JP2020123892A - マルチプレクサおよび通信装置 - Google Patents
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Abstract
Description
[1.マルチプレクサ1の回路構成]
図1は、実施の形態に係るマルチプレクサ1の回路構成図である。同図に示すように、マルチプレクサ1は、共通端子100、送信端子110および130と、受信端子120および140と、送信フィルタ10および30と、受信フィルタ20および40と、インダクタLmと、を備える。
図2は、実施の形態に係るマルチプレクサ1の断面構成図である。同図に示すように、マルチプレクサ1は、さらに、多層基板50および樹脂部材60を備える。
図3Aは、実施の形態に係るマルチプレクサ1の多層基板50の各層における導体パターンを示す図である。図3Bは、比較例に係るマルチプレクサの多層基板50の各層における導体パターンを示す図である。図2の断面構成図は、図3AのII−II線の断面図であり、図3Aには、図2に示された多層基板50の誘電体層51〜56のうち、誘電体層51〜54および56を第1主面側から平面視した場合の導体パターンのレイアウトが示されている。実施の形態に係るマルチプレクサ1と比較例に係るマルチプレクサとは、図1に示された同じ回路構成を有するが、インダクタLmを構成するコイルパターンの配置構成が異なる。
本実施の形態では、実施の形態1に係るマルチプレクサ1に対して、さらに、CAを実行する周波数帯域の組み合わせを選択するためのスイッチ回路が付加されたマルチプレクサ1A、および、マルチプレクサ1Aを含む通信装置6について示す。
以上、本発明に係るマルチプレクサおよび通信装置について、実施の形態1および2を挙げて説明したが、本発明は、上記実施の形態に限定されるものではない。上記実施の形態における任意の構成要素を組み合わせて実現される別の実施の形態や、上記実施の形態に対して本発明の主旨を逸脱しない範囲で当業者が思いつく各種変形を施して得られる変形例や、本発明に係るマルチプレクサおよび通信装置を内蔵した各種機器も本発明に含まれる。
2 アンテナ素子
3R 受信増幅回路
3T 送信増幅回路
4 RF信号処理回路(RFIC)
5 ベースバンド信号処理回路(BBIC)
6 通信装置
10、15、30 送信フィルタ
11、12、13、41、42、43 電極
16、35 送受信フィルタ
20、25、40 受信フィルタ
50 多層基板
51、52、53、54、55、56 誘電体層
60 樹脂部材
70 スイッチ回路
71、72、73、74 スイッチ
80 ダイプレクサ
100 共通端子
101 共通電極
110、130 送信端子
111、131 出力端子
120、140 受信端子
121、141 入力端子
150G グランド電極
L1、L2、Lm インダクタ
L22、L23、Lm3、Lm4 コイルパターン
p1、p2、p3 並列腕共振子
s1、s2、s3 直列腕共振子
t1、t2 並列腕端子
Claims (9)
- 共通端子、第1端子、および第2端子と、
前記共通端子と前記第1端子との間に配置され、第1周波数帯域を通過帯域とする第1フィルタと、
前記共通端子と前記第2端子との間に配置され、前記第1周波数帯域と異なる第2周波数帯域を通過帯域とする第2フィルタと、
前記共通端子に接続された第1インダクタと、
前記第1フィルタおよび前記第2フィルタを実装し、導体パターンが形成された複数の誘電体層の積層体で構成された多層基板と、を備え、
前記第1フィルタは、
前記共通端子と前記第1端子とを結ぶ第1経路と第1並列腕端子との間に接続された第1並列腕共振子と、
前記第1並列腕端子とグランドとの間に接続された第2インダクタと、を有し、
前記第1インダクタおよび前記第2インダクタの一方は、
前記複数の誘電体層のうちの第1誘電体層に形成された第1コイルパターンと、
前記第1誘電体層と異なる第2誘電体層に形成された第2コイルパターンと、を含み、
前記第1インダクタおよび前記第2インダクタの他方は、
前記第1誘電体層に形成され、前記第1コイルパターンと磁界結合する第3コイルパターンを含み、
前記第2コイルパターンのインダクタンス値は、前記第1コイルパターンのインダクタンス値よりも大きい、
マルチプレクサ。 - 前記第1インダクタは、
前記第1コイルパターンと、
前記第2コイルパターンと、を含み、
前記第2インダクタは、
前記第3コイルパターンを含む、
請求項1に記載のマルチプレクサ。 - 前記第2コイルパターンの巻き数は、前記第1コイルパターンの巻き数よりも多い、
請求項1または2に記載のマルチプレクサ。 - 前記第2コイルパターンの線幅は、前記第1コイルパターンの線幅よりも細い、
請求項1〜3のいずれか1項に記載のマルチプレクサ。 - 前記第2コイルパターンの最大巻き径は、前記第1コイルパターンの最大巻き径よりも大きい、
請求項1〜4のいずれか1項に記載のマルチプレクサ。 - 前記第1周波数帯域は、LTE(Long Term Evolution)のBand1に含まれ、
前記第2周波数帯域は、LTEのBand3に含まれ、
前記第1フィルタは、Band1の送信帯域を通過帯域とする送信フィルタであり、
前記第2フィルタは、Band3の受信帯域を通過帯域とする受信フィルタである、
請求項1〜5のいずれか1項に記載のマルチプレクサ。 - 前記第1周波数帯域は、LTEのBand25に含まれ、
前記第2周波数帯域は、LTEのBand66に含まれ、
前記第1フィルタは、Band25の送信帯域を通過帯域とする送信フィルタであり、
前記第2フィルタは、Band66の受信帯域を通過帯域とする受信フィルタである、
請求項1〜5のいずれか1項に記載のマルチプレクサ。 - さらに、
前記共通端子と、前記第1フィルタおよび前記第2フィルタとの間に配置され、前記共通端子と前記第1フィルタとの接続、および、前記共通端子と前記第2フィルタとの接続を同時に実行することが可能なスイッチ回路を備える、
請求項1〜7のいずれか1項に記載のマルチプレクサ。 - 請求項1〜8のいずれか1項に記載のマルチプレクサと、
前記第1端子および前記第2端子に接続された増幅回路と、
高周波信号を処理して前記増幅回路へ出力し、前記増幅回路から出力された高周波信号を処理するRF信号処理回路と、を備える
通信装置。
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JP2019015623A JP6919664B2 (ja) | 2019-01-31 | 2019-01-31 | マルチプレクサおよび通信装置 |
