JP2020150119A - Component mounting method and component mounting device - Google Patents

Abstract

To provide a component mounting method that can suppress mounting variations.SOLUTION: A component mounting method according to an embodiment of the present invention includes a transfer step (step S107) of placing a substrate on a substrate stage, a receiving step (step S105) of receiving a component to be mounted on the substrate by a heated head, a mounting step (step S109) of mounting the component received by the head on the substrate mounted on the substrate stage. The receiving step is executed in the upstream step immediately before a component mounting device after predetermined processing is completed on the substrate.SELECTED DRAWING: Figure 5

Description

The present invention relates to a component mounting method for thermocompression bonding a component to a substrate and a component mounting device for executing the component mounting method.

Conventionally, an ACF (Anisotropic Conductive Film) tape, which is an anisotropic conductive member, is attached to the end of a substrate as an adhesive member, and an electronic component such as a drive circuit (hereinafter, simply referred to as a drive circuit or the like) is attached to a portion of the substrate to which the ACF tape is attached. There is a component mounting line that includes a component mounting device that heats and mounts (referred to as a "component"), that is, performs temporary crimping (see, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2003-77956

In a component mounting line that produces display panels such as liquid crystal panels and organic EL panels, in order to minimize production tact (tact time), each device provided in the component mounting line operates with the standby time as short as possible.

For example, the component mounting device picks up components to be temporarily crimped to a substrate by a temporary crimp head as soon as possible. Here, if a delay occurs in the operation of a device other than the component mounting device on the component mounting line due to a defect or the like, the temporary crimping head remains holding the picked up component.

By the way, a flexible component, which is an example of a component mounted on a display panel, absorbs moisture in the air and expands. When the flexible component is held by the temporary crimping head heated to a high temperature, the moisture contained in the flexible component evaporates due to the heat from the temporary crimping head, and the flexible component shrinks.

Therefore, if the time for the temporary crimping head to hold the picked-up flexible component differs for each picked-up flexible component, the amount of shrinkage of each flexible component may differ. Due to this difference in the amount of shrinkage, when the component mounting device temporarily crimps a flexible component to a substrate, mounting variations such as misalignment may occur for each flexible component that is temporarily crimped. In particular, when so-called fine pitch mounting, which requires precise mounting accuracy, is required for the component mounting device, there is a concern that the mounting variation generated in this way may cause defects in the display panel.

The present invention provides a component mounting method and the like that can suppress mounting variations.

The component mounting method according to one aspect of the present invention is executed by the component mounting device that mounts a component on the board that has been subjected to a predetermined process upstream of the component mounting device in a component mounting line that executes a plurality of processes on the board. The component mounting method is a transfer step of mounting the substrate on a substrate stage, a receiving step of receiving a component for mounting on the substrate by a heated head, and the substrate mounted on the substrate stage. The receiving step includes a mounting step of mounting the component received by the head, and the receiving step is executed after the predetermined process is completed on the substrate in the upstream step immediately before the component mounting device.

Further, the component mounting device according to one aspect of the present invention is a component mounting device that mounts a component on a board that has been subjected to predetermined processing upstream in a component mounting line that executes a plurality of processes on the substrate. The board stage to be mounted, the board transfer device for mounting the board on the board stage, the component supply unit for supplying the components to be mounted on the board, and the board receiving the components from the component supply unit. A head mounted on the substrate mounted on the stage and a control unit for controlling the operation of the head are provided, the head has a heating mechanism, and the control unit is immediately before the component mounting device. It is determined whether or not the predetermined process is completed upstream, and when it is determined that the predetermined process is completed, the operation of the head is controlled so that the head receives the component from the component supply unit. ..

It should be noted that these comprehensive or specific embodiments may be realized by a recording medium such as a system, a method, an integrated circuit, a computer program or a computer-readable CD-ROM, and the system, the method, the integrated circuit, or the computer program. And any combination of recording media may be realized.

According to the present invention, it is possible to provide a component mounting method or the like that can suppress mounting variations.

FIG. 1 is a schematic configuration diagram of a component mounting line including the component mounting device according to the embodiment. FIG. 2 is a schematic perspective view showing a component mounting device according to the embodiment. FIG. 3 is a schematic side view showing a component mounting device according to the embodiment. FIG. 4 is a block diagram showing a functional configuration of the component mounting device according to the embodiment. FIG. 5 is a flowchart for explaining a processing procedure of an operation executed by the component mounting apparatus according to the embodiment. FIG. 6 is a side view for explaining the operation executed by the component mounting device according to the embodiment. FIG. 7 is a side view for explaining the operation executed by the component mounting device according to the embodiment.

Hereinafter, the component mounting method and the like according to the embodiment of the present invention will be described in detail with reference to the drawings. It should be noted that all of the embodiments described below show a specific example of the present invention. Therefore, the numerical values, shapes, materials, components, arrangement and connection forms of the components, steps and the order of steps shown in the following embodiments are examples, and are not intended to limit the present invention. Therefore, among the components in the following embodiments, the components not described in the independent claims indicating the highest level concept of the present invention will be described as arbitrary components.

Further, each figure is a schematic view and is not necessarily exactly illustrated. Further, in each figure, the same components are designated by the same reference numerals.

Further, in the present specification and drawings, the X-axis, the Y-axis, and the Z-axis represent the three axes of the three-dimensional Cartesian coordinate system. The X-axis and the Y-axis are orthogonal to each other and both are orthogonal to the Z-axis. Further, in the following embodiments, the X-axis positive direction in the substrate transport direction, the Z-axis positive direction may be upward, and the Z-axis negative direction may be downward.

(Embodiment)
[Overview]
First, with reference to FIG. 1, the outline of the component mounting line including the component mounting device according to the embodiment will be described.

FIG. 1 is a schematic configuration diagram of a component mounting line 1 including a component mounting device 100 according to an embodiment.

