JP2017085026A - Multilayer ceramic electronic component with metal terminals - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a high-capacity multilayer ceramic electronic component with metal terminals capable of obtaining a sufficient BDV (breakdown voltage) and sufficiently satisfying product properties.SOLUTION: A laminate ceramic electronic component 10 with metal terminals includes a plurality of electronic component bodies 12. Each of the electronic component body includes a laminate 14 and external electrodes 16. The laminate includes a plurality of ceramic layers and a plurality of inner electrode layers and includes principal planes 14a and 14b, side faces 14c and 14d and end faces 14e and 14f. The external electrodes are formed on the end faces 14e and 14f. The plurality of electronic component bodies 12 is arranged side by side in such a manner that the principal planes 14a and 14b oppose each other. The multilayer ceramic electronic component 10 with metal terminals also includes metal terminals 18 that are connected to the external electrodes 16. In the electronic component body 12, a dimension connecting the principal planes 14a and 14b is substantially equal to a dimension connecting the side faces 14c and 14d with each other. Electrode surfaces of the plurality of inner electrode layers are disposed in a direction that is vertical to an extending direction of the metal terminals 18.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a monolithic ceramic electronic component with metal terminals, and in particular, includes two metal terminals arranged along a plurality of monolithic ceramic electronic components arranged side by side and connected to external electrodes of the monolithic ceramic electronic component. The present invention relates to a multilayer ceramic electronic component with metal terminals.

  2. Description of the Related Art Conventionally, in multilayer ceramic electronic components with metal terminals, a structure is known in which a plurality of multilayer ceramic electronic components are connected in parallel to metal terminals for the purpose of increasing capacity (see Patent Document 1).

JP-A-2015-73038

However, when using a multilayer ceramic electronic component with a metal terminal having such a structure, a sufficient dielectric breakdown voltage (hereinafter referred to as BDV) cannot be obtained as compared with a case where the multilayer ceramic electronic component is used alone. In some cases, the product characteristics cannot be satisfied sufficiently.
As a result of intensive studies, the present inventors have found that the above problem is caused by unevenness in the stacking direction of the internal electrodes with respect to the mounting surface.

By the way, as in Patent Document 1, two main surfaces facing each other defined by the longitudinal direction and the width direction, two side surfaces facing each other defined by the longitudinal direction and the stacking direction, and the width direction and stacking When the longitudinal direction of the laminate is longer than the width direction and the width direction is longer than the thickness direction, the stack direction of the internal electrodes is necessarily the mounting surface. It becomes parallel to and no problem occurs.
However, when the dimension in the width direction of the laminate and the dimension in the laminate direction of the laminate are substantially the same, the lamination direction of the internal electrodes is random, and the above problem may occur.

  Therefore, a main object of the present invention is to provide a multilayer ceramic electronic component with a large capacity metal terminal which can obtain a sufficient BDV and sufficiently satisfy the characteristics of the product.

A multilayer ceramic electronic component with a metal terminal according to the present invention includes a plurality of ceramic layers and a plurality of internal electrode layers stacked, and includes a first main surface and a second main surface facing the stacking direction, and a stacking direction A laminated body including a first side surface and a second side surface opposite to each other in a width direction orthogonal to the first side surface, and a first end surface and a second end surface opposite to each other in a length direction perpendicular to the lamination direction and the width direction; A multilayer ceramic electronic component with metal terminals, comprising: a plurality of electronic component bodies having external electrodes formed on an end face of the laminate; and two metal terminals connected to the external electrodes of the plurality of electronic component bodies. The plurality of electronic component bodies have substantially the same dimension in the stacking direction connecting the first main surface and the second main surface and the width direction connecting the first side surface and the second side surface. The metal terminal is a lead terminal. Ri, the electrode surfaces of the plurality of internal electrode layers of the plurality of electronic component body is arranged perpendicular to the direction in which the metal terminal extends, a laminated ceramic electronic component with a metal terminal.
Moreover, the multilayer ceramic electronic component with metal terminals according to the present invention has a terminal joint portion where the metal terminal is connected to the external electrode, and a terminal extension portion extending from the terminal joint portion toward the mounting surface. The extension portion is preferably curved to support the electronic component body below the electronic component body closest to the mounting surface side.
Furthermore, in the multilayer ceramic electronic component with metal terminals according to the present invention, the multilayer ceramic electronic component with metal terminals preferably includes an exterior material that covers a plurality of electronic component bodies, terminal joint portions, and part of the terminal extension portions. .

