KR102394423B1 - Light-Emitting Package and Display Device having the same - Google Patents

Abstract

The present invention relates to a light source device for a backlight unit and a display device including the same, comprising a bent light source PCB having a light source chip receiving groove for accommodating the light source chip and a light source chip mounted directly on the upper surface of the light source chip receiving groove. By providing the light source device, the light source housing and the spacer pad can be removed, the thickness of the light source device is reduced, and the performance of the display device due to heat is reduced by arranging the light source device on one of the vertical sides of the display device. prevent, improve the scanning performance of the display device, and reduce the number of light source chips

Description

A light source device and a display device including the same {Light-Emitting Package and Display Device having the same}

The present invention relates to a light source device for a backlight unit, a display device including the same, and more specifically, a light source device including a light source printed circuit board (PCB) capable of mounting a surface-mounted light source chip in a light source chip accommodating groove, and the same It relates to a display device that

As the information society develops, the demand for display devices for displaying images is increasing in various forms. Various display devices such as an organic light emitting diode display device (OLED) are being used.

Among these display devices, a liquid crystal display (LCD) includes an array substrate including a thin film transistor as a switching element for on/off control of each pixel region, a color filter and/or a black matrix, and the like. It consists of an upper substrate, a display panel including a liquid crystal material layer formed therebetween, a driving unit for controlling the thin film transistor, and a backlight unit (BLU) that provides light to the display panel. , a device that displays an image by adjusting the arrangement of the liquid crystal layers according to the electric field applied between the pixel (PXL) electrode and the common voltage (Vcom) electrode provided in the pixel area and thus the transmittance of light accordingly.

In the case of such a liquid crystal display device, a backlight unit for providing light to the display panel is included, and the backlight unit may be of an edge-type or a direct-type type depending on the arrangement of the light source and the type of light transmission. can be distinguished.

Among them, in the edge type backlight unit, a light source such as an LED and a light source module or light source device including a holder or a housing for fixing the light source and a light source driving circuit are disposed on one side of the display device, and the light is diffused to the entire panel area. It may include a light guide plate (LGP) for, a reflector plate for reflecting light in the direction of the display panel, and one or more optical sheets disposed on the light guide plate for the purpose of improving luminance, diffusion and protection of light, etc. there is.

The light source device used in such an edge-type backlight unit may include a light source package as a unit light source including a light source chip such as an LED, and a light source PCB including a plurality of light source packages and a circuit element for driving the light source package. can

Typically, such a light source device is disposed in a lower horizontal area of the display device, and a light housing for supporting the light source device is required.

In addition, the light source package has a certain thickness, and in order to protect the light source package from expansion of the light guide plate, a spacing pad (T-Pad or U-Pad) of a certain thickness must be used on the light source PCB.

On the other hand, the demand for a narrow bezel of a display device is increasing recently. In the case of a display device having a general structure, a light source housing, a light source PCB, a light source package, and a spacer pad are disposed in the horizontal bezel area, so the horizontal bezel area This increase is an obstacle to the implementation of narrow bezels.

In addition, in general, a data driver (D-IC) that applies a data signal to the display panel is also disposed in the lower horizontal area of the display device. Therefore, there may be a problem in that the light guide plate or the optical sheet adjacent to the lower horizontal region is deformed by heat.

Accordingly, there is a need to develop a light source device or a backlight unit capable of implementing a narrow bezel and preventing damage due to heat.

Against this background, it is an object of the present invention to provide a light source device capable of implementing a narrow bezel of a display device and overcoming a problem due to heat generated during driving of the display device, and a display device including the same.

Another object of the present invention is to have a light source chip that is directly surface mounted on a light source PCB and a bent light source PCB having a light source chip accommodating groove for accommodating one or more light source chips to have a small thickness, thereby providing a narrow bezel of a display device. To provide a light source device that can contribute to

Another object of the present invention is to provide a light source device comprising a light source chip that is directly surface mounted on a light source PCB and a bent light source PCB having a light source chip accommodating groove for accommodating one or more light source chips on one of the vertical sides of the display device. It is to provide a display device capable of preventing deterioration of the performance of the display device due to heat, improving the scanning performance of the display device, and reducing the number of light source chips by disposing the display device.

In order to achieve the above object, an embodiment of the present invention, a display panel; A bendable light source PCB including a horizontal surface extending parallel to the display panel and a vertical surface perpendicular to the horizontal surface in which a plurality of light source chip accommodation grooves for accommodating the light source chip are disposed, and a top surface of the light source chip accommodation groove is in contact with a light source device including one or more light source chips mounted thereon; a light guide plate disposed to be spaced apart from the light source PCB by a predetermined distance in the light output direction of the light source device; and a support for supporting at least one of the light source device, the light guide plate, and the display panel.

Another embodiment of the present invention includes: a bent light source PCB including a horizontal surface extending parallel to a display panel and a vertical surface perpendicular to the horizontal surface and on which a plurality of light source chip accommodating grooves for accommodating light source chips are disposed; It provides a light source device comprising a; at least one light source chip mounted in contact with the upper surface of the light source chip receiving groove.

According to an embodiment of the present invention as will be described below, there is provided a light source device composed of a bent light source PCB having a light source chip receiving groove for accommodating a light source chip and a light source chip mounted directly on the upper surface of the light source chip receiving groove By doing so, the light source housing and the spacing pad can be removed, and the thickness of the light source device is reduced, thereby contributing to the narrow bezel of the display device.

