JP2020119966A - Mounting device - Google Patents

Abstract

To provide a mounting device that acquires a clear and accurate image of a board recognition mark and a chip recognition mark, obtains accurate position information, and realizes highly accurate alignment in face-up mounting in which the electrode surface of a board and the electrode surface of a chip component face in the same direction.SOLUTION: A mounting device includes elevating and lowering means for elevating and lowering a mounting head in a direction perpendicular to a board S, and recognition mechanism that recognizes chip recognition marks AC1 and AC2 and board recognition marks AS1 and AS2 from the upper side of the mounting head through the mounting head and is movable in the in-plane direction of the board, and a chip holding portion that holds a chip component C by a component of the mounting head has a light-transmitting property, and through holes 41H and 42H for recognizing the chip recognition mark and the board recognition mark are provided.SELECTED DRAWING: Figure 2

Description

The present invention relates to a mounting device and a mounting method for mounting a chip component on a substrate. In particular, the present invention relates to a mounting apparatus and a mounting method for performing face-up mounting in which an electrode surface of a substrate and an electrode surface of a chip component face the same direction.

As a mounting form for mounting a chip component such as a semiconductor chip on a substrate such as a wiring substrate, face-down mounting in which the electrode face of the chip component is opposed to the electrode face of the substrate, and the electrode face of the substrate and the electrode face of the chip component are mounted. It is well known that there is a face-up implementation that implements in the same direction.

In any of the mounting forms, it is necessary to perform highly accurate alignment for mounting the chip component at a predetermined position on the substrate, and a recognition mark for alignment is attached to the chip component and the substrate. Here, the reason why the chip component is aligned with the predetermined position of the substrate is to mount the positional relationship between the electrode of the substrate and the electrode of the chip component with predetermined accuracy. In the chip component, the recognition mark position is generally arranged on the basis of the electrode position, and is generally attached to the electrode surface side where the relative position is clear.

Here, FIG. 4 shows an example of face-up mounting. In the chip component C, as shown in FIG. 4A, two chip recognition first marks AC1 and chip recognition second marks AC2 are arranged as chip component recognition marks (hereinafter referred to as chip recognition marks). Is common. (Diagonal arrangement in the example of FIG. 4) On the other hand, on the substrate S, two substrate recognition first marks AS1 and substrate recognition second marks AS2 are arranged as substrate recognition marks (hereinafter referred to as substrate recognition marks). It is generally done. (Diagonal arrangement in the example of FIG. 4) Therefore, in alignment, the positional relationship between the chip recognition first mark AC1 and the substrate recognition first mark AS1 and the chip recognition first mark AC2 and the substrate recognition second mark AS2 are arranged. A positional deviation amount (position and angle in the in-plane direction of the substrate) with respect to a predetermined mounting position is obtained from the positional relationship, and the relative position is corrected before mounting (FIG. 4B).

By the way, in both the face-down mounting and the face-up mounting, the chip component held from the upper side by the mounting head is pressure-bonded to the substrate for mounting. For this reason, in face-down mounting in which the electrodes of the substrate and the chip component are opposed to each other, a method of directly observing the substrate recognition mark and the chip recognition mark at the same time by using an upper and lower two-view camera is known. On the other hand, in face-up mounting in which the electrodes of the substrate and the chip component are mounted in the same direction, the electrode surface of the chip component is in close contact with the mounting head, so the issue of how to accurately grasp the position of the chip recognition mark is a problem. is there.