The component mounting line 1 is a component mounting system for producing a display panel or the like, and executes a plurality of processes on a substrate 200 such as a display panel. Specifically, in the component mounting line 1, an anisotropic conductive member (ACF) 230 such as ACF is attached to the substrate 200 on which the electrode portion 210 is formed, and the substrate 200 and the component 220 are heated via the ACF 230. It is a device for crimping. Examples of the component 220 include flexible components such as TCP (Tape Carrier Package) and FPC (Flexible Printed Circuits). The component mounting device 100 according to the present embodiment is one device of the component mounting line 1 including a plurality of devices for performing a plurality of processes on a substrate 200 such as a display panel. The component mounting line 1 is a portion where a plurality of operations are performed in-line. The component mounting device 100 mounts the component 220 on the board 200 provided in the component mounting line 1 and which has been subjected to a predetermined process by a device upstream of the component mounting device 100. In the present embodiment, the component mounting device 100 mounts (more specifically, temporarily crimps) an electronic component (hereinafter, referred to as a component 220) in which a drive circuit or the like is formed on a substrate 200.

In the present embodiment, the component mounting line 1 includes a board loading section 10 for loading the substrate 200, a sticking section 20 for attaching the ACF 230 to the substrate 200, and a component mounting device 100 for temporarily crimping the component 220 onto the ACF 230. The main crimping portion 40 that thermocompression-bonds (main crimps) the component 220 together with the ACF 230 to ensure electrical continuity between the substrate 200 and the component 220, and the substrate carry-out portion that carries out the substrate 200 that is thermocompression-bonded to the component 220. 50 and a computer 110 (see FIG. 2) that controls the operation of each device on the component mounting line 1 are provided.

Although the computer 110 is not shown in FIG. 1, the computer 110 is a device such as a board loading section 10, a sticking section 20, a component mounting device 100, a crimping section 40, and a board loading section 50. It is communicably connected to and by a control line or the like, and controls the operation of each device, the timing of the operation, and the like.

The board loading section 10, the bonding section 20, the component mounting device 100, the main crimping section 40, and the board loading section 50 are connected in this order. The component mounting line 1 is a component mounting operation for mounting a component 220 on an electrode portion 210 provided on the periphery of a rectangular substrate 200 such as a display panel substrate carried in from a substrate loading portion 10 on the upstream side to which the substrate 200 is transported. Is executed, and the board 200 on which the component 220 is mounted is carried out from the board carry-out unit 50. The electrode portion 210 is composed of, for example, electrodes.

The board loading unit 10 is a device for loading the board 200 that has completed a predetermined operation in the upstream equipment arranged on the upstream side of the component mounting line 1. The board loading unit 10 includes a plurality of stages 11 arranged in parallel in the X direction. The stage 11 holds the substrate 200 carried out from the upstream equipment.

The sticking portion 20 is a kind of adhesive tape, and is a device for sticking ACF 230, which is a tape of an anisotropic conductive film, to a substrate 200. The sticking portion 20 includes, for example, a plurality of stages 21 arranged in parallel in the X direction. The stage 21 holds the substrate 200 carried out from the substrate loading unit 10. The sticking portion 20 moves the substrate 200 held by the stage 21 in a predetermined direction, and moves the substrate 200 to a sticking position where the ACF 230 is stuck. Further, the sticking portion 20 sticks the ACF 230 cut to a predetermined size to the substrate 200 by the sticking tool 22. By doing so, the sticking portion 20 sticks the ACF 230 to the substrate 200.

The component mounting device 100 is a device for temporarily crimping a component 220 onto an ACF 230 attached to a substrate 200. Specifically, the component mounting device 100 picks up the component 220 mounted on the component standby stage 70 (see FIG. 2), supplies the component to the component stage 90 (see FIG. 2), and supplies the component at a predetermined timing. The component 220 supplied to the stage 90 is picked up, and the component 220 is mounted on the substrate 200 via the ACF 230.

The main crimping portion 40 is a device for thermocompression bonding (main crimping) a component 220 temporarily crimped to a substrate 200. The crimping portion 40 includes, for example, a plurality of stages 41 arranged in parallel in the X direction. The crimping portion 40 moves the substrate 200 held by the stage 41 in a predetermined direction, and moves the substrate 200 on which the component 220 is temporarily crimped to a component crimping position where the component 220 is thermocompression bonded. Further, the main crimping portion 40 is thermocompression-bonded by pressing the component against the substrate 200 via the ACF 230 while heating the component by the crimping tool 42.

The board carry-out unit 50 is a device that carries out the board 200 whose parts have been main-crimped by the main crimping portion 40 to the downstream equipment arranged downstream of the component mounting line 1. The substrate 200 held by the stage 51 included in the substrate unloading unit 50 is carried out to the downstream equipment by a carrying-out device (not shown) capable of taking out the board 200 from the stage 51 and carrying it out to the downstream side.

The computer 110 is a control device that controls the operation of each device of the component mounting line 1 including the component mounting device 100 and the component mounting device 100. The computer 110 includes a control unit 120, which is a processing unit realized by executing software, and a storage unit 130 that stores the software.

The computer 110 may be provided independently by the component mounting device 100, or may use a computer included in the component mounting line 1.

The control unit 120 controls the operation of each device of the board loading unit 10, the sticking unit 20, the component mounting device 100, the main crimping unit 40, and the component mounting line 1 including the board loading unit 50, the timing of the operation, and the like. To do. Further, the control unit 120 controls the board transfer device 60 to execute the board transfer work of transferring the board 200 to the next process between the devices included in the component mounting line 1.

The control unit 120 is stored in the storage unit 130, for example, by a control program for controlling each device included in the component mounting device 100 and the component mounting line 1, and a CPU (Central Processing Unit) that executes the control program. It will be realized.

The storage unit 130 mounts components such as the size of the board 200, the type of the component 220 mounted on the board 200, the mounting position, the mounting direction, the operation of each device, the timing of the operation, and the timing of transferring the board 200 between the devices. Various data required for the work, a control program executed by the control unit 120, and the like are stored.

The storage unit 130 is realized by, for example, a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory).

[Parts mounting device]
Subsequently, the component mounting device 100 will be described in detail with reference to FIGS. 2 to 4.