In addition, by arranging such a light source device on one of the vertical sides of the display device, it is possible to prevent deterioration of the performance of the display device due to heat, improve the scanning performance of the display device, and reduce the number of light source chips. there is

1 is a plan view of a general display device.
FIG. 2 is a cross-sectional view of a light incident part side of the display device of FIG. 1 and a perspective view of a light source device used in the display device of FIG. 1 .
FIG. 3 shows an example of a light source package that can be used in the light source device shown in FIG. 2 .
FIG. 4 shows a thickness of a backlight unit used in the display device of FIG. 2 and a heat transfer state in the display device of FIG. 2 .
5 is a plan view and a side cross-sectional view of a display device according to an embodiment of the present invention.
6 is a perspective view and a longitudinal cross-sectional view of a light source device according to an embodiment of the present invention.
7 shows an equivalent circuit used in a light source device according to an embodiment of the present invention and an arrangement state of a light source chip related thereto.
8 shows a detailed structure of a light source chip and a heat dissipation member that can be used in a light source device according to an embodiment of the present invention.
9 is a cross-sectional view of a light carrying-in part side of a display device according to an embodiment of the present invention, and a light guide plate supporting member used in the light carrying-in part.
10 is a diagram for explaining an effect of a display device according to an embodiment of the present invention.

Hereinafter, some embodiments of the present invention will be described in detail with reference to exemplary drawings. In adding reference numerals to components of each drawing, the same components may have the same reference numerals as much as possible even though they are indicated in different drawings. In addition, in describing the present invention, if it is determined that a detailed description of a related known configuration or function may obscure the gist of the present invention, the detailed description may be omitted.

In addition, in describing the components of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only for distinguishing the elements from other elements, and the essence, order, order, or number of the elements are not limited by the terms. When it is described that a component is “connected”, “coupled” or “connected” to another component, the component may be directly connected or connected to the other component, but other components may be interposed between each component. It should be understood that each component may be “interposed” or “connected”, “coupled” or “connected” through another component.

1 is a plan view of a display device including an edge-type backlight unit to which an embodiment of the present invention can be applied.

1 , a display device to which an embodiment of the present invention can be applied includes a plurality of gate lines GL, a plurality of data lines DL, and a pixel P defined as an intersection area of the lines. a liquid crystal display panel 10, which is disposed outside or inside one side of the display panel to apply a gate signal to a gate line, and a gate driver 20 disposed outside the lower horizontal region of the display device to drive the gate driver and a data driver 30 (hereinafter referred to as 'D-IC') for simultaneously applying an image signal (data signal) to the data line.

In addition, in such a liquid crystal display device, a backlight unit for providing light to the display panel is included, and the backlight unit can be of an edge-type or a direct-type type depending on the arrangement of the light source and the transmission type of light. can be distinguished.

Among them, an edge type backlight unit to which an embodiment of the present invention can be applied is an edge type backlight unit including a light source unit such as a light source package, and a light source device comprising a light source PCB supporting the light source unit and including a light source circuit element do.

In the edge type backlight unit, the light source device 40 is disposed on one or more of the four sides of the display device, and the light from the light source device is provided to the entire display device by a light guide plate disposed entirely on the rear surface of the display panel.

1, the light source device 40 is generally disposed on the lower horizontal side of the display device. can

FIG. 2 is a cross-sectional view of a light incident part side of the display device taken along line I-I' of FIG. 1 , and a perspective view of a light source device used in the display device of FIG. 1 .

As shown in FIG. 2 , a light source device including a light source unit 128 such as an LED package and a light source PCB 127 in the form of a long bar supporting the light source unit is disposed on the light receiving unit side of a general display device.

In addition, an L-shape or 'C'-shaped light housing (Light Housing; 129) to support the light source device, and a light guide plate (123; Light Guide Plate; LGP) for diffusing the light from the light source device to the entire display panel area ), a reflective plate 122 for reflecting light in the direction of the display panel, and one or more optical sheets 124 disposed on the light guide plate to improve luminance, diffuse and protect light, etc. may be disposed.

At this time, the light source unit 128 and the light source PCB 127 can be expressed as a light source device, and an assembly including the light source device, the light source housing 129 , the light guide plate 123 , the reflection plate 122 , and the optical sheet 124 , etc. may be expressed as a backlight unit.

In addition, as a structure for supporting the backlight unit and the display panel, a cover bottom 110 made of metal or plastic that supports the backlight unit and extends over the entire rear surface of the display device, and the side surface of the cover bottom 110 . A guide panel 130 for supporting the display panel 140 and a case top 150 surrounding the side surface of the guide panel and extending to a portion of the front portion of the display panel are provided. may additionally include.

As shown in (b) of FIG. 2 , the light source device is configured by arranging a plurality of package-type light source units 128 at regular intervals on a long bar-shaped light source PCB 127 .

Meanwhile, a spacer pad 125 is used between the light source units 128 of the light source device to protect the light source unit from expansion of the light guide plate due to heat.

When the backlight unit as shown in FIG. 2A operates, heat is emitted from the light source unit 128 and transferred to the light guide plate 123 .

In general, since the light guide plate 123 is made of a plastic material, it thermally expands when exposed to heat, and as a result, the end face of the light guide plate on the light incident part approaches the light source part.

Therefore, in order to maintain a constant optical gap between the light source device and the light guide plate and at the same time prevent the light source unit 128 from being damaged due to thermal expansion of the light guide plate, there is a constant thickness Tt between the light source units 128 on the light source PCB 127 . ) is used as a spacing pad 125 having a.

