bonding layer and a copper (Cu) bonding layer disposed under the chromium bonding layer. A support structure including a ratio of a length (Wl) of a major axis to a length (Ws) of a minor axis of 10: 1 or more and including an inner space defined by a side wall portion and a bottom portion; A first light source chip and a second light source chip spaced apart from each other by a distance P1 between the first light source chip and the second light source chip and a first electrode connected to the P and N electrode pads of the first light source chip and the second light source chip, A light source package including a lead frame including a second electrode and a common electrode;
A light source substrate for mounting the plurality of light source packages;
A light guide plate for diffusing light from the light source package;
A reflection plate disposed on a bottom surface of the light guide plate;
An optical sheet portion including at least one individual optical sheet arranged on the upper surface of the light guide plate;
And a backlight unit for a display device. 10. The method of claim 9,
Wherein at least one of the first electrode, the second electrode, and the common electrode has an electrode separation inclined surface inclined to have a first angle (? 1) of 30 degrees or more and 60 degrees or less with respect to the major axis direction And a backlight unit for the display device.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190098628A (en) * 2018-02-14 2019-08-22 엘지이노텍 주식회사 Semiconductor device package and lighting device module including the same
CN113985653A (en) * 2021-10-20 2022-01-28 京东方科技集团股份有限公司 Light-emitting element, backlight source, backlight module and display device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190098628A (en) * 2018-02-14 2019-08-22 엘지이노텍 주식회사 Semiconductor device package and lighting device module including the same
CN113985653A (en) * 2021-10-20 2022-01-28 京东方科技集团股份有限公司 Light-emitting element, backlight source, backlight module and display device
CN113985653B (en) * 2021-10-20 2023-10-20 京东方科技集团股份有限公司 Light-emitting element, backlight source, backlight module and display device

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