JP2020050951A5 - - Google Patents
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- JP2020050951A5 JP2020050951A5 JP2019168647A JP2019168647A JP2020050951A5 JP 2020050951 A5 JP2020050951 A5 JP 2020050951A5 JP 2019168647 A JP2019168647 A JP 2019168647A JP 2019168647 A JP2019168647 A JP 2019168647A JP 2020050951 A5 JP2020050951 A5 JP 2020050951A5
- Authority
- JP
- Japan
- Prior art keywords
- voltage
- electrostatic chuck
- adsorbed
- applying
- adsorption
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000001179 sorption measurement Methods 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 9
- 239000003463 adsorbent Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 238000000926 separation method Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000000151 deposition Methods 0.000 claims description 2
- 238000001704 evaporation Methods 0.000 claims description 2
- 238000007740 vapor deposition Methods 0.000 claims description 2
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020180113763A KR102411995B1 (ko) | 2018-09-21 | 2018-09-21 | 정전척 시스템, 성막장치, 흡착 및 분리방법, 성막방법 및 전자 디바이스의 제조방법 |
| KR10-2018-0113763 | 2018-09-21 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020050951A JP2020050951A (ja) | 2020-04-02 |
| JP2020050951A5 true JP2020050951A5 (enExample) | 2021-10-21 |
| JP7162845B2 JP7162845B2 (ja) | 2022-10-31 |
Family
ID=69906201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019168647A Active JP7162845B2 (ja) | 2018-09-21 | 2019-09-17 | 静電チャックシステム、成膜装置、吸着及び分離方法、成膜方法及び電子デバイスの製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7162845B2 (enExample) |
| KR (1) | KR102411995B1 (enExample) |
| CN (1) | CN110938805A (enExample) |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06343278A (ja) * | 1993-05-31 | 1994-12-13 | Ryoden Semiconductor Syst Eng Kk | 静電吸着方法 |
| JP2001085504A (ja) | 1999-09-10 | 2001-03-30 | Toto Ltd | 静電吸着力制御装置 |
| JP4647122B2 (ja) * | 2001-03-19 | 2011-03-09 | 株式会社アルバック | 真空処理方法 |
| JP2004152704A (ja) | 2002-11-01 | 2004-05-27 | Matsushita Electric Ind Co Ltd | 有機エレクトロルミネッセンス素子の製造方法 |
| KR101289345B1 (ko) | 2005-07-19 | 2013-07-29 | 주성엔지니어링(주) | 섀도우 마스크와 이를 이용한 정렬장치 |
| JP4677397B2 (ja) | 2006-12-11 | 2011-04-27 | 株式会社巴川製紙所 | 静電吸着方法 |
| KR101000094B1 (ko) * | 2007-08-08 | 2010-12-09 | 엘아이지에이디피 주식회사 | 기판 증착장치 |
| JP4620766B2 (ja) * | 2008-07-31 | 2011-01-26 | 東京エレクトロン株式会社 | はがし装置及びはがし方法 |
| US10304713B2 (en) * | 2013-09-20 | 2019-05-28 | Applied Materials, Inc. | Substrate carrier with integrated electrostatic chuck |
| CN106165141B (zh) | 2014-05-09 | 2019-01-15 | 应用材料公司 | 基板载体系统及使用它的方法 |
| KR102490641B1 (ko) * | 2015-11-25 | 2023-01-20 | 삼성디스플레이 주식회사 | 증착 장치 및 증착 방법 |
| JP6461235B2 (ja) * | 2017-05-22 | 2019-01-30 | キヤノントッキ株式会社 | 基板載置装置、成膜装置、基板載置方法、成膜方法、および電子デバイスの製造方法 |
| KR101961186B1 (ko) * | 2017-09-04 | 2019-03-21 | 주식회사 선익시스템 | 웨이퍼 증착장치 |
| KR102427823B1 (ko) * | 2018-06-11 | 2022-07-29 | 캐논 톡키 가부시키가이샤 | 정전척 시스템, 성막장치, 흡착방법, 성막방법 및 전자 디바이스의 제조방법 |
-
2018
- 2018-09-21 KR KR1020180113763A patent/KR102411995B1/ko active Active
-
2019
- 2019-09-17 JP JP2019168647A patent/JP7162845B2/ja active Active
- 2019-09-20 CN CN201910889626.5A patent/CN110938805A/zh active Pending
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