The spacing pad 125 is a T-shaped or U-shaped protrusion structure having a thickness greater than the thickness Tp of the light source, and is also called a T-pad or U-pad.

In such an edge-type backlight unit, the light from the light source unit 128 of the light source device is incident on the inlet portion, which is the end face of the light incident portion side of the light guide plate 123, and then is totally reflected in the light guide plate and spreads to the front surface of the display device to emit light in the direction of the display panel. do.

FIG. 3 shows an example of a light source package that can be used in the light source device shown in FIG. 2 .

On the other hand, the light source unit 128 included in the light source device as shown in FIG. 2 may be a chip mounted directly on the light source PCB by surface mounting technology, but includes a light source chip, a mold structure, a lead frame, etc. as shown in FIG. 3 . It is more common to be in the form of a single package.

That is, the light source unit used in the backlight unit may include one package including a light source chip such as an LED and a surrounding structure thereof, and this package may be expressed as a light source package or an LED package.

As shown in FIG. 3, the light source package includes a light source chip 224 that is an LED chip, a lead frame 226 made of a metal material and electrically connected to the chip electrode of the light source chip, and injection molded on the lead frame. It is configured to include a mold structure 222 and the like formed to surround the chip.

The mold structure 222 is generally injection-molded to surround the bottom and side surfaces of the light source chip with an opaque resin, and a phosphor layer, which is a light conversion material that converts blue light into red, yellow, or green light, inside the mold structure 222 . (225) may be included.

The metal pads formed on both sides of the lead frame 226 are electrically connected to both electrodes of the light source chip 224 by bonding wires 223 , and the metal pads of the lead frame are connected to the PCB electrodes formed on the light source PCB 210 . By soldering, it is connected to the light source PCB.

In addition, in the light source package shown in FIG. 3 , when the light source chip 224 is a blue LED chip, a phosphor layer 225 which is a light conversion material that converts blue light into red, yellow, or green light is formed, and in the light source chip 224 , After the emitted blue light is reflected by the mold structure 222 , the phosphor layer 225 converts it into R, G, Y light, and finally white light is emitted.

Of course, when the light source chip 224 is a white LED emitting white light, the above-described phosphor layer will not be necessary.

FIG. 4 illustrates a thickness of a backlight unit used in the display device of FIG. 2 and a heat transfer state in the display device of FIG. 2 .

In the display device having the structure shown in FIG. 2 , there is a problem in that the thickness of the backlight unit becomes large.

That is, as shown in (a) of FIG. 4 , the total thickness of the backlight unit up to the light guide plate inlet portion is the thickness Th of the light source housing 129 , the thickness Tc of the light source PCB 127 , and the spacer pad 125 . ) is determined by the sum of the heights (or thicknesses) Tt.

In addition, in the lower horizontal region of the display device, in addition to the total thickness of the backlight unit, the thicknesses of the cover bottom 110 , the guide panel 130 , and the case top 150 shown in FIG. 2 are added.

Accordingly, since the thickness of the non-display area of the lower horizontal area of the display device is increased, it becomes an obstacle to realizing the narrow bezel.

In addition, as described above, as the light guide plate 123 thermally expands and approaches the light source device during operation of the backlight unit, the separation pad 125 may be damaged or pushed, and in such a case, the light source unit 128 may be damaged. can cause

In addition, as shown in FIG. 4(b), both the D-IC 30 and the light source device are disposed in the lower horizontal area of the display device, and heat is generated in both parts during operation. It is naturally transmitted to the upper part of the display device by the convection phenomenon.

That is, since both the heat H1 generated by the light source device 40 and the heat H2 generated by the D-IC 30 are transferred to the upper portion of the display panel due to the convection phenomenon, the light incident part is exposed to strong heat.

Accordingly, sheet structures such as a light guide plate adjacent to the light incident part or a reflective plate and an optical sheet attached thereto may be bent due to heat (Sheet Wrinkle).

Since the wrinkle of the sheet is easily recognized in the horizontal viewing angle direction obliquely observed in the horizontal direction, in the structure shown in FIG. 4 , a display defect in which the sheet wrinkle due to heat is visually recognized may be caused.

In addition, the input direction of the gate signal, which is the scanning direction of the display panel, is the horizontal (horizontal) direction, and the input direction of the data signal, which is the image signal, is the vertical (vertical) direction. There is also a problem in that the scanning effect for realizing the motion picture response time (MDRT) effect is deteriorated.

In addition, in general, since the length in the horizontal (horizontal) direction of display devices such as TVs and monitors is greater than the length in the vertical (vertical) direction, the light source unit ( There is also a problem that the number of light source packages) increases.

Accordingly, in the embodiment of the present invention, in order to solve the above-mentioned problems, the thickness of the light source device is reduced by removing the separation pad and the light source housing, and the light source device of a new structure can prevent damage due to heat or deterioration of the scanning effect. and a display device.

5 is a plan view and a side cross-sectional view of a display device according to an embodiment of the present invention.

6 is a perspective view and a longitudinal cross-sectional view of a light source device according to an embodiment of the present invention.

A detailed configuration of a light source device and a display device including the light source device according to an embodiment of the present invention will be described with reference to FIGS. 5 and 6 .

As shown in FIG. 5 , the display device 1000 according to the embodiment of the present invention includes a display panel 1140 , a light source device 500 disposed on one side of the display panel, and light from the light source unit of the light source device. It is configured to include a light guide plate 630 for guiding light to the entire display device, and a support for supporting them.