To solve this problem, for example, there is a method of using an upper and lower two-view camera shown in FIG. 5A, which has been conventionally used. In this method, as shown in FIG. 5B, the positional relationship between the position of the chip recognition first mark AC1 of the chip component C and the corner CC1 of the chip component C closest to the chip recognition first mark AC1 (ΔX1 and ΔY1) is obtained in advance in a separate process (the same applies to the positional relationship between the chip recognition second mark AC2 and the corner CC2 of the chip component C closest to AC2 (ΔX2, ΔY2)), and the board recognition first mark AS1 of the substrate S is obtained. After observing the corner CC1 of the chip component C and the second mark for recognizing the substrate and the corner CC2 of the chip component C with the upper and lower two-view camera, the previously calculated positional relationship between the chip recognition mark and the corner of the chip component is calculated. Is used to align the substrate S and the chip component C. With this method, although the upper and lower two-view camera can be used as in the face-down mounting, there are the following problems. (1) A separate device or process for grasping the positional relationship between the chip recognition mark and the corners of the chip part C is required, resulting in an increase in cost or a decrease in productivity. (2) The corners and edges of the chip component C are easily chipped, and generally, the corners are less accurately recognized than the recognition marks, so that the alignment accuracy is reduced.

Therefore, in order to directly observe and align the recognition mark of the chip component even in the face-up mounting, a device such as a transparent member such as glass is used in a portion of the mounting head for holding the chip component, and the arrangement is shown in FIG. Thus, a method has been proposed in which each recognition mark can be observed through the mounting head. (For example, Patent Documents 1 and 2)

International Publication No. 2003/041478 JP, 2017-208522, A

The high density, multi-electrode, and narrow pitch of semiconductor parts are progressing remarkably, and in the mounting device, alignment is performed with higher accuracy than before without a significant increase in cost or decrease in productivity. Required to be implemented.

In order to realize highly accurate alignment, it is necessary to obtain the position information by observing the chip recognition mark and the substrate recognition mark clearly and accurately in the alignment step. However, in the conventional method as shown in FIG. 6, the attachment tool 42 composed of the transparent member 42T and the heater portion 41 composed of the transparent member 41T are transmitted and recognized, so that the method is clear and accurate. Images may not be obtained. That is, when the transparent material 42T or 41T that constitutes the attachment tool 42 or the heater unit 41 has an optical defect or geometrical tolerance, image blurring, image distortion, positional deviation due to a difference in refractive index, and the like may occur. This is because it becomes difficult to obtain accurate position information. Here, the optical defects are minute voids, inclusion of impurities, deformation due to heating, and the like, and the geometrical tolerances are surface roughness, thickness dimension tolerance, parallelism, flatness, and the like.

As described above, in the method of observing and aligning the chip recognition mark and the board recognition mark through the mounting head by using the transparent member for the mounting head portion that holds the chip, it is possible to obtain a clear and accurate image. Therefore, the issue is whether to obtain highly accurate position information.

The present invention has been made in view of the above problems, in the face-up mounting in which the electrode surface of the substrate and the electrode surface of the chip component face the same direction, a clear and accurate image of the substrate recognition mark and the chip recognition mark, (EN) A mounting apparatus that obtains and obtains accurate position information and realizes highly accurate alignment.

In order to solve the above problems, the invention according to claim 1 is
A mounting device for mounting a chip component having a chip recognition mark for position alignment and a substrate having a substrate recognition mark for position alignment face-up with the chip recognition mark and the substrate recognition mark facing upward. ,
A substrate stage for holding the substrate,
A mounting head that holds the chip component and press-bonds it to the substrate,
An elevating means for elevating and lowering the mounting head in a direction perpendicular to the substrate,
From the upper side of the mounting head, over the mounting head, recognizing the chip recognition mark and the substrate recognition mark, and comprising a recognition mechanism movable in the in-plane direction of the substrate,
A mounting device in which a chip holding portion that holds the chip component by a component of the mounting head uses a material having light transparency and has a through hole for recognizing the chip recognition mark and the substrate recognition mark. I will provide a.

The invention described in claim 2 is the mounting apparatus according to claim 1,
The chip holding part for holding the chip is made of glass or ceramics, and provides a mounting device having a transmittance of visible light and infrared light of 50% or more in a thickness of 1 mm.

