JP2020040086A - スリーブはんだ付け装置 - Google Patents
スリーブはんだ付け装置 Download PDFInfo
- Publication number
- JP2020040086A JP2020040086A JP2018168748A JP2018168748A JP2020040086A JP 2020040086 A JP2020040086 A JP 2020040086A JP 2018168748 A JP2018168748 A JP 2018168748A JP 2018168748 A JP2018168748 A JP 2018168748A JP 2020040086 A JP2020040086 A JP 2020040086A
- Authority
- JP
- Japan
- Prior art keywords
- deformation
- soldering
- substrate
- sleeve
- auxiliary heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (5)
- 基板(100)のスルーホール(101)に設けられたランド(102)内に電子部品の端子(110)をはんだ付けする装置(10)であって、
筒状に形成され、内部に供給されるはんだを加熱するスリーブ(11)と、
前記基板の変形を検知する変形検知部(18)と、
前記変形検知部による検知結果に応じて制御する制御部(20)と、
を備えるスリーブはんだ付け装置。 - はんだ付けの実行前に予め前記ランドおよび前記端子を局所的に加熱する補助熱源(16,17)をさらに備え、
前記変形検知部(18)は、前記補助熱源による補助加熱時における前記基板の変形を検知する請求項1に記載のスリーブはんだ付け装置。 - 前記変形検知部は、前記基板の変形を時系列で検知する請求項2に記載のスリーブはんだ付け装置。
- 前記制御部は、前記変形検知部が検知する前記基板の変形量が所定量以下となるように前記補助熱源の駆動を制御する請求項2または3に記載のスリーブはんだ付け装置。
- 前記制御部は、スリーブ内部の前記変形検知部が検知する前記基板の変形量が所定量以下となるように前記補助熱源の駆動を制御する請求項2から4の何れか1項に記載のスリーブはんだ付装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018168748A JP7196479B2 (ja) | 2018-09-10 | 2018-09-10 | スリーブはんだ付け装置 |
PCT/JP2019/035222 WO2020054621A1 (ja) | 2018-09-10 | 2019-09-06 | スリーブはんだ付け装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018168748A JP7196479B2 (ja) | 2018-09-10 | 2018-09-10 | スリーブはんだ付け装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020040086A true JP2020040086A (ja) | 2020-03-19 |
JP7196479B2 JP7196479B2 (ja) | 2022-12-27 |
Family
ID=69778278
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018168748A Active JP7196479B2 (ja) | 2018-09-10 | 2018-09-10 | スリーブはんだ付け装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP7196479B2 (ja) |
WO (1) | WO2020054621A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11696411B2 (en) | 2019-05-16 | 2023-07-04 | Denso Corporation | Sleeve soldering device and method of producing electronic device |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61156896A (ja) * | 1984-12-28 | 1986-07-16 | 三菱電機株式会社 | 半田付け方法 |
JP2012134269A (ja) * | 2010-12-21 | 2012-07-12 | Ricoh Microelectronics Co Ltd | ハンダ除去方法及びその装置 |
JP2014146630A (ja) * | 2013-01-28 | 2014-08-14 | Fuji Electric Co Ltd | 半導体装置の製造方法及びはんだごて |
JP2017038007A (ja) * | 2015-08-12 | 2017-02-16 | 株式会社アンド | 半田処理装置 |
JP2018019029A (ja) * | 2016-07-29 | 2018-02-01 | 株式会社アンド | 半田処理装置 |
WO2018025787A1 (ja) * | 2016-07-30 | 2018-02-08 | 株式会社パラット | 半田付け装置および半田付け方法 |
-
2018
- 2018-09-10 JP JP2018168748A patent/JP7196479B2/ja active Active
-
2019
- 2019-09-06 WO PCT/JP2019/035222 patent/WO2020054621A1/ja active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61156896A (ja) * | 1984-12-28 | 1986-07-16 | 三菱電機株式会社 | 半田付け方法 |
JP2012134269A (ja) * | 2010-12-21 | 2012-07-12 | Ricoh Microelectronics Co Ltd | ハンダ除去方法及びその装置 |
JP2014146630A (ja) * | 2013-01-28 | 2014-08-14 | Fuji Electric Co Ltd | 半導体装置の製造方法及びはんだごて |
JP2017038007A (ja) * | 2015-08-12 | 2017-02-16 | 株式会社アンド | 半田処理装置 |
JP2018019029A (ja) * | 2016-07-29 | 2018-02-01 | 株式会社アンド | 半田処理装置 |
WO2018025787A1 (ja) * | 2016-07-30 | 2018-02-08 | 株式会社パラット | 半田付け装置および半田付け方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11696411B2 (en) | 2019-05-16 | 2023-07-04 | Denso Corporation | Sleeve soldering device and method of producing electronic device |
Also Published As
Publication number | Publication date |
---|---|
WO2020054621A1 (ja) | 2020-03-19 |
JP7196479B2 (ja) | 2022-12-27 |
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