JP2020087943A - 挿抜機構及びブロック部材の交換方法 - Google Patents
挿抜機構及びブロック部材の交換方法 Download PDFInfo
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- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
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- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
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- G—PHYSICS
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- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
- H01R13/629—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances
- H01R13/631—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances for engagement only
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/26—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for engaging or disengaging the two parts of a coupling device
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
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- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Environmental & Geological Engineering (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
Description
図1は、検査装置を複数搭載した検査システムの構成例を示す斜視図である。検査システム10は、被検査体である半導体ウエハ(以下「ウエハ」という。)に形成された複数の被検査デバイス(DUT:Device Under Test)に電気信号を与えてデバイスの種々の電気特性を検査するシステムである。
次に、前述の中間接続部材40を構成するポゴフレーム41に対してポゴブロック42を挿抜する挿抜機構の一例について説明する。図7は、挿抜機構の一例を示す平面図である。図8は、図7の挿抜機構の断面図であり、図7における一点鎖線VIII−VIIIにおいて切断した断面図である。図9は、図7の挿抜機構の動作を説明するための図である。
31 テスタマザーボード
40 中間接続部材
41 ポゴフレーム
42 ポゴブロック
422 接続端子
424 ピン係止部
50 プローブカード
51 基部
100,200 挿抜機構
110,210 筐体
120,220 第1の係合部
121,221 第1の係合ピン
130,230 第2の係合部
131,231 第2の係合ピン
Claims (10)
- 複数の第1端子を有する第1部材と複数の第2端子を有する第2部材との間に設けられ、前記第1端子と前記第2端子とを電気的に接続する中間接続部材を構成するフレーム材に対して、前記第1端子と前記第2端子とを電気的に接続する複数の接続端子を有する一又は複数のブロック部材を挿抜する挿抜機構であって、
前記ブロック部材の第1の被係合部に係合可能であり、少なくとも前記第1の被係合部と係合する位置と係合しない位置との間で移動可能な第1の係合部と、
前記ブロック部材の第2の被係合部に係合可能であり、少なくとも前記第2の被係合部と係合する位置と係合しない位置との間で移動可能な第2の係合部と、
を有し、
前記第1の係合部及び前記第2の係合部がそれぞれ前記第1の被係合部及び第2の被係合部に係合することで前記ブロック部材を保持する、
挿抜機構。 - 前記第1の係合部及び前記第2の係合部は、互いに平行に直動する、
請求項1に記載の挿抜機構。 - 前記第1の係合部及び前記第2の係合部を水平方向に直動可能に支持する筐体を有する、
請求項1又は2に記載の挿抜機構。 - 前記第1の係合部は、前記第1の被係合部に係合可能な第1の係合ピンと、前記第1の係合ピンを前記筐体に対して直動させる第1のスライド部材と、前記第1のスライド部材を直動可能に支持する第1の支持部材と、を有し、
前記第2の係合部は、前記第2の被係合部に係合可能な第2の係合ピンと、前記第2の係合ピンを前記筐体に対して直動させる第2のスライド部材と、前記第2のスライド部材を直動可能に支持する第2の支持部材と、を有する、
請求項3に記載の挿抜機構。 - 前記第1の係合ピン及び前記第2の係合ピンは、それぞれ前記第1のスライド部材及び前記第2のスライド部材の下方へ延びて下端が前記第1の係合部及び前記第2の係合部の移動方向に屈曲する、
請求項4に記載の挿抜機構。 - 前記第1の係合ピン及び前記第2の係合ピンの下端は、前記筐体の下端よりも上方に位置する、
請求項5に記載の挿抜機構。 - 前記第1の係合ピン及び前記第2の係合ピンは、それぞれ第1のスライド部材及び第2のスライド部材に固定されている、
請求項4乃至6のいずれか一項に記載の挿抜機構。 - 前記第1の係合ピン及び前記第2の係合ピンは、それぞれ前記第1のスライド部材及び前記第2のスライド部材に対して水平方向に直動可能である、
請求項4乃至6のいずれか一項に記載の挿抜機構。 - 前記筐体は、前記フレーム材に設けられた位置決め穴に挿嵌可能な位置決めピンを有する、
請求項3乃至8のいずれか一項に記載の挿抜機構。 - 複数の第1端子を有する第1部材と複数の第2端子を有する第2部材との間に設けられ、前記第1端子と前記第2端子とを電気的に接続する中間接続部材を構成するフレーム材に対して、前記第1端子と前記第2端子とを電気的に接続する複数の接続端子を有するブロック部材を交換する方法であって、
前記ブロック部材の第1の被係合部に係合可能な第1の係合部を、前記第1の被係合部と係合しない位置から係合する位置に移動させる工程と、
前記ブロック部材の第2の被係合部に係合可能な第2の係合部を、前記第2の被係合部と係合しない位置から係合する位置に移動させる工程と、
前記第1の被係合部及び前記第2の被係合部にそれぞれ前記第1の係合部及び前記第2の係合部を係合させた状態で、前記ブロック部材を搬送する工程と、
を有するブロック部材の交換方法。
Priority Applications (4)
