JP2020064885A - Component loading device and manufacturing method for mounting substrate - Google Patents

Abstract

To provide a component loading device and a manufacturing method for a mounting substrate which can surely exchange a substrate at a loading work position.SOLUTION: A component loading device includes: a carry-in area 30 to which a substrate 3 received from a device at an upstream side is carried in by a carry-in conveyor 30a; a loading area 31 which is loaded with a component by receiving the substrate 3 from the carry-in area 30; a carry-out area 32 which carries out the substrate 3 carried out from the loading area 31 to a device at a downstream side by a carry-out conveyor 32a; a contact member 42 which is brought into contact with the rear end of the substrate 3 to move the substrate 3 to the downstream side; a contact member drive mechanism 40 which vertically lifts the contact member 42 and moves it between a standby position P1 set in the carry-in area 30 and a delivery position P3 set at the downstream side; and a conveyance control unit which controls a carry-in drive mechanism 30b, a carry-out drive mechanism 32b and the contact member drive mechanism 40.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a component mounting apparatus and a mounting substrate manufacturing method for manufacturing a mounting substrate in which components are mounted on the substrate.

  As a component mounting device that manufactures a mounting substrate with components mounted on the substrate, after inserting the leads of the component with leads into the insertion holes of the substrate held at the mounting work position, bend the leads protruding on the back surface of the substrate with a foot bending mechanism. It is known that components are prevented from coming off the board (see, for example, Patent Document 1). The component mounting apparatus described in Patent Document 1 includes a supply conveyor, a positioning unit that holds a board on which a mounting work position is set, and a carry-out conveyor. The supply conveyor and the positioning unit convey the board from the upstream side. The component is loaded to the position, the component is mounted, and the substrate on which the component is mounted is transported to the downstream side by the conveyor of the positioning unit and the unloading conveyor.

JP, 2015-226037, A

  However, in the related art including Patent Document 1, there is a problem in that the foot bending mechanism interferes with the conveyor of the positioning unit, so that the foot inserted into the side area near the edge of the board cannot be bent, and thus the board side. There is a problem that the component inserted in the partial region is bent and the substrate is surely carried in and out at the mounting work position.

  Therefore, it is an object of the present invention to provide a component mounting apparatus and a mounting substrate manufacturing method capable of reliably replacing a substrate at a mounting work position.

  The component mounting apparatus of the present invention has a carry-in drive mechanism for driving a carry-in conveyor, and a carry-in area for carrying in the board received from the apparatus on the upstream side in the board carrying direction by the carry-in conveyor, and the board from the carry-in area. Receiving, mounting area for mounting components on the board, and having a carry-out drive mechanism for driving a carry-out conveyor, the board carried out from the mounting area to the apparatus on the downstream side in the board carrying direction by the carry-out conveyor. A carry-out area for carrying out, a contact member for contacting a rear end of the substrate to move the substrate to the downstream side, a vertical position for the contact member, and a standby position and a standby position set in the carry-in area. A contact member drive mechanism that is moved between the position and the delivery position set on the downstream side, and the carry-in drive mechanism, the carry-out drive mechanism, and the contact member drive mechanism It includes a control unit, a.

  A mounting board manufacturing method according to the present invention is a mounting board manufacturing method for manufacturing a mounting board in which a component is mounted on a board by a component mounting apparatus, wherein the component mounting apparatus receives from a device on an upstream side in a board transport direction. A carrying-in area for carrying in a board with a carrying-in conveyor, a mounting area for receiving the board from the carrying-in area and mounting a component, and a board for carrying out the board carried out from the mounting area on a downstream side in the board-carrying direction with a carrying-out conveyor. Moves between the carry-out area carried out to the apparatus and the vertical position, and moves between the waiting position set in the carrying-in area and the delivery position set on the downstream side of the waiting position, and contacts the rear end of the substrate. A contact member that moves the board toward the downstream side by means of a component mounting step of mounting a component on the board in the mounting area, and the upstream side after the component mounting step. In the unloading request step of requesting the device to unload the next substrate, the contact member waiting in the standby position is moved to the delivery position, and the contact member is moved to the mounting area in the middle of the movement. A carry-out area moving step of bringing the board into contact with the rear end of the board and moving the board to the carry-out area, a carry-out step of carrying out the board to the apparatus on the downstream side by the carry-out conveyor, and the delivery position The contact member that has been moved to the standby position is moved to the standby position, the contact member returning step of raising the contact member, and the next substrate to be carried out by the upstream device is received by the carry-in conveyor. A standby position loading step of moving the next substrate until the rear end of the next substrate passes the standby position, and lowering the contact member to move the contact member to the downstream side. Wherein the next substrate in comprising a mounting area moving step of moving to the mounting area, and the contact member forward step of moving the abutment member that has moved to the mounting area to the standby position.

  According to the present invention, the substrates at the mounting work position can be reliably exchanged.

The top view which shows the structure of the component mounting apparatus of one embodiment of this invention. Explanatory drawing which shows an example of the insertion component mounted by the component mounting apparatus of one Embodiment of this invention on a board | substrate. (A) Plan view (b) Side view which shows the structure of the board | substrate conveyance mechanism with which the component mounting apparatus of one embodiment of this invention is equipped. 1 is a block diagram showing a configuration of a control system of a component mounting device according to an embodiment of the present invention. The figure explaining board conveyance by the component mounting device of one embodiment of the present invention. The figure explaining board conveyance by the component mounting device of one embodiment of the present invention. (A) (b) (c) (d) (e) Explanatory drawing of the manufacturing process of the mounting board in the component mounting apparatus of one Embodiment of this invention. (A) (b) (c) (d) (e) Explanatory drawing of the manufacturing process of the mounting board in the component mounting apparatus of one Embodiment of this invention. Flowchart of a method of manufacturing a mounting board in the component mounting apparatus according to the embodiment of the present invention Flowchart of the board unloading method in the component mounting apparatus according to an embodiment of the present invention Flowchart of a board loading method in the component mounting apparatus according to the embodiment of the present invention Flowchart of a method for manufacturing another mounting board in the component mounting apparatus according to the embodiment of the present invention Flow chart of another board loading method in the component mounting apparatus according to the embodiment of the present invention

  An embodiment of the present invention will be described in detail below with reference to the drawings. The configurations, shapes, and the like described below are examples for description, and can be appropriately changed according to the specifications of the component mounting device and the board transfer mechanism. In the following, corresponding elements are denoted by the same reference numerals in all the drawings, and overlapping description will be omitted. In FIG. 1 and a part which will be described later, as the biaxial directions orthogonal to each other in the horizontal plane, the X direction of the substrate transfer direction (left and right direction in FIG. 1) and the Y direction orthogonal to the substrate transfer direction (up and down direction in FIG. 1) Is shown. In FIG. 3B and a part described later, the Z direction (vertical direction in FIG. 3B) is shown as the height direction orthogonal to the horizontal plane. The Z direction is the vertical direction when the component mounting device is installed on a horizontal plane.

  First, the configuration of the component mounting apparatus 1 will be described with reference to FIG. The component mounting apparatus 1 has a function of manufacturing a mounting substrate in which components are mounted on the substrate. A substrate transfer mechanism 2 is installed in the X direction at the center of the base 1a. The substrate transport mechanism 2 transports the substrate 3 loaded from the upstream side (the left side in FIG. 1) in the X direction, and positions and holds the substrate 3 at the mounting work position by the mounting head described below. In addition, the board transport mechanism 2 carries out the board 3 on which the component mounting work has been completed to the downstream side (right side in FIG. 1). A component supply unit 4 is installed on each side of the board transfer mechanism 2.

