JP2020082204A - Grinding device - Google Patents

Grinding device Download PDF

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JP2020082204A
JP2020082204A JP2018214593A JP2018214593A JP2020082204A JP 2020082204 A JP2020082204 A JP 2020082204A JP 2018214593 A JP2018214593 A JP 2018214593A JP 2018214593 A JP2018214593 A JP 2018214593A JP 2020082204 A JP2020082204 A JP 2020082204A
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grinding
top plate
net
water
grinding wheel
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JP7202152B2 (en
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二郎 現王園
Jiro Genoen
二郎 現王園
大 齋藤
Masaru Saito
大 齋藤
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Disco Corp
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Disco Abrasive Systems Ltd
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Abstract

To provide a grinding device which prevents grinding dusts produced by grinding processing from attaching to a lateral plate or a top board of a processing chamber.SOLUTION: A grinding device 1 provided with a first processing chamber 30a in which a net N1 is arranged so as to be parallel to a lateral plate 37 at a predetermined interval from the lateral plate 37 is used. Thereby, upon rough grinding of a workpiece W, grinding water which passes through a grinding water path H from a grinding water supply means 80 and is supplied between a rough grinding grinding stone 201a and the workpiece W, when receiving a centrifugal force of the rotating rough grinding grinding stone 201a and being scattered in a direction of the lateral plate 37 together with grinding dusts produced by grinding, the grinding device receives the grinding water containing scattered grinding dusts with the net N1 to present the grinding dusts from attaching to the lateral plate 37.SELECTED DRAWING: Figure 2

Description

本発明は、被加工物を研削する研削装置に関する。 The present invention relates to a grinding device that grinds a workpiece.

研削装置では、研削砥石が環状に配設された研削ホイールをスピンドルに装着し、スピンドルをモータの駆動によって回転させ、回転する研削砥石と被加工物とを当接させることによって被加工物の研削が行われる。研削砥石と被加工物との当接は、研削装置に備えられた加工室の内部で行われる。研削時、研削砥石と被加工物との間に研削水が供給されるが、研削水の供給は、研削時に発生する研削加工熱を除去する目的や、同じく研削時に発生する研削屑を被加工物から除去する目的の下で行なわれている。 In a grinding device, a grinding wheel in which a grinding wheel is annularly arranged is mounted on a spindle, the spindle is rotated by driving a motor, and the rotating grinding wheel is brought into contact with the workpiece to grind the workpiece. Is done. The contact between the grinding wheel and the workpiece is performed inside a processing chamber provided in the grinding device. At the time of grinding, grinding water is supplied between the grinding wheel and the work piece, but the supply of grinding water is for the purpose of removing the grinding heat generated during grinding and also for processing the grinding dust generated during grinding. It is carried out for the purpose of removing from things.

研削中に研削砥石と被加工物との間に供給された研削水は、回転する研削砥石の遠心力によって研削屑とともに飛散し、加工室の内部の側板や天板等に付着する。加工室の側板や天板等に付着した研削屑を洗浄するため、研削加工終了後、研削砥石を被加工物から上方へと離間させながら、回転する研削砥石に研削水を供給して、加工室の天板等に付着した研削屑等を洗い流す(特許文献1及び特許文献2参照)。洗い流された研削屑を含んだ研削水は、研削廃液として研削装置の外部へと除去されることとなる。 The grinding water supplied between the grinding wheel and the workpiece during grinding scatters together with grinding dust due to the centrifugal force of the rotating grinding wheel, and adheres to the side plate, top plate, etc. inside the processing chamber. In order to clean the grinding dust adhering to the side plate and top plate of the processing chamber, after finishing the grinding process, while supplying the grinding water to the rotating grinding wheel while separating the grinding wheel upward from the work piece, The grinding dust and the like adhering to the top plate of the chamber is washed away (see Patent Documents 1 and 2). The grinding water containing the flushed grinding dust is removed to the outside of the grinding device as a grinding waste liquid.

特許第6353684号Patent No. 6353684 特許第6129022号Patent No. 6129022

研削屑が付着した加工室の側板や天板等の流水洗浄が不十分であると、時間の経過等により、側板や天板等に付着した加工廃液が乾燥して研削屑が固化する。例えば、研削ホイールの交換等のメンテナンス作業のために加工室の天板を開けた際、天板の振動等により、加工室の天板で固化した研削屑が粉塵となり研削装置の内外へと飛散し、研削装置がクリーンルームを汚染させる汚染源となる。また、天板の隙間や、天板を開閉させる丁番の隙間等に入り込んだ加工廃液が乾燥して固化した研削屑によって天板が開かなくなり、装置の故障や加工作業の効率の低下等を招く。本発明が解決しようとする課題は、研削時に回転する研削砥石の遠心力によって飛散した研削屑を含んだ研削水が、加工室内の側板や天板等に付着しないようにすることである。 If the side plates or the top plate of the processing chamber to which the grinding dust adheres is insufficiently washed with running water, the processing waste liquid adhering to the side plate or the top plate will dry and the grinding chips will solidify over time. For example, when the top plate of the processing chamber is opened for maintenance work such as exchanging the grinding wheel, the vibration of the top plate causes the grinding dust solidified on the top plate of the processing chamber to become dust and scatter inside and outside the grinding machine. However, the grinding device becomes a pollution source that pollutes the clean room. In addition, the top plate cannot be opened due to the grinding waste solidified by the processing waste liquid that has entered the gaps between the top plate and the hinges that open and close the top plate, which may cause equipment failure and reduced processing efficiency. Invite. The problem to be solved by the present invention is to prevent the grinding water containing the grinding dust scattered by the centrifugal force of the grinding wheel rotating during grinding from adhering to the side plate, the top plate or the like in the processing chamber.

