JP2020035969A - Electronic component and mounting structure of electronic component - Google Patents

Abstract

To provide an electronic component which can achieve both high capacity of an electrostatic capacitance and reduction in size, and a mounting structure of an electronic component.SOLUTION: An electronic component 1 has a plurality of multilayer capacitors 3, a case 5 which has a pair of first side parts 5a and 5b and a pair of second side parts 5c and 5d and has an opening 5o formed of the pair of first side parts 5a and 5b and the pair of second side parts 5c and 5d, a first lead wire 7 connected to a first external electrode 3b and a second lead wire 9 connected to a second external electrode 3c, in which the case 5 has a larger third dimension in a third direction perpendicular to a first direction and a second direction than a first dimension in the first direction along an opposite direction of the pair of first side parts 5a and 5b and a second dimension in the second direction along an opposite direction of the pair of second side parts 5c and 5d, and the first lead wire and the second lead wire project from the opening of the case to the outside of the case.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electronic component and a mounting structure for the electronic component.

  The capacitor includes a body, a pair of external electrodes arranged on an outer surface of the body, and a plurality of internal electrodes arranged inside the body (for example, see Patent Document 1). .

JP-A-3-218613

  In an electronic component, a plurality of capacitors are connected in parallel to secure a large capacitance. In this configuration, the size of the electronic component must be increased. In a circuit board or the like on which electronic components are mounted, there is a limit on a space in which the electronic components are mounted.

  An object of one aspect of the present invention is to provide an electronic component and a mounting structure of the electronic component, which can increase the capacitance and reduce the size.

  An electronic component according to one aspect of the present invention includes a plurality of capacitors each including a pair of external electrodes arranged to face each other, a pair of first side portions facing each other, and faces each other. At least a pair of second side portions, a hollow portion capable of accommodating a plurality of capacitors is formed by the pair of first side portions and the pair of second side portions, and the pair of first side portions and the pair of second side portions. A case having an opening formed by the second side, a connection member connected to one external electrode in each of the plurality of capacitors, and a second lead wire connected to the other external electrode Wherein the case has a first dimension in a first direction along the opposing direction of the pair of first side parts, and a second dimension in a second direction along the opposing direction of the pair of second side parts. Are orthogonal to the first and second directions. The third dimension is large along a third direction, the first lead and the second lead wire protrudes from the opening of the case to outside the case.

  In the electronic component according to one aspect of the present invention, the first lead wire is connected to one external electrode of each of the plurality of capacitors, and the second lead wire is connected to the other external electrode of each of the plurality of capacitors. ing. Thus, in the electronic component, a plurality of capacitors are connected in parallel. Therefore, the capacitance of the electronic component can be increased. In the electronic component, the case has a shape in which the third dimension is larger than the first dimension and the second dimension, and has an opening. In the electronic component, a plurality of capacitors, the first lead wire, and the second lead wire can be accommodated in the case having such a configuration through the opening. Therefore, the electronic component can be downsized in a configuration in which a plurality of capacitors are connected in parallel.

  In one embodiment, a fourth dimension of a portion where the first lead wire and the second lead wire protrude outside the case may be larger than the first dimension and the second dimension. With this configuration, when mounting the electronic component, the height of the electronic component can be reduced by bending the first lead wire and the second lead wire.

  In one embodiment, the third dimension may be larger than a fourth dimension of a portion where the first lead wire and the second lead wire project outside the case. With this configuration, the height of the electronic component can be reduced.

  In one embodiment, at least two of the pair of first side portions and the pair of second side portions are provided with a groove at the end on the opening side from the inner surface to the outer surface of the side portion. May be. With this configuration, when mounting the electronic component, the first lead wire and the second lead wire can be accommodated in the groove when the opening of the electronic component faces the circuit board or the like. Thus, since the first lead wire and the second lead wire are not disposed between the side end surface and the circuit board, the electronic component can be stably mounted on the circuit board.