  In FIG. 1, a plurality of tape feeders 5 are mounted in parallel in the X direction on one component supply unit 4 (lower side in FIG. 1). The tape feeder 5 will be described later by pitch-feeding a carrier tape in which pockets for storing components such as surface-mounted components are formed in a direction from the outside of the component supply unit 4 toward the substrate transport mechanism 2 (tape feeding direction). The mounting head supplies the component to the component suction position where the component is sucked.

  A plurality of insertion component feeders 6 and tray feeders 7 are mounted in parallel in the X direction on the other component supply unit 4 (upper side in FIG. 1). The insertion component feeder 6 pitches the component holding tape holding the insertion component in the direction from the outside of the component supply unit 4 toward the substrate transport mechanism 2 (tape feeding direction), so that the mounting head holds the insertion component. Supply the inserts to the holding position. The tray feeder 7 supplies a tray 8 for aligning and holding components such as insert components and press-fit components to a component holding position where the mounting head holds the components. It should be noted that the component supply unit 4 may be equipped with a stick feeder for supplying the components stored in the stick or a ball feeder for supplying the components contained in the bowl while aligning them.

  Here, the structure of the insertion component 20 will be described with reference to FIG. The insert component 20 is provided with a plurality of leads 21 (two here) that are inserted into an insertion hole 3v (see FIG. 3B) formed in the substrate 3 and vertically penetrating the substrate 3. ing. The component holding tape 22 holds the plurality of insertion components 20 at equal intervals with the lead 21 sandwiched therebetween. The component holding tape 22 is formed with a feed hole 22a that engages with a sprocket included in the insert component feeder 6. The insert component feeder 6 feeds the insert component 20 to the component holding position with the lead 21 extending downward by engaging the sprocket with the feed hole 22a and pitch feeding the component holding tape 22.

  In FIG. 1, Y-axis tables 9 having linear drive mechanisms are installed at both ends in the X direction on the upper surface of the base 1a along the Y direction. A beam 10 also having a linear drive mechanism is coupled to the Y-axis table 9 so as to be movable in the Y direction. A mounting head 11 is mounted on the beam 10 so as to be movable in the X direction. At the lower end of the mounting head 11, a suction nozzle that sucks and holds a component, and a component holder 11a (see FIG. 3B) that grips and holds the insertion component 20 with a pair of chucks 11b are mounted. . A plurality of suction nozzles and component holders 11 a are mounted on the mounting head 11 in correspondence with the components to be mounted on the board 3.

  The Y-axis table 9 and the beam 10 configure a mounting head moving mechanism 12 that moves the mounting head 11 in the horizontal direction (X direction, Y direction). The mounting head moving mechanism 12 and the mounting head 11 take out the component (inserted component 20) supplied to the component supply unit 4, transfer it to the mounting position of the substrate 3 held by the substrate transport mechanism 2, and mount the component. Repeat a series of work turns.

  In FIG. 1, the beam 10 is equipped with a head camera 13 located on the lower surface side of the beam 10 and moving integrally with the mounting head 11. As the mounting head 11 moves, the head camera 13 moves above the substrate 3 positioned at the mounting operation position of the substrate transport mechanism 2 and images the substrate mark (not shown) provided on the substrate 3. Recognize the position of the substrate 3.

  A component recognition camera 14 is installed between the component supply unit 4 and the board transfer mechanism 2. The component recognition camera 14 moves the component (inserted component 20) held by the suction nozzle or the component holder 11 a downward when the mounting head 11 that has taken out the component from the component supply unit 4 is positioned above the component recognition camera 14. Image from. In the work of mounting the component on the substrate 3 by the mounting head 11, the mounting position is corrected by taking into consideration the recognition result of the substrate 3 by the head camera 13 and the recognition result of the component by the component recognition camera 14.

  Next, the structure of the substrate transfer mechanism 2 will be described with reference to FIGS. 3A is a plan view of the substrate transfer mechanism 2 as viewed from above, and FIG. 3B is a side view of the substrate transfer mechanism 2 as viewed from the upstream side. In FIG. 3A, the board transfer mechanism 2 includes a loading area 30, a mounting area 31, and an unloading area 32 in order from the upstream side. The substrate transfer mechanism 2 includes a pair of plate-shaped members 33 that include a carry-in area 30, a mounting area 31, and a carry-out area 32 and extend in the X direction. Inside the pair of plate-shaped members 33 in the carry-in area 30, a pair of carry-in conveyors 30a driven by a carry-in drive mechanism 30b including a motor is installed. The carry-in conveyor 30a carries the substrate 3 carried in from the upstream device to the downstream side.

  In FIG. 3A, a pair of rails 31 a is installed inside the pair of plate-shaped members 33 in the mounting area 31. The pair of rails 31a is moved up and down by a rail lifting mechanism 31b (see FIG. 4). At the upper end of the plate-shaped member 33 located in the mounting area 31, a holding plate 34 that projects above the rail 31a is installed.

  By positioning the front end 3h of the board 3 moved on the rail 31a at the mounting work position P2 set in the mounting area 31, the rail elevating mechanism 31b is operated to raise the rail 31a ( The substrate 3 is held by pressing the edge portion thereof against the lower surface of the pressing plate 34, as indicated by the arrow k8 in FIG. 8 (e). When the rail elevating mechanism 31b is operated to lower the rail 31a (arrow j1 in FIG. 7B), the height of the upper surface of the rail 31a becomes the same height position as the carry-in conveyor 30a and the carry-out conveyor 32a described later. When the rail 31a is at this height position, it is possible to transfer the substrate 3 from the loading area 30 to the mounting area 31 and to transfer the substrate 3 from the mounting area 31 to the unloading area 32.

  In FIG. 3B, the component holding portion 11a holding the insertion component 20 descends from above (arrow a), and the lead 21 is inserted into the insertion hole 3v formed in the board 3 held in the mounting area 31. As a result, the insert component 20 is mounted. Below the substrate 3 held in the mounting area 31, a lead processing mechanism 35 that moves horizontally (X direction, Y direction) and vertically (Z direction) by a built-in moving mechanism (not shown) is installed. There is. The lead processing mechanism 35 moves below the insertion component 20 mounted on the substrate 3, cuts the lead 21 of the insertion component 20 (component) mounted on the substrate 3 into a predetermined length, and after cutting. It has a function of processing the lead 21, such as bending the lead 21 in the direction of the lower surface of the substrate 3 to fix the insertion component 20 to the substrate 3.

  In FIG. 3A, inside the pair of plate-shaped members 33 in the carry-out area 32, a pair of carry-out conveyors 32a driven by a carry-out driving mechanism 32b including a motor is installed. The carry-out conveyor 32a carries out the substrate 3 carried from the mounting area 31 to a downstream device. The carry-in conveyor 30a and the carry-out conveyor 32a may be a belt conveyor that conveys the substrate 3 by a belt made of rubber or the like, or a conveyor that conveys the substrate 3 by a chain.