In the present specification, it is assumed that the display device 1000 is long in the horizontal (horizontal) direction and short in the vertical (vertical) direction, and in this case, the light source device 500 according to the present embodiment is vertically ( vertical) is preferably disposed on at least one of the sides.

Meanwhile, as shown in FIG. 6 , the light source device 500 used in the display device includes an L-shaped bent light source PCB 510 , and the light source chip 520 includes a light source chip receiving groove formed in the light source PCB. (516) It is a form that is directly mounted inside.

More specifically, the light source PCB 510 included in the light source device 500 according to the present embodiment includes a horizontal surface 512 extending parallel to the display panel 1140 and a vertical surface 514 perpendicular to the horizontal surface. As a bent substrate, a plurality of light source chip accommodating grooves for accommodating one or more light source chips 520 are formed on the vertical surface 514 .

The light source chip 520 is mounted in direct contact with the upper surface of the light source chip receiving groove 516 formed on the vertical surface 514 of the light source PCB.

The light source chip 520 may be a light source package of the type shown in FIG. 3 or the like, but as will be described with reference to FIG. 8 , it is disposed on the upper surface of the light source chip accommodating groove 516 by surface mount technology (SMT). Preferably, it is a chip scale package type LED chip mounted directly on a PCB electrode (not shown) or a flip chip type LED chip capable of emitting side light.

The detailed configuration of the light source chip 520 will be described in more detail below with reference to FIG. 8 .

In addition, when the light source chip 520 is a blue light source chip emitting blue light, in order to realize white light, the receiving space of the light source chip receiving groove 516 emits blue light to red, red (R), yellow (Y), green ( G) A phosphor layer 522 filled with a phosphor that converts light or the like may be further formed.

Among the phosphor materials used for the phosphor layer 522 , the yellow phosphor (Y) is YAG:Ce(T3Al5O12:Ce) which is yttrium (Y) aluminum (Al) garnet doped with cerium (Ce) having a wavelength of 530 to 570 nm. )-based phosphor or may be a silicate-based material.

The red (R) phosphor is a YOX (Y2O3:EU)-based phosphor composed of a compound of yttrium oxide (Y2O3) and europium (EU) having a wavelength of 611 nm as the dominant wavelength, and the phosphor of green (G) has a wavelength of 544 nm It is a phosphoric acid (Po4), lanthanum (La), and terbium (Tb)-based phosphor, LAP (LaPo4:Ce,Tb)-based phosphor, and the blue (B) phosphor is barium (Ba) with a wavelength of 450nm. A BAM blue (BaMgAl10O17:EU)-based phosphor, which is a compound of magnesium (Mg) and aluminum oxide, and europium (EU), may be used.

In addition, a nitride or oxynitride-based phosphor material in which an optically active rare-earth ion is activated using a nitride or oxynitride crystal as a host may be used, and the nitride-based phosphor includes an α-sialon phosphor , CaAlSiN2 phosphor, β-sialon phosphor, AlN phosphor, and the like may be included. In addition, a fluoride compound KSF (K ₂ SiF ₆ ) phosphor (hereinafter referred to as “KSF phosphor”), which is an Mn4+ activator phosphor having excellent color reproducibility and luminous efficiency, may be used.

Of course, when the light source chip 520 is a white LED emitting white light, the phosphor layer 522 may be excluded, and in this case, the space inside the light source chip accommodating groove 516 may be empty.

The light source PCB 510 is a plate-shaped substrate member having a thickness of T made of an insulating material such as FR4, and the horizontal plane 512 and the vertical plane 514 have an L-shaped bent shape. As will be described below, 512 of the light source PCB 510 and the outer surface of the vertical surface 514 may be contact-coupled with the inner surface of the cover bottom 1110 constituting the support part of the display device, respectively.

FR4 used as a material for the light source PCB 510 is a glass-reinforced epoxy laminated sheet, tube, rod or printed circuit board, and may be a woven glass fiber material containing an epoxy resin binder. .

In addition, various circuit elements necessary for driving the light source device and circuit wiring connecting them are formed on the light source PCB 510 .

The height Hp of the vertical surface 514 of the light source PCB 510 is preferably about 1.1 mm or less.

On the other hand, on the inner surface side of the vertical surface 514 of the light source PCB 510, a plurality of light source chip accommodating grooves 516 formed long in the longitudinal direction of the light source PCB are formed to be spaced apart by a predetermined distance, and a plurality of light source chip accommodating grooves 516 are formed. ) A spaced portion 517 is formed between.

One or more light source chips 520 are accommodated inside each light source chip receiving groove 516, and the chip electrode of the light source chip 520 is soldered to a PCB electrode (not shown) formed on the upper surface of the light source chip receiving groove 516. are combined

In this case, a plurality of light source chips 520 included in one string and serially connected to each other on an equivalent circuit for driving a light source may be disposed inside one light source chip accommodating groove 516 . This will be described in more detail below with reference to FIG. 7 .

As shown in FIG. 6B , a reflective layer 518 that is a silver (Ag) or tin (Tin) thin film may be coated on the inner surface of the light source chip receiving groove 516 .

The reflective layer 518 coated with silver or tin reflects light from the light source chip 520 and condenses it in a direction perpendicular to the vertical surface 514 of the light source PCB 510 , and is incident on the light incident surface of the light guide plate 630 . It functions to increase the luminous efficiency.

