JP2020126982A - フィルム状接着剤及び接着シート - Google Patents
フィルム状接着剤及び接着シート Download PDFInfo
- Publication number
- JP2020126982A JP2020126982A JP2019020033A JP2019020033A JP2020126982A JP 2020126982 A JP2020126982 A JP 2020126982A JP 2019020033 A JP2019020033 A JP 2019020033A JP 2019020033 A JP2019020033 A JP 2019020033A JP 2020126982 A JP2020126982 A JP 2020126982A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- film
- semiconductor element
- semiconductor
- adhesive sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 165
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 161
- 239000004065 semiconductor Substances 0.000 claims abstract description 113
- 229920000800 acrylic rubber Polymers 0.000 claims abstract description 20
- 229920000058 polyacrylate Polymers 0.000 claims abstract description 20
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims abstract description 15
- 230000009477 glass transition Effects 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims description 18
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 abstract description 25
- 229910001431 copper ion Inorganic materials 0.000 abstract description 25
- 230000007547 defect Effects 0.000 abstract description 5
- 239000010408 film Substances 0.000 description 95
- 238000000034 method Methods 0.000 description 23
- 238000010438 heat treatment Methods 0.000 description 16
- 238000007789 sealing Methods 0.000 description 15
- 239000000203 mixture Substances 0.000 description 12
- 239000002904 solvent Substances 0.000 description 12
- 239000002966 varnish Substances 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 239000010949 copper Substances 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 10
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 10
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- -1 polypropylene Polymers 0.000 description 9
- 239000000243 solution Substances 0.000 description 8
- 239000000758 substrate Substances 0.000 description 7
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 6
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 6
- 239000000470 constituent Substances 0.000 description 6
- 239000010410 layer Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 5
- 239000013039 cover film Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 239000002985 plastic film Substances 0.000 description 4
- 229920006255 plastic film Polymers 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 239000003566 sealing material Substances 0.000 description 4
- 238000011282 treatment Methods 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 229910000365 copper sulfate Inorganic materials 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000011116 polymethylpentene Substances 0.000 description 2
- 229920000306 polymethylpentene Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052938 sodium sulfate Inorganic materials 0.000 description 2
- 235000011152 sodium sulphate Nutrition 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 238000007611 bar coating method Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910000366 copper(II) sulfate Inorganic materials 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 150000002391 heterocyclic compounds Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 125000005487 naphthalate group Chemical group 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 239000002987 primer (paints) Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 125000006413 ring segment Chemical group 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J119/00—Adhesives based on rubbers, not provided for in groups C09J107/00 - C09J117/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/18—Homopolymers or copolymers of nitriles