FIG. 2 is a schematic perspective view showing the component mounting device 100 according to the embodiment. FIG. 3 is a schematic side view showing the component mounting device 100 according to the embodiment. Note that in FIG. 2, the backup stage 86 is not shown. Further, in FIG. 3, some devices such as the computer 110 and the substrate transfer device 60 are not shown. FIG. 4 is a block diagram showing a functional configuration of the component mounting device 100 according to the embodiment.

Further, FIG. 2 shows a computer 110 for controlling each device included in the component mounting device 100 as a functional block. The computer 110 is communicably connected to each device included in the component mounting device 100 by a control line (not shown) or the like.

Further, FIGS. 2 and 3 show the component standby stage moving mechanism 71, the pickup head moving mechanism 73, the camera moving mechanism 76, and the crimping head moving mechanism 81 as functional blocks.

The component mounting device 100 is a device (for example, a sticking portion 20) upstream of the component mounting device 100 in the component mounting line 1 that executes a plurality of processes on the board 200, and performs a predetermined process (for example, the ACF 230 on the board 200). The component 220 is mounted (more specifically, temporarily crimped) on the substrate 200 that has been pasted).

The component mounting method executed by the component mounting device 100 includes a transfer process, a receiving process, and a mounting process.

In the transfer process, the component mounting device 100 places the substrate 200 on the substrate stage 83.

Further, in the receiving process, the component mounting device 100 receives, that is, picks up the component 220 to be mounted on the substrate 200 by the head (crimp head 80) heated by the heating mechanism 85.

Further, the component mounting device 100 executes the receiving process after the predetermined process is completed on the substrate 200 in the upstream process immediately before the transfer process. In the present embodiment, in the component mounting device 100, in the step of attaching the ACF 230 to the substrate 200 by the attaching portion 20, after the attachment of the ACF 230 to the substrate 200 is completed, the component 220 is provided by the heated crimping head 80. Perform the receiving process to receive.

For example, the component mounting device 100 performs the receiving process after the predetermined process is completed in the upstream process immediately before the component mounting device 100 and the transfer of the substrate 200 from the upstream to the component mounting device 100 is started. Execute. For example, the control unit 120 attaches the ACF 230 to the substrate 200 by the attachment unit 20 to the component mounting device 100 of the substrate 200 after the attachment process of the ACF 230 to the substrate 200 is completed and the attachment process by the substrate transfer device 60 is completed. After the transfer is started, a receiving step is performed in which the heated crimping head 80 receives the part 220.

Further, for example, in the component mounting device 100, the substrate 200 transported from the upstream (for example, the bonding portion 20) by the substrate transfer device 60 is placed on the substrate stage 83, that is, after the transfer process is completed. Then, the receiving process is executed.

Further, in the mounting process, the component mounting device 100 mounts the component 220 received by the crimping head 80 on the substrate 200 mounted on the substrate stage 83. For example, in the mounting process, the control unit 120 temporarily crimps the component 220 received by the crimping head 80 to the board 200 mounted on the board stage 83 to the crimping head 80.

Further, the component mounting method executed by the component mounting device 100 may further include a substrate defect detection step, a component supply process, and a component defect detection step.

For example, the component mounting device 100 detects defects such as misalignment of the substrate 200 mounted on the substrate stage 83 in the substrate defect detection step. For example, the control unit 120 controls the substrate defect detection unit 33 to image the substrate 200 mounted on the substrate stage 83, and analyzes the image generated by the imaging to cause the substrate 200 to be defective. Determine if there is. In this case, for example, the control unit 120 causes the crimping head 80 to execute the receiving step when the defect of the substrate 200 is not detected in the substrate defect detecting step.

Further, for example, in the component mounting device 100, the component 220 is mounted on the component stage 90 by supplying the component 220 to the component stage 90 in the component supply process. Further, for example, the component mounting device 100 detects defects in the component 220 supplied to the component stage 90 in the component defect detection step. For example, the control unit 120 controls the component defect detection unit 34 to image the component 220 mounted on the component stage 90, and analyzes the image generated by the imaging to cause the component 220 to be defective. Determine if there is. In this case, for example, in the receiving process, the component mounting device 100 causes the crimping head 80 to stand by directly above the component 220 mounted on the component stage 90 after the component detection process is completed, and immediately before the component mounting device 100. After the predetermined processing is completed on the substrate 200 in the process upstream of the above, the component 220 mounted on the component stage 90 is received by the crimping head 80. Specifically, for example, in the receiving process, the control unit 120 controls the crimping head 80 to control the crimping head moving mechanism 81 and directly above the component 220 mounted on the component stage 90 after the component detecting step is completed. After the ACF 230 has been attached to the substrate 200 in the attaching process, the part 220 placed on the component stage 90 is received by the crimping head 80.

The component mounting device 100 detects the completion of the sticking process of the ACF 230, or detects the start of transportation of the board 200 to which the sticking process of the board transfer device 60 has been completed to the component mounting device 100. A detection device for this purpose may be provided. Further, for example, the component mounting device 100 acquires information indicating the start and completion of processing from a device upstream of the component mounting device 100 such as the bonding portion 20 in order to detect the completion of the bonding process of the ACF 230. A communication interface or the like for the purpose may be provided as an acquisition unit.

The component mounting device 100 functionally includes a temporary crimping section 30, a component supply section 31, a detection section 32, a substrate transfer device 60, a control section 120, and a storage section 130.

The component supply unit 31 supplies the component 220 to be mounted (temporarily crimped) on the substrate 200. More specifically, the component supply unit 31 picks up one component 220 from the component standby stage 70 on which the component 220 mounted on the board 200 is mounted, and mounts the component 220 on the component stage 90. This is a device that supplies the component 220 to the temporary crimping portion 30.

The parts supply unit 31 includes a parts standby stage 70, a parts standby stage moving mechanism 71, a pickup head 72, a pickup head moving mechanism 73, a parts stage 90, and a parts stage moving mechanism 91 as hardware parts. Have.