As shown in FIG. 5B , the light guide plate 630 is disposed to be spaced apart from the vertical surface 514 of the light source PCB 510 by a predetermined optical gap.

The light guide plate 630 may be formed of a rectangular transparent plastic sheet that is die-cut, extruded, or injection-molded from a plastic sheet, and the white light emitted from the light source chip 520 is the edge surface of the light guide plate 630 . That is, after being incident on the light incident surface, the light is totally reflected inside the light guide plate and diffuses across the rear surface of the display panel, and the light emitted through the flat upper surface of the light guide plate functions as a backlight of the display panel.

Materials constituting the light guide plate 630 include polymethyl methacrylate (PMMA), methlystylene (MS) resin, polystyrene (PS), polypropylene (PP), and polyethylene terephthalate. :PET) and polycarbonate (PC) may be at least one light-transmitting material selected from, but is not limited thereto.

Meanwhile, as shown in FIG. 6B , the depth D of the light source chip accommodating groove 516 is preferably greater than the height Hc of the light source chip.

While the backlight unit is operating, the aforementioned light guide plate 630 may receive heat from the light source chip 520 to thermally expand, so that the light incident surface of the light guide plate approaches the light source device.

At this time, since the depth D of the light source chip accommodating groove 516 is greater than the height Hc of the light source chip, the light incident surface of the light guide plate is in contact with the spacer 517 formed between the light source chip accommodating grooves 516 and is no longer Since it cannot proceed, it cannot come into contact with the light source chip 520 accommodated therein. Accordingly, it is possible to prevent the light source chip 520 from being damaged by the expansion of the light guide plate.

On the other hand, as shown in (b) of Figure 6, the spaced portion 517 formed between the receiving light source chip receiving grooves 516 has a constant width S, and the spaced portion forms a dark portion through which light is not transmitted. Therefore, it is preferable that the width S of the separation portion is as small as possible.

Meanwhile, a reflector 640 disposed under the light guide plate to reflect light from the light guide plate toward the display panel 1140, and an optical sheet unit 650 disposed above the light guide plate to collect or diffuse light emitted from the light guide plate. may further include.

The reflection plate 640 is located on the rear surface of the light guide plate 630 and functions to improve the luminance of the light by reflecting the light passing through the rear surface of the light guide plate toward the display panel 1140 .

The optical sheet part 650 disposed on the light guide plate 630 collects light so that a more uniform surface light source is incident on the display panel 1140 , and one or more individual optical sheets may be combined.

The optical sheet unit 650 includes a light collecting sheet or prism sheet (PS) having a light collecting function, a diffusing sheet (DS) for diffusing light, and a reflective type called DBEF (dual brightness enhancement film). Various functional sheets such as a polarizing film may be combined and configured.

The light source device 500 including the light source PCB 510 and the light source chip 520 , the light guide plate 630 , the reflection plate 640 , and the optical sheet unit 650 may be combined to form a backlight unit.

On the other hand, the display device according to the present embodiment has a structure for supporting the backlight unit and the display panel, and includes a cover bottom 1110 which is a metal or plastic back cover that covers a part of the back and side surfaces of the display device; , a guide panel 1130 supporting the display panel from the bottom, and a case top 1150 covering the outermost side of the display device and the upper edge of the display panel may be additionally provided.

The cover bottom 1110 constituting the support portion of the display device is a plate-shaped member made of a metal or plastic material, and may include a rear portion supporting the entire rear surface of the display device and a side portion extending therefrom to cover a portion of the side surface of the backlight unit.

In particular, the cover bottom 1110 according to the present embodiment is a plate-shaped member bent in an L-shape, and is disposed to surround the outside of the horizontal surface 512 and the vertical surface 514 of the light source PCB 510 .

In the present specification, the cover bottom 1110 includes all types of support structures for supporting at least one of a backlight unit and a display panel, and includes a base frame, a metal frame, and a metal chassis. (Metal Chassis), chassis base (Chassis Base), etc. can be used in other expressions.

The guide panel 1130 is coupled to the cover bottom 1110 and is a plastic structure for attaching the display panel 1140 from the upper side while covering a portion of the front surface of the backlight unit.

More specifically, the guide panel 1130 is a plastic member that is fixed to the side surface of the cover bottom 1110 to connect the backlight unit and the display panel 1140 , and is sometimes referred to as a support main. A double-sided tape is attached to the upper surface of the horizontal extension of the guide panel 1130 and the display panel 1140 is disposed thereon, so that the display panel can be fixedly mounted.

The cover bottom and guide panel as a support portion of the display device are organically coupled to the display panel while supporting the backlight unit including the light source device according to the present embodiment, thereby reducing the overall bezel of the display device, as will be described below. function to make

The case top 1150 covers the side surface of the cover bottom 1110 or the guide panel 1130 and extends to a portion of the front surface of the display panel to protect the front edge of the display panel.

The case top 1150 is a "L"-shaped metal plate-like member for covering and protecting the front edge of the display panel and the side of the display device. It is a concept including all types of covers and frames for protecting a portion of the front surface of the display panel by extending to a portion thereof, and is not necessarily limited to the term case top.

In the case of a liquid crystal display panel, the display panel 1140 receiving light by the light source device and the backlight unit including the light source device according to the present embodiment again includes a plurality of gate lines and data lines, and pixels defined in an intersection region thereof. And, an array substrate including a thin film transistor, which is a switching element for controlling light transmittance in each pixel, an upper substrate having a color filter and/or a black matrix, and the like, and a liquid crystal material layer formed therebetween. can be configured.