  Thus, the carry-in area 30 has the carry-in drive mechanism 30b for driving the carry-in conveyor 30a, and carries in the substrate 3 received from the upstream device in the substrate carrying direction (X direction) by the carry-in conveyor 30a. The mounting area 31 receives the board 3 from the carry-in area 30 and mounts a component (mounting component 20) on the board 3. The carry-out area 32 has a carry-out drive mechanism 32b for driving the carry-out conveyor 32a, and carries out the substrate 3 carried out from the mounting area 31 to the apparatus on the downstream side in the substrate carrying direction by the carry-out conveyor 32a. Since there is no conveyor mechanism for conveying the board 3 in the mounting area 31 of the board conveying mechanism 2 of the present embodiment, the lead processing mechanism 35 is moved to near the edge of the board 3 to process the lead 21 of the insertion part 20. can do.

  In FIG. 3A, a first substrate detection sensor 36 is installed at the carry-in entrance S1 on the upstream side of the carry-in area 30. In the carry-in area 30, a second substrate detection sensor 37 is installed at an intermediate position S2 between the carry-in entrance S1 and a standby position P1 described later. A third substrate detection sensor 38 is installed at the carry-in / out entrance S3 on the upstream side of the carry-out area 32. A fourth substrate detection sensor 39 is installed at the carry-out exit S4 on the downstream side of the carry-out area 32.

  The first substrate detection sensor 36, the second substrate detection sensor 37, the third substrate detection sensor 38, and the fourth substrate detection sensor 39 each include a light projecting unit that emits detection light and a detection unit that receives the detection light. The presence or absence of the substrate 3 is detected by the substrate 3 blocking the detection light. For the detection signals from the first board detection sensor 36, the second board detection sensor 37, the third board detection sensor 38, and the fourth board detection sensor 39, see the control device 50 (FIG. 4) provided in the main body of the component mounting apparatus 1. Be transmitted to.

  3A and 3B, a contact member moving mechanism 40b for moving the contact member elevating mechanism 40a in the substrate transport direction (X direction) is installed outside the one plate-shaped member 33. ing. The contact member moving mechanism 40b reciprocates the contact member elevating mechanism 40a between the standby position P1 set in the carry-in area 30 and the delivery position P3 set downstream of the standby position P1. In the example of FIG. 3A, the delivery position P3 is set in the carry-out area 32.

  The contact member raising / lowering mechanism 40a includes an arm 41 that extends in the Y direction to extend inside the rail 31a while straddling over the pressing plate 34. One end of the arm 41 is supported by the contact member elevating mechanism 40a, and the other end has a contact member 42 extending downward. The contact member elevating mechanism 40a swings the other end of the arm 41 up and down with one end of the arm 41 as a rotation axis (arrow b). As a result, the contact member 42 arranged at the other end of the arm 41 moves up and down (arrow k3 in FIG. 8B, arrow k5 in FIG. 8C).

  In the state where the contact member 42 is in the raised position, the substrate 3 can pass below the contact member 42 (arrow k4 in FIG. 8C). In the state where the contact member 42 is in the lowered position, the contact member 42 can contact the rear end 3e of the substrate 3 (FIG. 7B). When the contact member moving mechanism 40b moves the contact member elevating mechanism 40a (contact member 42) to the downstream side with the contact member 42 in contact with the rear end 3e of the substrate 3, the substrate 3 moves to the downstream side. It can be moved (arrow k6 in FIG. 8D, arrow j3 in FIG. 7D, arrow j4 in FIG. 7E).

  In this way, the contact member elevating mechanism 40a and the contact member moving mechanism 40b move the contact member 42 up and down and are set to the standby position P1 set in the carry-in area 30 and to the downstream side of the standby position P1. The contact member drive mechanism 40 is configured to move in the substrate transfer direction (X direction) between the contact position and the delivery position P3. That is, when the contact member 42 moves from the standby position P1 to the delivery position P3 in the lowered position, the rear end 3e contacts the rear end 3e of the substrate 3 between the standby position P1 and the delivery position P3. To move the substrate 3 to the downstream side.

  The contact member moving mechanism 40b may be any mechanism that reciprocates the contact member elevating mechanism 40a in the X direction. For example, the contact member moving mechanism 40b may be configured such that the contact screw elevating mechanism 40a is reciprocated by a linear motor or the belt is driven by a motor to reciprocate. It may be configured to be driven to reciprocate. Further, the contact member moving mechanism 40b has a built-in encoder (not shown), and detects the position of the contact member elevating mechanism 40a (contact member 42) in the X direction.

  Hereinafter, in the substrate transfer mechanism 2 shown in FIG. 3A, a distance L1 is provided between the carry-in entrance S1 and the intermediate position S2, a distance L2 is provided between the intermediate position S2 and the standby position P1, and a standby position P1 and a mounting work position P2 are provided. The distance is L3, and the distance between the mounting work position P2 and the delivery position P3 is L4. Further, the size of the substrate 3 along the substrate transport direction is the length Lb.

  Next, the configuration of the control system of the component mounting apparatus 1 will be described in detail with reference to FIG. The control device 50 included in the component mounting apparatus 1 includes a substrate transfer mechanism 2, a component supply unit 4, a mounting head 11, a mounting head moving mechanism 12, a head camera 13, a component recognition camera 14, a lead processing mechanism 35, and a first substrate detection. The sensor 36, the second substrate detection sensor 37, the third substrate detection sensor 38, and the fourth substrate detection sensor 39 are connected. The substrate transfer mechanism 2 includes a carry-in drive mechanism 30b, a rail elevating mechanism 31b, a carry-out drive mechanism 32b, and a contact member drive mechanism 40.

  The control device 50 includes a conveyance control unit 51, an arrival time calculation unit 52, a return time calculation unit 53, a mounting control unit 54, a production data storage unit 55, and a parts information storage unit 56. The transport control unit 51 includes a communication processing unit 51a as an internal processing unit. The production data storage unit 55 is a storage device, and for each type of mounting board to be manufactured, the size (length Lb, etc.) of the board 3, the part name of the part mounted on the board 3, the mounting position (XY coordinates), etc. Is remembered. The component information storage unit 56 is a storage device, and stores the component type (surface mount component, lead component 20), component size, and the like for each component name.

  In FIG. 4, the communication processing unit 51a transmits an unloading request instruction requesting unloading of the substrate 3 to an upstream device, and also receives an unloading request instruction transmitted by a downstream device. The transport control unit 51 controls the substrate transport mechanism 2 based on the detection results of the first substrate detection sensor 36, the second substrate detection sensor 37, the third substrate detection sensor 38, and the fourth substrate detection sensor 39, and the substrate 3 Is received from the upstream device, conveyed, positioned and held at the mounting work position P2, and carried out to the downstream device.

  That is, the transport control unit 51 is a control unit that controls the carry-in drive mechanism 30b, the carry-out drive mechanism 32b, and the contact member drive mechanism 40 to carry the substrate 3 in the carry-in area 30, the mounting area 31, and the carry-out area 32. Further, the transfer controller 51 controls the rail elevating mechanism 31b to raise the rail 31a to clamp (hold) the board 3 while the board 3 is positioned at the mounting work position P2, and clamp the board 3. From that state, the rail 31a is lowered to open the clamp.