本発明は、被加工物を保持する保持手段と、環状に研削砥石が配設された研削ホイールをスピンドルに装着して該研削砥石を回転させることで該保持手段が保持した被加工物を研削する研削手段と、該研削手段を該保持手段に対し垂直な方向に接近及び離間させる研削送り手段と、該研削砥石に研削水を供給する研削水供給手段と、該保持手段が保持した被加工物と該研削砥石とを収容する加工室と、を備えた研削装置であって、該加工室は、該保持手段を下方から囲む底板と、該底板に対峙し該研削ホイールを上方から囲む天板と、該保持手段と該研削手段とを側方から囲み該底板と該天板とを連結する側板と、該側板の内面の内側に該側板に対して所定の隙間を開けて配設され該研削砥石の高速回転による遠心力を受けた研削水を受け止めるネットと、を備え、該研削砥石が被加工物を研削しているときは、研削屑が含まれた状態で飛散する研削水を該ネットで受け止め排水に導き、該研削砥石が被加工物から離間しているときは、該研削砥石に供給され研削屑が含まれない状態で飛散する研削水で該ネットを洗浄する、研削装置である。 The present invention grounds a workpiece held by the holding means by holding a holding means for holding the workpiece and a grinding wheel in which a grinding wheel is annularly arranged on a spindle and rotating the grinding wheel. Grinding means, a grinding feed means for moving the grinding means toward and away from the holding means in a direction perpendicular to the holding means, a grinding water supply means for supplying grinding water to the grinding wheel, and a workpiece held by the holding means. What is claimed is: 1. A grinding apparatus, comprising: a processing chamber that accommodates an object and the grinding wheel; the processing chamber includes a bottom plate that surrounds the holding means from below, and a ceiling that faces the bottom plate and surrounds the grinding wheel from above. A side plate that surrounds the plate, the holding means and the grinding means from the side and connects the bottom plate and the top plate, and is provided inside the inner surface of the side plate with a predetermined gap from the side plate. A net for receiving the grinding water that has received the centrifugal force due to the high-speed rotation of the grinding wheel, and when the grinding wheel is grinding an object to be processed, the grinding water that scatters in the state that the grinding chips are included is scattered. A grinding device that receives the wastewater with the net and guides it to drainage, and when the grinding wheel is separated from the workpiece, cleans the net with grinding water that is supplied to the grinding wheel and scatters without containing grinding debris. Is.

上記の研削装置においては、該天板の下側に所定の隙間をあけて配設され研削水を受け止める天板ネットを備えることが望ましい。 In the above grinding apparatus, it is desirable to include a top plate net which is arranged below the top plate with a predetermined gap therebetween and receives grinding water.

上記の研削装置においては、該天板の下側に該天板に対して所定の隙間をあけて配設され該研削手段を囲む第2の天板を備え、該第2の天板から該ネットを垂下させて配設し、該第2の天板で該ネットに研削水を導くことが望ましい。 In the above grinding apparatus, a second top plate is provided below the top plate with a predetermined gap from the top plate and surrounds the grinding means. It is desirable to arrange the net so as to hang down and guide the grinding water to the net by the second top plate.

本発明では、飛散した研削水を、加工室の側板の内面の内側に備えたネットで受け止めることによって、研削屑を含んだ研削水が側板等に当たって飛散し加工室内の天板等の壁面に付着するのを防ぐことができる。また、ネットに付着させた研削屑を、研削屑を含まない研削水によって洗い流すことで、側板等に付着した研削屑を洗い流すよりも容易に洗浄することができる。 In the present invention, the scattered grinding water is received by the net provided inside the inner surface of the side plate of the processing chamber, so that the grinding water containing grinding dust hits the side plate and is scattered to adhere to the wall surface of the top plate or the like in the processing chamber. Can be prevented. In addition, by flushing the grinding dust attached to the net with the grinding water that does not contain the grinding dust, it is possible to wash the grinding dust more easily than washing the grinding dust attached to the side plate and the like.

さらに、加工室の天板の下側に該天板に対して所定の間隔をあけて天板ネットを配設することにより、天板に研削屑が付着するのをより確実に防ぐことができる。 Further, by disposing the top net under the top of the processing chamber at a predetermined distance from the top, it is possible to more reliably prevent grinding dust from adhering to the top. ..

そして、天板の下側に所定の間隔をあけて研削手段を囲む第2の天板を配設し、第2の天板からネットを垂下させて配設することで、第2の天板で研削水を受け止めて天板に研削水が付着するのを防止し、受け止めた研削水をネットに導くことができる。 Then, a second top plate surrounding the grinding means is arranged below the top plate at a predetermined interval, and a net is hung from the second top plate to arrange the second top plate. It is possible to receive the grinding water, prevent the grinding water from adhering to the top plate, and guide the received grinding water to the net.

研削装置の全体を表す斜視図である。It is a perspective view showing the whole grinding device. 研削時の加工室を表す断面図である。It is a sectional view showing a processing chamber at the time of grinding. ネット洗浄時の加工室を表す断面図である。It is a sectional view showing a processing room at the time of net cleaning. 加工室の天板の下方に天板ネットを備えた加工室を表す断面図である。It is sectional drawing showing the processing chamber provided with the top plate net under the top plate of a processing chamber. 加工室の天板の下方に第2の天板を備え、第2の天板にネットが配設されている加工室を表す断面図である。FIG. 6 is a cross-sectional view showing a processing chamber in which a second top plate is provided below the top plate of the processing chamber, and a net is arranged on the second top plate.

1 研削装置の構成
図1に示す研削装置1は、例えば、半導体ウェーハ等の被加工物Wを研削する加工装置である。研削装置1は、ベース2とコラム3とを備えており、ベース2は、X軸方向に延設され、コラム3はベース2の上の−X側に立設されている。
1 Configuration of Grinding Device The grinding device 1 shown in FIG. 1 is, for example, a processing device that grinds a workpiece W such as a semiconductor wafer. The grinding device 1 includes a base 2 and a column 3, the base 2 is extended in the X-axis direction, and the column 3 is erected on the −X side above the base 2.

研削装置1のベース2の上の前方(+X側)には搬入出手段40が配設されている。搬入出手段40の近傍には、研削加工前の被加工物Wが収納されている第1のカセット41と、研削加工された被加工物Wを収納する第2のカセット46とを備えている。研削加工される前の被加工物Wは、搬入出手段40によって第1のカセット41から引き出され、また、研削加工された後に洗浄された被加工物Wは、搬入出手段40によって第2のカセット46へと収納させられることとなる。 A loading/unloading means 40 is disposed on the front side (+X side) of the base 2 of the grinding device 1. In the vicinity of the carry-in/out means 40, there are provided a first cassette 41 in which the workpiece W before grinding is stored and a second cassette 46 in which the workpiece W after grinding is stored. .. The workpiece W before being ground is pulled out from the first cassette 41 by the loading/unloading means 40, and the workpiece W that has been cleaned after being ground is loaded into the second cassette 41 by the loading/unloading means 40. It will be stored in the cassette 46.