Meanwhile, the display panel 1140 according to the present embodiment is not limited to such a liquid crystal display panel, and may include other types of display devices requiring a backlight unit.

Meanwhile, the display device according to the present embodiment may further include a heat dissipation member 660 disposed between the horizontal surface 512 of the light source PCB 510 and the light guide plate 630 or the reflection plate 640 .

As shown in (b) of FIG. 8, the heat dissipation member 660 is a metal member in the form of a long bar formed of a thermally conductive material such as aluminum (Al), and the upper surface is the lower part of the backlight unit, more specifically For example, the light guide plate 630 or the reflective plate 640 is in contact with the lower surface, and the lower surface is in contact with the upper surface of the horizontal surface 512 of the light source PCB 510 or the inner surface of the cover bottom 1110 .

In the backlight unit according to the present embodiment, heat may be emitted from the light source circuit elements disposed on the light source PCB 510 during operation, and heat may also be emitted from the light source chip 520 and transferred to the light guide plate 630 . In this case, in particular, heat may be concentrated in the vicinity of the light incident surface of the light guide plate.

Accordingly, since the heat dissipation member 660 disposed as above is disposed in contact with the bottom surface near the light incident surface of the light guide plate 630 and the horizontal surface 512 of the light source PCB, it absorbs heat from the light guide plate and the light source PCB, thereby damaging the circuit element. It is possible to prevent thermal expansion of the light guide plate and at the same time suppress the thermal expansion of the light guide plate.

On the other hand, as shown in FIGS. 5 (b) and 8 (b), the heat dissipation member 660 can be fixedly coupled to the light source PCB 510 and the cover bottom 1110 by the fixing bolts 662. there is.

The heat dissipation member 660 may be disposed to extend as a whole in the longitudinal direction of the light source device in order to maximize the heat dissipation function. That is, the heat dissipation member 660 may be formed in a long bar type and disposed over the entire vertical side of the display device.

According to the light source device and the display device including the light source device according to the embodiment of the present invention, the light source housing generally used can be removed by forming the light source PCB in an L-shape and arranging the light source chip on the vertical surface thereof.

In addition, by mounting and protecting the light source chip inside the light source chip accommodating groove of the light source PCB, it is possible to remove the light guide plate spacer, such as the conventional T-pad or U-pad.

As a result, as will be further described with reference to FIG. 10 , by reducing the thickness of the display device in the bezel direction, it is advantageous to implement the narrow bezel.

In addition, by arranging the light source device in a vertical region of the display device, deterioration of the performance of the display device due to heat can be prevented, the scanning performance of the display device can be improved, and the number of light source chips can be reduced. It will be described in more detail with reference to FIG. 10 below.

7 shows an equivalent circuit used in a light source device according to an embodiment of the present invention and an arrangement state of a light source chip related thereto.

In general, a plurality of light emitting devices are used to drive the light source device, and when the light source driving circuit is expressed as an equivalent circuit, it can be as shown in FIG. 7(a).

That is, the equivalent circuit constituting the light source module may be configured by connecting a power source and a string of k light emitting devices in parallel between the power source, and each light emitting device string is connected in series with i light emitting devices. can be configured.

In order to easily implement such an equivalent circuit, in the light source device 500 according to the present embodiment, the number of light source chips 520 disposed per one light source chip accommodating groove 516 is i, and is disposed on the vertical surface of the light source PCB. Preferably, the total number of light source chip receiving grooves is k.

That is, as shown in (b) of FIG. 7 , a total of i light source chips D1, D2, ..., Di are connected in series in the first light source chip receiving groove 516 to form the first light emitting element string S1. make up

Similarly, in the second light source chip receiving groove 516' to the last k-th light source chip receiving groove 516", a total of i light source chips are connected in series, respectively, so that the second to k-th light emitting element strings S2, ..., sk) is formed.

With this configuration, as shown in FIG. 7(b) , since the chip electrodes of the light source chip disposed in one light source chip accommodating groove may be connected in series, wiring inside the light source chip accommodating groove is facilitated.

In addition, by connecting the first wiring connecting the first electrodes of the first light source chips included in each light source chip accommodating groove and the second wiring connecting the second electrodes of the last i-th light source chips to the power supply unit, It becomes possible to implement an equivalent circuit such as a).

As a result, as described above, the number of light source chip accommodating grooves is formed as much as the number of light emitting element strings, and by arranging the light source chips included in each string in series in each light source chip accommodating groove, wiring for constructing a light source equivalent circuit is simplified. There are advantages to doing so.

8A shows a detailed structure of a light source chip that can be used in a light source device according to an embodiment of the present invention.

The light source chip 520 used in the embodiment of the present invention is a Chip Scale Package (CSP) type LED chip mounted directly on the upper surface of the light source chip receiving groove 516 or a flip chip capable of side light emission. Chip) type LED chip.

In order to manufacture the light source chip 520, first, the first electrode layer 522, the light emitting layer 523, and the second electrode layer 524 are formed on a growth substrate made of a sapphire material having light transmission characteristics by SMT technique. form each. The growth substrate may be removed after the light source chip is manufactured, or the light transmitting layer 525 of a certain thickness included in the light source chip may be formed without being removed.