The component standby stage 70 is a stage on which the component 220 is placed. For example, a plurality of components 220 may be mounted on the component standby stage 70. In this case, the plurality of parts 220 are placed on the parts standby stage 70, for example, in a state of being arranged on a tray in a predetermined arrangement. Further, the supply form of the component 220 to the component standby stage 70 is not limited to this. For example, even if the carrier tape is pulled out from the supply reel around which the carrier tapes holding the plurality of parts 220 are wound, the parts 220 are punched out from the drawn carrier tape with a mold, and the parts 220 are supplied to the parts standby stage 70. Good.

The component standby stage moving mechanism 71 is a moving mechanism for moving the component 220 mounted on the component standby stage 70 to a position where the pickup head 72 can pick up. The component standby stage moving mechanism 71 is, for example, a conveyor configured so that the component standby stage 70 can be arbitrarily moved on an XY plane.

The pickup head 72 is a device for picking up the component 220 mounted on the component standby stage 70 and supplying the component 220 to the component stage 90. Specifically, the pickup head 72 picks up the component 220 mounted on the component standby stage 70, and separates the picked up component 220 at the component stage 90 to move the picked up component 220 to the component stage 90. Place it. The pickup head 72 includes a suction nozzle that can suck and hold the component 220.

The method of holding the component 220 by the pickup head 72 is not particularly limited, but in the case of the present embodiment, a method of holding the component 220 by vacuum suction is adopted.

The pickup head moving mechanism 73 is a moving mechanism for moving the pickup head 72. The pickup head moving mechanism 73 is composed of, for example, a linear motion guide and a linear motor for reciprocating the pickup head 72 in the Z-axis direction.

The component stage 90 is a stage on which the component 220 supplied by the pickup head 72 is placed.

The component stage moving mechanism 91 is a moving mechanism for moving the component stage 90 to a position where the pickup head 72 can supply the component 220. Further, the component stage moving mechanism 91 moves the component stage 90 to a position where the camera 74 can image the component 220 mounted on the component stage 90. In the present embodiment, the component stage moving mechanism 91 moves the component stage 90 mounted on the component stage 90 to the lower part of the camera 74. Further, the component stage moving mechanism 91 moves the component stage 90 to a position where the crimping head 80 can receive the component 220 mounted on the component stage 90, that is, can pick up the component stage 90.

The component stage moving mechanism 91 is, for example, a conveyor configured so that the component stage 90 can be reciprocated in the Y-axis direction.

The temporary crimping unit 30 is a device that picks up the component 220 supplied to the component stage 90 by the component supply unit 31 and mounts (temporarily crimps) it on the substrate 200.

The temporary crimping portion 30 includes a camera 75, a crimping head (head) 80, a crimping head moving mechanism 81, a substrate stage 83, a backup stage 86, a substrate stage moving mechanism 84, and a heating mechanism 85 as hardware portions. And have. Note that in FIGS. 2 and 3, the heating mechanism 85 is not shown.

The crimping head 80 receives the component 220 from the component supply unit 31 and attaches it to the substrate 200 mounted on the substrate stage 83. The crimping head 80 includes a suction nozzle capable of sucking and holding the component 220 mounted on the component stage 90. The crimping head 80 sucks the component 220 mounted on the component stage 90 by the suction nozzle and temporarily crimps the component 220 to the substrate 200.

The method of holding the component 220 by the crimping head 80 is not particularly limited, but in the case of the present embodiment, a method of holding the component 220 by vacuum suction is adopted.

The crimping head moving mechanism 81 is a moving mechanism for moving the crimping head 80. The crimping head moving mechanism 81 is composed of, for example, a linear motion guide and a linear motor for reciprocating the crimping head 80 in the Z-axis direction.

The substrate stage 83 is a stage on which the substrate 200 carried out from the attachment portion 20 by the substrate transfer device 60 is placed. The substrate 200 is placed on the substrate stage 83 with the outer edge of the substrate 200 to which the ACF 230 is attached protruding from the substrate stage 83.

The backup stage 86 is a portion of the substrate 200 to be temporarily crimped when the temporary crimping head 80 temporarily crimps the component 220 to the substrate 200, that is, an outer edge portion of the substrate 200 to which the ACF 230 is attached. This is a stage for supporting the portion of the substrate 200 protruding from the stage 83 from the back side (lower side) of the substrate 200.

The substrate stage moving mechanism 84 is a moving mechanism that moves the substrate stage 83 to a position where the substrate 200 conveyed from the attachment portion 20 by the substrate transfer device 60 can be placed on the substrate stage 83. Further, the substrate stage moving mechanism 84 moves the substrate 200 to a position where the crimping head 80 can temporarily crimp the component 220 to the ACF 230 attached to the substrate 200.

The substrate stage moving mechanism 84 is, for example, a conveyor that is configured so that the substrate stage 83 can be arbitrarily moved in the XY plane and can be moved up and down in the Z-axis direction.

The heating mechanism 85 is a heater having a heating wire for heating the crimping head, a Peltier element, and the like. The heating mechanism 85 is built in, for example, the crimping head 80. The component 220 held by the crimping head 80 is heated to a predetermined temperature by the heating mechanism 85 before being temporarily crimped to the substrate 200. The crimping head 80 presses the component 220 against the substrate 200 while heating the component 220 via the ACF 230 attached to the substrate 200 in a state of being heated by the heating mechanism 85. By doing so, the component 220 is temporarily crimped to the substrate 200 while the ACF 230 is cured by the heat generated from the crimping head 80.

The detection unit 32 is a device for detecting defects such as failures and misalignments of the component 220 and the substrate 200. Functionally, the detection unit 32 includes a substrate defect detection unit 33 and a component defect detection unit 34.

The substrate defect detection unit 33 detects defects such as misalignment of the substrate 200 mounted on the substrate stage 83. The detection unit 32 includes a camera 75 as a hardware unit.

The component defect detection unit 34 detects defects such as a failure of the component 220. The component defect detection unit 34 includes cameras 74 and 75 and a camera moving mechanism 76 as hardware units.