搬入出手段40の近傍には、位置合わせ手段43が備えられている。位置合わせ手段43は、被加工物Wを載置する仮置き領域430と位置合わせピン431とを備え、仮置き領域430の上に載置された被加工物Wは、複数の位置合わせピン431によって適切に位置合わせされた後、仮置き領域430からローディング手段44によって保持され、研削加工のための領域へと移動させる。 A positioning unit 43 is provided near the loading/unloading unit 40. The alignment means 43 includes a temporary placement area 430 on which the workpiece W is placed and an alignment pin 431. The workpiece W placed on the temporary placement area 430 has a plurality of alignment pins 431. After being properly aligned by, the temporary placement area 430 is held by the loading means 44 and moved to an area for grinding.

研削装置1のベース2の上の後方(−X側)には、略円板形状のターンテーブル103を備えており、ターンテーブル103は、複数の保持手段100を回転可能に支持している。ターンテーブル103は、Z軸方向の回転軸105を軸に自転可能となっており、ターンテーブル103が回転することで保持手段100を公転させ、保持手段を粗研削領域、仕上げ研削領域、搬入出領域に位置づけることができる。 A rear side (−X side) of the base 2 of the grinding apparatus 1 is provided with a substantially disc-shaped turntable 103, and the turntable 103 rotatably supports a plurality of holding means 100. The turntable 103 is rotatable about a rotary shaft 105 in the Z-axis direction. When the turntable 103 is rotated, the holding means 100 is revolved, and the holding means is moved to a rough grinding area, a finish grinding area, and carrying in/out. Can be located in the area.

保持手段100は、吸引部101と吸引部101を囲繞する枠体102とが備わっている。保持手段100は、吸引部101の保持面101aを図示しない吸引源に連通させ保持面101aで被加工物Wを吸引保持する。保持手段100は、図示しない回転手段によってZ軸方向の回転軸104を軸として自転することができる。 The holding unit 100 includes a suction unit 101 and a frame body 102 surrounding the suction unit 101. The holding unit 100 causes the holding surface 101a of the suction unit 101 to communicate with a suction source (not shown) and sucks and holds the workpiece W by the holding surface 101a. The holding means 100 can rotate about a Z-axis rotating shaft 104 as an axis by a rotating means (not shown).

研削装置1のベース2の後方(−X側)には、粗研削のための第1研削手段20aが配設されている。第1研削手段20aに備えられた研削ホイール200の下端には、図2に示す粗研削砥石201aが環状に配設されている。さらに第1研削手段20aには、モータ21と、モータ21の駆動により回転するスピンドル22と、スピンドル22に取り付けられたマウント24とが備えられている。マウント24に研削ホイール200を装着しており、モータ21が駆動されてスピンドル22が回転することにより、研削ホイール200を回転させる事ができる。 Behind the base 2 (-X side) of the grinding device 1 is provided a first grinding means 20a for rough grinding. At the lower end of the grinding wheel 200 provided in the first grinding means 20a, a rough grinding wheel 201a shown in FIG. 2 is annularly arranged. Further, the first grinding means 20a is provided with a motor 21, a spindle 22 that is rotated by the drive of the motor 21, and a mount 24 attached to the spindle 22. The grinding wheel 200 is mounted on the mount 24, and the motor 21 is driven to rotate the spindle 22 so that the grinding wheel 200 can be rotated.

図1に示すように、研削装置1のベース2の後方(−X側)には、仕上げ研削のための第2研削手段20bが配設されている。第2研削手段20bが備える研削ホイール200の下端には、図2に示す略直方体形状の仕上げ研削砥石201bが固着されている。第2研削手段20bの構成は、研削ホイール200の下端に備える研削砥石の種類を除いて第1研削手段20aと同様であり、同様に構成される部分に関しては共通の符号を付し、その説明を省略する。図1においては、第2研削手段20bは第1研削手段20aの左隣に配設されているが、第1研削手段20aと第2研削手段20bとは、図1に示されている位置関係に限定されるものではなく、例えば、第1研削手段20aと第2研削手段20bとに備えられたそれぞれの研削ホイール200を入れ替えることで、第1研削手段20aと第2研削手段20bとの位置を入れ替えることもできる。 As shown in FIG. 1, a second grinding means 20b for finish grinding is arranged behind (on the -X side) the base 2 of the grinding device 1. A substantially rectangular parallelepiped finish grinding wheel 201b shown in FIG. 2 is fixed to the lower end of the grinding wheel 200 included in the second grinding means 20b. The configuration of the second grinding means 20b is the same as that of the first grinding means 20a except for the type of grinding wheel provided at the lower end of the grinding wheel 200, and the same components are denoted by common reference numerals and the description thereof is omitted. Is omitted. In FIG. 1, the second grinding means 20b is arranged to the left of the first grinding means 20a, but the first grinding means 20a and the second grinding means 20b are in the positional relationship shown in FIG. However, the positions of the first grinding means 20a and the second grinding means 20b are not limited to the above, but the positions of the first grinding means 20a and the second grinding means 20b are changed by replacing the respective grinding wheels 200 provided in the first grinding means 20a and the second grinding means 20b. Can be replaced.

図1に示すように、研削装置1は、二つの研削送り手段60を備える。二つの研削送り手段60は、それぞれコラム3の側面に並設されている。研削送り手段60は、それぞれ、Z軸方向の軸心を有するボールネジ63と、ボールネジ63と平行に配設された一対のガイドレール64と、ボールネジ63の上端に連結されたモータ61と、ガイドレール64に摺接するとともに内部のナット構造がボールネジ63に螺合する昇降板65と、昇降板65に連結されたホルダ66とを備える。二つの研削送り手段60がそれぞれ備えるホルダ66は、それぞれ、第1研削手段20aと第2研削手段20bとを支持しており、二つの研削送り手段60は、それぞれ第1研削手段20aと第2研削手段20bとを被加工物Wに接近及び離間させることができる。 As shown in FIG. 1, the grinding device 1 includes two grinding feed means 60. The two grinding feed means 60 are arranged in parallel on the side surface of the column 3, respectively. The grinding feed means 60 includes a ball screw 63 having an axis in the Z-axis direction, a pair of guide rails 64 arranged in parallel with the ball screw 63, a motor 61 connected to the upper end of the ball screw 63, and a guide rail. An elevating plate 65, which is in sliding contact with 64 and has an internal nut structure screwed into the ball screw 63, and a holder 66 connected to the elevating plate 65. The holders 66 included in the two grinding feed means 60 respectively support the first grinding means 20a and the second grinding means 20b, and the two grinding feed means 60 respectively include the first grinding means 20a and the second grinding means 20a. The grinding means 20b can be moved toward and away from the workpiece W.