  In the multilayer ceramic electronic component with metal terminals according to the present invention, the electrode surfaces of the internal electrode layers of the electronic component body are aligned in one direction, and are stacked so as to be perpendicular to the direction in which the metal terminals extend. Since a breakdown voltage (BDV) close to that obtained when the electronic component main body is used alone can be obtained, the characteristics of the multilayer ceramic electronic component with metal terminals can be sufficiently satisfied. This is probably because the breakdown voltage due to electrostriction of the electronic component main body varies depending on the stacking direction, and the stress concentration is minimized by aligning in a direction in which the ceramic displacement due to electrostriction is small.

  According to this invention, a sufficient capacity BDV can be obtained, and a large capacity multilayer ceramic electronic component with a metal terminal that can sufficiently satisfy the characteristics of the product can be obtained.

  The above-described object, other objects, features, and advantages of the present invention will become more apparent from the following description of embodiments for carrying out the invention with reference to the drawings.

It is an external appearance perspective view which shows an example of the multilayer ceramic electronic component with a metal terminal of this invention. It is a perspective view which shows the external shape of the electronic component main body used for the laminated ceramic electronic component with a metal terminal shown in FIG. (A) is sectional drawing in line II-II of the electronic component main body shown in FIG. 2, (b) is sectional drawing in line III-III of the electronic component main body shown in FIG. (A) (b) is an illustration figure which shows the connection relation of the electronic component main body of a multilayer ceramic electronic component with a metal terminal shown in FIG. 1, and a metal terminal. It is a cross-sectional solution figure in line II of the multilayer ceramic electronic component with a metal terminal shown to Fig.1 (a). (A) is an illustration figure which shows an example of the state which mounted the multilayer ceramic electronic component with a metal terminal of this invention on the circuit board, (b) mounted the multilayer ceramic electronic component with a metal terminal of this invention on the circuit board. It is an illustration figure which shows the other example of a state. (A) is a cross-sectional view of the multilayer ceramic electronic component with metal terminals in Comparative Example 1, and (b) is a cross-sectional view of the multilayer ceramic electronic component with metal terminals in Comparative Example 2. It is the figure which showed the measurement result of dielectric breakdown voltage by frequency distribution, (a) is the measurement result of the breakdown voltage in the sample concerning a reference example, (b) is the measurement of the dielectric breakdown voltage in the sample concerning an Example. (C) is a measurement result of the breakdown voltage in the sample according to Comparative Example 1, and (d) is a measurement result of the breakdown voltage in the sample according to Comparative Example 2.

1. Multilayer ceramic electronic component with metal terminal A multilayer ceramic electronic component with metal terminal according to an embodiment of the present invention will be described. FIG. 1 is an external perspective view showing an example of a multilayer ceramic electronic component with metal terminals according to the present invention. FIG. 2 is a perspective view showing an outer shape of an electronic component body used in the multilayer ceramic electronic component with metal terminals shown in FIG. 3A is a cross-sectional view taken along line II-II of the electronic component main body shown in FIG. 2, and FIG. 3B is a cross-sectional view taken along line III-III of the electronic component main body shown in FIG. is there.

  A multilayer ceramic electronic component 10 with metal terminals according to this embodiment includes an electronic component body 12 which is a plurality of multilayer ceramic electronic components. The electronic component body 12 includes a laminate 14 and external electrodes 16. The multilayer ceramic electronic component 10 with metal terminals includes a metal terminal 18 connected to the external electrode 16 of the electronic component body 12.