  Here, specific control by the transport control unit 51 will be described with reference to FIGS. 5 to 8. 5 and 6, the positions of the front ends 3h and the rear ends 3e of the substrates 3a, 3b, and 3c transported by the substrate transport mechanism 2 and the position of the contact member 42 (vertical axis) along the time T (horizontal axis). Is represented. FIG. 5 shows a process of transferring the next board 3b to the mounting work position P2 after the component mounting work on the board 3a clamped at the mounting work position P2 is completed. FIG. 6 shows a process in which the next board 3c is conveyed to the mounting work position P2 after the component mounting work on the board 3b clamped at the mounting work position P2 is completed.

  First, the control for receiving the substrates 3b and 3c from the upstream apparatus and transporting them to the standby position P1 will be described. In FIGS. 5 and 6, the transfer control unit 51 determines that the front ends 3h of the substrates 3b and 3c that have been unloaded from the upstream apparatus (arrow k2 in FIG. 8B) have reached the loading / unloading port S1. When the detection sensor 36 detects (arrow c1 in FIG. 5, arrow h1 in FIG. 6), the carry-in drive mechanism 30b is operated. As a result, the carry-in conveyor 30a travels to carry the substrates 3b and 3c to the downstream side (arrow k4 in FIG. 8C).

  Based on the length Lb of the substrates 3b and 3c stored in the production data storage unit 55, the transport control unit 51 causes the rear ends 3e of the substrates 3b and 3c to pass the standby position P1 and stop the transport. (FIG. 8 (c)), the carry-in drive mechanism 30b is stopped after a predetermined time from the actuation of the carry-in drive mechanism 30b (arrow d1 in FIG. 5, arrow i1 in FIG. 6).

  The transport controller 51 controls the contact member drive mechanism 40 to raise the contact member 42 to the raised position at the standby position P1 before the front ends 3h of the substrates 3b and 3c reach the standby position P1 (FIG. 5). Section e7, section g1 in FIG. 6, arrow k3 in FIG. 8B). This can prevent the front ends 3h of the substrates 3b and 3c being conveyed from colliding with the contact member 42. Hereinafter, a state in which the contact member 42 returns to the standby position P1 and rises to the raised position is referred to as a “return complete state”.

  When the front ends 3h of the substrates 3b and 3c reach the standby position P1 before the contact member 42 reaches the return completion state, the transport control unit 51 controls the loading drive mechanism 30b to move the loading conveyor 30a to the substrate 3b ,. The conveyance speed for moving 3c to the downstream side is adjusted to be slow. In FIG. 5, since the front end 3h of the substrate 3b reaches the standby position P1 (arrow c2) after the contact member 42 is in the return completion state (section e8), the conveyance speed of the substrate 3b is not adjusted. . On the other hand, in FIG. 6, when the conveyance speed of the substrate 3c is not adjusted, the front end 3h reaches the standby position P1 (arrow h2) before the contact member 42 reaches the return completion state (section g2). The transport control unit 51 makes adjustments to reduce the transport speed.

  The adjustment of the transfer speed is performed even after the front end 3h of the substrate 3c reaches the loading / unloading port S1, and after a predetermined time (or a predetermined distance is passed) after the front end 3h of the substrate 3c passes through the loading / unloading port S1. You may go after). In FIG. 6, when the front end 3h of the substrate 3c is between the carry-in entrance S1 and the standby position P1 (arrow h4) and the conveyance speed is slowed down, the contact member 42 is in the return completion state (section g2). The front end 3h has reached the standby position P1 (arrow h5).

  When the substrates 3b and 3c carried out from the upstream device are transferred to the carry-in conveyor 30a, the substrates 3b and 3c are pushed in by the upstream device and slide on the carry-in conveyor 30a, or the carry-in conveyor 30a is the substrate 3b. The conveyance error is large, for example, idling without receiving 3c. Therefore, the transport controller 51 may adjust (decrease) the transport speed after the second substrate detection sensor 37 detects that the front ends 3h of the substrates 3b and 3c have reached the intermediate position S2. By adjusting the transport speed based on the time T when the transport of the substrates 3b and 3c reaches the stable intermediate position S2, the substrates 3b and 3c can be accurately stopped at the standby position P1. Further, the transport control unit 51 may control the carry-in drive mechanism 30b so that the transport is temporarily stopped instead of slowing the transport speed.

  Next, control for transporting the substrates 3b and 3c from the standby position P1 to the mounting work position P2 will be described. 5 and 6, the transfer control unit 51 controls the contact member drive mechanism 40 in a state where the rear ends 3e of the substrates 3b and 3c have passed the standby position P1 to lower the contact member 42 to the lowered position. (Section e9 in FIG. 5, section g3 in FIG. 6, arrow k5 in FIG. 8C). The conveyance control unit 51 controls the contact member drive mechanism 40 in a state where the contact member 42 is in the lowered position to move the contact member 42 from the standby position P1 to the downstream side (section e10 in FIG. 5, FIG. 6). Section g4, arrow k6 in FIG. 8 (d)). As a result, the rear end 3e is pushed by the contact member 42 and the substrates 3b and 3c move to the downstream side.

  Based on the length Lb of the substrates 3b and 3c stored in the production data storage unit 55, the transport control unit 51 stops the front ends 3h of the substrates 3b and 3c at the mounting work position P2 (arrow c3 in FIG. 5). 6, the contact member drive mechanism 40 is controlled to stop the contact member 42 at a predetermined position (arrow e11 in FIG. 5, arrow g5 in FIG. 6). That is, the contact member 42 is moved downstream from the standby position P1 by a distance (L3-Lb) obtained by subtracting the length Lb of the substrates 3b and 3c from the distance L3 between the standby position P1 and the mounting work position P2. It stops at the position (Fig. 8 (d)). As a result, the substrates 3b and 3c are positioned at the mounting work position P2.

  In FIGS. 5 and 6, when the substrates 3b and 3c are positioned at the mounting work position P2, the transport control unit 51 controls the contact member drive mechanism 40 to move the contact member 42 to the standby position P1 (forwarding). ) (Section e12 in FIG. 5, section g6 in FIG. 6, arrow k7 in FIG. 8E). When the contact member 42 returns to the standby position P1, the transport controller 51 controls the rail elevating mechanism 31b to raise the rail 31a and clamp (hold) the substrates 3b and 3c (section e13 in FIG. 5, FIG. 6 arrow g7, FIG. 8 (e) arrow k8).

  Next, the control for unloading the board 3a for which the component mounting work has been completed out of the apparatus will be described. In FIG. 5, when the component mounting work (FIG. 7A) on the board 3a is completed, the transport control unit 51 controls the rail elevating mechanism 31b to lower the rail 31a to open the clamp of the board 3a ( Section e1, arrow j1 in FIG. 7B).

  When the clamp of the substrate 3a is released, the transport control unit 51 controls the contact member drive mechanism 40 to move the contact member 42 to the downstream side (section e2, arrow j2 in FIG. 7C). The transport controller 51 controls the contact member drive mechanism 40 to move the contact member 42 to the downstream side after the contact member 42 contacts the rear end 3e of the substrate 3a (arrow e3). 3a is moved to the downstream side from the mounting work position P2 (arrow f1) (section e4, arrow j3 in FIG. 7D).