  In one embodiment, the case has a third side located at a position facing the opening, and a capacitor and a third side located closest to the third side. Is larger than the distance between the first and second lead wires and the third side, and a resin member having electrical insulation between the capacitor and the third side is filled. It may be provided in the state where it is. In this configuration, since the resin member is filled in the gap between the capacitor and the third side portion, electrical insulation between the pair of external electrodes of the capacitor can be secured. Therefore, it is possible to suppress the occurrence of a short circuit caused by the occurrence of discharge between the pair of outer electrodes. As a result, the reliability of the electronic component 1 can be improved.

  In one embodiment, the plurality of capacitors may be arranged side by side along the third direction of the case. In this configuration, since a plurality of capacitors are arranged in the case along the third direction of the case, the size of the electronic component can be reduced while increasing the capacity.

  An electronic component mounting structure according to one aspect of the present invention includes the above electronic component and a circuit board having a mounting surface on which the electronic component is mounted.

  In the electronic component mounting structure according to one aspect of the present invention, in the above electronic component, the capacitance can be increased and the size can be reduced.

  In one embodiment, the electronic component may be arranged such that one side of the pair of first sides and the pair of second sides faces the mounting surface of the circuit board. With this configuration, the electronic component can be mounted at a low height. Therefore, the mounting structure is particularly effective when the space for mounting the electronic component is limited.

  In one embodiment, the electronic component may be arranged such that the opening faces the mounting surface of the circuit board. That is, the electronic component may be arranged such that ends of the pair of first side portions and the pair of second side portions forming the opening face the mounting surface. In such a mounting form, if a groove is formed on the side, the first lead wire and the second lead wire are accommodated in the groove. Therefore, since the first lead wire and the second lead wire are not arranged between the end surfaces of the pair of first side portions and the pair of second side portions and the mounting surface, the electronic component is stably mounted on the circuit board. it can.

  According to one aspect of the present invention, the capacitance can be increased and the size can be reduced.

FIG. 1 is a perspective view showing an electronic component according to one embodiment. FIG. 2 is a top view of the electronic component shown in FIG. FIG. 3 is a side view of the electronic component shown in FIG. FIG. 4A is a perspective view showing the multilayer capacitor, and FIG. 4B is an exploded perspective view of the element body of the multilayer capacitor. FIG. 5 is a front view of the electronic component shown in FIG. FIG. 6 is a diagram showing a cross-sectional configuration along the line VI-VI in FIG. FIG. 7 is an enlarged sectional view showing a part of the electronic component. FIG. 8 is an equivalent circuit diagram of the electronic component. FIG. 9 is a diagram illustrating an example of a mounting structure of an electronic component. FIG. 10 is a diagram illustrating an example of a mounting structure of an electronic component.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or corresponding elements will be denoted by the same reference symbols, without redundant description.

  As shown in FIGS. 1, 2, and 3, the electronic component 1 includes a plurality of multilayer capacitors 3, a case 5, a first lead 7 and a second lead 9.

  Each of the plurality (seven in the present embodiment) of the multilayer capacitors 3 has the same configuration. As shown in FIG. 4A, the multilayer capacitor 3 includes a body 3a, a first external electrode (one external electrode) 3b and a second external electrode (the other) disposed on the outer surface of the body 3a. 3c).

The element body 3a has a rectangular parallelepiped shape. The rectangular parallelepiped shape includes a rectangular parallelepiped shape in which corners and ridges are chamfered, and a rectangular parallelepiped in which the corners and ridges are rounded. As shown in FIG. 4B, the element body 3a is configured by stacking a plurality of dielectric layers (insulator layers) 4. Each dielectric layer 4 is a sintered body of a ceramic green sheet containing, for example, a dielectric material (dielectric ceramic such as BaTiO ₃ , Ba (Ti, Zr) O ₃ , or (Ba, Ca) TiO ₃ ). Consists of In the actual element body 3a, the dielectric layers 4 are integrated so that the boundaries between the dielectric layers 4 cannot be visually recognized.