The first electrode layer 522 is electrically connected to the first electrode terminal 522 ′ formed on the lower surface of the light source chip through a contact hole penetrating the light emitting layer 523 and the second electrode layer 524 , and the second electrode layer 524 . ) is also electrically connected to the second electrode terminal 524' formed on the lower surface of the light source chip. The first electrode layer 522 and the first electrode terminal 522' constitute a first electrode part, and the second electrode layer 524 and the second electrode 524' constitute a second electrode part.

The growth substrate constituting the light transmitting layer 525 is formed using a transparent material including sapphire, and in addition to sapphire, zinc oxide (ZNO), gallium nitride (GaN), silicon carbide : SiC) and aluminum nitride (AlN) may be formed.

The first electrode layer 522 and the second electrode layer 524 are each formed of a p-type semiconductor layer and an n-type semiconductor layer, and the first electrode terminal 522' and the second electrode terminal 524' are each a p-type electrode. and an n-type electrode.

The second electrode layer 524 and the second electrode terminal 524 ′, which are n-type semiconductor layers, may be made of GaN or GaN/AlGaN doped with n-type impurities, and the n-type impurities include Si, Ge and Sn are used, and preferably Si is mainly used.

In addition, the first electrode layer 522 and the first electrode terminal 522 ′, which are p-type semiconductor layers, may be made of GaN or GaN/AlGaN doped with p-type conductivity type impurities. Mg, Zn and Be are used, and preferably Mg is mainly used.

In the manufacturing process of the light source chip, parts of the first electrode layer 522 and the light emitting layer 523, which are the p-type semiconductor layers, are removed by mesa etching so that a part of the second electrode layer 524, which is the n-type semiconductor layer, is exposed. Accordingly, the first electrode layer 522 as the p-type semiconductor layer and the light emitting layer 523 as the active layer are formed on a portion of the second electrode layer 524 as the n-type semiconductor layer.

At this time, the second electrode terminal 524 ′, which is an n-type electrode, is configured at one corner of the exposed second electrode layer 524 , and the first electrode terminal 522 ′, which is a p-type electrode, is formed with the first electrode layer 522 . In the "Top-Top" method configured on the top, the electrodes are arranged, and a horizontal LED chip is formed.

The light emitting layer 523 may be a GaN-based single quantum well structure (single quantum well: SQW) or a multi quantum well structure (MQW), and also has a quantum structure such as their super lattice (SL), The quantum structure of the light emitting layer 523 may be formed by combining various GaN-based materials, and for example, AlGaN, AlNGaN, InGaN, or the like may be used.

When an electric field is applied to the light emitting layer 523 , light is generated by bonding of electron-hole pairs.

Accordingly, when a voltage is applied between the first electrode layer 522 and the second electrode layer 524, the light source chip is formed into the first electrode layer 522, which is a P-type semiconductor layer, and the second electrode layer 524, which is an n-type semiconductor layer. Holes and electrons are respectively injected, and as holes and electrons recombine in the light emitting layer 523 , excess energy is converted into light and emitted to the outside through the light transmitting layer 525 .

However, the embodiment of the present invention is not limited to the light source chip having the above structure, and a light source chip or a light source package having a different structure may be used as long as it can be directly surface mounted on the upper surface of the light source chip accommodating groove.

9 is a cross-sectional view of a light carrying-in part side of a display device according to an embodiment of the present invention, and a light guide plate support member used in the light-carrying part.

As shown in FIG. 9A , the light-incoming part of the display device according to the embodiment of the present invention has a structure similar to that of the light-incident part, except that the light source device 500 is not present.

However, in the light incident portion, the light guide plate 630 is disposed on the heat dissipation member 660 and spaced apart from the cover bottom 1110 by a certain distance. there is.

The light guide plate support member 570 is a short block-shaped plastic member, and is disposed between the upper surface of the cover bottom 1110 and the bottom surface of the light guide plate 630 or reflective plate 640 to support the light guide plate.

The light guide plate support member 570 does not need to be long along one side of the display device, but may be locally disposed at a corner or a predetermined position on one side.

As described above, by using the light guide plate support member 570 disposed on the light-incoming portion side, it is possible to maintain a horizontal state of the light guide plate with respect to the heat dissipation member disposed on the light incident portion.

10 is a diagram for explaining an effect of a display device according to an embodiment of the present invention.

FIG. 10 shows only the configuration of the light incident part of the display device according to the present embodiment, excluding the cover bottom, the guide panel, the case top, and the like, which are the supporting parts of the display device.

10A is a backlight unit having a general structure in which a light source housing 129 and a spacer pad 125 are used as shown in FIG. 2 , and FIG. 10B is an embodiment of the present invention. A backlight unit including a bent light source PCB and a light source chip is shown.

In the case of a general backlight unit, the thickness in the bezel direction becomes a large value as the sum of the thickness Th of the light source housing 129 , the thickness Tc of the light source PCB 127 , and the height or thickness Tt of the spacing pad 125 .

On the other hand, when the embodiment of the present invention is used, not only the existing light source housing and the spacing pad are removed, but also the light source chip is accommodated and disposed inside the light source chip receiving groove of the light source PCB, so the thickness in the bezel direction is the light source PCB (510). ) is equal to Tc, which is the thickness of

Therefore, when the light source device 500 according to the embodiment of the present invention is used, the thickness or width of the bezel can be remarkably reduced, and as a result, the narrow bezel of the display device can be easily implemented.

In addition, since the light source chip is disposed inside the light source chip receiving groove and the spacer between the light source chip receiving groove blocks access due to the expansion of the light guide plate, the existing spacer pad is pushed or the light source chip is not fundamentally damaged. will not

In addition, by effectively dissipating heat generated from the light source PCB and the light incident portion of the light guide plate by the heat dissipating member 660 , damage to circuit elements is prevented and thermal expansion of the light guide plate can be suppressed.