  In FIG. 5, when the third substrate detection sensor 38 detects that the front end 3h of the substrate 3a moving to the downstream side reaches the carry-in / out port S3, the transport control unit 51 detects the arrow f2 (FIG. 7D). , The carry-out drive mechanism 32b is operated. The transport control unit 51 controls the contact member drive mechanism 40 to move the contact member 42 to the delivery position P3 after the front end 3h of the substrate 3a reaches the carry-in / out port S3 (arrow f2) (arrow e5, Arrow j4 in FIG. 7 (e). That is, the contact member 42 is located downstream of the standby position P1 by a distance (L3 + L4) obtained by adding the distance L4 between the mounting work position P2 and the delivery position P3 to the distance L3 between the standby position P1 and the mounting work position P2. (FIG. 7 (e)).

  In the process in which the front end 3h of the substrate 3a moves to the downstream side from the carry-in / out port S3 (section f3), the substrate 3a is transferred to the traveling carry-out conveyor 32a. After the rear end 3e of the substrate 3a has passed the delivery position P3 (arrow e5, arrow f4), the carry-out conveyor 32a conveys the substrate 3a to the downstream side (arrow j5 in FIG. 8A). When the fourth substrate detection sensor 39 detects that the front end 3h of the substrate 3a moving to the downstream side has reached the carry-out exit S4 (arrow f5, FIG. 8A), the carry control unit 51 carries out the carry-out drive mechanism. 32b is suspended.

  When the communication processing unit 51a receives the carry-out request instruction from the device on the downstream side, the transfer control unit 51 reactivates the carry-out drive mechanism 32b (arrow f6) to move the substrate 3a in the carry-out area 32 to the device on the downstream side. To be carried out (section f7, arrow j6 in FIG. 8B). In addition, when the front end 3h of the substrate 3b reaches the unloading exit S4 after the communication processing unit 51a receives the unloading request instruction from the downstream device (FIG. 6), the transport control unit 51 causes the unloading drive mechanism 32b to operate. The substrate 3b is carried out to the apparatus on the downstream side without being temporarily stopped.

  In FIG. 5, the conveyance control unit 51 controls the contact member drive mechanism 40 to move the contact member 42 (arrow e5) that has moved to the delivery position P3 to the standby position P1 (section e6, FIG. 8A). Arrow k1). When the substrate 3 is transferred onto the carry-out conveyor 32a before the contact member 42 reaches the delivery position P3, the contact member 42 may be returned to the standby position P1 without moving to the delivery position P3.

  For example, as shown in FIG. 6, the transfer control unit 51 uses the contact member up to the position where half of the substrate 3b is transferred to the carry-out conveyor 32a based on the length Lb of the substrate 3a stored in the production data storage unit 55. After moving 42 (arrow g8), it may be returned to the standby position P1 (section g9). As a result, the time T (arrow g10) when the contact member 42 moves to the standby position P1 can be shortened. That is, the delivery position P3 does not necessarily have to be set in the carry-out area 32, but may be set in the mounting area 31 according to the length Lb of the substrate 3.

  Further, the transport control unit 51 (control unit) controls the contact member drive mechanism 40 so that the contact member 42 moves in the lowered position to the lowered position at least in the mounting area 31. As a result, it is possible to prevent the arm 41 and the contact member 42 from interfering (colliding) with the suction nozzle and the component holding portion 11a mounted on the lower end of the mounting head 11.

  In FIG. 4, the arrival time calculation unit 52 determines the arrival time at which the front end 3h of the next substrate 3b, 3c unloaded from the upstream device reaches the standby position P1 (arrow c2 in FIG. 5, arrow h2 in FIG. 6). Calculate Ta1 and Ta2. More specifically, the arrival time calculation unit 52 starts from the time T when the first substrate detection sensor 36 detects that the front ends 3h of the substrates 3b and 3c have reached the loading / unloading port S1 (arrow c1 in FIG. 5, FIG. 6). H1), the time obtained by dividing the distance (L1 + L2) between the carry-in entrance S1 and the standby position P1 by the carrying speed of the carry-in conveyor 30a is calculated as arrival times Ta1 and Ta2.

  In addition, the arrival time calculation unit 52 calculates the distance L2 between the intermediate position S2 and the standby position P1 from the time T when the second substrate detection sensor 37 detects that the front ends 3h of the substrates 3b and 3c have reached the intermediate position S2. May be calculated as the arrival times Ta1 and Ta2 after the time obtained by dividing by the transport speed of the carry-in conveyor 30a. By calculating the arrival times Ta1 and Ta2 at the intermediate position S2 where the transfer of the substrates 3b and 3c by the carry-in conveyor 30a is stable, the prediction accuracy of the arrival times Ta1 and Ta2 can be improved.

  In this way, the arrival time calculation unit 52 has the following substrates when the sensors (the first substrate detection sensor 36 and the second substrate detection sensor 37) that detect the substrate 3 installed on the upstream side of the standby position P1 of the carry-in area 30 are the next substrate. Arrival times Ta1 and Ta2 are calculated based on the time T at which 3b and 3c are detected.

  In FIG. 4, the return time calculation unit 53 returns the contact member 42 from the delivery position P3 (arrow e5 in FIG. 5) to the standby position P1 (section e6 in FIG. 5) and ascends to the rising position (section e7 in FIG. 5). , And the return times Tr1 and Tr2 in which the section g1) in FIG. 6 is reached (return completion state). More specifically, the return time calculation unit 53 determines that the contact member drive mechanism 40 applies the distance (L3 + L4) between the transfer position P3 and the standby position P1 from the time T when the contact member 42 reaches the transfer position P3. The time obtained by dividing the contact member 42 by the feedback speed at which the contact member 42 is moved to the upstream side is calculated as the feedback times Tr1 and Tr2.

  When the contact member 42 moving to the downstream side returns to the standby position P1 (moves to the upstream side) before reaching the delivery position P3, the return time calculation unit 53 changes the moving direction. Return times Tr1 and Tr2 are calculated based on the distance from the reverse position (arrow g8 in FIG. 6) to the standby position P1. That is, the return time calculation unit 53 calculates the return times Tr1 and Tr2 based on the position of the contact member 42.

  After the unloading request command is transmitted from the communication processing unit 51a to the upstream device, the timing at which the next substrate 3b, 3c is unloaded from the upstream device changes depending on the processing status of the upstream device. For example, the time T at which the substrate 3b is unloaded from the upstream device after the unloading request command is transmitted (FIG. 5) is later than the time T at which the substrate 3c is unloaded (FIG. 6). In the example of FIG. 5, the arrival time Ta1 of the substrate 3b is later than the return time Tr1 (Tr1 <Ta1). Therefore, when the front end 3h of the substrate 3b reaches the standby position P1, the contact member 42 is already in the raised position (returning completion state), and the front end 3h of the substrate 3b does not collide with the contact member 42. Is conveyed downstream from the standby position P1.

  On the other hand, in the example of FIG. 6, the arrival time Ta2 of the substrate 3c is earlier than the return time Tr2 (Ta2 <Tr2). Therefore, when the conveyance speed of the substrate 3c is not adjusted, the contact member 42 does not return to the standby position P1 when the front end 3h of the substrate 3c reaches the standby position P1, or rises even if it returns to the standby position P1. Not in position (not complete return). When the substrate 3c is conveyed downstream from the standby position P1 in this state, the front end 3h of the substrate 3b collides with the contact member 42 (arrow h3 in FIG. 6).

