JP2000354954A - Semiconductor substrate polishing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To effectively prevent contamination in a polishing device by providing a rotating carrier for holding a semiconductor substrate on a polishing cloth held on a platen, supplying abrasive liquid on the polishing cloth from an abrasive liquid supply nozzle, while sucking the abrasive liquid or its dispersed body by a sucking plate. SOLUTION: In the inside of an enclosure 1, a semiconductor substrate 2 is held on a carrier 3, and with the surface 4 thereof abutting on the upper surface of a polishing cloth 6 held on a platen 5 driven in rotation, an abrasive liquid 8 is dropped and supplied on the upper part of the polishing cloth 6 from an abrasive liquid supply nozzle 7, thereby polishing the surface 4 of the substrate 2. In this case, a sucking plate 9 is disposed to cover part of the polishing cloth 6 and not to be in contact with the carrier 3 and the semiconductor substrate 2 above the abrasive liquid supply nozzle 7. Thus, an abrasive liquid scattering in the vicinity of the abrasive liquid supply nozzle 7 or its dispersed body are trapped by the sucking plate 9 to prevent adhesion to parts affecting the process performance and the product quality inside the enclosure 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a semiconductor manufacturing apparatus, and more particularly to a chemical mechanical polishing apparatus used for flattening a semiconductor substrate.

[0002]

2. Description of the Related Art Conventionally, a chemical mechanical polishing apparatus used for flattening a semiconductor substrate, that is, polishing a surface of the semiconductor substrate, comprises:
As shown in FIG.
Is held by the carrier 3, and its surface 4 is arranged so as to be in contact with the upper surface of the polishing cloth 6 held on the platen 5, and an abrasive liquid supply nozzle 7 is provided on the upper part of the polishing cloth 6. Then, an abrasive liquid 8 containing abrasive particles is dripped and supplied from the abrasive liquid supply nozzle 7 onto the polishing cloth 6.
Then, the surface 4 of the semiconductor substrate 2 is polished by rotating while the semiconductor substrate 2 held by the carrier 3 is in contact with each other.

[0003]

In such a chemical mechanical polishing apparatus, a dispersion in which the abrasive liquid is scattered or the abrasive liquid is dispersed in the form of a mist is applied to the inner wall of the housing, the carrier, and the abrasive liquid supply nozzle. Etc., causing contamination of equipment and work environment. In addition, the abrasive particles such as silicon dioxide, cerium oxide, etc., which are dried and fall off, cause scratches to be formed on the surface of the semiconductor substrate. There was a problem such as a drop.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned disadvantages, and it is possible to prevent contamination in a semiconductor substrate polishing apparatus and defects in production and quality caused by the contamination and to stably produce high quality products. It is an object of the present invention to provide a semiconductor substrate polishing apparatus that can be used.

[0005]

According to the present invention, there is provided a semiconductor substrate polishing apparatus comprising: a platen; a polishing cloth held on the platen; a carrier which holds the semiconductor substrate on the polishing cloth and rotates; A polishing liquid supply nozzle for supplying a polishing liquid onto a cloth, and an adsorbing plate disposed near the semiconductor substrate and adsorbing the polishing liquid or a dispersion thereof are provided.

Further, in the semiconductor substrate polishing apparatus according to the present invention, the suction plate may be at least one of a position facing the platen, an outer peripheral portion of the platen, an outer peripheral portion of the carrier, and an outer peripheral portion of the polishing liquid supply nozzle. It is arranged at a position including a part.

Further, in the semiconductor substrate polishing apparatus according to the present invention, the adsorbing plate electrically or physically adsorbs the polishing liquid or a dispersion thereof.

Further, in the semiconductor substrate polishing apparatus of the present invention, the suction plate is set in a magnetic field or an electric field which can be controlled arbitrarily.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. In these drawings, the same or corresponding components as those in FIG. 1 are denoted by the same reference numerals. (Embodiment 1) FIG. 1 is a view showing an embodiment of a semiconductor substrate polishing apparatus according to the present invention.