  The stacked body 14 includes a plurality of stacked ceramic layers 20 and a plurality of internal electrode layers 22. The laminated body 14 includes a first main surface 14a and a second main surface 14b facing each other, a first side surface 14c and a second side surface 14d facing each other, a first end surface 14e and a second surface facing each other. End face 14f. The first main surface 14a and the second main surface 14b extend along the length direction L and the width direction W, respectively. The first side surface 14c and the second side surface 14d extend along the length direction L and the stacking direction T, respectively. The first end surface 14e and the second end surface 14f extend along the width direction W and the stacking direction T, respectively. The first main surface 14a and the second main surface 14b are parallel to the surface (mounting surface) on which the electronic component main body 12 is mounted.

  Therefore, the length direction L is a direction connecting a pair of end surfaces, the width direction W is a direction connecting a pair of side surfaces, and the stacking direction T is a pair of main surfaces. It is the direction. The laminated body 14 included in the electronic component body 12 connects the first side surface 14c and the second side surface 14d with the dimension in the stacking direction T connecting the first main surface 14a and the second main surface 14b. The dimensions in the width direction W are substantially the same.

  In the multilayer ceramic electronic component 10 with metal terminals according to this embodiment, the multilayer body 14 is formed in a rectangular parallelepiped shape. Moreover, it is preferable that the laminated body 14 is rounded in the corner | angular part and the ridgeline part. Here, the corner portion is a portion where three surfaces of the laminate 14 intersect, and the ridge line portion is a portion where two surfaces of the laminate 14 intersect.

  The ceramic layer 20 includes an outer layer portion 20a and an inner layer portion 20b. The outer layer portion 20a is located on the first main surface 14a side and the second main surface 14b side of the stacked body 14, and is formed between the first main surface 14a and the internal electrode layer 22 closest to the first main surface 14a. The ceramic layer 20 is positioned between the second main surface 14b and the internal electrode layer 22 closest to the second main surface 14b. A region sandwiched between both outer layer portions 20a is the inner layer portion 20b.

The ceramic layer 20 can be formed of, for example, a dielectric material. As the dielectric material, for example, a dielectric ceramic containing a component such as BaTiO ₃ , CaTiO ₃ , SrTiO ₃ , or CaZrO ₃ can be used. When the above dielectric material is included as a main component, the content is less than that of the main component such as Mn compound, Fe compound, Cr compound, Co compound, Ni compound, etc., depending on the desired characteristics of the electronic component body 12. You may use what added the component.

As described above, the laminate 14 according to this embodiment is made of a dielectric ceramic. Therefore, the electronic component main body 12 functions as a capacitor.
On the other hand, when a piezoelectric ceramic is used for the laminated body 14, the electronic component main body 12 functions as a ceramic piezoelectric element. Specific examples of the piezoelectric ceramic material include, for example, a PZT (lead zirconate titanate) ceramic material.
Moreover, when a semiconductor ceramic is used for the laminated body 14, the electronic component main body 12 functions as a thermistor element. Specific examples of the semiconductor ceramic material include spinel ceramic materials.
Further, when a magnetic ceramic is used for the laminated body 14, the electronic component main body 12 functions as an inductor element. When functioning as an inductor element, the internal electrode 24 becomes a coiled conductor. Specific examples of the magnetic ceramic material include a ferrite ceramic material.

  The thickness of the ceramic layer 20 after firing is preferably 0.5 μm or more and 10 μm or less.

  As illustrated in FIG. 3, the stacked body 14 includes, as the plurality of internal electrode layers 22, for example, a plurality of first internal electrode layers 22 a and a plurality of second internal electrode layers 22 b having a substantially rectangular shape. The plurality of first internal electrode layers 22a and the plurality of second internal electrode layers 22b are parallel to the first main surface 14a and the second main surface 14b of the multilayer body 14, and Along the direction T, the ceramic layers 20 are alternately stacked. Therefore, the electrode surfaces of the first internal electrode layer 22a and the second internal electrode layer 22b are arranged perpendicular to the direction in which the metal terminal 18 extends.