例えば、第1研削手段20aを研削送りする研削送り手段60は、モータ61がボールネジ63を回転させることにより、昇降板65及びホルダ66がガイドレール64に案内されて昇降し、そして、昇降板65及びホルダ66が昇降することにより、ホルダ66によって支持された第1研削手段20aも昇降することで第1研削手段20aが保持手段100に対して接近及び離反する構成となっている。 For example, in the grinding feed unit 60 that feeds the first grinding unit 20a by grinding, the motor 61 rotates the ball screw 63, and the lift plate 65 and the holder 66 are guided by the guide rails 64 to move up and down, and then the lift plate 65. Also, as the holder 66 moves up and down, the first grinding means 20a supported by the holder 66 also moves up and down, so that the first grinding means 20a moves toward and away from the holding means 100.

なお、第2研削手段20bを研削送りする研削送り手段60についても同様の構成となっている。 The grinding feed means 60 for feeding the second grinding means 20b by grinding has the same structure.

研削装置1のベース2の前方(+X側)には、洗浄手段90が配設されている。研削加工が施された被加工物Wは、アンローディング手段45によって保持されて、保持手段100の上から洗浄領域900に移動させられ、洗浄手段90によって洗浄させられる。 A cleaning unit 90 is disposed in front of the base 2 of the grinding device 1 (on the +X side). The workpiece W that has undergone the grinding process is held by the unloading means 45, moved from the holding means 100 to the cleaning region 900, and cleaned by the cleaning means 90.

研削装置1は、制御手段70を備えている。制御手段70は研削加工の各工程において装置機構を制御する役割を担う。 The grinding device 1 includes a control unit 70. The control means 70 has a role of controlling the device mechanism in each step of the grinding process.

研削装置1のベース2の後方(−X側)には、第1加工室30aと第2加工室30bとが配設されている。第1加工室30aは、粗研削時に第1研削手段20aと被加工物Wとを当接させて粗研削を行うための領域であり、同様に、第2加工室30bは、仕上げ研削時に第2研削手段20bと被加工物Wとを当接させて仕上げ研削を行うための領域である。第1加工室30aと第2加工室30bとは、仕切り板32によって区切られている。仕切り板32の下方には、ターンテーブル103の回転によって、保持手段100及び保持手段100に保持された被加工物Wを第1加工室30aから第2加工室30bへと通過させるための隙間があいている。 A first processing chamber 30a and a second processing chamber 30b are provided behind (on the -X side of) the base 2 of the grinding device 1. The first processing chamber 30a is a region for performing the rough grinding by bringing the first grinding means 20a and the workpiece W into contact with each other at the time of rough grinding, and similarly, the second processing chamber 30b is provided at the time of finish grinding. 2 This is an area for finishing grinding by bringing the grinding means 20b and the workpiece W into contact with each other. The first processing chamber 30a and the second processing chamber 30b are separated by a partition plate 32. Below the partition plate 32, there is a gap for passing the holding means 100 and the workpiece W held by the holding means 100 from the first processing chamber 30a to the second processing chamber 30b by the rotation of the turntable 103. I am open.

図2に示す第1加工室30aは、保持手段10を下方から囲む底板38を備えている。研削水や粗研削によって生じた研削屑等を含んだ研削廃液は、底板38に備えられた傾斜によって底板38から排水口39まで導かれ、排水口39から研削装置1の外部へと流れ出ていく。 The first processing chamber 30a shown in FIG. 2 includes a bottom plate 38 that surrounds the holding means 10 from below. A grinding waste liquid containing grinding water and grinding dust generated by rough grinding is guided from the bottom plate 38 to the drain port 39 by the inclination provided on the bottom plate 38, and flows out of the grinding device 1 from the drain port 39. ..

さらに、第1加工室30aは、底板38に対峙し第1研削手段20aを上方から囲む天板33を備えており、天板33は開閉部330と固定部331とを備えている。固定部331は、蛇腹36を介してホルダ66と接続されており、また、開閉部330は、丁番35によって側板37と連結されている。側板37は、保持手段10や第1研削手段20aを側方から囲み底板38と天板33とを連結している。 Further, the first processing chamber 30a includes a top plate 33 that faces the bottom plate 38 and surrounds the first grinding means 20a from above, and the top plate 33 includes an opening/closing part 330 and a fixing part 331. The fixing portion 331 is connected to the holder 66 via the bellows 36, and the opening/closing portion 330 is connected to the side plate 37 by the hinge 35. The side plate 37 surrounds the holding means 10 and the first grinding means 20a from the side, and connects the bottom plate 38 and the top plate 33.

例えば、第1加工室30aの内部のメンテナンス等を行う際、例えば、オペレータ等が天板33の開閉部330に取り付けられた取手332を握持して引き上げることで、天板33の開閉部330が丁番35を軸にして回転しながら持ち上がり、第1加工室30aの上面を解放できる。 For example, when performing maintenance or the like inside the first processing chamber 30a, for example, an operator or the like holds and pulls up the handle 332 attached to the opening/closing portion 330 of the top plate 33, so that the opening/closing portion 330 of the top plate 33. Lifts while rotating around the hinge 35, and the upper surface of the first processing chamber 30a can be released.

第1加工室30aの内部には、側板37から所定の間隔をあけて、側板37に対して平行になるようにネットN1が配設されている。ネットN1は、高速回転する粗研削砥石201aの遠心力を受けて側板37の方向に飛散した研削水を受け止めることができる。受け止められた研削水は底板38に流れ落ち、底板38の傾斜によって排水口39まで導かれて、排水口39から研削装置1の外部へと流れ出ていく。 Inside the first processing chamber 30a, a net N1 is arranged so as to be parallel to the side plate 37 at a predetermined distance from the side plate 37. The net N1 can receive the grinding water scattered in the direction of the side plate 37 by receiving the centrifugal force of the rough grinding wheel 201a rotating at a high speed. The received grinding water flows down to the bottom plate 38, is guided to the drain port 39 by the inclination of the bottom plate 38, and flows out of the grinding device 1 from the drain port 39.