The camera 74 is an imaging device for detecting defects in the component 220 mounted on the component stage 90. The camera 74, for example, captures the upper surface side of the component 220 mounted on the component stage 90 by imaging the lower part. For example, the component mounting device 100 (more specifically, the control unit 120) determines whether or not the component 220 is a defective product by imaging the component 220 with the camera 74 and performing image analysis. When the component mounting device 100 determines that the component 220 is a defective product, for example, the component mounting device 100 collects the component 220 from the component stage 90 and discards it. For example, when the control unit 120 determines that the component 220 is a defective product, the control unit 120 controls, for example, the component stage moving mechanism 91, the pickup head 72, and the pickup head moving mechanism 73, and causes the component to the pickup head 72. The 220 is picked up, the component 220 is collected from the component stage 90, and the component 220 is moved to a collection box (not shown) or the like installed in advance in order to discard the defective component.

The camera moving mechanism 76 is a moving mechanism for moving the camera 74 to a position where the camera 74 can image the component 220. The camera moving mechanism 76 is composed of, for example, a linear motion guide and a linear motor for reciprocating the camera 74 in the Z-axis direction.

The camera 75 is an image pickup device held by the crimping head 80, that is, for detecting a defect of the picked-up component 220. The camera 75 is provided below the backup stage 86, for example, and images the lower surface side of the component 220 held by the crimping head 80 by photographing the upper side through a window portion (not shown) provided in the backup stage 86. To do. The window portion is, for example, a member having translucency or a through hole formed in the backup stage 86. For example, the component mounting device 100 (more specifically, the control unit 120) determines whether or not the component 220 is a defective product by imaging the component 220 with the camera 75 and analyzing the image. When the component mounting device 100 determines that the component 220 is a defective product, for example, the component mounting device 100 discards the component 220. For example, when the control unit 120 determines that the component 220 is a defective product, the control unit 120 controls the crimp head 80 and the crimp head moving mechanism 81 to discard the defective component in a pre-installed collection box (not shown). ) Etc. to move the component 220.

Further, the camera 75 detects defects such as misalignment of the substrate 200 mounted on the substrate stage 83. For example, the substrate 200 is placed on the substrate stage 83 so that the outer edge of the substrate 200 slightly protrudes from the outer edge of the substrate stage 83 in the positive direction of the Y-axis in the top view. The camera 75 takes an image of the outer edge of the substrate 200 in order to detect the position of the outer edge of the substrate 200 protruding from the outer edge of the substrate stage 83 in the bottom view. By analyzing the image including the substrate 200 captured by the camera 75, the control unit 120 determines whether or not there is a defect such as a positional deviation from a predetermined position for temporarily crimping the component 220 to the substrate 200. .. When, for example, the control unit 120 determines that the substrate 200 is defective, for example, the substrate 200 (specifically, a position where the substrate stage moving mechanism 84 can be controlled to temporarily crimp the component 220 to the substrate 200 by the crimping head 80). Specifically, the substrate stage 83) is moved.

The camera moving mechanism 76 may be configured so that the camera 74 can be freely moved in the XY plane. In this case, the camera moving mechanism 76 is composed of, for example, a guide for moving the camera 74 in the XY plane and a linear motor.

Further, in the present embodiment, the camera 75 has a fixed position, but may be configured to be movable.

The board transfer device 60 is a device for transferring (transferring) the board 200 between adjacent devices. The substrate transfer device 60 reciprocates between adjacent devices along the X-axis direction, receives the board 200 from the upstream device, and places the board 200 on a stage of the downstream device, for example. For example, the substrate transfer device 60 receives the substrate 200 from which the ACF 230 has been attached to the substrate 200 by the attachment portion 20 from the attachment portion 20, and mounts the substrate stage 83 of the component mounting device 100.

The control unit 120 is a processing unit that controls each operation of the temporary crimping unit 30, the component supply unit 31, the detection unit 32, the substrate transfer device 60, etc., the timing of each operation, and the like. In the present embodiment, the control unit 120 also controls the operation of devices such as the sticking unit 20 and the crimping unit 40 included in the component mounting line 1.

The control unit 120 determines, for example, whether or not a predetermined process is completed upstream immediately before the component mounting device 100, and if it is determined that the predetermined process is completed, the component 220 is attached to the crimping head 80. The operation of the crimping head 80 is controlled so as to receive from 31.

The control unit 120 may control the operation of the crimping head 80 so that the crimping head 80 holds the component 220 for a predetermined time, for example. The predetermined time may be arbitrarily set in advance and is not limited. The control unit 120 controls the operation of the crimping head 80 so that, for example, the component 220 that has passed a predetermined time after the crimping head 80 holds the component 220 is discarded without being temporarily crimped to the substrate 200. .. The component mounting device 100 may include a time measuring unit (not shown) such as an RTC (Real Time Clock) in order to measure the time.

The storage unit 130 is a control unit and various data necessary for mounting the component 220 on the board 200, such as the operation of each device included in the component mounting device 100, the timing of the operation, and the timing of transferring the board 200 between the devices. The control program and the like executed by the 120 are stored. In the present embodiment, the storage unit 130 also stores a control program for the control unit 120 to control the operation of each device included in the component mounting line 1 other than the component mounting device 100, the timing of the operation, and the like. ..

The storage unit 130 is realized by, for example, a memory such as a ROM or a RAM.

[Processing procedure]
Subsequently, the processing procedure of the component mounting apparatus 100 according to the embodiment will be described in detail with reference to FIGS. 5 to 7.

FIG. 5 is a flowchart for explaining a processing procedure of an operation executed by the component mounting device 100 according to the embodiment. FIG. 6 is a side view for explaining the operation executed by the component mounting device 100 according to the embodiment. FIG. 7 is a side view for explaining the operation executed by the component mounting device 100 according to the embodiment.

Note that in FIGS. 6 and 7, some components such as the component standby stage 70 and the board transfer device 60 are not shown.

As shown in FIG. 5, first, the control unit 120 causes the component stage 90 to supply the component 220 to the component supply unit 31 (step S101).