[0010] As shown in FIG.
The semiconductor substrate 2 is held by a carrier 3 and its surface 4
Is arranged so as to be in contact with the upper surface of the polishing cloth 6 held on the platen 5, and an abrasive liquid supply nozzle 7 is provided above the polishing cloth 6. Above the abrasive liquid supply nozzle 7,
The suction plate 9 is arranged so as to cover a part of the polishing cloth 6 and not to contact the carrier 3 and the semiconductor substrate 2.

With such an apparatus configuration, as in the prior art, the polishing liquid 8 is dropped and supplied from the polishing liquid supply nozzle 7 onto the polishing cloth 6, and the polishing cloth 6 and the semiconductor substrate 2 held by the carrier 3 are separated. The surface 4 of the semiconductor substrate 2 is polished by rotating while being in contact with each other.

At this time, the abrasive fluid and the dispersion thereof which have been scattered in the vicinity of the abrasive fluid supply nozzle 7 can be trapped by the suction plate 9. Adhesion to affected areas can be prevented. Therefore, stable polishing characteristics can be obtained, and high-quality products can be produced. (Embodiment 2) FIG. 2 is a view showing another embodiment of the semiconductor substrate polishing apparatus of the present invention.

As shown in FIG. 2, in the apparatus configuration, the suction plate 9 is formed in a cylindrical shape from the bottom surface of the platen 5 to a position higher than the installation position of the semiconductor substrate 2 and the polishing liquid supply nozzle 7 so as to surround the outer periphery of the platen 5. Only in that it is installed in the first embodiment.

With such an apparatus configuration, the surface 4 of the semiconductor substrate 2 is polished as in the first embodiment.

At this time, the polishing liquid and the dispersion thereof which have been scattered on the outer periphery of the platen 5 can be trapped by the suction plate 9, so that the same effect as in the first embodiment can be obtained. (Embodiment 3) FIG. 3 is a view showing still another embodiment of the semiconductor substrate polishing apparatus of the present invention.

As shown in FIG. 3, in the configuration of the apparatus, the suction plate 9 is disposed so as to cover the entire semiconductor substrate 2, carrier 3, platen 5, polishing cloth 6, and polishing liquid supply nozzle 7. Only the second embodiment is different from the first embodiment.

With such an apparatus configuration, the surface 4 of the semiconductor substrate 2 is polished as in the first embodiment.

At this time, the abrasive fluid and its dispersion which have been scattered above and around the platen 5 in the past can be trapped by the suction plate 9, so that the same effects as in the first embodiment can be obtained. . (Embodiment 4) FIG. 4 is a view showing still another embodiment of the semiconductor substrate polishing apparatus of the present invention.

As shown in FIG. 4, in the device configuration, the suction plate 9 is different from the first embodiment only in that it is arranged in contact with the lower outer periphery of the carrier 3.

With such an apparatus configuration, the surface 4 of the semiconductor substrate 2 is polished as in the first embodiment.

At this time, the abrasive fluid and the dispersion thereof which have been scattered around the outer periphery of the carrier 3 can be trapped by the suction plate 9, so that the same effect as in the first embodiment can be obtained. (Embodiment 5) FIG. 5 is a view showing still another embodiment of the semiconductor substrate polishing apparatus of the present invention.

As shown in FIG. 5, in the configuration of the apparatus, the suction plate 9
Only in that it is arranged in a portion facing the.

With such an apparatus configuration, the surface 4 of the semiconductor substrate 2 is polished as in the first embodiment.

At this time, since the abrasive fluid and the dispersion thereof which have been scattered around the outer periphery of the abrasive fluid supply nozzle 7 can be trapped by the suction plate 9, the same effect as in the first embodiment can be obtained. .

The location where the suction plate is provided is not limited to these embodiments, and the same effect can be obtained as long as the abrasive fluid or its dispersion is scattered.