  Therefore, when the arrival time Ta2 is earlier than the return time Tr2, the transport control unit 51 (control unit) controls to decelerate or temporarily stop the carry-in drive mechanism 30b that carries in the next substrate 3c. In the example of FIG. 6, the transport control unit 51 slows the transport speed (decelerates the loading drive mechanism 30b) so that the front end 3h of the substrate 3c is between the carry-in entrance S1 and the standby position P1 (arrow h4), and moves the substrate 3c. The front end 3h is controlled so as to reach the standby position P1 (arrow h5) at the arrival time Ta3 later than the return time Tr2.

  That is, the transfer control unit 51 (control unit) moves the contact member 42, which has moved the substrate 3a on which the components have been mounted in the mounting area 31 to the unloading area 32, from the delivery position P3 (arrow e5 in FIG. 5) to the standby position. Before returning to P1 and raising the state (return completion state) (section e7 in FIG. 5, section g1 in FIG. 6), carry-in drive so that the front ends 3h of the next substrates 3b and 3c do not reach the standby position P1. The mechanism 30b is controlled.

  Note that, when the arrival time Ta2 is earlier than the return time Tr2, the transport control unit 51 temporarily stops the carry-in drive mechanism 30b when the second substrate detection sensor 37 detects that the front end 3h of the substrate 3c has reached the intermediate position S2. You may make it stop. As a result, the arrival time Ta2 can be delayed. When the arrival time Ta2 is earlier than the return time Tr2, the transport controller 51 may control the contact member drive mechanism 40 to increase the return speed of the contact member 42. Thereby, the return time Tr2 can be advanced.

  When the arrival time Ta2 is earlier than the return time Tr2 and the substrate 3b is transferred onto the carry-out conveyor 32a (arrow g8 in FIG. 6), the transfer control unit 51 controls the contact member drive mechanism 40 to detect the contact. The contact member 42 may be returned to the standby position P1 without moving to the delivery position P3 (arrow g10 in FIG. 6). Thereby, the return time Tr2 can be advanced.

  In FIG. 4, the mounting control unit 54 controls the component supply unit 4, the mounting head 11, the mounting head moving mechanism 12, the head camera 13, the component recognition camera 14, and the lead processing mechanism 35 to clamp (hold) the mounting area 31. The component mounting work for mounting the component on the printed circuit board 3 is performed. When mounting the insertion component 20 on the board 3, the mounting control unit 54 controls the lead processing mechanism 35 to move the lead processing mechanism 35 to a position below the mounting position of the insertion component 20, and the mounted insertion component 20. The lead 21 is processed.

  As described above, the component mounting apparatus 1 includes the carry-in area 30 for carrying in the board 3 received from the upstream apparatus by the carry-in conveyor 30a, and the mounting area 31 for receiving the board 3 from the carry-in area 30 and mounting the component. A carry-out area 32 for carrying out the board 3 carried out from the mounting area 31 to a downstream device by a carry-out conveyor 32a, and a contact member 42 for coming into contact with the rear end 3e of the board 3 to move the board 3 to the downstream side. The contact member drive mechanism 40 that moves the contact member 42 up and down and moves between the standby position P1 set in the carry-in area 30 and the delivery position P3 set on the downstream side, and the carry-in drive mechanism 30b. And a conveyance control unit 51 (control unit) that controls the carry-out drive mechanism 32b and the contact member drive mechanism 40. As a result, the substrate 3 at the mounting work position P2 can be reliably replaced.

  Next, a method of manufacturing a mounting board for manufacturing a mounting board in which components are mounted on the board 3 by the component mounting apparatus 1 will be described along the flow of FIGS. 9 to 11 with reference to FIGS. 5 to 8. In the mounting area 31, it is assumed that the raised rail 31a presses the substrate 3a positioned at the mounting work position P2 against the pressing plate 34 to clamp it (FIG. 7A).

  In FIG. 9, the mounting control unit 54 causes the mounting head 11 to mount a component (inserted component 20) on the substrate 3a in the mounting area 31 (ST1: component mounting step) (FIG. 7A). Next, when there is a board 3b for component mounting work (Yes in ST2), the communication processing unit 51a transmits a carry-out request instruction for the next board 3b to the upstream device (ST3: carry-out request process). That is, after the component mounting step (ST1) is completed, the upstream device is required to carry out the next substrate 3b (ST3).

  Next, the transfer control unit 51 lowers the rail 31a (section e1 in FIG. 5, arrow j1 in FIG. 7B) to release the clamp of the substrate 3a (ST4: clamp release step). Next, the transport control unit 51 moves the contact member 42 at the lowered position of the standby position P1 to the delivery position P3, and carries out the substrate 3a in the mounting area 31 to the downstream device through the carry-out area 32 (ST5: Substrate unloading process).

  In FIG. 9, the transport control unit 51 then moves the contact member 42 that has moved to the delivery position P3 (arrow e5 in FIG. 5, arrow j4 in FIG. 7E) to the standby position P1 (section in FIG. 5). e6, an arrow k1 in FIG. 8A), and an elevated position (ST6: contact member returning step) (section e7 in FIG. 5, arrow k3 in FIG. 8B). As a result, the contact member 42 is in the return completion state. As described above, the communication processing unit 51 a included in the transport control unit 51 (control unit) moves the board 3 a to the carry-out area 32 after the components are mounted on the board 3 a in the mounting area 31. The next apparatus 3b is requested to unload the next substrate 3b from the upstream apparatus before returning to the standby position P1.

  Next, the transfer control unit 51 receives the board 3b carried out from the upstream device, and carries in the board 3b to the mounting work position P2 in the mounting area 31 through the carry-in area 30 (ST7: board carrying-in step). Next, the conveyance control unit 51 moves (forwards) the contact member 42 that has moved to the mounting area 31 (arrow e11 in FIG. 5, k6 in FIG. 8D) to the standby position P1 (ST8: forward contact member). Process) (section e12 in FIG. 5, arrow k7 in FIG. 8 (e)).

Next, the transfer control unit 51 raises the rail 31a to clamp the board 3b positioned at the mounting work position P2 (ST9: board clamping step). As a result, the preparation for mounting the component on the next substrate 3b is completed. As described above, according to the method of manufacturing the mounting board of the present embodiment, the board 3a at the mounting work position P2 can be reliably replaced with the next board 3b.

  In FIG. 9, when there is no substrate 3 to be subjected to the component mounting work after the component mounting process (ST1) (No in ST2), the unloading request process (ST3) is skipped and the clamp release process (ST4), the substrate unloading process. (ST5), the contact member return step (ST6) is executed. As a result, the final board 3a on which the component mounting is completed is carried out to the downstream device, and the manufacturing of the mounting board in the component mounting apparatus 1 is completed.

  Next, the details of the substrate unloading step (ST5) will be described along the flow of FIG. 10 and with reference to FIGS. 5, 7, and 8. In FIG. 10, when the clamp of the substrate 3a is released (ST4), the transport control unit 51 moves the contact member 42 waiting at the standby position P1 to the delivery position P3 (section e2 to section e2 in FIG. 5). e4, arrow j2 in FIG. 7 (c) to arrow j4 in FIG. 7 (e)). During this movement, the contact member 42 contacts the rear end 3e of the board 3a in the mounting area 31 (arrow e3 in FIG. 5) and moves the board 3a to the carry-out area 32 (ST11: carry-out area moving step).