  On one end side of the first internal electrode layer 22a, there is an extraction electrode portion 24a that is extracted to the first end surface 14e of the multilayer body 14. On one end side of the second internal electrode layer 22b, there is an extraction electrode portion 24b extracted to the second end face 14f of the multilayer body 14. Specifically, the extraction electrode portion 24 a on one end side of the first internal electrode layer 22 a is exposed on the first end face 14 e of the multilayer body 14. Further, the lead electrode portion 24 b on one end side of the second internal electrode layer 22 b is exposed on the second end face 14 f of the multilayer body 14.

  The multilayer body 14 includes a counter electrode portion 26a in which the first internal electrode layer 22a and the second internal electrode layer 22b face each other in the inner layer portion 20b of the ceramic layer 20. The stacked body 14 is formed between one end in the width direction W of the counter electrode portion 26a and the first side surface 14c and between the other end in the width direction W of the counter electrode portion 26a and the second side surface 14d. Side part (hereinafter referred to as “W gap”) 26 b of the laminate 14. Further, the laminated body 14 is formed between the end portion of the first internal electrode layer 22a opposite to the extraction electrode portion 24a and the second end surface 14f and the extraction electrode portion 24b of the second internal electrode layer 22b. It includes an end portion (hereinafter referred to as “L gap”) 26c of the stacked body 14 formed between the opposite end portion and the first end face 14e.

  The first internal electrode layer 22a and the second internal electrode layer 22b are made of, for example, a metal such as Ni, Cu, Ag, Pd, or Au, or an alloy such as an Ag—Pd alloy containing one of these metals. can do. The first internal electrode layer 22 a and the second internal electrode layer 22 b may further include dielectric particles having the same composition system as the ceramic included in the ceramic layer 20. The thickness of each of the first internal electrode layer 22a and the second internal electrode layer 22b is preferably 0.1 μm or more and 2 μm or less.

External electrodes 16 are formed on the first end face 14 e side and the second end face 14 f side of the multilayer body 14. The external electrode 16 includes a first external electrode 16a and a second external electrode 16b.
A first external electrode 16 a is formed on the first end face 14 e side of the multilayer body 14. The first external electrode 16a may be formed only on the first end surface 14e of the multilayer body 12, or may be extended from the first end surface 14e to form the first main surface 14a, the second main surface 14b, It may be formed so as to cover a part of the first side surface 14c and the second side surface 14d. In this case, the first external electrode 16a is electrically connected to the extraction electrode portion 24a of the first internal electrode layer 22a.
A second external electrode 16b is formed on the second end face 14f side of the multilayer body 14. The second external electrode 16b may be formed only on the second end surface 14f of the multilayer body 14, or extends from the second end surface 14f to form the first main surface 14a, the second main surface 14b, It may be formed so as to cover a part of the first side surface 14c and the second side surface 14d. In this case, the second external electrode 16b is electrically connected to the extraction electrode portion 24b of the second internal electrode layer 22b.

  In the laminated body 14, the first internal electrode layer 22 a and the second internal electrode layer 22 b are opposed to each other through the ceramic layer 20 in the counter electrode portion 26 a, whereby electric characteristics (for example, electrostatic capacity) are obtained. Occur. Therefore, a capacitance can be obtained between the first external electrode 16a to which the first internal electrode layer 22a is connected and the second external electrode 16b to which the second internal electrode layer 22b is connected. . Therefore, the electronic component body 12 having such a structure functions as a capacitor.

The external electrode 16 has a base electrode layer and a plating layer in order from the laminated body 14 side. Each of the base electrode layers includes at least one selected from a baking layer, a resin layer, a thin film layer, and the like. Here, the base electrode layer formed of the baking layer will be described.
The baking layer includes glass and metal. Examples of the metal for the baking layer include at least one selected from Cu, Ni, Ag, Pd, an Ag—Pd alloy, Au, and the like. The baking layer may be a plurality of layers. The baking layer is formed by applying and baking a conductive paste containing glass and metal on the laminate 14. The baking layer may be fired simultaneously with the ceramic layer 20 and the internal electrode layer 22, or may be fired after the ceramic layer 20 and the internal electrode layer 22 are fired. The thickness of the thickest part in the baking layer is preferably 10 μm or more and 50 μm or less.