US16/739,172 US11528010B2 (en) | 2019-01-31 | 2020-01-10 | Multiplexer and communication apparatus |
CN202010056912.6A CN111510276B (zh) | 2019-01-31 | 2020-01-17 | 多工器以及通信装置 |
KR1020200009955A KR102318206B1 (ko) | 2019-01-31 | 2020-01-28 | 멀티플렉서 및 통신 장치 |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2015019722A1 (ja) * | 2013-08-06 | 2015-02-12 | 株式会社村田製作所 | 高周波モジュール |
JP2015033080A (ja) * | 2013-08-06 | 2015-02-16 | 株式会社村田製作所 | 高周波モジュール |
WO2016002737A1 (ja) * | 2014-07-01 | 2016-01-07 | 株式会社村田製作所 | 高周波モジュール |
WO2016060151A1 (ja) * | 2014-10-16 | 2016-04-21 | 株式会社村田製作所 | 高周波モジュール |
JP6020780B1 (ja) * | 2015-02-25 | 2016-11-02 | 株式会社村田製作所 | 高周波モジュール |
JP2019009583A (ja) * | 2017-06-23 | 2019-01-17 | 株式会社村田製作所 | マルチプレクサ、送信装置および受信装置 |
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---|---|---|---|---|
JP3972810B2 (ja) * | 2002-12-18 | 2007-09-05 | 株式会社村田製作所 | 分波器、および通信機 |
JP4120935B2 (ja) * | 2003-08-08 | 2008-07-16 | 日立金属株式会社 | 高周波モジュール及びこれを用いた通信機 |
JPWO2006137248A1 (ja) * | 2005-06-21 | 2009-01-08 | 株式会社村田製作所 | Saw分波器 |
JP2007060411A (ja) * | 2005-08-25 | 2007-03-08 | Fujitsu Media Device Kk | 分波器 |
JP4177389B2 (ja) * | 2006-05-18 | 2008-11-05 | 富士通メディアデバイス株式会社 | フィルタおよび分波器 |
JP5081742B2 (ja) * | 2007-06-29 | 2012-11-28 | 日本電波工業株式会社 | アンテナ分波器 |
US8237531B2 (en) * | 2007-12-31 | 2012-08-07 | Globalfoundries Singapore Pte. Ltd. | Tunable high quality factor inductor |
JP5099219B2 (ja) * | 2008-05-07 | 2012-12-19 | 株式会社村田製作所 | 弾性波フィルタ装置 |
US8760240B2 (en) * | 2010-09-15 | 2014-06-24 | Wilocity, Ltd. | Method for designing coupling-function based millimeter wave electrical elements |
US9621330B2 (en) * | 2011-11-30 | 2017-04-11 | Maxlinear Asia Singapore Private Limited | Split microwave backhaul transceiver architecture with coaxial interconnect |
US9143208B2 (en) * | 2012-07-18 | 2015-09-22 | Rf Micro Devices, Inc. | Radio front end having reduced diversity switch linearity requirement |
US9105395B2 (en) * | 2012-09-23 | 2015-08-11 | Dsp Group Ltd. | Envelope tracking signal generator incorporating trim cell |
US9172441B2 (en) * | 2013-02-08 | 2015-10-27 | Rf Micro Devices, Inc. | Front end circuitry for carrier aggregation configurations |
US9742359B2 (en) * | 2013-03-15 | 2017-08-22 | Qorvo International Pte. Ltd. | Power amplifier with wide dynamic range am feedback linearization scheme |
US9722639B2 (en) * | 2013-05-01 | 2017-08-01 | Qorvo Us, Inc. | Carrier aggregation arrangements for mobile devices |
US9225382B2 (en) * | 2013-05-20 | 2015-12-29 | Rf Micro Devices, Inc. | Tunable filter front end architecture for non-contiguous carrier aggregation |
JP5943158B1 (ja) * | 2014-08-12 | 2016-06-29 | 株式会社村田製作所 | 高周波モジュール |
US9602146B2 (en) * | 2014-10-24 | 2017-03-21 | Qorvo Us, Inc. | RF front end architecture |