Next, the control unit 120 causes the detection unit 32 to detect the defect of the component 220 supplied to the component stage 90, and determines whether or not the component 220 is a defective product (step S102). In step S102, for example, the control unit 120 determines whether or not the component 220 is a defective product by taking an image of the component 220 by the camera 74 and analyzing the generated image.

When the control unit 120 determines that the component 220 is not a defective product (No in step S102), the control unit 120 positions the crimping head 80 above the component 220 supplied to the component stage 90 (step S103). In the present embodiment, in step S103, as shown in FIG. 6A, the control unit 120 raises the camera 74, which has been brought close to the component 220 in order to detect the defect of the component 220, by the camera moving mechanism 76. And by moving the component stage 90 in the negative direction of the Y-axis by the component stage moving mechanism 91, the crimping head 80 is positioned above the component 220 supplied to the component stage 90. When the crimping head moving mechanism 81 is configured to move the crimping head 80 in the Y-axis direction, the control unit 120 moves the crimping head 80 by the crimping head moving mechanism 81 to move the crimping head 80. May be moved above the component 220 supplied to the component stage 90.

Next, the control unit 120 determines whether or not a predetermined process in the process of the device upstream of the component mounting device 100 is completed (step S104). For example, in step S104, the control unit 120 determines whether or not the attachment unit 20 has completed the attachment of the ACF 230 to the substrate 200. The sticking unit 20 transmits, for example, a completion signal indicating that the sticking unit 20 has completed the sticking of the ACF 230 to the substrate 200 to the control unit 120. When the control unit 120 receives the completion signal, the control unit 120 determines that the attachment unit 20 has completed the attachment of the ACF 230 to the substrate 200.

When the control unit 120 determines that a predetermined process in the process of the device upstream of the component mounting device 100 is completed (Yes in step S104), the control unit 120 causes the crimping head 80 to receive the component 220, that is, to pick up the component 220. (Step S105). For example, as shown in FIG. 6B, the control unit 120 causes the crimping head 80 to receive the component by moving the crimping head 80 downward to the crimping head moving mechanism 81 and sucking the component 220. ..

In this way, the component mounting device 100 causes the crimping head 80 to receive the component 220 after determining that a predetermined process in the process of the device upstream of the component mounting device 100 has been completed.

Further, for example, after the crimping head 80 receives the component 220, the control unit 120 moves the component stage 90 in the positive direction of the Y-axis by the component stage moving mechanism 91 as shown in FIG. 6B. The component supply unit 31 newly supplies the component 220 to the component stage 90.

Next, the control unit 120 causes the detection unit 32 to detect the defect of the component 220 received by the crimping head 80, and determines whether or not the component 220 is a defective product (step S106). In the present embodiment, in step S106, as shown in FIG. 6C, the control unit 120 moves the crimping head 80 downward by the crimping head moving mechanism 81 in order to detect the defect of the component 220. The component 220 is brought closer to the camera 75. Further, in step S106, for example, the control unit 120 determines whether or not the component 220 is a defective product by taking an image of the component 220 by the camera 75 and analyzing the generated image.

When the control unit 120 determines that the component 220 is not a defective product (No in step S106), the control unit 120 moves the substrate 200 to which the ACF 230 is attached by the attachment unit 20 to the substrate transfer device 60 to the component mounting device 100 and the substrate. It is placed on the stage 83 (step S107).

Next, the control unit 120 causes the detection unit 32 to detect a defect of the substrate 200 mounted on the substrate 200, and determines whether or not the substrate 200 has a defect (step S108). For example, in step S108, as shown in FIG. 6C, the control unit 120 moves the crimping head 80 upward (in the direction of the arrow A1) to the crimping head moving mechanism 81, and causes the substrate 200 to move upward (in the direction of arrow A1). Temporarily crimp the component 220 to the substrate 200 In order to detect defects such as misalignment from a predetermined position, the substrate stage moving mechanism 84 moves the substrate stage 83 in the positive Y-axis direction (direction of arrow A2). Then, the camera 75 is made to take an image of the position of the outer edge of the substrate 200 protruding from the outer edge of the substrate stage 83. The control unit 120 analyzes the image generated by the camera 75 to determine whether or not there is a defect such as a displacement from a predetermined position for temporarily crimping the component 220 to the substrate 200. To do.

When the control unit 120 determines that the substrate 200 is not defective (No in step S108), the control unit 120 temporarily crimps the component 220 to the substrate 200 by the crimping head 80 and the crimping head moving mechanism 81 (step S109). In step S109, for example, the control unit 120 first moves the substrate stage 83 to the substrate stage moving mechanism 84 in the negative direction of the Z axis (direction of arrow A3) as shown in FIG. 6 (c). As shown in (d) of 7, the lower surface of the substrate 200 is brought into contact with the backup stage. Next, as shown in FIG. 7D, the control unit 120 moves the crimping head 80 downward to the crimping head moving mechanism 81 to temporarily crimp the component 220 to the substrate 200.

Further, after the component 220 is temporarily crimped to the substrate 200 in step S109, the control unit 120 moves the crimping head 80 upward (direction of arrow A4) on the crimping head moving mechanism 81 as shown in FIG. 7 (e). ), The substrate stage 83 is moved to the substrate stage moving mechanism 84 in the Z-axis positive direction (direction of arrow A5), and the substrate stage 83 is moved to the substrate stage moving mechanism 84 in the Y-axis negative direction (arrow A6). Orientation). Further, the control unit 120 moves the substrate 200 to the substrate transfer device 60 in a process downstream of the component mounting device 100 (in the present embodiment, the main crimping unit 40), and returns the process to step S101.

Further, for example, in step S102 or step S106, when the control unit 120 determines that the component 220 is a defective product (Yes in step S102 or step S106), the substrate 200 disposes of the component 220 without temporarily crimping the component 220. As described above, the operation of the component supply unit 31 and the component stage moving mechanism 91 and the like, or the crimping head 80 and the crimping head moving mechanism 81 and the like is controlled.