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JP2018214146A JP7076360B2 (ja) | 2018-11-14 | 2018-11-14 | 挿抜機構及びブロック部材の交換方法 |
KR1020190142321A KR102305873B1 (ko) | 2018-11-14 | 2019-11-08 | 삽발 기구 및 블록 부재의 교환 방법 |
US16/682,915 US11525859B2 (en) | 2018-11-14 | 2019-11-13 | Insertion/extraction mechanism and method for replacing block member |
CN201911111095.3A CN111257712B (zh) | 2018-11-14 | 2019-11-14 | 插拔机构以及块构件的更换方法 |
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JP2018214146A JP7076360B2 (ja) | 2018-11-14 | 2018-11-14 | 挿抜機構及びブロック部材の交換方法 |
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CN113675702B (zh) * | 2021-07-13 | 2024-02-20 | 北京无线电测量研究所 | 一种插拔机构 |
Citations (6)
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JPH05183026A (ja) * | 1991-12-26 | 1993-07-23 | Tokyo Electron Yamanashi Kk | プローブカード収納用ストッカ |
JPH0735777A (ja) * | 1993-05-19 | 1995-02-07 | Tokyo Electron Ltd | 検査装置および検査装置における接続方法 |
JPH11111791A (ja) * | 1997-10-01 | 1999-04-23 | Asia Electron Inc | プローバおよびウェーハ測定装置 |
JP2001124833A (ja) * | 1999-09-14 | 2001-05-11 | Advantest Corp | ピンブロック・ストラクチャ |
JP2014179379A (ja) * | 2013-03-13 | 2014-09-25 | Tokyo Electron Ltd | ウエハ検査装置及び該装置の整備方法 |
JP2016181601A (ja) * | 2015-03-24 | 2016-10-13 | 株式会社東京精密 | プローバ及びウエハチャック温度測定方法 |
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CN2728022Y (zh) * | 2004-04-30 | 2005-09-21 | 连展科技(深圳)有限公司 | 电连接器总成 |
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TWI359535B (en) * | 2008-12-30 | 2012-03-01 | King Yuan Electronics Co Ltd | Zif connectors and semiconductor testing device an |
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JP2015061021A (ja) | 2013-09-20 | 2015-03-30 | 東京エレクトロン株式会社 | ウエハ検査ユニット、テストヘッド及びウエハ検査装置 |
JP5967510B1 (ja) * | 2015-03-24 | 2016-08-10 | 株式会社東京精密 | プローバ |
CN105137323B (zh) * | 2015-08-14 | 2019-01-29 | 深圳创维-Rgb电子有限公司 | 一种pcb板自动测试装置及其测试方法 |
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CN107053138A (zh) | 2017-03-31 | 2017-08-18 | 苏州御北辰精工科技有限公司 | 一种用于液晶显示器插拔检测的机械手协同装置 |
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Publication number | Priority date | Publication date | Assignee | Title |
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JPH05183026A (ja) * | 1991-12-26 | 1993-07-23 | Tokyo Electron Yamanashi Kk | プローブカード収納用ストッカ |
JPH0735777A (ja) * | 1993-05-19 | 1995-02-07 | Tokyo Electron Ltd | 検査装置および検査装置における接続方法 |
JPH11111791A (ja) * | 1997-10-01 | 1999-04-23 | Asia Electron Inc | プローバおよびウェーハ測定装置 |
JP2001124833A (ja) * | 1999-09-14 | 2001-05-11 | Advantest Corp | ピンブロック・ストラクチャ |
JP2014179379A (ja) * | 2013-03-13 | 2014-09-25 | Tokyo Electron Ltd | ウエハ検査装置及び該装置の整備方法 |
JP2016181601A (ja) * | 2015-03-24 | 2016-10-13 | 株式会社東京精密 | プローバ及びウエハチャック温度測定方法 |
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KR20200056309A (ko) | 2020-05-22 |
CN111257712A (zh) | 2020-06-09 |
JP7076360B2 (ja) | 2022-05-27 |
US20200153189A1 (en) | 2020-05-14 |
CN111257712B (zh) | 2022-08-16 |
KR102305873B1 (ko) | 2021-09-27 |
US11525859B2 (en) | 2022-12-13 |
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