  The multilayer capacitor 3 includes a plurality of first internal electrodes 6a and a plurality of second internal electrodes 6b as internal conductors arranged in the element body 3a. In the present embodiment, the number of the plurality of first internal electrodes 6a is the same as the number of the plurality of second internal electrodes 6b. The plurality of first internal electrodes 6a and the plurality of second internal electrodes 6b are made of a conductive material (for example, Ni or Cu) which is generally used as an internal electrode of a laminated electric element. The plurality of first internal electrodes 6a and the plurality of second internal electrodes 6b are configured as a sintered body of a conductive paste containing the conductive material.

  The first internal electrodes 6a and the second internal electrodes 6b are arranged alternately. The first internal electrodes 6a and the second internal electrodes 6b are alternately arranged in the element body 3a so as to face each other with an interval in the direction in which the dielectric layers 4 are stacked.

  As shown in FIG. 4A, the first external electrode 3b is disposed on one end side of the element body 3a in the longitudinal direction, and the second external electrode 3c is disposed on the other end of the element body 3a in the longitudinal direction. It is arranged on the part side. That is, the first external electrode 3b and the second external electrode 3c face each other in the longitudinal direction of the element body 3a, and are separated from each other. The first external electrode 3b and the second external electrode 3c include a conductive material (for example, Ag or Pd). The first external electrode 3b and the second external electrode 3c are configured as a sintered body of a conductive paste containing a conductive metal powder (for example, Ag powder or Pd powder). The first external electrode 3b and the second external electrode 3c are subjected to electroplating, so that a plating layer is formed on the surfaces thereof. For the electroplating, for example, Ni, Sn, or the like is used.

  As shown in FIGS. 1 and 2, the plurality of multilayer capacitors 3 are arranged in a line in the third direction D3. In each of the plurality of multilayer capacitors 3, the facing direction of the first external electrode 3b and the second external electrode 3c is along the second direction D2 orthogonal (intersecting) to the third direction D3. In the present embodiment, the first direction D1 is the width direction of the electronic component 1. The second direction D2 is a length direction of the electronic component 1. A third direction D3 orthogonal to the first direction D1 and the second direction D2 is a height direction of the electronic component 1.

  As shown in FIG. 1, the case 5 contains a plurality of multilayer capacitors 3. The case 5 is formed of an insulating resin. The case 5 includes a pair of first side portions 5a and 5b facing each other, a pair of second side portions 5c and 5d facing each other, and the first side portions 5a and 5b and the second side portion 5c. And a third side 5e closing one of the openings formed by 5d. In the present embodiment, the facing direction of the pair of first side portions 5a and 5b is along the first direction D1. The facing direction of the pair of second side portions 5c and 5d is along the second direction D2. The case 5 has a rectangular parallelepiped shape. In the case 5, a rectangular hollow portion capable of accommodating a plurality of multilayer capacitors 3 is formed by the first side portions 5a and 5b, the second side portions 5c and 5d, and the third side portion 5e. In the case 5, an opening 5o is formed by the first side portions 5a and 5b and the second side portions 5c and 5d.

  As shown in FIG. 1, a groove 5s is provided in the second side portion 5c. Specifically, the groove 5s is provided at an end of the second side 5c on the side of the opening 5o (an end opposite to the end of the third side 5e). The groove 5s is formed over the inner surface and the outer surface of the second side 5c. The groove 5s is formed continuously with the end face of the second side 5c. The cross section of the groove 5s has, for example, a semicircular shape. The groove 5s is arranged at a position corresponding to the first lead wire 7 in the first direction D1. In the present embodiment, the groove 5s is arranged at an end of the second side portion 5c at a substantially central portion in the first direction D1.