According to the present invention, in face-up mounting in which the electrode surface of the substrate and the electrode surface of the chip component face in the same direction, a clear and accurate image of the substrate recognition mark and the chip recognition mark can be obtained without increasing the cost or decreasing the productivity. It is possible to realize a mounting apparatus that acquires the position information, obtains accurate position information, and performs highly accurate positioning.

It is a figure which shows the external appearance of the mounting apparatus which concerns on embodiment of this invention. (b) It is a figure which shows the external appearance and the component which looked at the same mounting apparatus from another angle. In the mounting apparatus according to the embodiment of the present invention, it is a diagram for explaining the through holes for aligning the chip component and the substrate, (a) aligning the through holes of the heater part and the attachment tool with the positions of the individual recognition marks. (B) Through holes of the heater portion are provided so as to cover the entire specification dimension range, and the through holes of the attachment tool are provided in a shape including adjacent recognition marks. In the mounting apparatus according to the embodiment of the present invention, it is a diagram for explaining the through holes provided in the attachment tool, (a) an example in which the through holes are provided in accordance with the position of each recognition mark, (b) the through holes are close This is an example in which the recognition marks are included in a shape. FIGS. 4A and 4B are views for explaining face-up mounting, and FIG. 6A is a diagram showing a state where the chip component is separated from the substrate, and FIG. 6B is a diagram showing a state where the chip component is aligned and mounted on the substrate. (A) It is a figure which shows the example which uses the up-and-down two-view camera for the position alignment of face-up mounting, (b) It is a figure which shows the recognition mark of a chip component, and the distance of the corner|angular part of a chip component. It is a figure explaining a mode that a transparent member is permeate|transmitted and the individual recognition mark is imaged and acquired over the mounting head by the position alignment of the conventional face-up mounting.

An embodiment of the present invention will be described with reference to the drawings. FIG. 1A shows an appearance of a mounting apparatus 1 according to an embodiment of the present invention, and FIG. 1B is an appearance view seen from a different angle from FIG. 1A, and a configuration including a control system. The elements are also noted.

The mounting device 1 is a device for aligning the chip component C on the substrate S by face-up mounting. For alignment, the chip recognition first mark AC1, the chip recognition second mark AC2, and the substrate The board recognition first mark AS1 and the board recognition second mark AS2 marked S are used. Specifically, after the positional relationship between the chip recognition first mark AC1 and the substrate recognition first mark AS1 and the positional relationship between the chip recognition second mark AC2 and the substrate recognition second mark AS2 are corrected within the allowable range, the chip component is corrected. C is mounted on the substrate S.

The chip component C is generally mounted on the substrate S via a thermosetting adhesive. The thermosetting adhesive is usually provided on the side opposite to the electrode surface of the chip component C (the surface having the chip recognition mark), but it may be provided on the substrate S side.

The mounting apparatus 1 includes a substrate stage 2, a lifting/pressurizing unit 3, a mounting head 4, a recognition mechanism 5, and a controller 10.

The substrate stage 2 has a function of holding the substrate S and moving the substrate S in the in-plane direction (in the XY plane). Here, the vacuum suction method is suitable for holding the substrate S, but the invention is not limited to this and an electrostatic suction method may be adopted.

The lifting/pressurizing unit 3 has a function of moving the mounting head 4 in the vertical direction (Z direction) of the substrate S and a function of adjusting the pressure applied to the chip component C via the mounting head 4. It is desirable to have a function of adjusting the angle of the head 4 in the rotational direction about the Z direction.

The mounting head 4 holds the chip component C and press-bonds it to the substrate S. The mounting head 4 includes a head body 40, a heater unit 41, and an attachment tool 42 as constituent elements. The head main body 40 is connected to the lifting/pressurizing unit 3, and the heater unit 41 is held and arranged on the lower side. The heater section 41 has a heat generating function, and heats the chip component C via the attachment tool 42. Further, the heater unit 41 has a function of sucking and holding the attachment tool 42 by using a depressurized flow path (not shown). The attachment tool 42 is a chip holding part that sucks and holds the chip component C. A tool suitable for the shape of the chip component C is selected and sucked and held by the heater part 41.