US9548768B2 (en) * | 2015-02-09 | 2017-01-17 | Qorvo Us, Inc. | Radio frequency front end circuitry for carrier aggregation |
DE112016001482T5 (de) * | 2015-04-01 | 2017-12-28 | Murata Manufacturing Co., Ltd. | Duplexer |
US9735850B2 (en) * | 2015-06-17 | 2017-08-15 | Qorvo Us, Inc. | High linearity antenna swapping circuitry |
US9806773B2 (en) * | 2015-10-16 | 2017-10-31 | Qorvo Us, Inc. | Apparatus for a mulitple-input multiple-output (MIMO) architecture |
WO2017115579A1 (ja) * | 2015-12-28 | 2017-07-06 | 株式会社村田製作所 | マルチプレクサ |
DE102016102073A1 (de) * | 2016-02-05 | 2017-08-10 | Snaptrack, Inc. | Frontend-Modul für Carrier-Aggregation-Betrieb |
US9876513B2 (en) * | 2016-03-31 | 2018-01-23 | Qualcomm Incorporated | LC filter layer stacking by layer transfer to make 3D multiplexer structures |
JP6677296B2 (ja) * | 2016-06-24 | 2020-04-08 | 株式会社村田製作所 | 弾性波フィルタ装置 |
WO2018003378A1 (ja) * | 2016-06-27 | 2018-01-04 | 株式会社村田製作所 | フィルタ装置およびマルチプレクサ |
US10477550B2 (en) * | 2016-11-30 | 2019-11-12 | Skyworks Solutions, Inc. | Front-end modules for carrier aggregation |
DE102018102891A1 (de) * | 2017-02-13 | 2018-08-16 | Murata Manufacturing Co., Ltd. | Multiplexierer, Übertragungsvorrichtung und Empfangsvorrichtung |
US10319716B2 (en) * | 2017-05-05 | 2019-06-11 | Newport Fab, Llc | Substrate isolation for low-loss radio frequency (RF) circuits |
JP6798521B2 (ja) * | 2017-05-19 | 2020-12-09 | 株式会社村田製作所 | マルチプレクサ、高周波フロントエンド回路および通信装置 |
US10230418B2 (en) * | 2017-05-19 | 2019-03-12 | Murata Manufacturing Co., Ltd. | Multiplexer, high-frequency front end circuit, and communication device |
EP3665880A4 (en) * | 2017-08-10 | 2022-01-05 | Commscope Technologies LLC | METHODS AND DEVICES FOR DIGITAL PRE-DISTORTION |
US20200259481A1 (en) * | 2017-08-29 | 2020-08-13 | Kyocera Corporation | Filter device and communication apparatus |
US10432237B2 (en) * | 2017-10-20 | 2019-10-01 | Taiyo Yuden Co., Ltd. | Multiplexer |
US10979088B2 (en) * | 2017-12-15 | 2021-04-13 | Skyworks Solutions, Inc. | Front end architecture for selectively adding external carrier aggregation band |
JP6922845B2 (ja) * | 2018-05-23 | 2021-08-18 | 株式会社村田製作所 | マルチプレクサおよび通信装置 |
-
2019
- 2019-01-31 JP JP2019015623A patent/JP6919664B2/ja active Active
-
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- 2020-01-10 US US16/739,172 patent/US11528010B2/en active Active
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015019722A1 (ja) * | 2013-08-06 | 2015-02-12 | 株式会社村田製作所 | 高周波モジュール |
JP2015033080A (ja) * | 2013-08-06 | 2015-02-16 | 株式会社村田製作所 | 高周波モジュール |
WO2016002737A1 (ja) * | 2014-07-01 | 2016-01-07 | 株式会社村田製作所 | 高周波モジュール |
WO2016060151A1 (ja) * | 2014-10-16 | 2016-04-21 | 株式会社村田製作所 | 高周波モジュール |
JP6020780B1 (ja) * | 2015-02-25 | 2016-11-02 | 株式会社村田製作所 | 高周波モジュール |
JP2019009583A (ja) * | 2017-06-23 | 2019-01-17 | 株式会社村田製作所 | マルチプレクサ、送信装置および受信装置 |
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