- C09J133/20—Homopolymers or copolymers of acrylonitrile
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
Description
条件(i):アクリロニトリルに由来する構成単位を有し、かつ12℃を超えるガラス転移温度(Tg)を有する。
条件(ii):アクリロニトリルに由来する構成単位を有せず、かつ0℃以上であるガラス転移温度(Tg)を有する。
条件(i):アクリロニトリルに由来する構成単位を有し、かつ12℃を超えるガラス転移温度(Tg)を有する。
条件(ii):アクリロニトリルに由来する構成単位を有せず、かつ0℃以上であるガラス転移温度(Tg)を有する。
[フィルム状接着剤の作製]
<接着剤ワニスの準備>
表1に示すアクリルゴム溶液を、接着剤ワニスとして用いた。なお、表1に示す数値は、アクリルゴム溶液の固形分の質量部を意味する。
(A1)アクリルゴムA:SG−P3溶剤変更品(SG−P3(商品名、ナガセケムテックス株式会社製、アクリルゴムのメチルエチルケトン溶液)の溶剤を変更したもの)、アクリロニトリルに由来する構成単位:有り、重量平均分子量:70万、実測Tg:12℃、溶剤:シクロヘキサノン
(A2)アクリルゴムB:アクリロニトリルに由来する構成単位:有り、重量平均分子量:70万、実測Tg:22℃、溶剤:シクロヘキサノン
(A3)アクリルゴムC:アクリロニトリルに由来する構成単位:無し、重量平均分子量:50万、実測Tg:20℃、溶剤:シクロヘキサノン
作製した接着剤ワニスを100メッシュのフィルターでろ過し、真空脱泡した。基材フィルムとして、厚み38μmの離型処理を施したポリエチレンテレフタレート(PET)フィルムを用意し、真空脱泡後の接着剤ワニスをPETフィルム上に塗布した。塗布した接着剤ワニスを、90℃で5分間、続いて130℃で5分間の2段階で加熱乾燥し、Bステージ状態にある実施例1、2及び比較例1のフィルム状接着剤を得た。フィルム状接着剤においては、接着剤ワニスの塗布量によって、厚み20μmになるように調整した。
<A液の調製>
無水硫酸銅(II)2.0gを蒸留水1020gに溶解させ、完全に硫酸銅が溶解するまで撹拌し、銅イオン濃度がCu元素換算で濃度500mg/kgである硫酸銅水溶液を調製した。得られた硫酸銅水溶液をA液とした。
無水硫酸ナトリウム1.0gを蒸留水1000gに溶解させ、完全に硫酸ナトリウムが溶解するまで撹拌した。これにさらにN−メチル−2−ピロリドン(NMP)を1000g加え、撹拌した。その後、室温になるまで空冷して硫酸ナトリウム水溶液を得た。得られた溶液をB液とした。
上記で作製した実施例1、2及び比較例1のフィルム状接着剤(厚み:20μm)を、それぞれ直径約3cmの円状に切り抜いた。次に、厚み1.5mm、外径約3cm、内径1.8cmのシリコンパッキンシートを2枚用意した。円状に切り抜いたフィルム状接着剤を2枚のシリコンパッキンシートで挟み、これを容積50mLの2つのガラス製セルのフランジ部で挟み、ゴムバンドで固定した。
Claims (3)
- 半導体素子と前記半導体素子を搭載する支持部材とを接着するためのフィルム状接着剤であって、
アクリルゴムを含有し、
前記アクリルゴムが下記の条件(i)又は条件(ii)のいずれかを満たす、フィルム状接着剤。
条件(i):アクリロニトリルに由来する構成単位を有し、かつ12℃を超えるガラス転移温度(Tg)を有する。
条件(ii):アクリロニトリルに由来する構成単位を有せず、かつ0℃以上であるガラス転移温度(Tg)を有する。 - 基材と、
前記基材の一方の面上に設けられた請求項1に記載のフィルム状接着剤と、
を備える、接着シート。 - 前記基材がダイシングテープである、請求項2に記載の接着シート。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019020033A JP2020126982A (ja) | 2019-02-06 | 2019-02-06 | フィルム状接着剤及び接着シート |
CN202080012681.7A CN113474433A (zh) | 2019-02-06 | 2020-02-03 | 膜状黏合剂、黏合片及半导体装置 |
KR1020217024989A KR20210123319A (ko) | 2019-02-06 | 2020-02-03 | 필름상 접착제, 접착 시트, 및 반도체 장치 |
SG11202108155SA SG11202108155SA (en) | 2019-02-06 | 2020-02-03 | Film-like adhesive, adhesive sheet and semiconductor device |
PCT/JP2020/003972 WO2020162412A1 (ja) | 2019-02-06 | 2020-02-03 | フィルム状接着剤、接着シート、及び半導体装置 |
TW109103343A TW202045670A (zh) | 2019-02-06 | 2020-02-04 | 膜狀接著劑、接著片以及半導體裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019020033A JP2020126982A (ja) | 2019-02-06 | 2019-02-06 | フィルム状接着剤及び接着シート |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2020126982A true JP2020126982A (ja) | 2020-08-20 |
Family
ID=71947713
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019020033A Withdrawn JP2020126982A (ja) | 2019-02-06 | 2019-02-06 | フィルム状接着剤及び接着シート |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP2020126982A (ja) |
KR (1) | KR20210123319A (ja) |
CN (1) | CN113474433A (ja) |
SG (1) | SG11202108155SA (ja) |
TW (1) | TW202045670A (ja) |
WO (1) | WO2020162412A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023182226A1 (ja) * | 2022-03-25 | 2023-09-28 | 株式会社レゾナック | 半導体用接着フィルム、ダイシング・ダイボンディング一体型フィルム、及び半導体装置の製造方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1996031574A1 (fr) * | 1995-04-04 | 1996-10-10 | Hitachi Chemical Company, Ltd. | Adhesif, pellicule adhesive et feuille metallique a envers adhesif |
JP2011052109A (ja) * | 2009-09-01 | 2011-03-17 | Hitachi Chem Co Ltd | フィルム状接着剤、接着シート及び半導体装置 |
JP2011100927A (ja) * | 2009-11-09 | 2011-05-19 | Sony Chemical & Information Device Corp | 接着剤組成物 |
JP2014194031A (ja) * | 2014-05-22 | 2014-10-09 | Lintec Corp | 接着シートおよび半導体装置の製造方法 |
JP2018530905A (ja) * | 2015-09-23 | 2018-10-18 | エルジー・ケム・リミテッド | 接着フィルム、半導体装置の製造方法および半導体装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006237483A (ja) * | 2005-02-28 | 2006-09-07 | Sumitomo Bakelite Co Ltd | ダイシングシート機能付きダイアタッチフィルム及びそれを用いた半導体装置の製造方法及び半導体装置。 |