In the present invention, the board recognition mark and the chip recognition mark are observed through the mounting head 4. Therefore, the mounting head 4 needs a space into which the image capturing unit 50 for observing the board recognition mark and the chip recognition mark can enter. In the present embodiment, a head space 40V is provided as shown in FIG. There is. That is, in the mounting apparatus 1 of FIG. 1, the head body 40 has a structure including a heater portion, side plates, and a top plate.

Further, the heater portion 41 is provided with a through hole 41H through which the substrate recognition mark and the chip recognition mark can be observed. Here, the through hole 41H may be provided at the position of each of the substrate recognition mark and the chip recognition mark as shown in FIG. 2A, but since it does not need to be replaced depending on the shape of the chip component, As in b), it is desirable that the hole shape is such that the dimensional specification range of the chip part C can be fully covered.

In the mounting head 4, the attachment tool 42 that holds the chip is also provided with a through hole 42H through which the substrate recognition mark and the chip recognition mark can be observed, like the heater unit 41. The through-hole 42H may be provided so as to match the positions of the individual substrate recognition marks and the chip recognition marks as shown in FIG. 2A, but the adjacent substrate recognition marks and chip recognition marks as shown in FIG. 2B. It may be a hole shape including both of the above. 3A is an example of the attachment tool 42 in which a through hole 42HS aligned with the position of the board recognition mark and a through hole 42HC aligned with the position of the chip recognition mark are separately provided, and FIG. It is an example of the attachment 42 in which a through hole 42H is provided in a shape including a mark and a chip recognition mark.

Here, it is desirable that the attachment tool 42 and the heater portion 41 have light transmissivity. If the attachment tool 42 and the heater unit 41 do not transmit light, the chip recognition first mark AC1 and the chip recognition second mark AC2, the substrate recognition first mark AS1, the substrate recognition second mark in the state of FIG. Since the AS2 images only the light through the through holes 42H and the through holes 41H, it is difficult to obtain a sufficient amount of light and it is difficult to obtain a clear image. As a result, the positioning accuracy is adversely affected. Exert. On the other hand, if the attachment tool 42 and the heater unit 41 have light transmissive properties, in addition to the light passing through the through hole 42H and the through hole 41H, the light also passes through the through hole 42H and the periphery of the through hole 41H. Therefore, it is possible to obtain a sufficient amount of light for obtaining a clear image.
Furthermore, since the image does not pass through the transparent member and passes through the through hole 41H of the heater portion 41 and the through hole 42H of the attachment tool 42, there is no adverse effect such as optical defects and geometrical tolerance of the transparent member. And it becomes possible to obtain an accurate image.

By the way, the light transmittance of the attachment tool 42 and the heater portion 41 does not mean the transparency required in the conventional example shown in FIG. Even if it exists, it may be one that transmits the brightness of light. Therefore, the material is not limited to glass or quartz, but may be ceramics having light transmittance. However, in order to transmit a quantity of light suitable for clearly and accurately capturing the chip recognition mark and the board recognition mark, a material having a visible light and infrared light transmittance of 50% or more at a thickness of 1 mm is desirable, and 80%. The above is more preferable.

The recognition mechanism 5 is used for recognizing the positions of the board recognition mark and the chip recognition mark through the attachment tool 42 and the heater unit 41 and over the mounting head 4 to acquire position information. In the present embodiment, the recognition mechanism 5 includes the image capturing unit 50, the optical system 52, and the image pickup unit 53 connected to the optical system 52 as constituent elements. Here, the image capturing unit 50 is arranged above the recognition target acquired by the imaging unit 53, and stores the recognition target within the visual field. The image capturing unit 50 has a function of changing the direction of the optical path by the reflection means 510, and the optical system 52 has an optical lens and has a function of enlarging an image to obtain high resolution. ing.