  The second side portion 5d is also provided with a groove 5s. Specifically, the groove 5s is provided at an end of the second side 5d on the opening 5o side. The groove 5s is formed over the inner surface and the outer surface of the second side 5d. The groove 5s is formed continuously with the end face of the second side 5d. The cross section of the groove 5s has, for example, a semicircular shape. The groove 5s is arranged at a position corresponding to the second lead wire 9 in the first direction D1. In the present embodiment, the groove 5s is disposed at an end of the second side 5d at a substantially central portion in the first direction D1.

  As shown in FIG. 2 or FIG. 3, in the case 5, the first dimension W along the first direction D1 and the second dimension L along the second direction D2 are the first dimension W along the third direction D3. It is smaller than three dimensions T1 (W, L <T1). In other words, the third dimension T1 is larger than the first dimension W and the second dimension L. In the present embodiment, the first dimension W is smaller than the second dimension L (W <L). The first dimension W corresponds to the height direction of the multilayer capacitor 3. The second dimension L corresponds to the longitudinal direction of the multilayer capacitor 3. The third dimension T1 corresponds to the width direction of the multilayer capacitor 3.

  The first lead wire 7 is connected to the first external electrode 3b of each of the plurality of multilayer capacitors 3. The first lead wire 7 is a linear member and can maintain its shape and can be deformed (bent). The first lead wire 7 is formed of a conductive member (for example, metal or the like). The first lead wire 7 is arranged so that the longitudinal direction is along the third direction D3. The first lead wire 7 is arranged between the first external electrode 3b and the second side 5c of the case 5. The first lead wire 7 is joined to the first external electrode 3b by solder S1 (see FIG. 6).

  One end of the first lead wire 7 in the third direction D3 projects outside the case 5. The first lead wire 7 protrudes from the opening 5 o of the case 5 to the outside of the case 5. As shown in FIGS. 2 and 3, the fourth dimension T2 of the portion of the first lead wire 7 protruding outside the case 5 is larger than the first dimension W and the second dimension L of the case 5 ( T2> W, L). In the present embodiment, the fourth dimension T2 is smaller than the third dimension T1 of the case 5 (T2 <T1). As shown in FIG. 7, the other end of the first lead wire 7 in the third direction D3 is in contact with (close to) the third side 5 e of the case 5.

  The second lead wire 9 is connected to the second external electrode 3c of each of the plurality of multilayer capacitors 3. The second lead wire 9 is a linear member and can maintain its shape and can be deformed (bent). The second lead wire 9 is formed of a conductive member (for example, metal). The second lead wire 9 is arranged such that the longitudinal direction is along the third direction D3. The second lead wire 9 is arranged between the second external electrode 3c and the second side 5d of the case 5. The second lead wire 9 is joined to the second external electrode 3c by solder S2 (see FIG. 6).

  One end of the second lead wire 9 in the third direction D3 projects outside the case 5. The second lead wire 9 protrudes from the opening 5o of the case 5 to the outside of the case 5. As shown in FIGS. 2 and 3, the fourth dimension T2 of the portion of the second lead wire 9 protruding outside the case 5 is larger than the first dimension W and the second dimension L of the case 5 ( T2> W, L). In the present embodiment, the fourth dimension T2 is smaller than the third dimension T1 of the case 5 (T2 <T1). As shown in FIG. 7, the other end of the second lead wire 9 in the third direction D3 is in contact with (close to) the third side 5e of the case 5.

  As shown in FIGS. 5 and 6, the case 5 is filled with a resin member R. The resin member R is a resin having electrical insulation. The resin member R has, for example, transparency (being transparent). In the electronic component 1, the plurality of multilayer capacitors 3, the first lead wire 7, and the second lead wire 9 are fixed in the case 5 by the resin member R filled in the case 5. That is, the electronic component 1 is integrated (moduleed).