A resin layer containing conductive particles and a thermosetting resin may be formed on the surface of the baking layer. The resin layer may be directly formed on the laminate 14 without forming a baking layer. The resin layer may be a plurality of layers. The thickness of the thickest portion of the resin layer is preferably 10 μm or more and 150 μm or less.
Further, the thin film layer is a layer of 1 μm or less formed by a thin film forming method such as a sputtering method or a vapor deposition method and deposited with metal particles.

Moreover, as a plating layer, at least 1 chosen from Cu, Ni, Sn, Ag, Pd, an Ag-Pd alloy, Au etc. is included, for example.
The plating layer may be formed of a plurality of layers. The plating layer preferably has a two-layer structure including a first plating layer provided on the surface of the baking layer and a second plating layer provided on the surface of the first plating layer. It is preferable to use Ni for the first plating layer. In addition, when the internal electrode layer 22 contains Ni, it is preferable to use Cu having good bondability with Ni as the first plating layer. Moreover, it is preferable to use Sn or Au for the second plating layer. The thickness per plating layer is preferably 1 μm or more and 15 μm or less.

The plurality of electronic component main bodies 12 are arranged side by side so that the principal surfaces face each other. The plurality of electronic component bodies 12 may be joined with a joining material or the like. Metal terminals 18 are connected to the plurality of electronic component bodies 12, here, external electrodes 16 on both sides of the five electronic component bodies 12. The plurality of electronic component bodies 12 are soldered to the metal terminals 18 so that the surface direction of the main surface and the direction in which the metal terminals 18 extend are substantially orthogonal. Here, the attachment position of the metal terminal 18 is preferably attached to the center of the end face of the external electrode 16 of the electronic component body 12.
Note that the number of electronic component main bodies 12 connected to the metal terminals 18 is not limited, and fewer or more than five electronic component main bodies 12 may be connected to the metal terminals 18.

  The metal terminal 18 is, for example, a lead terminal. The metal terminal 18 includes a first metal terminal 18a and a second metal terminal 18b. The first metal terminal 18a has a terminal joint portion 28a connected to the first external electrode 18a, and a terminal extension 30a extending from the terminal joint portion 28a. The second metal terminal 18b has a terminal joint portion 28b connected to the second external electrode 18b and a terminal extension portion 30b extending from the terminal joint portion 28b. The terminal joint portion 28a is connected to the first external electrodes 18a of the five electronic component main bodies 12 aligned with the principal surfaces thereof facing each other, and the terminal joint portion 28b is similarly connected to the second external portion. Connected to the electrode 18b. Therefore, the electrode surface of the internal electrode layer 22 of the electronic component body 12 is disposed so as to be perpendicular to the direction in which the terminal extensions 30a and 30b of the metal terminal 18 extend.

  As shown in FIG. 4A, the distal end portion of the terminal joint portion 28a is bent toward the external electrode 18a on the end face of the electronic component main body 12 disposed at one end portion, and the distal end portion of the terminal joint portion 28b. Similarly, the portion is bent toward the external electrode 18b on the end face of the electronic component main body 12 arranged at one end portion. Moreover, in terminal extension part 30a and 30b, it bend | folds in U shape toward the main surface of the electronic component main body 12 arrange | positioned at the other side edge part, and supports the main surface of the electronic component main body 12. FIG. In other words, the terminal extensions 30a and 30b are curved to support the electronic component main body 12 below the electronic component main body 12 closest to the mounting surface side. In this way, the electronic component main body 12 on one side is sandwiched between the respective distal end portions of the terminal connecting portion 28a and the terminal connecting portion 28b, and the main surface of the other electronic component main body 12 is bent on the terminal extending portions 30a and 30b. By supporting, the electronic component main bodies 12 arranged in multiple stages can be positioned without being displaced from the metal terminals 18, and the plurality of electronic component main bodies 12 can be stably aligned. Further, by holding the end face of the electronic component body 12 with the bent end portions of the terminal connection portion 28a and the terminal connection portion 28b, as shown in FIG. 4A, the terminal connection portion 28a and the terminal connection portion 28b A slight gap is formed between the electronic component body 12 and the cream solder as the bonding material 32 easily enters the gap, so that the soldering position between the metal terminal 18 and the electronic component body 12 can be stabilized. Thereby, the terminal connection part 28a and the terminal connection part 28b, and the electronic component main body 12 can be fixed reliably. Further, as shown in FIG. 4B, the terminal connection portion 28 a and the terminal connection portion 28 b are bent in a “<” shape along the end surfaces of the five aligned electronic component bodies 12.