FIG. 10C is for explaining the effect of the light source device according to the embodiment of the present invention being disposed in a vertical area of the display device.

The light source device according to the present embodiment is preferably disposed on at least one of vertical sides that are shorter sides of the display device.

In the case of this configuration, the heat H3 generated from the light source device 500 is not added to the heat H2 generated from the D-IC 30 disposed in the lower horizontal region, thereby preventing the concentration of heat. Several disadvantages can be reduced.

In addition, since heat H3 generated from the light source device 500 disposed vertically as shown in FIG. can be minimized.

In addition, although sheet structures such as the light guide plate adjacent to the light incident part or the reflective plate and optical sheet attached thereto may be bent by heat, such wrinkles may occur, but such wrinkles are mainly recognized at a horizontal viewing angle. The display defect caused by the sheet wrinkles in the vertical direction generated by the embodiment can be minimized.

In addition, since both the input direction of the gate signal, which is the scanning direction of the display panel, and the light application direction are the same in the horizontal direction, the scanning effect for realizing the motion picture response time (MDRT) effect can be maximized.

As an additional effect, by arranging the light source device in a relatively short vertical (vertical) direction, there is also an advantage in that the number of light source chips required can be reduced.

By using the embodiment of the present invention as described above, by providing a light source device composed of a bent light source PCB having a light source chip receiving groove for accommodating a light source chip and a light source chip mounted directly on the upper surface of the light source chip receiving groove, The light source housing and the spacer pad can be removed, and the thickness of the light source device is reduced, thereby contributing to a narrow bezel of the display device.

In addition, by arranging the light source device as described above on one of the vertical sides of the display device, it is possible to prevent deterioration of the performance of the display device due to heat, improve the scanning performance of the display device, and reduce the number of light source chips. can have an effect.

The above description and the accompanying drawings are merely illustrative of the technical idea of the present invention, and those of ordinary skill in the art to which the present invention pertains can combine configurations within a range that does not depart from the essential characteristics of the present invention. , various modifications and variations such as separation, substitution and alteration will be possible. Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical spirit of the present invention, but to explain, and the scope of the technical spirit of the present invention is not limited by these embodiments. The protection scope of the present invention should be construed by the following claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

500: light source device 510: light source PCB
520: light source chip 512: horizontal plane
514: vertical surface 516: light source chip receiving groove
660: heat dissipation member 670: light guide plate support member
630: light guide plate

Claims (12)

display panel;
A bendable light source PCB including a horizontal surface extending parallel to the display panel and a vertical surface perpendicular to the horizontal surface in which a plurality of light source chip accommodation grooves for accommodating the light source chip are disposed, and a top surface of the light source chip accommodation groove is in contact with a light source device including one or more light source chips mounted thereon;
a light guide plate disposed to be spaced apart from the light source PCB by a predetermined distance in the light output direction of the light source device;
a support part for supporting at least one of the light source device, the light guide plate, and the display panel;
includes,
In the equivalent circuit for supplying light to the light source device, k strings in which i light source chips are connected in series are connected in parallel,
The number of light source chips disposed per one light source chip receiving groove is i,
The number of light source chip accommodating grooves disposed on the vertical surface of the light source PCB is k,
The chip electrodes of the i light source chips disposed in each light source chip receiving groove are connected in series, the first wiring connecting the first electrodes of the first light source chips included in each light source chip receiving groove, and the last i-th light source chips The second wiring connecting the second electrodes is connected to the power supply unit. According to claim 1,
The light source device is disposed on at least one of vertical sides of the display device. 3. The method of claim 2,
and a heat dissipation member disposed between a horizontal surface of the light source PCB and the light guide plate. 4. The method of claim 3,
The display device of claim 1, wherein the support part includes a cover bottom surrounding the outside of the horizontal and vertical surfaces of the light source PCB, and a guide panel coupled to the cover bottom and supporting the display panel from an upper portion. 5. The method of claim 4,
The display device further includes a light guide plate support member disposed between an upper surface of the cover bottom and the light guide plate to support the light guide plate in a light carrying portion opposite to a vertical side on which the light source device is disposed. delete According to claim 1,
and a reflective layer coated with silver or tin on an upper surface of the light source chip receiving groove. 8. The method of claim 7,
A depth (D) of the light source chip receiving groove is greater than a height (H) of the light source chip. a bent light source PCB comprising: a horizontal surface extending parallel to the display panel;
one or more light source chips mounted in contact with the upper surface of the light source chip receiving groove;
includes,
In the equivalent circuit for supplying light to the light source device, k strings in which i light source chips are connected in series are connected in parallel,
The number of light source chips disposed per one light source chip receiving groove is i,
The number of light source chip accommodating grooves disposed on the vertical surface of the light source PCB is k,
The chip electrodes of the i light source chips disposed in each light source chip receiving groove are connected in series, the first wiring connecting the first electrodes of the first light source chips included in each light source chip receiving groove, and the last i-th light source chips The second wiring connecting the second electrodes is connected to the power supply unit.
delete 10. The method of claim 9,
The light source device further comprising a reflective layer coated with silver or tin on the upper surface of the light source chip receiving groove. 12. The method of claim 11,
A depth (D) of the light source chip accommodating groove is greater than a height (H) of the light source chip.

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