  As shown in FIG. 7, the other ends of the first lead wire 7 and the second lead wire 9 are in contact with the third side 5 e of the case 5. In the plurality of multilayer capacitors 3 arranged along the third direction D3, the multilayer capacitor 3 arranged at a position closest to the third side 5e of the case 5 has a predetermined distance from the third side 5e. It is arranged open. That is, the distance between the multilayer capacitor 3 disposed closest to the third side 5e and the third side 5e is equal to the distance between the first lead 7 and the second lead 9 and the third side 5e. Greater than the distance between. Thereby, a gap A is formed between the multilayer capacitor 3 and the third side 5e. The space A is provided in a state where the resin member R is filled.

  As shown in FIG. 8, in the electronic component 1 having the above configuration, a plurality of capacitors C1 to C7 are connected in parallel. Specifically, in the electronic component 1, the capacitors C1 to C7 are configured by the first internal electrode 6a and the second internal electrode 6b of the multilayer capacitor 3.

  Subsequently, a mounting structure of the electronic component 1 will be described. In FIG. 9, the circuit board 110 is shown in cross section for convenience of explanation. As shown in FIG. 9, the mounting structure 100 of the electronic component 1 includes the electronic component 1 and a circuit board 110. The circuit board 110 is mounted on another electronic device or the like. The circuit board 110 has a hole conductor 112 electrically connected to a wiring (not shown). The electronic component 1 is arranged such that the mounting surface 110a of the circuit board 110 and the first side 5b of the case 5 face each other. The second lead wire 9 (the first lead wire 7) is bent at approximately 90 ° and is electrically connected to the hole conductor 112.

  As shown in FIG. 10, the electronic component 1 mounting structure 120 includes the electronic component 1 and a circuit board 122. The circuit board 122 has a first electrode 124 and a second electrode 126. The electronic component 1 is arranged so that the opening 5o of the case 5 faces the mounting surface 122a of the circuit board 122 (so that the openings 5o face each other). That is, the electronic component 1 is arranged such that the ends of the first side portions 5a and 5b and the second side portions 5c and 5d forming the opening 5o face the mounting surface 122a of the circuit board 122.

  The first lead wire 7 is connected to the first electrode 124 by, for example, solder or the like. Specifically, the first lead wire 7 is bent at approximately 90 ° toward the first side portion 5a of the case 5, and is located (accommodated) in the groove 5s. The second lead wire 9 is connected to the second electrode 126 by, for example, solder or the like. Specifically, the second lead wire 9 is bent by approximately 90 ° toward the first side portion 5b of the case 5, and is located in the groove 5s. With such a configuration, the electronic component 1 is disposed such that the ends of the first side portions 5a and 5b and the second side portions 5c and 5d of the case 5 are in contact with (close to) the circuit board 122.

  As described above, in the electronic component 1 according to the present embodiment, the first lead wire 7 is connected to each of the first external electrodes 3b of each of the plurality of multilayer capacitors, and the second lead wire 9 is formed of the plurality of multilayer capacitors. It is connected to each second external electrode 3c of the capacitor 3. Thereby, in the electronic component 1, the plurality of multilayer capacitors 3 are connected in parallel. Therefore, in the electronic component 1, the capacitance can be increased. In the electronic component 1, the case 5 has a shape in which the third dimension T1 is larger than the first dimension W and the second dimension L, and has an opening 5o. In the electronic component 1, the plurality of multilayer capacitors 3, the first lead wire 7, and the second lead wire 9 can be accommodated in the case 5 having such a configuration through the opening 5o. Therefore, the electronic component 1 can be downsized in a configuration in which the plurality of multilayer capacitors 3 are connected in parallel.

  In the electronic component 1 according to the present embodiment, the fourth dimension T2 of the portion where the first lead wire 7 and the second lead wire 9 protrude outside the case 5 is larger than the first dimension W and the second dimension L. . The third dimension T1 of the case 5 is larger than the fourth dimension T2 of the first lead wire 7 and the second lead wire 9. With this configuration, when mounting the electronic component 1, the electronic component 1 can be reduced in height by bending the first lead wire 7 and the second lead wire 9.