Further, for example, in step S104, when the control unit 120 does not determine that the predetermined process in the process of the device upstream of the component mounting device 100 is completed (No in step S104), the crimping head 80 is made to receive the component 220. Instead, the crimping head 80 is made to stand by above the component 220 on the component stage 90 (step S111), and the process is returned to step S104. That is, when the control unit 120 does not determine that the predetermined process in the process of the device upstream of the component mounting device 100 is completed, the control unit 120 does not receive the component 220 from the crimping head 80 and stands by above the component 220 on the component stage 90. Continue to continue (step S111).

Further, for example, in step S108, when the control unit 120 determines that the substrate 200 is defective (Yes in step S108), the substrate on the substrate stage 83 is determined by the substrate stage moving mechanism 84, the substrate transfer device 60, and the like. After the position of 200 is corrected to a predetermined position (step S112), the component 220 is temporarily crimped to the substrate 200 by the crimping head 80 and the crimping head moving mechanism 81 (step S109).

The start of the transfer of the substrate 200 from the sticking portion 20 may be executed in parallel with the step S105 after the step S104 in the case of Yes in the step S104. That is, step S107 may be executed in parallel with step S105 after step S104 in the case of Yes in step S104. That is, the steps of steps S101 and S102 and the steps of steps S103 to S109 may be executed in parallel.

Further, step S105 may be executed after the determination of Yes is made by the control unit 120 in step S104, and may be executed after step S107, for example, and the determination of No in step S108 may be executed after the determination unit 120. It may be executed after it has been done or after step S112.

[Effects, etc.]
As described above, in the component mounting method according to the embodiment, the component 220 is mounted on the board 200 that has been subjected to a predetermined process upstream of the component mounting device 100 in the component mounting line 1 that executes a plurality of processes on the board 200. This is a component mounting method executed by the component mounting device 100 to be mounted. The component mounting method according to the embodiment includes a transfer step of mounting the substrate 200 on the substrate stage 83, a receiving step of receiving the component 220 for mounting on the substrate 200 by a heated head (crimping head 80), and a substrate. A mounting step of mounting the component 220 received by the crimping head 80 on the substrate 200 mounted on the stage 83 is included. The receiving process is executed after the predetermined processing on the substrate 200 is completed in the upstream process immediately before the component mounting device 100.

According to such a method, the crimping head 80 receives and holds the component 220 even when the transfer of the substrate 200 is delayed due to a defect or the like in the upstream process immediately before the component mounting device 100. Therefore, the heat from the crimping head 80 is less likely to affect the component 220. Therefore, deformation of the component 220 due to heat from the crimping head 80 is less likely to occur. For example, when the predetermined process is a process that easily causes a delay, such as a process of attaching the ACF 230 to the substrate 200, the predetermined process is performed on the substrate 200 in the upstream process immediately before the component mounting device 100. If the crimping head 80 receives and holds the part 220 before the completion of the process, heat is applied to the part 220 depending on whether there is a delay in the linear process or not. The time is different. Therefore, due to deformation of the component 220 or the like, shape unevenness occurs for each component 220, and mounting variation of the component 220 on the substrate 200 occurs for each component 220. Therefore, the receiving step in the component mounting method according to the present embodiment is executed after the predetermined processing on the substrate 200 is completed in the upstream process immediately before the component mounting device 100. By doing so, it becomes difficult for a difference in the time for applying heat to the component 220 to occur between the case where the delay occurs and the case where the delay does not occur in the linear process of the component mounting device 100. Therefore, the difference in the degree of deformation of the component 220 due to the heat from the crimping head 80 is unlikely to occur for each component 220, so that the variation in mounting of the component 220 on the substrate 200 can be suppressed.

Further, for example, in the receiving process in the component mounting method according to the embodiment, a predetermined process is completed in the upstream process immediately before the component mounting device 100, and the board 200 is transported from the upstream to the component mounting device 100. Executed after it is started.

According to such a method, there is a delay in moving the substrate 200 to the transfer position, for example, between the time when the transfer of the board 200 to the component mounting device 100 is started after the completion of the predetermined process in the upstream. Even if it occurs, the difference in the time for applying heat to the component 220 for each component 220 mounted on the substrate 200 is less likely to occur. Therefore, the difference in the degree of deformation of the component 220 due to the heat from the crimping head 80 is less likely to occur for each component 220, so that the variation in mounting of the component 220 on the substrate 200 can be further suppressed.

Further, for example, the receiving process in the component mounting method according to the embodiment is executed after the transfer process is completed.

According to such a method, even if a delay occurs in the upstream, there is no difference in the time for applying heat to the component 220 for each component 220 mounted on the substrate 200. Therefore, the difference in the degree of deformation of the component 220 due to the heat from the crimping head 80 is less likely to occur for each component 220, so that the variation in mounting of the component 220 on the substrate 200 can be further suppressed.

Further, for example, the component mounting method according to the embodiment further includes a substrate defect detecting step of detecting defects in the substrate 200 mounted on the substrate stage 83, and the receiving process is a substrate defect detecting step of the substrate 200. Executed when no defect is detected.

According to such a method, even when a delay occurs due to alignment of the board 200 or the like in order to mount the component 220 on the board 200 where the delay occurs upstream, for each component 220 mounted on the board 200, There is no difference in the time when heat is applied to the component 220. Therefore, the difference in the degree of deformation of the component 220 due to the heat from the crimping head 80 is less likely to occur for each component 220, so that the variation in mounting of the component 220 on the substrate 200 can be further suppressed.

Further, for example, the component mounting method according to the embodiment further includes a component supply step of supplying the component 220 to the component stage 90, a component defect detection step of detecting the defect of the component 220 supplied to the component stage 90, and the component defect detection step. including. In this case, in the receiving step, after the component defect detection step is completed, the crimping head 80 is made to stand by directly above the component 220, and a predetermined process is completed on the substrate 200 in the upstream process immediately before the component mounting device 100. After that, the component 220 mounted on the component stage 90 is received by the crimping head 80.