As the adsorbing plate, a polishing liquid, a dispersion thereof and a material having a property of adsorbing abrasive particles contained therein can be used. For example, a material which can be electrically adsorbed, It is possible to use a plastics material, an acrylic resin material, a material coated with a Teflon-based material, or a ceramic-based material capable of being physically adsorbed.

Further, such an attraction plate functions more effectively by being arranged in a magnetic field which can be controlled arbitrarily. (Embodiment 6) FIG. 6 is a view showing still another embodiment of the semiconductor substrate polishing apparatus of the present invention.

As shown in FIG. 6, the apparatus differs from the fifth embodiment in that the attraction plate 9 is arranged in the magnetic field generated by the electromagnet 10 composed of a magnet coil in the configuration of the apparatus. The electromagnet 10 is installed outside the housing 1 such that a magnetic field distribution is generated from the bottom surface of the platen 5 inside the housing 1 to the installation position of the abrasive liquid supply nozzle 7 and the suction plate 9 provided on the outer periphery thereof. .

With such an apparatus configuration, the surface 4 of the semiconductor substrate 2 is polished as in the first embodiment.

At this time, the abrasive particles contained in the dispersion, that is, the fine powder charged with static electricity, can be moved to the suction plate 9 by a desired magnetic field distribution generated by the electromagnet 10, and can be moved inside the conventional housing 1. The scattered abrasive fluid and its dispersion can be trapped more efficiently.

In this embodiment, the suction plate 9 is set in a magnetic field, but the same effect can be obtained in an electric field. That is, by using a pair of opposing electrode plates instead of the electromagnet 10, similar control by an electric field is also possible.

[0032]

According to the present invention, it is possible to provide a semiconductor substrate polishing apparatus capable of obtaining stable polishing characteristics and producing high quality products.

[Brief description of the drawings]

FIG. 1 is a top view and a side view of a semiconductor substrate polishing apparatus according to an embodiment of the present invention.

FIG. 2 is a top view and a side view of a semiconductor substrate polishing apparatus showing another embodiment of the present invention.

FIG. 3 is a top view and a side view of a semiconductor substrate polishing apparatus showing still another embodiment of the present invention.

FIG. 4 is a top view and a side view of a semiconductor substrate polishing apparatus showing still another embodiment of the present invention.

FIG. 5 is a top view and a side view of a semiconductor substrate polishing apparatus showing still another embodiment of the present invention.

FIG. 6 is a top view and a side view of a semiconductor substrate polishing apparatus showing still another embodiment of the present invention.

FIG. 7 is a top view and a side view showing a conventional semiconductor substrate polishing apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Housing 2 Semiconductor substrate 3 Carrier 4 Semiconductor substrate surface 5 Platen 6 Polishing cloth 7 Abrasive supply nozzle 8 Abrasive 9 Adsorption plate 10 Electromagnet

Claims (4)

[Claims] A platen, a polishing cloth held on the platen, a carrier holding and rotating a semiconductor substrate on the polishing cloth, and a polishing liquid supply nozzle for supplying a polishing liquid onto the polishing cloth. An adsorbing plate disposed near the semiconductor substrate to adsorb the polishing liquid or a dispersion thereof. 2. The apparatus according to claim 1, wherein the suction plate is located at a position facing the platen, an outer peripheral portion of the platen, an outer peripheral portion of the carrier,
2. The semiconductor substrate polishing apparatus according to claim 1, wherein the apparatus is arranged at a position including at least a part of an outer peripheral portion of the polishing liquid supply nozzle. 3. The semiconductor substrate polishing apparatus according to claim 1, wherein the suction plate electrically or physically adsorbs the polishing liquid or a dispersion thereof. 4. The semiconductor substrate polishing apparatus according to claim 1, wherein the suction plate is installed in a magnetic field or an electric field that can be controlled arbitrarily.