  The diameter of the metal terminal 18 is preferably about 0.3 mm or more and 0.8 mm or less. The terminal connection portions 28a and 28b of the metal terminal 18 and the external electrode 16 of the electronic component body 12 are connected by a bonding material 32 as shown in FIG. For this purpose, the metal terminal 18 is preferably composed of a lead body and a plating film formed on the surface of the lead body.

  The lead body is made of Ni, Fe, Cu, Ag, Cr, or an alloy containing one or more of these metals as a main component. In particular, the lead body is preferably formed of Ni, Fe, Cr, or an alloy containing one or more of these metals as a main component. Specifically, the lead body is formed of an Fe-42Ni alloy, an Fe-18Cr alloy, or the like. Thereby, the heat resistance of the external electrode 16 can be improved.

  A plating film is formed on the surface of the lead body. The plating film covers the exposed part of the lead body. The plating film is composed of a lower plating film formed on the surface of the lead body and an upper plating film formed on the surface of the lower plating film. Each of the lower plating film and the upper plating film may be formed of a plurality of plating films. The thickness of the lower plating film is preferably about 1.0 μm or more and 5.0 μm or less. The thickness of the upper plating film is preferably about 1.0 μm or more and 5.0 μm or less.

  The lower plating film is formed of Ni, Fe, Cu, Ag, Cr, or an alloy containing at least one of these metals as a main component. In particular, the lower plating film is preferably made of Ni, Fe, Cr, or an alloy containing one or more of these metals as a main component. Each of the lead body and the lower plating film is made of high melting point Ni, Fe, Cr or an alloy containing one or more of these metals as a main component, thereby improving the heat resistance of the metal terminal 18. be able to.

  The upper plating film is formed of Sn, Ag, Au, or an alloy containing one or more of these metals as a main component. In particular, the upper plating film is preferably made of Sn or an alloy containing Sn as a main component. By forming the upper plating film with Sn or an alloy containing Sn as a main component, the solderability between the metal terminal 18 and the external electrode 16 can be improved.

  In this way, the two metal terminals 18 and the external electrodes 18 of the electronic component main body 12 disposed along the metal terminals 18 are bonded to each other by the bonding material 32. The terminal joint portion 28a of the first metal terminal 18a and the terminal joint portion 28b of the second metal terminal 18b are formed so as to be bent in a "<" shape, so that the first metal terminal 18a and the second metal terminal 18b When cream solder is attached to the second metal terminal 18b, the extensibility of the cream solder to the terminal joint portion 28a of the first metal terminal 18a and the terminal joint portion 28b of the second metal terminal 18b can be improved. There is an effect. The angle of the "<"-shaped bent portion is preferably about 10 ° to 30 °. As the solder used here, for example, Sn-Sb-based, Sn-Ag-Cu-based, Sn-Cu-based, Sn-Bi-based LF solder can be used. In particular, when Sn—Sb solder is used, the Sb content is preferably about 10%.

  As shown in FIGS. 6A and 6B, the multilayer ceramic electronic component 10 with metal terminals includes an outer surface of a plurality of electronic component bodies 12, a terminal joint portion 28a of the first metal terminal 18a, and a second metal. As necessary, the exterior material is covered with a resin so as to cover the terminal joint portion 28b of the terminal 18b and the terminal extension portion 30a of the first metal terminal 18 and a part of the terminal extension portion 30b of the second metal terminal 18b. 34 may be formed. Thereby, effects such as insulation and water resistance can be obtained. In addition, as a kind of the exterior material 34, an epoxy resin, a silicon resin, etc. can be used.