  When the third substrate detection sensor 38 detects that the front end 3h of the substrate 3a has reached the carry-in / out port S3 during the process of moving the substrate 3a to the downstream side (Yes in ST12) (arrow f2 in FIG. 5, FIG. 7D). ), The transfer control unit 51 operates the carry-out conveyor 32a (ST13: carry-out conveyor operating process). After that, the substrate 3a whose rear end 3e is pushed by the contact member 42 and is moving (arrow j4 in FIG. 7E) is transferred onto the traveling carry-out conveyor 32a. Next, the transport control unit 51 stops the movement of the contact member 42 at the delivery position P3 (ST14) (arrow e5 in FIG. 5, FIG. 7E).

  In FIG. 10, when the fourth substrate detection sensor 39 detects that the front end 3h of the substrate 3a that is being conveyed downstream by the unloading conveyor 32a (arrow j5 in FIG. 8A) has reached the unloading outlet S4 (( In ST15 (Yes) (arrow f5 in FIG. 5, FIG. 8A), the transport control unit 51 temporarily stops the carry-out conveyor 32a (ST16: carry-out conveyor temporary stopping step).

  Next, when the communication processing unit 51a receives the unloading request instruction from the downstream device (Yes in ST17), the transport control unit 51 reactivates the unloading conveyor 32a (arrow f6 in FIG. 5) to move the substrate 3a out of the device. (ST18: unloading step outside the apparatus) (section f7 in FIG. 5, arrow j6 in FIG. 8B). That is, in the unloading step outside the apparatus (ST18), the substrate 3a moved to the unloading area 32 is unloaded to the downstream apparatus by the unloading conveyor 32a. This completes a series of substrate unloading steps (ST5).

  Next, the details of the substrate loading step (ST7) will be described along the flow of FIG. 11 and with reference to FIGS. In FIG. 11, first, the return time calculation unit 53 causes the contact member 42 to return to the standby position P1 in the contact member return step (ST6) and rise to the raised position (section e8 in FIG. 5, FIG. 8 (b)) Return time Tr1 is calculated (ST21: Return time calculation step). On the other hand, when the first substrate detection sensor 36 detects that the front end 3h of the substrate 3b that has been unloaded from the upstream apparatus (arrow k2 in FIG. 8B) has reached the loading / unloading port S1 (Yes in ST22) (FIG. The arrow c1 in FIG. 5 and FIG. 8B), the transfer control unit 51 operates the carry-in conveyor 30a (ST23: carry-in conveyor operation step).

  In FIG. 11, when the carry-in conveyor 30a is activated, the arrival time calculation unit 52 detects the substrate 3b installed on the upstream side of the standby position P1 of the carry-in area 30 (first substrate detection sensor 36, second substrate detection). The arrival time Ta1 is calculated based on the time T when the sensor 37) detects the next substrate 3b (ST24: arrival time calculation step). Next, the transport controller 51 determines whether the arrival time Ta1 is earlier than the return time Tr1 (ST25).

  In the example of FIG. 5, the arrival time Ta1 of the substrate 3b is later than the return time Tr1 (No in ST25), and the front end 3h of the substrate 3b does not collide with the abutting member 42. Therefore, the carry-in conveyor 30a is operated as it is and the substrate 3b is not moved. The front end 3h is moved so as to pass the standby position P1 (arrow k4 in FIG. 8C).

  On the other hand, in the example of FIG. 6, the arrival time Ta2 of the substrate 3c is earlier than the return time Tr2 (Yes in ST25), and when the carry-in conveyor 30a is operated as it is, the front end 3h of the substrate 3c collides with the contact member 42 (FIG. 6). Arrow h3). Therefore, if the arrival time Ta2 is earlier than the return time Tr2 (Yes in ST25), the transport control unit 51 decelerates or temporarily stops the traveling of the carry-in conveyor 30a that loads the next substrate 3c, and the arrival time Ta3 is returned to the return time Tr2. The timing is adjusted to be later (ST26: timing adjustment step).

  In FIG. 11, when the front ends 3h of the substrates 3b and 3c pass the standby position P1 and the rear end 3e of the substrate 3b passes the standby position P1 (Yes in ST27) (arrow d1 in FIG. 5 and arrow i1 in FIG. 6). , FIG. 8C), the transfer control unit 51 stops the carry-in conveyor 30a (ST28: carry-in conveyor stopping step). In this way, the return time calculation step (ST21) to the carry-in conveyor stop step (ST28) receive the next substrate 3b, 3c carried out by the upstream apparatus, and the carry-in conveyor 30a causes the next substrate 3b, 3c to arrive after the next board 3b, 3c. This is a standby position loading step of moving the next substrates 3b and 3c until the end 3e passes the standby position P1.

  Then, in the standby position carry-in step, the arrival time calculation step (ST24) of calculating arrival times Ta1 and Ta2 at which the front end 3h of the next substrate 3b, 3c reaches the standby position P1 and the return time calculation of calculating the return times Tr1 and Tr2. When the step (ST21) is executed and the arrival time Ta2 is earlier than the return time Tr2, the traveling of the carry-in conveyor 30a for carrying in the next substrate 3c is decelerated or temporarily stopped in the standby position carry-in step. That is, in the standby position carry-in process, before the contact member returning process (ST6) is completed, the carry-in conveyor 30a is moved so that the front end 3h of the next substrate 3c does not reach the standby position P1.

  In FIG. 11, when the carry-in conveyor 30a is stopped (ST28), the transport control unit 51 lowers the contact member 42 to the lowered position (section e9 in FIG. 5, section g3 in FIG. 6, arrow in FIG. 8C). k5), the contact member 42 is moved to the downstream side (section e10 in FIG. 5, section g4 in FIG. 6, arrow k6 in FIG. 8D), and the rear ends of the next substrates 3b and 3c in the carry-in area 30. 3e is pushed by the contact member 42 and moved to the mounting area 31 (ST29: mounting area moving step) (arrow e11 in FIG. 5, arrow g5 in FIG. 6). The transport controller 51 stops the substrates 3b and 3c at the position where the front end 3h of the substrate 3b becomes the mounting work position P2. This completes the series of substrate loading steps (ST7).

  Next, another manufacturing method of a mounting board for manufacturing the mounting board by the component mounting apparatus 1 will be described with reference to the flows of FIGS. 12 and 13. Another method for manufacturing a mounting board is to transmit an instruction to carry out the next board 3b to the upstream device after the contact member returning step (ST6). Different from Hereinafter, the same steps as those in the method of manufacturing the mounting board shown in FIGS.

  In FIG. 12, after the component mounting step (ST1), the clamp opening step (ST4), the board unloading step (ST5), and the contact member returning step (ST6) are executed without executing the unloading request step (ST3). . Next, when there is a board 3b for component mounting work (Yes in ST31), the communication processing unit 51a transmits a carry-out request instruction for the next board 3b to the upstream device (ST32: another carry-out request process). That is, the transport control unit 51 (communication processing unit 51a) returns the contact member 42, which has moved the board 3a on which the components have been mounted in the mounting area 31 to the carry-out area 32, from the delivery position P3 to the standby position P1 and moves up. After the state (return completion state) is reached, the upstream device is requested to carry out the next substrate 3b. That is, another carrying-out request process (ST32) is started after the contact member returning process (ST6) is completed.

  Next, the transfer control unit 51 receives the board 3b carried out from the upstream apparatus from the carry-in area 30, and carries in the board 3b to the mounting work position P2 of the mounting area 31 through the carry-in area 30 (ST33: other board carrying-in step). Next, the contact member feeding step (ST8) and the board clamping step (ST9) are performed, and the preparation for the next component mounting work on the board 3b is completed. After the contact member returning step (ST6), if there is no board 3 on which the component mounting work is to be performed next (No in ST31), the manufacturing of the mounting substrate in the component mounting apparatus 1 is completed.