第2加工室30bについても、上記の第1加工室30aの構成と同様であるため、共通の符号を付し、その説明を省略する。 The second processing chamber 30b also has the same configuration as the first processing chamber 30a described above, and thus is denoted by the same reference numeral and description thereof will be omitted.

研削装置1は、二つの研削水供給手段80を備える。二つの研削水供給手段80は、それぞれ第1研削手段20a及び第2研削手段20bに備えられている。マウント24の内部には、水路Hに連通するとともに、下面において開口するマウント水路24Hが形成されている。また、研削ホイール200には、マウント水路24Hに連通するとともに下部が開口したホイール水路20Hが形成されている。 The grinding device 1 includes two grinding water supply means 80. The two grinding water supply means 80 are provided in the first grinding means 20a and the second grinding means 20b, respectively. Inside the mount 24, a mount water channel 24H that communicates with the water channel H and opens at the lower surface is formed. Further, the grinding wheel 200 is formed with a wheel water passage 20H which is in communication with the mount water passage 24H and whose lower portion is opened.

2 研削装置の動作
(位置合わせ)
上記の構成の研削装置1を用いて被加工物Wを研削加工する際の研削装置1の動作について説明する。まず、図1に示した第1のカセット41に予め収納されている研削加工前の被加工物Wを、搬入出手段40によって搬出し、位置合わせ手段43の仮置き領域430に載置する。そして、複数の位置合わせピン431により位置合わせを行う。
2 Grinding machine operation (positioning)
The operation of the grinding device 1 when the workpiece W is ground by using the grinding device 1 having the above configuration will be described. First, the workpiece W before grinding, which is stored in advance in the first cassette 41 shown in FIG. 1, is carried out by the carry-in/carry-out means 40 and placed in the temporary placement area 430 of the alignment means 43. Then, the alignment is performed by the plurality of alignment pins 431.

(保持)
位置合わせが完了した後、仮置き領域430に載置されている被加工物Wをローディング手段44によって保持し、保持手段100の吸引部101の保持面101aの上に載置する。保持面100aの上に載置された被加工物Wは、例えば、保持手段100の下方の図示しない吸引手段等によって吸引保持される。
(Retention)
After the alignment is completed, the workpiece W placed on the temporary placement area 430 is held by the loading unit 44 and placed on the holding surface 101a of the suction unit 101 of the holding unit 100. The workpiece W placed on the holding surface 100a is suction-held, for example, by suction means (not shown) below the holding means 100.

(粗研削)
保持手段100の吸引部101の保持面101aに被加工物Wを載置した後、ターンテーブル103を、Z軸方向の回転軸105を軸として、+Z方向から見て反時計回りに所定の角度だけ回転させる。これにより、被加工物Wを保持している保持手段100が所定の角度だけ公転させられて第1加工室30aの内部へと移動し、第1研削手段20aの研削ホイール200の下方に位置付けられる。
(Rough grinding)
After the workpiece W is placed on the holding surface 101a of the suction unit 101 of the holding means 100, the turntable 103 is rotated counterclockwise by a predetermined angle when viewed from the +Z direction with the Z-axis rotating shaft 105 as an axis. Just rotate. As a result, the holding means 100 holding the workpiece W is revolved by a predetermined angle to move into the inside of the first processing chamber 30a, and is positioned below the grinding wheel 200 of the first grinding means 20a. ..

次いで、第1研削手段20aのモータ21の駆動によって、スピンドル22をZ軸方向の回転軸23を軸として回転させる。スピンドル22の回転に伴い、研削ホイール200が回転する。さらに、保持手段100を保持手段100の下方に配設された図示しない回転手段によってZ軸方向の回転軸104のまわりに回転させることで、被加工物Wを回転軸104のまわりに回転させる。 Then, by driving the motor 21 of the first grinding means 20a, the spindle 22 is rotated about the rotary shaft 23 in the Z-axis direction. The grinding wheel 200 rotates as the spindle 22 rotates. Further, the workpiece W is rotated around the rotation axis 104 by rotating the holding means 100 around the rotation axis 104 in the Z-axis direction by a rotation means (not shown) arranged below the holding means 100.

図2に示した研削水供給手段80によって、粗研削砥石201aと被加工物Wとの間に研削水を供給しながら、昇降板65を−Z方向に降下させ、昇降板65に接続されたホルダ66に支持されている第1研削手段20aの研削ホイール200を−Z方向に降下させることで、回転する研削ホイール200の下端に備えられた粗研削砥石201aを、同じく回転する被加工物Wに当接させ、被加工物Wを粗研削する。 While supplying the grinding water between the rough grinding wheel 201a and the workpiece W by the grinding water supply means 80 shown in FIG. 2, the lifting plate 65 was lowered in the −Z direction and connected to the lifting plate 65. By lowering the grinding wheel 200 of the first grinding means 20a supported by the holder 66 in the −Z direction, the rough grinding wheel 201a provided at the lower end of the rotating grinding wheel 200 is moved to the workpiece W that also rotates. And the workpiece W is roughly ground.

粗研削時、研削水供給手段80から供給される研削水は、第1研削手段20aのモータ21の上方より第1研削手段20aの内部に進入し、第1研削手段20aの内部の研削水路H、マウント水路24H及びホイール水路20Hを通って噴出し、粗研削砥石201aと被加工物Wとの間に供給される。粗研削砥石201aと被加工物Wとの間に供給された研削水は、粗研削によって粗研削砥石201aと被加工物Wとの間に生じる研削屑とともに、回転する粗研削砥石201aの遠心力によって、例えば、第1加工室30aの側板37に向けて飛散する。飛散した研削屑を含んだ研削水の水滴Laは、第1加工室30aの側板37の近くに配設されているネットN1で受け止められる。その後、ネットN1によって受け止められた研削屑を含む研削水は、第1加工室30aの底板38に流れ落ち、底板38が有する傾斜に従って排水口39の方へと導かれ、排水口39から研削装置1の外部へと流れ出る。 During the rough grinding, the grinding water supplied from the grinding water supply means 80 enters the inside of the first grinding means 20a from above the motor 21 of the first grinding means 20a, and the grinding water channel H inside the first grinding means 20a. , Is ejected through the mount water passage 24H and the wheel water passage 20H, and is supplied between the rough grinding wheel 201a and the workpiece W. The grinding water supplied between the rough grinding wheel 201a and the workpiece W is the centrifugal force of the rotating rough grinding wheel 201a together with the grinding dust generated between the rough grinding wheel 201a and the workpiece W by the rough grinding. Thus, for example, the particles are scattered toward the side plate 37 of the first processing chamber 30a. The water droplet La of the grinding water containing the scattered grinding dust is received by the net N1 arranged near the side plate 37 of the first processing chamber 30a. After that, the grinding water containing the grinding dust received by the net N1 flows down to the bottom plate 38 of the first processing chamber 30a, is guided toward the drainage port 39 according to the inclination of the bottom plate 38, and is discharged from the drainage port 39 to the grinding device 1. Flows out of.