  Further, as shown in FIG. 6A, the multilayer ceramic electronic component 10 with metal terminals is mounted such that the main surfaces 14a and 14b of the plurality of electronic component bodies 12 are parallel to the mounting surface of the circuit board. Alternatively, as shown in FIG. 6B, the main surfaces 14a and 14b of the plurality of electronic component bodies 12 may be mounted so as to be perpendicular to the mounting surface.

  When the multilayer ceramic electronic component 10 with metal terminals is mounted on a circuit board as shown in FIG. 6A, the electrode surfaces of the first internal electrode layer 22a and the second internal electrode layer 22b are the circuit board. It is arranged so as to be parallel to the mounting surface.

  On the other hand, when the multilayer ceramic electronic component 10 with metal terminals is mounted on the circuit board as shown in FIG. 6B, the electrode surfaces of the first internal electrode 22a and the second internal electrode layer 22b It is arranged perpendicular to the mounting surface of the substrate. When the main surfaces 14a and 14b of the plurality of electronic component bodies 12 are mounted so as to be perpendicular to the mounting surface of the circuit board, the mounting surface and the surface of the multilayer ceramic electronic component 10 with metal terminals are provided. And may be fixed by an adhesive. Moreover, further space saving can be achieved by bending the metal terminal 18 portion of the multilayer ceramic electronic component 10 with metal terminals mounted on the circuit board at a right angle. The bent corner of the metal terminal 18 may be rounded.

  The multilayer ceramic electronic component 10 with metal terminals shown in FIG. 1 has the electrode surface lamination direction of the internal electrode layer 22 of the electronic component body 12 aligned in one direction, and the direction in which the terminal extensions 30a and 30b of the metal terminal 18 extend. Since the dielectric breakdown voltage (BDV) close to that when the electronic component body 12 is used alone is obtained, the characteristics of the multilayer ceramic electronic component 10 with metal terminals are sufficiently satisfied. can do. This is probably because the breakdown voltage due to electrostriction of the electronic component body 12 varies depending on the stacking direction, and the stress concentration is minimized by aligning in a direction where the ceramic displacement due to electrostriction is small.

2. Next, the manufacturing method of this multilayer ceramic electronic component with a metal terminal is demonstrated.

(Create electronic component body)
First, a ceramic green sheet and a conductive paste for internal electrodes are prepared. The conductive paste for ceramic green sheets and internal electrodes contains a binder (for example, a known organic binder) and a solvent (for example, an organic solvent).

  Next, a conductive paste for internal electrodes is printed in a predetermined pattern on the ceramic green sheet by, for example, screen printing or gravure printing to form an internal electrode pattern. In this way, a ceramic green sheet for the inner layer on which the internal electrode pattern is printed is produced. Also, an outer layer ceramic green sheet on which no internal electrode pattern is printed is also produced.

  Then, a predetermined number of outer layer ceramic green sheets on which the internal electrode pattern is not printed are laminated, an inner layer ceramic green sheet on which the inner electrode pattern is printed is sequentially laminated, and an outer layer ceramic green sheet is laminated on the surface. A laminated sheet is produced by laminating a predetermined number of green sheets.

  Further, the laminated sheet is pressed in the laminating direction by means such as isostatic pressing to produce a laminated block.

  Subsequently, a laminated chip is manufactured by cutting the laminated block into a predetermined size. At this time, roundness may be formed at corners and ridges of the laminated chip by barrel polishing or the like.

  Next, a laminated body is produced by firing the laminated chip. The firing temperature is preferably 900 ° C. or higher and 1300 ° C. or lower, although it depends on the ceramic and internal electrode materials.