  Next, details of another substrate loading step (ST33) will be described along the flow of FIG. In the other substrate loading process (ST33), the arrival times Ta1, Ta2, Ta3 and the return times Tr1, Tr2 are not calculated, which is different from the substrate loading process (ST7) shown in FIG. That is, when the first board detection sensor 36 detects that the front end 3h of the board 3b carried out from the upstream device has reached the carry-in entrance S1 (Yes in ST22), the carry-in conveyor operation step (ST23) is executed. .

  Next, when the front end 3h of the substrate 3b passes the standby position P1 and the rear end 3e of the substrate 3b passes the standby position P1 (Yes in ST27), the carry-in conveyor stopping step (ST28) and the mounting area moving step (ST29) are performed. To be executed. As a result, the front end 3h of the substrate 3b is positioned at the mounting work position P2, and a series of other substrate loading steps (ST33) is completed. As described above, in other mounting board manufacturing methods, the board 3a at the mounting work position P2 can be reliably replaced with the next board 3b without calculating the arrival times Ta1, Ta2, Ta3 and the return times Tr1, Tr2. it can.

  INDUSTRIAL APPLICABILITY The component mounting apparatus and the mounting substrate manufacturing method of the present invention have an effect that the substrates at the mounting work positions can be reliably exchanged, and are useful in the field of mounting components on the substrates.

1 Component mounting device 3, 3a Substrate 3b, 3c Next substrate (substrate)
3e Rear end 3h Front end 20 Inserted parts (parts)
21 lead 30 carry-in area 30a carry-in conveyor 30b carry-in drive mechanism 31 mounting area 32 carry-out area 32a carry-out conveyor 32b carry-out drive mechanism 35 lead processing mechanism 36 first substrate detection sensor (sensor)
37 Second Substrate Detection Sensor (Sensor)
40 Contact member drive mechanism 42 Contact member P1 Standby position P3 Delivery position

Claims (16)

Having a carry-in drive mechanism for driving the carry-in conveyor, a carry-in area for carrying in the substrate received from the device on the upstream side in the substrate carrying direction by the carry-in conveyor,
A mounting area for receiving the board from the carry-in area and mounting a component on the board,
Having a carry-out drive mechanism for driving a carry-out conveyor, a carry-out area for carrying out the substrate carried out from the mounting area to a device on the downstream side in the substrate carrying direction by the carry-out conveyor,
A contact member that contacts the rear end of the substrate to move the substrate to the downstream side;
A contact member drive mechanism for moving the contact member up and down and moving it between a standby position set in the carry-in area and a delivery position set downstream of the standby position,
A component mounting apparatus comprising: a carry-in drive mechanism, a carry-out drive mechanism, and a control unit that controls the contact member drive mechanism. The control unit is
The front end of the next substrate does not reach the standby position before returning the contact member, which has moved the substrate, in which the components have been mounted in the mounting area, to the carry-out area, to the standby position and raised. The component mounting apparatus according to claim 1, wherein the carry-in drive mechanism is controlled as described above. The control unit is
During the period from the end of the mounting of the component to the board in the mounting area to the return of the contact member that has moved the board to the carry-out area to the standby position, the next board is connected to the upstream device. The component mounting apparatus according to claim 2, which requests unloading. An arrival time calculation unit that calculates an arrival time at which the front end of the next board reaches the standby position,
A return time calculating unit that calculates a return time when the contact member returns to the standby position and is in a raised state,
The component mounting apparatus according to claim 2, wherein the control unit controls to decelerate or temporarily stop the carry-in drive mechanism that carries in the next substrate when the arrival time is earlier than the return time. . A sensor that detects a substrate on the upstream side of the standby position in the loading area;
The component mounting apparatus according to claim 4, wherein the arrival time calculation unit calculates the arrival time based on a time when the sensor detects the next substrate.   The component mounting apparatus according to claim 4, wherein the return time calculation unit calculates the return time based on the position of the contact member. The control unit is
After the board in which the components have been mounted in the mounting area has been moved to the carry-out area, the contact member is returned to the standby position and raised, and then the next board is carried out to the upstream device. The component mounting apparatus according to claim 1, which makes a request. The control unit is
8. The component mounting apparatus according to claim 1, wherein the contact member driving mechanism is controlled so that the contact member moves in a lowered state at least in the mounting area.   The component mounting apparatus according to claim 1, further comprising a lead processing mechanism that processes a lead of a component mounted on the board in the mounting area. A mounting board manufacturing method for manufacturing a mounting board in which components are mounted on a board by a component mounting device,
The component mounting device has a carry-in area in which a substrate received from a device upstream in the substrate transport direction is carried in by a carry-in conveyor, a mounting area in which the substrate is received from the carry-in area and components are mounted, and a component is carried out from the mounting area. The unloading area for unloading the substrate to a device on the downstream side in the substrate transporting direction by the unloading conveyor, and the vertical movement, and the standby position set in the loading area and the downstream side of the standby position. And a contact member that moves between the delivery position and the rear end of the substrate to move the substrate to the downstream side.
A component mounting step of mounting a component on a board in the mounting area,
A unloading request step of requesting the unloading of the next substrate from the upstream device after the component mounting step is finished;
The contact member waiting at the standby position is moved to the transfer position, and the contact member is brought into contact with the rear end of the substrate in the mounting area during the movement to carry out the substrate. A transfer area moving process to move to the area,
An apparatus unloading step of unloading the substrate to the apparatus on the downstream side by the unloading conveyor,
A contact member returning step of moving the contact member moved to the delivery position to the standby position and raising the contact member;
A standby position carry-in step of receiving the next substrate carried out by the upstream device and moving the next substrate by the carry-in conveyor until the rear end of the next substrate passes the standby position,
A mounting area moving step of lowering the contact member to move it to the downstream side, and moving the next substrate in the carry-in area to the mounting area;
And a contact member forwarding step of moving the contact member moved to the mounting area to the standby position.   11. The mounting board according to claim 10, wherein in the standby position carrying-in step, the carry-in conveyor is moved so that the front end of the next board does not reach the waiting position before the contact member returning step is completed. Production method. An arrival time calculation step of calculating an arrival time at which the front end of the next board reaches the standby position in the standby position loading step;
A return time calculating step of calculating a return time when the contact member returns to the standby position and is in a raised state in the contact member returning step,
The method for manufacturing a mounting board according to claim 11, wherein, when the arrival time is earlier than the return time, the traveling of the carry-in conveyor that carries in the next board is decelerated or temporarily stopped in the standby position carry-in step. The component mounting device includes a sensor that detects a substrate on the upstream side from the standby position in the carry-in area,
The mounting board manufacturing method according to claim 12, wherein, in the arrival time calculating step, the arrival time is calculated based on a time when the sensor detects the next board.   The method for manufacturing a mounting board according to claim 12, wherein the return time is calculated based on the position of the contact member in the return time calculating step.   The method for manufacturing a mounting board according to claim 10, wherein the carry-out request step is started after the contact member returning step is completed.   The method for manufacturing a mounting board according to claim 10, wherein the contact member moves in a lowered state at least in the mounting area.

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