JP2008156539A (ja) * | 2006-12-26 | 2008-07-10 | Soken Chem & Eng Co Ltd | 近赤外線吸収フィルム用バインダー樹脂およびこれを利用する近赤外線吸収フィルター |
JP4661889B2 (ja) * | 2008-03-17 | 2011-03-30 | 住友ベークライト株式会社 | ダイシングシート機能付きダイアタッチフィルム及びそれを用いた半導体装置の製造方法 |
JP2010114433A (ja) * | 2008-10-07 | 2010-05-20 | Hitachi Chem Co Ltd | ダイボンディングフィルム及びこれを用いた半導体装置 |
JP2011198914A (ja) * | 2010-03-18 | 2011-10-06 | Lintec Corp | 半導体用接着剤組成物、半導体用接着シートおよび半導体装置の製造方法 |
JP5804820B2 (ja) | 2011-07-25 | 2015-11-04 | 日東電工株式会社 | 半導体装置製造用の接着シート、半導体装置製造用の接着シートを有する半導体装置、及び、半導体装置の製造方法 |
JP6001331B2 (ja) * | 2012-05-28 | 2016-10-05 | ヘンケルジャパン株式会社 | 積層シート用接着剤 |
JP6733394B2 (ja) * | 2016-07-25 | 2020-07-29 | 日立化成株式会社 | 接着シート、及び半導体装置の製造方法。 |
-
2019
- 2019-02-06 JP JP2019020033A patent/JP2020126982A/ja not_active Withdrawn
-
2020
- 2020-02-03 WO PCT/JP2020/003972 patent/WO2020162412A1/ja active Application Filing
- 2020-02-03 SG SG11202108155SA patent/SG11202108155SA/en unknown
- 2020-02-03 CN CN202080012681.7A patent/CN113474433A/zh active Pending
- 2020-02-03 KR KR1020217024989A patent/KR20210123319A/ko not_active Application Discontinuation
- 2020-02-04 TW TW109103343A patent/TW202045670A/zh unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1996031574A1 (fr) * | 1995-04-04 | 1996-10-10 | Hitachi Chemical Company, Ltd. | Adhesif, pellicule adhesive et feuille metallique a envers adhesif |
JP2011052109A (ja) * | 2009-09-01 | 2011-03-17 | Hitachi Chem Co Ltd | フィルム状接着剤、接着シート及び半導体装置 |
JP2011100927A (ja) * | 2009-11-09 | 2011-05-19 | Sony Chemical & Information Device Corp | 接着剤組成物 |
JP2014194031A (ja) * | 2014-05-22 | 2014-10-09 | Lintec Corp | 接着シートおよび半導体装置の製造方法 |
JP2018530905A (ja) * | 2015-09-23 | 2018-10-18 | エルジー・ケム・リミテッド | 接着フィルム、半導体装置の製造方法および半導体装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023182226A1 (ja) * | 2022-03-25 | 2023-09-28 | 株式会社レゾナック | 半導体用接着フィルム、ダイシング・ダイボンディング一体型フィルム、及び半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
TW202045670A (zh) | 2020-12-16 |
CN113474433A (zh) | 2021-10-01 |
KR20210123319A (ko) | 2021-10-13 |
WO2020162412A1 (ja) | 2020-08-13 |
SG11202108155SA (en) | 2021-08-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP3434398B1 (en) | Thermal bonding sheet, thermal bonding sheet with dicing tape, bonded body production method, and power semiconductor device | |
EP3358607A1 (en) | Thermal bonding sheet, and thermal bonding sheet with dicing tape | |
EP2200075A1 (en) | Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device | |
EP3477689B1 (en) | Heat bonding sheet, and heat bonding sheet with dicing tape | |
JP2024010048A (ja) | 半導体装置 | |
WO2020162412A1 (ja) | フィルム状接着剤、接着シート、及び半導体装置 | |
WO2020158490A1 (ja) | フィルム状接着剤、接着シート、並びに半導体装置及びその製造方法 | |
WO2020129996A1 (ja) | フィルム状接着剤、接着シート、並びに半導体装置及びその製造方法 | |
JP7255146B2 (ja) | フィルム状接着剤、接着シート、並びに半導体装置及びその製造方法 | |
WO2020065783A1 (ja) | フィルム状接着剤、接着シート、並びに半導体装置及びその製造方法 | |
KR102629864B1 (ko) | 필름상 접착제, 접착 시트, 및 반도체 장치와 그 제조 방법 | |
WO2022149581A1 (ja) | 接着剤組成物、フィルム状接着剤、ダイシング・ダイボンディング一体型フィルム、並びに半導体装置及びその製造方法 | |
WO2022149582A1 (ja) | フィルム状接着剤、ダイシング・ダイボンディング一体型フィルム、並びに半導体装置及びその製造方法 | |
JP2010001453A (ja) | 接着フィルム、接着シート、半導体装置及び半導体装置の製造方法 | |
JP2022044991A (ja) | ダイボンディングフィルム、接着シート、並びに半導体装置及びその製造方法 | |
JP2020128500A (ja) | 接着剤組成物、接着フィルム、接着シート、並びに半導体装置及びその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20220107 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20221025 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20221212 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230307 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20230905 |
|
A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20230908 |