According to such a method, by making the crimping head 80 stand by directly above the component 220, the crimping head 80 can immediately receive the component 220 when a predetermined process is completed on the substrate 200. Therefore, according to such a method, the tact time for mounting the component 220 on the substrate 200 can be shortened.

Further, the component mounting device 100 according to the present embodiment is a component mounting device that mounts a component 220 on a board 200 that has been subjected to a predetermined process upstream in a component mounting line 1 that executes a plurality of processes on the board 200. .. The component mounting device 100 includes a board stage 83 on which the board 200 is mounted, a board transfer device 60 on which the board 200 is mounted on the board stage 83, and a component supply unit 31 that supplies components 220 to be mounted on the board 200. A crimping head 80 that receives the component 220 from the component supply unit 31 and attaches the component 220 to the substrate 200 mounted on the substrate stage 83, and a control unit 120 that controls the operation of the crimping head 80 are provided. The crimping head 80 has a heating mechanism 85. The control unit 120 determines whether or not a predetermined process is completed upstream immediately before the component mounting device 100, and if it is determined that the predetermined process is completed, the component 220 is attached to the crimping head 80 from the component supply unit 31. The operation of the crimping head 80 is controlled so that it can be received.

According to such a configuration, the difference in the time for applying heat to the component 220 is less likely to occur between the case where the delay occurs in the process immediately before the component mounting device 100 and the case where the delay does not occur. Therefore, the difference in the degree of deformation of the component 220 due to the heat from the crimping head 80 is unlikely to occur for each component 220, so that the variation in mounting of the component 220 on the substrate 200 can be suppressed.

(Other embodiments)
Although the component mounting method and the like according to the present embodiment have been described above based on the above-described embodiment, the present invention is not limited to the above-described embodiment.

For example, in the above embodiment, all or a part of the components of the computer 110 may be configured by dedicated hardware, or may be realized by executing a software program suitable for each component. Good. Each component may be realized by a program execution unit such as a CPU (Central Processing Unit) or a processor reading and executing a software program recorded on a recording medium such as an HDD (Hard Disk Drive) or a semiconductor memory. Good.

Further, the components of the computer 110 may be composed of one or a plurality of electronic circuits. The one or more electronic circuits may be general-purpose circuits or dedicated circuits, respectively.

The one or more electronic circuits may include, for example, a semiconductor device, an IC (Integrated Circuit), an LSI (Large Scale Integration), or the like. The IC or LSI may be integrated on one chip or may be integrated on a plurality of chips. Here, it is called an IC or an LSI, but the name changes depending on the degree of integration, and it may be called a system LSI, a VLSI (Very Large Scale Integration), or a ULSI (Ultra Large Scale Integration). Further, an FPGA (Field Programmable Gate Array) programmed after manufacturing the LSI can also be used for the same purpose.

In addition, it is realized by arbitrarily combining the components and functions in each embodiment within the range obtained by applying various modifications to each embodiment and the gist of the present invention. Forms are also included in the present invention.

The component mounting method according to the present invention can be used in a component mounting device for temporarily crimping a component to a substrate, which is possessed by a component mounting line for producing a display panel or the like.

1 Parts mounting line 10 Board carry-in part 11, 21, 41, 51 Stage 20 Sticking part 22 Sticking tool 30 Temporary crimping part 31 Parts supply part 32 Detection part 33 Board defect detecting part 34 Parts defect detecting part 40 crimping parts 42 Crimping tool 50 Board carry-out part 60 Board transfer device 70 Parts standby stage 71 Parts standby stage movement mechanism 72 Pickup head 73 Pickup head movement mechanism 74, 75 Camera 76 Camera movement mechanism 80 Crimping head (head)
81 Crimping head moving mechanism 83 Board stage 84 Board stage moving mechanism 85 Heating mechanism 86 Backup stage 90 Parts stage 91 Parts stage moving mechanism 100 Parts mounting device 110 Computer 120 Control unit 130 Storage unit 200 Board 210 Electrode unit 220 Parts 230 Anisotropic Conductive member (ACF)
A1, A2, A3, A4, A5, A6 Arrows

Claims (6)

A component mounting method executed by a component mounting device that mounts a component on the board that has been subjected to predetermined processing upstream of the component mounting device in a component mounting line that executes a plurality of processes on the board.
The transfer process of placing the substrate on the substrate stage and
The receiving process of receiving the parts to be mounted on the board by the heated head,
Including a mounting step of mounting the component received by the head on the board mounted on the board stage.
The receiving step is executed after the predetermined process is completed on the substrate in the upstream step immediately before the component mounting device.
Component mounting method. The receiving step is executed after the predetermined process is completed in the upstream step immediately before the component mounting device and the transfer of the substrate from the upstream to the component mounting device is started.
The component mounting method according to claim 1. The receiving process is executed after the transporting process is completed.
The component mounting method according to claim 1 or 2. Further, a substrate defect detection step of detecting a defect of the substrate mounted on the substrate stage is included.
The receiving step is executed when a defect of the substrate is not detected in the substrate defect detecting step.
The component mounting method according to any one of claims 1 to 3. further,
The parts supply process for supplying the parts to the parts stage and
Including a component defect detection step of detecting defects of the component supplied to the component stage.
In the receiving process,
After the component defect detection step is completed, the head is made to stand by directly above the component.
Any one of claims 1 to 4 in which the head receives the component mounted on the component stage after the predetermined process is completed on the substrate in the upstream process immediately before the component mounting device. The component mounting method described in the section. A component mounting device that mounts components on a board that has undergone predetermined processing upstream in a component mounting line that executes multiple processes on the board.
The board stage on which the board is placed and
A substrate transfer device for mounting the substrate on the substrate stage,
A component supply unit that supplies components to be mounted on the board, and
A head that receives the component from the component supply unit and attaches the component to the board mounted on the board stage.
A control unit that controls the operation of the head
With
The head has a heating mechanism
The control unit
It is determined whether or not the predetermined process is completed in the upstream immediately before the component mounting device, and when it is determined that the predetermined process is completed, the head is made to receive the component from the component supply unit. Controls the operation of the head,
Component mounting device.

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