The recognition mechanism 5 is configured to be movable in the in-plane direction of the substrate S (and the chip component C) within the head space 40V by a drive mechanism (not shown). Further, it is desirable that the substrate S can be moved in the vertical direction (Z direction) so that the focus position can be adjusted.

The mounting head 4 is configured to be independently movable in the vertical direction with respect to the substrate S, and the recognition mechanism 5 that has entered the head space 40V does not interfere even if the mounting head 4 moves in the vertical direction. Therefore, the head space 40V is designed.

The control unit 10 controls the operation of the mounting apparatus 1, and is connected to the mounting stage 2, the lifting/pressurizing unit 3, the mounting head 4, and the recognition mechanism 5.

The control unit 10 is essentially composed of a CPU and a storage device as main constituent elements, and is connected to each device through an interface as necessary, and by incorporating a program, the acquired data is used to perform an operation. It is also possible to carry out and output according to the calculation result.

The control unit 10 is connected to the mounting stage 2 and has a function of controlling holding and releasing of the substrate S by the mounting stage 2 and controlling in-plane movement of the substrate S.

The control unit 10 is connected to the lifting/pressurizing unit 3 and has a function of driving the mounting head 4 in a direction perpendicular to the substrate S (Z direction) and in a rotational direction about the Z direction, and controlling a pressing force. doing.

The control unit 10 is connected to the mounting head 4 and has a function of suction-holding and releasing the chip component C by the attachment tool 42 and controlling a heating temperature of the heater unit 41.

The control unit 10 is connected to the recognition mechanism 5 and controls the drive of the substrate S (and the chip component C) in the in-plane direction and the drive in the direction perpendicular to the substrate S (Z direction), and also controls the imaging unit 53. It has a function of acquiring image data. Further, the control unit 10 has an image processing function, and has a function of obtaining the position of the recognition mark in the image acquired by the imaging unit 53.

In the mounting apparatus 1 having the above-described configuration, a clear and accurate image of the chip recognition mark and the board recognition mark is acquired when the chip component C and the board S are aligned with each other without increasing the cost and decreasing the productivity. However, since accurate position information of each recognition mark can be obtained, it is possible to realize a mounting apparatus that performs highly accurate positioning.

DESCRIPTION OF SYMBOLS 1 Mounting device 2 Substrate stage 3 Lifting/pressurizing unit 4 Mounting head 5 Recognition mechanism 10 Control part 40 Head body 40V Head space 41 Heater part 41H Through hole (heater part)
41T Transparent member (heater part)
42 Attachment Tool 42H Through Hole (Attachment Tool)
42T transparent member (attachment tool)
50 Image Capture Unit 52 Optical System 53 Imaging Device 510 Reflecting Device C Chip Component S Substrate AC1, AC2 Chip Recognition Mark AS1, AS2 Substrate Recognition Mark

Claims (2)

A mounting device for mounting a chip component having a chip recognition mark for position alignment and a substrate having a substrate recognition mark for position alignment face-up with the chip recognition mark and the substrate recognition mark facing upward. ,
A substrate stage for holding the substrate,
A mounting head that holds the chip component and press-bonds it to the substrate,
An elevating means for elevating and lowering the mounting head in a direction perpendicular to the substrate,
From the upper side of the mounting head, over the mounting head, recognizing the chip recognition mark and the substrate recognition mark, and comprising a recognition mechanism movable in the in-plane direction of the substrate,
A mounting device in which a chip holding portion that holds the chip component by a component of the mounting head uses a material having light transparency and has a through hole for recognizing the chip recognition mark and the substrate recognition mark. .. The mounting apparatus according to claim 1, wherein
The chip holder for holding the chip is made of glass or ceramics, and the mounting apparatus has a visible light and infrared light transmittance of 50% or more in a thickness of 1 mm.