  In the electronic component 1 according to the present embodiment, the pair of second side portions 5c and 5d is provided with a groove 5s at the end on the opening 5o side from the inner surface to the outer surface of the first side portions 5a and 5b. . In this configuration, when the electronic component 1 is mounted and the opening 5o of the electronic component 1 is arranged so as to face the circuit board or the like, the first lead wire 7 and the second lead wire 9 are accommodated in the groove 5s. Can be done. As a result, the first lead wire 7 and the second lead wire 9 are not arranged between the end faces of the pair of first side portions 5a and 5b and the circuit board, so that the electronic component 1 is stably mounted on the circuit board. It is possible to do.

  In the electronic component 1 according to the present embodiment, the case 5 has the third side portion 5e arranged at a position facing the opening 5o. In the electronic component 1, the distance between the multilayer capacitor 3 disposed closest to the third side 5e and the third side 5e is equal to the distance between the first lead 7 and the second lead 9 and the third side 5e. It is larger than the distance between the portion 5e. In the electronic component 1, a resin member R having electrical insulation is filled between the multilayer capacitor 3 and the third side 5e. In this configuration, the gap A between the multilayer capacitor 3 and the third side portion 5e is filled with the resin member R, so that the electric power is applied between the first external electrode 3b and the second external electrode 3c of the multilayer capacitor 3. Electrical insulation can be secured. Therefore, it is possible to suppress the occurrence of a short circuit caused by the occurrence of discharge between the first external electrode 3b and the second external electrode 3c. As a result, the reliability of the electronic component can be improved.

  In the electronic component 1 according to the present embodiment, the plurality of multilayer capacitors 3 are arranged side by side along the third direction D3 of the case 5. With this configuration, it is possible to reduce the size while increasing the capacity of the electronic component 1.

  As shown in FIG. 9, in the mounting structure 100 of the electronic component 1 according to the present embodiment, the electronic component 1 is arranged such that the first side 5 b of the case 5 faces the mounting surface 110 a of the circuit board 110. I have. In the configuration described above, the electronic component 1 can be mounted at a low height. Therefore, the mounting structure 100 is particularly effective when the space in which the electronic component 1 is mounted is limited.

  As shown in FIG. 10, in the mounting structure 120 of the electronic component 1 according to the present embodiment, the electronic component 1 is arranged such that the opening 5o faces the mounting surface 122a of the circuit board 122. That is, in the electronic component 1, the ends of the pair of first side portions 5a and 5b and the pair of second side portions 5c and 5d forming the opening 5o are arranged to face the mounting surface 122a. In such a mounting form, when the groove 5s is formed in the second side portions 5c and 5d, the first lead wire 7 and the second lead wire 9 are accommodated in the groove 5s. Therefore, in the mounting structure 120, the first lead wire 7 and the second lead wire 9 are not arranged between the end surfaces of the pair of first side portions 5a and 5b and the pair of second side portions 5c and 5d and the mounting surface 122a. Therefore, the electronic component 1 can be stably mounted on the circuit board 122.

  Although the embodiments of the present invention have been described above, the present invention is not necessarily limited to the above-described embodiments, and various changes can be made without departing from the gist of the present invention.

  In the above embodiment, an example in which the capacitor is the multilayer capacitor 3 has been described. However, the capacitor may be another capacitor or the like.

  In the above embodiment, an example in which the plurality of multilayer capacitors 3 are arranged in a line along the third direction D3 has been described as an example. However, the arrangement of the multilayer capacitor 3 in the case 5 is not limited to this.

  In the above embodiment, an example in which the case 5 has the third side portion 5e has been described. However, the case 5 may not have the third side 5e. The case may have a tubular shape having two openings.

  In the above embodiment, an example in which the groove 5s is provided in the second side portion 5c and the second side portion 5d of the case 5 has been described as an example. However, the groove may be provided on two of the first side 5a, the first side 5b, the second side 5c, and the second side 5d. Further, the grooves need not be provided.