(ネット洗浄)
粗研削の終了後、図3に示すように、研削送り手段60の昇降板65を+Z方向に上昇させることによって、回転する粗研削砥石201aを+Z方向に上昇させ、粗研削砥石201aを保持手段100に載置された被加工物Wから離間させる。粗研削砥石201aが被加工物Wから離間する間、研削水供給手段80から粗研削砥石201aに供給され続けている研削水が、回転する粗研削砥石201aの遠心力によって研削屑を含まずに飛散し、第1加工室30aの内部のネットN1に付着した研削屑等を洗い流す。粗研削砥石201aが所定の高さ位置まで戻り、研削送り手段60の上昇移動が停止された後も、ネットN1に付着した研削屑が十分に取り除かれるまで、研削水供給手段80から粗研削砥石201aと被加工物Wとの間に研削水を適宜送り続けながら、回転する粗研削砥石201aの遠心力によって研削水の水滴LをネットN1に向けて飛散させてネットN1の流水洗浄を行う。
(Net cleaning)
After the completion of the rough grinding, as shown in FIG. 3, the lifting plate 65 of the grinding feed means 60 is raised in the +Z direction to raise the rotating rough grinding wheel 201a in the +Z direction and hold the rough grinding wheel 201a. The workpiece W placed on 100 is separated from the workpiece W. While the rough grinding wheel 201a is separated from the workpiece W, the grinding water continuously supplied from the grinding water supply means 80 to the rough grinding wheel 201a does not include grinding debris due to the centrifugal force of the rotating rough grinding wheel 201a. Grinding dust and the like scattered and attached to the net N1 inside the first processing chamber 30a are washed away. Even after the rough grinding wheel 201a returns to the predetermined height position and the ascending movement of the grinding feed means 60 is stopped, the grinding water supply means 80 causes the rough grinding wheel to be sufficiently removed until the grinding dust adhering to the net N1 is sufficiently removed. While continuing to appropriately feed the grinding water between 201a and the workpiece W, the centrifugal force of the rotating rough grinding wheel 201a scatters the water droplet L of the grinding water toward the net N1 to wash the net N1 with running water.

(仕上げ研削)
ネット洗浄の後、ターンテーブル103を回転軸105を軸として、+Z方向から見て反時計回りに所定の角度だけ回転させ、保持手段100を公転させ、被加工物Wが保持された保持手段100を第2加工室30bの内部へと移動させ、第2研削手段20bの研削ホイール200の下方に位置付ける。
(Finish grinding)
After the net cleaning, the turntable 103 is rotated counterclockwise by a predetermined angle when viewed from the +Z direction around the rotary shaft 105 as an axis, and the holding means 100 is revolved to hold the workpiece W. Is moved to the inside of the second processing chamber 30b and is positioned below the grinding wheel 200 of the second grinding means 20b.

保持手段100を第2研削手段20bの研削ホイール200の下方に位置付けた後、粗研削と同様の研削を行う。ただし、仕上げ研削の際に用いられる砥石は、粗研削時に用いられる粗研削砥石201aよりも砥粒が細かい仕上げ研削砥石201bである。また、仕上げ研削には、粗研削時に形成された研削面を整形するという目的等があるため、例えば、粗研削のときよりも仕上げ研削のときの方が研削送りの速度(研削砥石の−Z方向への降下速度)が遅いといった特徴がある。 After positioning the holding means 100 below the grinding wheel 200 of the second grinding means 20b, the same grinding as the rough grinding is performed. However, the grindstone used in the finish grinding is the finish grinding grindstone 201b having finer abrasive grains than the coarse grinding grindstone 201a used in the rough grinding. Further, since the finish grinding has the purpose of shaping the ground surface formed during the rough grinding, for example, the grinding feed speed (-Z There is a feature that the descent speed in the direction) is slow.

仕上げ研削中に回転する仕上げ研削砥石201bによって飛散する研削屑を含んだ研削水の水滴Laは、粗研削時と同様に、ネットN1によって受け止められる。仕上げ研削の終了後、研削送り手段60の昇降板65を+Z方向に上昇させ、仕上げ研削砥石201bを被加工物Wから離間させる。そして、粗研削後に行った上述のネット洗浄と同様のネット洗浄を行う。 The water droplet La containing the grinding dust scattered by the finishing grinding wheel 201b rotating during the finishing grinding is received by the net N1 as in the rough grinding. After finishing grinding is finished, the lifting plate 65 of the grinding feed means 60 is raised in the +Z direction to separate the finishing grinding wheel 201b from the workpiece W. Then, the same net cleaning as the above-described net cleaning performed after the rough grinding is performed.

粗研削時や仕上げ研削時、或いは研削実施後のネット洗浄時、回転する研削砥石から飛散する研削水は、側板37の方向だけでなく、天板33の方向にも飛散する可能性がある。また、側板37の方向に飛散したが、ネットN1によって受け止められなかった研削水がネットN1に当たって天板33の方向へ飛散する可能性もある。 At the time of rough grinding, finish grinding, or net cleaning after the grinding, the grinding water scattered from the rotating grinding wheel may be scattered not only toward the side plate 37 but also toward the top plate 33. Further, there is a possibility that the grinding water, which has been scattered in the direction of the side plate 37 but not received by the net N1, hits the net N1 and is scattered in the direction of the top plate 33.