  In the above embodiment, an example in which the case 5 is filled with the resin member R has been described as an example. However, the resin member R may not be filled. The point is that the case 5 only needs to accommodate a plurality of multilayer capacitors 3.

  In the above embodiment, an example in which the case 5 is formed of an insulating resin has been described. However, the case 5 may be formed of an insulating material such as ceramic.

  In the above embodiment, the case where the groove 5s is provided in the first side portions 5a and 5b of the case 5 has been described as an example. However, the groove 5s may not be provided.

  In the above embodiment, in the first lead wire 7 and the second lead wire 9, the fourth dimension T2 of the portion protruding outside the case 5 is larger than the first dimension W and the second dimension L of the case 5. Was described as an example. However, the fourth dimension T2 may be smaller than the first dimension W and / or the second dimension L of the case 5.

  In the above embodiment, in the mounting structure 100 of the electronic component 1 shown in FIG. 9, an example in which the first side portion 5 b of the case 5 of the electronic component 1 is disposed so as to face the mounting surface 110 a of the circuit board 110. explained. However, one of the first side portions 5a and 5b and the second side portions 5c and 5d of the case 5 may be disposed to face the mounting surface 110a of the circuit board 110.

  DESCRIPTION OF SYMBOLS 1 ... Electronic component, 3 ... Multilayer capacitor, 3b ... 1st external electrode, 3c ... 2nd external electrode, 5 ... Case, 5a, 5b ... 1st side part, 5c, 5d ... 2nd side part, 5e ... 3rd Side, 5o Opening, 7 First lead wire, 9 Second lead wire, 100, 120 Mounting structure, 110 Circuit board, 110a Mounting surface, 122 Circuit board, 122a Mounting surface, R ... Resin member.

Claims (9)

A plurality of capacitors each having a pair of external electrodes arranged facing each other,
At least a pair of first side portions facing each other and a pair of second side portions facing each other are provided, and the plurality of capacitors are accommodated by the pair of first side portions and the pair of second side portions. A case in which a possible hollow portion is formed, and which has an opening formed by the pair of the first side portions and the pair of the second side portions;
In each of the plurality of capacitors, a first lead wire connected to one of the external electrodes, and a second lead wire connected to the other of the external electrodes,
The case has a first dimension in a first direction along the facing direction of the pair of first side portions, and a second dimension in a second direction along the facing direction of the pair of second side portions, A third dimension is large along a third direction orthogonal to the first direction and the second direction;
The electronic component, wherein the first lead wire and the second lead wire project from the opening of the case to the outside of the case.   The electronic component according to claim 1, wherein a fourth dimension of a portion where the first lead wire and the second lead wire protrude outside the case is larger than the first dimension and the second dimension.   The electronic component according to claim 1, wherein the third dimension is larger than a fourth dimension of a portion where the first lead wire and the second lead wire protrude outside the case.   Of at least two of the pair of first side portions and the pair of second side portions, a groove is provided at an end on the opening side from an inner surface to an outer surface of the side portion, The electronic component according to claim 1. The case has a third side disposed at a position facing the opening,
The distance between the capacitor disposed closest to the third side portion and the third side portion is a distance between the first lead wire and the second lead wire and the third side portion. Greater than the distance,
5. The electronic component according to claim 1, wherein the electronic component is provided between the capacitor and the third side portion in a state where a resin member having electrical insulation properties is filled.   The electronic component according to claim 1, wherein the plurality of capacitors are arranged side by side along the third direction of the case. An electronic component according to any one of claims 1 to 6,
And a circuit board having a mounting surface on which the electronic component is mounted.   The electronic component according to claim 7, wherein one side of the pair of the first side and the pair of the second side is arranged to face the mounting surface of the circuit board. Mounting structure.   The electronic component mounting structure according to claim 7, wherein the electronic component is arranged so that the opening faces the mounting surface of the circuit board.

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