そこで、例えば図4に示すように、第1加工室30a及び第2加工室30bにおいて、それぞれ天板33の下側に、天板33から所定の隙間をあけて天板ネットN2を配設してもよい。研削時に飛散する研削屑を含んだ研削水の水滴Laや、ネット洗浄時に飛散される研削屑を含まない研削水の水滴Lは、側板37の方向だけでなく天板33の方向へと飛散するが、回転する粗研削砥石201aから天板33の方向へと飛散した研削水を天板ネットN2によって受け止めることができるため、飛散した研削水が天板33に付着するのを、より確実に防ぐことができる。同様に、第2加工室30bの天板33の下側に所定の間隔をあけて天板ネットN2が配設されていれば、第2加工室30bの天板33に研削水が付着するのを防ぐことができる。 Therefore, as shown in FIG. 4, for example, in the first processing chamber 30a and the second processing chamber 30b, the top plate net N2 is disposed below the top plate 33 with a predetermined gap from the top plate 33. May be. A water droplet La of grinding water containing grinding dust and a water droplet L of grinding water containing no grinding dust that is scattered during net cleaning are scattered not only in the direction of the side plate 37 but also in the direction of the top plate 33. However, since the grinding water scattered from the rotating rough grinding wheel 201a toward the top plate 33 can be received by the top plate net N2, the scattered grinding water is more reliably prevented from adhering to the top plate 33. be able to. Similarly, if the top plate net N2 is arranged below the top plate 33 of the second processing chamber 30b at a predetermined interval, the grinding water adheres to the top plate 33 of the second processing chamber 30b. Can be prevented.

図5に示すように、第1加工室30aの天板33の下側に所定の間隔をあけて第2の天板34が配設され、さらにネットN1が、第2の天板34から側板37に対して平行にネットN1を垂下させる形で配設されている構成としてもよい。この場合、回転する粗研削砥石201aの遠心力により飛散して第2の天板34に付着した研削水は、ネットN1へと伝わり、ネットN1から底板38まで流れていく。次いで、底板38に運ばれた研削水は、底板38の傾斜に導かれ、排水口39から研削装置1の外部へと流れ出ていく。第2の天板34を配設することで、研削屑が天板33や側板37に付着するのを防ぐことができる。 As shown in FIG. 5, a second top plate 34 is arranged below the top plate 33 of the first processing chamber 30a with a predetermined space, and the net N1 is provided from the second top plate 34 to the side plate. Alternatively, the net N1 may be arranged in parallel with 37. In this case, the grinding water scattered by the centrifugal force of the rotating rough grinding wheel 201a and attached to the second top plate 34 is transmitted to the net N1 and flows from the net N1 to the bottom plate 38. Next, the grinding water carried to the bottom plate 38 is guided by the inclination of the bottom plate 38 and flows out of the grinding device 1 through the drainage port 39. By disposing the second top plate 34, it is possible to prevent grinding dust from adhering to the top plate 33 and the side plates 37.

このとき、第2の天板34が、ネットN1の方向に下がるような傾斜を備えていれば、第2の天板34に付着した研削水が、より効率良くネットN1の方向に流れていく。第2加工室30bの天板33の下方に、第2の天板34を配設する場合についても、上記と同様の構成によって天板33に研削水が付着するのを防ぐことができる。 At this time, if the second top plate 34 is provided with an inclination so as to be lowered toward the net N1, the grinding water attached to the second top plate 34 will flow toward the net N1 more efficiently. .. Even when the second top plate 34 is arranged below the top plate 33 of the second processing chamber 30b, it is possible to prevent the grinding water from adhering to the top plate 33 by the same configuration as described above.

本発明により、例えば、第1加工室30aに関して、第1加工室30aの天板33や側板37等の壁面に研削屑が固化するのを防ぐことができれば、例えば、オペレータ等による第1加工室30aの内部のメンテナンス時に、オペレータ等が加工室30の天板33の取手332を持ち、開閉部330を持ち上げ、第1加工室30aの上面を解放させた際、研削屑の粉塵が第1加工室30aの内外に飛散するのを防ぐことができる。第2加工室30bについても天板33や側板37等の壁面に研削屑が固化するのを防ぐことができる。 According to the present invention, for example, regarding the first processing chamber 30a, if it is possible to prevent the grinding dust from solidifying on the wall surfaces of the top plate 33, the side plate 37, etc. of the first processing chamber 30a, for example, the first processing chamber by an operator or the like. During maintenance of the inside of 30a, when an operator or the like holds the handle 332 of the top plate 33 of the processing chamber 30 and lifts the opening/closing portion 330 to release the upper surface of the first processing chamber 30a, dust of grinding dust causes the first processing. It is possible to prevent scattering inside and outside the chamber 30a. Also in the second processing chamber 30b, it is possible to prevent the grinding dust from solidifying on the wall surfaces of the top plate 33, the side plate 37, and the like.

また、天板33に研削屑が固化するのを防ぐことで、天板33の開閉不良を防ぐこともでき、メンテナンス作業の効率化を図ることができる。 Further, by preventing the grinding dust from solidifying on the top plate 33, it is possible to prevent the top plate 33 from being opened/closed poorly and to improve the efficiency of the maintenance work.

本発明に係る研削装置1は、上述した粗研削と仕上げ研削との二つの研削工程を実施するための、第1研削手段20aと第2研削手段20bとを備えるいわゆる二軸機であってもよいし、或いは、例えば、一種類の研削砥石によって仕上げ厚みまで研削加工する一軸機であってもよい。 The grinding apparatus 1 according to the present invention may be a so-called twin-screw machine including the first grinding means 20a and the second grinding means 20b for performing the two grinding steps of the above-described rough grinding and finish grinding. Alternatively, for example, a uniaxial machine that grinds to a finished thickness with one kind of grinding wheel may be used.

また、本発明に係る研削装置1は、例えば、ベース2の上に図示しない研磨手段等を備え、研削と研磨とを同じ装置内で続けて行うことができる加工装置であってもよい。
また、飛散する水滴LaがネットN1を通過することがあった場合、ネットN1を通過した水滴Laが側板に当たってさらに飛散し減速され、その飛散し減速した水滴LaをネットN1が受け止める事ができる。また、ネットN1は、隙間をあけて複数枚配設させてもよい。
さらに、天板に隙間をあけて配設する天板ネットN2は、天板に平行に配設させなくてもよく、傾斜させ、天板ネットN2に付着した研削水La、Lを自重で天板ネットN2から排水されるようにしてもよい。
Further, the grinding apparatus 1 according to the present invention may be, for example, a processing apparatus that includes a polishing means (not shown) on the base 2 and can perform grinding and polishing continuously in the same apparatus.
In addition, when the scattered water droplet La may pass through the net N1, the water droplet La that has passed through the net N1 hits the side plate and is further scattered and decelerated, and the net N1 can catch the scattered and decelerated water droplet La. Also, a plurality of nets N1 may be arranged with a gap.
Further, the top plate net N2 arranged with a gap on the top plate does not have to be arranged in parallel to the top plate, but is inclined and the grinding water La, L adhering to the top plate net N2 is lifted by its own weight. You may make it drain from the board net N2.

1:研削装置 2:ベース 3:コラム
10:保持手段 100:保持手段
101:吸引部 101a:保持面 枠体:102 103:ターンテーブル
104:保持手段の回転軸 105:ターンテーブルの回転軸
20a:第1研削手段 20b:第2研削手段 200:研削ホイール
201a:粗研削砥石 201b:仕上げ研削砥石
21:モータ 22:スピンドル 23:回転軸
30a:第1加工室 30b:第2加工室
33:天板 330:開閉部 331:固定部 332:取手 34:第2の天板
35:丁番 36:蛇腹 37:側板 38:底板 39:排水口
40:搬入出手段 41:第1のカセット
43:位置合わせ手段 430:仮置き領域 431:位置合わせピン
44:ローディングアーム 45:アンローディングアーム 46:第2のカセット
60:研削送り手段 61:モータ 63:ボールネジ 64:ガイドレール
65:昇降板 66:ホルダ
70:制御手段 80:研削水供給手段 90:洗浄手段 900:洗浄領域
W:被加工物 Wa:裏面 Wb:表面
H:研削水路 L:研削屑を含まない研削水 La:研削屑を含む研削水
N1:ネット N2:天板ネット
1: Grinding device 2: Base 3: Column 10: Holding means 100: Holding means 101: Suction part 101a: Holding surface Frame body: 102 103: Turntable 104: Rotating shaft of holding means 105: Rotating shaft of turntable 20a: 1st grinding means 20b: 2nd grinding means 200: Grinding wheel 201a: Coarse grinding wheel 201b: Finishing grinding wheel 21: Motor 22: Spindle 23: Rotating shaft 30a: 1st processing chamber 30b: 2nd processing chamber
33: Top plate 330: Opening/closing part 331: Fixed part 332: Handle 34: Second top plate 35: Hinges 36: Bellows 37: Side plate 38: Bottom plate 39: Drainage port 40: Carrying in/out means 41: First cassette 43: Positioning Means 430: Temporary Placement Area 431: Positioning Pins 44: Loading Arms 45: Unloading Arms 46: Second Cassette 60: Grinding Feeding Means 61: Motors 63: Ball Screws 64: Guide Rails 65: Elevating Plates 66 : Holder 70: Control means 80: Grinding water supply means 90: Cleaning means 900: Cleaning area W: Workpiece Wa: Back surface Wb: Surface H: Grinding water channel L: Grinding water not containing grinding debris La: Grinding debris included Grinding water
N1: Net N2: Top plate net

Claims (3)

被加工物を保持する保持手段と、
環状に研削砥石を配設した研削ホイールをスピンドルに装着し該研削砥石を回転させ該保持手段が保持した被加工物を研削する研削手段と、
該研削手段を該保持手段に対して垂直な方向に接近及び離間させる研削送り手段と、
該研削砥石に研削水を供給する研削水供給手段と、
該保持手段が保持した被加工物と該研削砥石とを収容する加工室と、を備えた研削装置であって、
該加工室は、該保持手段を下方から囲む底板と、
該底板に対峙し該研削ホイールを上方から囲む天板と、
該保持手段と該研削ホイールとを側方から囲み該底板と該天板とを連結する側板と、
該側板の内面の内側に該側板に対して所定の隙間を開けて配設され該研削砥石の高速回転による遠心力を受けた研削水を受け止めるネットと、を備え、
該研削砥石が被加工物を研削しているときは、研削屑が含まれた状態で飛散する研削水を該ネットで受け止め排水に導き、該研削砥石が被加工物から離間しているときは、該研削砥石に供給され研削屑が含まれない状態で飛散する研削水で該ネットを洗浄する、研削装置。
Holding means for holding the workpiece,
Grinding means for mounting a grinding wheel in which a grinding wheel is annularly arranged on a spindle and rotating the grinding wheel to grind the workpiece held by the holding means,
Grinding feed means for moving the grinding means toward and away from each other in a direction perpendicular to the holding means,
Grinding water supply means for supplying grinding water to the grinding wheel,
A grinding device comprising: a workpiece held by the holding means; and a processing chamber that accommodates the grinding wheel.
The processing chamber includes a bottom plate that surrounds the holding means from below,
A top plate that faces the bottom plate and surrounds the grinding wheel from above;
A side plate that surrounds the holding means and the grinding wheel from the side and connects the bottom plate and the top plate;
A net for receiving the grinding water that has been subjected to the centrifugal force generated by the high-speed rotation of the grinding wheel and is disposed inside the inner surface of the side plate with a predetermined gap with respect to the side plate;
When the grinding wheel is grinding the work piece, the grinding water scattered in a state where grinding dust is contained is received by the net and guided to drainage, and when the grinding wheel is separated from the work piece. A grinding device that cleans the net with grinding water that is supplied to the grinding wheel and scatters in a state where grinding dust is not included.
該天板の下側に所定の隙間をあけて配設され研削水を受け止める天板ネットを備える、請求項1記載の研削装置。 The grinding device according to claim 1, further comprising a top plate net which is arranged below the top plate with a predetermined gap and receives the grinding water. 該天板の下側に該天板に対して所定の隙間をあけて配設され該研削ホイールを上方から囲む第2の天板を備え、該ネットを該第2の天板から垂下させて該第2の天板で該ネットに研削水を導く、請求項1記載の研削装置。 A second top plate is provided below the top plate with a predetermined gap from the top plate and surrounds the grinding wheel from above, and the net is hung from the second top plate. The grinding device according to claim 1, wherein grinding water is guided to the net by the second top plate.
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000354954A (en) * 1999-06-15 2000-12-26 Toshiba Corp Semiconductor substrate polishing device
JP2015036162A (en) * 2013-08-12 2015-02-23 株式会社ディスコ Processing chamber cleaning method of grinding device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000354954A (en) * 1999-06-15 2000-12-26 Toshiba Corp Semiconductor substrate polishing device
JP2015036162A (en) * 2013-08-12 2015-02-23 株式会社ディスコ Processing chamber cleaning method of grinding device

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