  Finally, a conductive paste for an external electrode is applied to both end faces of the laminate and baked to form a baked layer for the external electrode. The baking temperature is preferably 700 ° C. or higher and 900 ° C. or lower. If necessary, a plating layer may be formed on the surface of the baking layer. The electronic component body (capacitor) is manufactured as described above.

(Process of attaching a pair of metal terminals to the electronic component body)
Next, the metal terminal mounting process in the method for manufacturing a multilayer ceramic electronic component with metal terminals according to the present invention will be described.

  First, a pair of metal terminals is prepared. In parallel with the step of preparing the pair of metal terminals, the main surfaces of the electronic component main body are arranged side by side so as to face each other. As a result, the direction of the electrode surface of the internal electrode of the electronic component main body is a constant direction. A plurality of electronic component bodies are stacked in a state where they are aligned.

  The plurality of electronic component bodies are sandwiched between a pair of metal terminals so as to be perpendicular to the electrode surfaces of the internal electrodes of the plurality of stacked electronic component bodies, and the end surfaces of the pair of metal terminals and the external electrodes of the electronic component body Are bonded using a bonding material. Solder is used as the bonding material. This soldering is performed by reflow, and the reflow temperature is preferably 270 ° C. or higher and 290 ° C. or lower. As described above, the pair of metal terminals is attached to the plurality of electronic component bodies.

  The effect of the multilayer ceramic electronic component with metal terminals obtained as described above will be apparent from the following experimental example.

3. Experimental Example Hereinafter, an experimental example performed by the inventors to confirm the effect of the present invention will be described.
In the experimental example, the dielectric breakdown voltage (BDV) was measured for the multilayer ceramic electronic component with metal terminals obtained by the above-described method, and the evaluation was performed based on the result. For this evaluation, a sample of the multilayer ceramic electronic component with metal terminal according to the example and each sample of the multilayer ceramic electronic component with metal terminal according to Comparative Example 1 and Comparative Example 2 were prepared. The samples of the multilayer ceramic electronic components with metal terminals of the example, comparative example 1 and comparative example 2 are different in the method of stacking the electronic component bodies.
Further, for this evaluation, a sample of the electronic component main body alone was prepared as a reference example, and the dielectric breakdown voltage was also measured for the sample of the electronic component main body according to the reference example.
The electronic component body used in this experimental example was a multilayer ceramic capacitor.

The specifications of the electronic component main body used in the reference examples, examples, and comparative examples 1 and 2 are as follows. Note that dimensions such as size are design values.
Size: L x W x T = 3.2 mm x 2.5 mm x 2.5 mm
Ceramic layer material: BaTiO ₃
Internal electrode layer: Ni
Structure of external electrode Base electrode layer: Cu
Plating layer: Ni plating layer, two-layer structure consisting of Sn plating layer Metal terminal Terminal body diameter: 0.6 mm
Lower layer plating: Cu
Upper layer plating: Sn

(Reference example)
The sample according to the reference example is a single electronic component body.

(Example)
In order to prepare a sample of the multilayer ceramic electronic component with metal terminals according to the example, five electronic component bodies were prepared for each multilayer ceramic electronic component with metal terminals. As shown in FIG. 5, the five electronic component main bodies were arranged and overlapped so that the electrode surface of the internal electrode layer was perpendicular to the direction in which the terminal extension of the metal terminal extends.

(Comparative Example 1)
In order to produce a sample of a multilayer ceramic electronic component with metal terminals according to Comparative Example 1, five electronic component bodies were prepared for each multilayer ceramic electronic component with metal terminals. As shown in FIG. 7 (a), the electrode surfaces of the internal electrode layers are stacked alternately with the case where the electrode surface is perpendicular to the direction in which the terminal extension of the metal terminal extends and the case where the electrode surface is parallel. The electronic component body was placed and stacked. Other conditions were the same as in the example.

(Comparative Example 2)
In order to produce a sample of a multilayer ceramic electronic component with metal terminals according to Comparative Example 2, five electronic component bodies were prepared for each multilayer ceramic electronic component with metal terminals. As shown in FIG. 7B, the five electronic component bodies were arranged and overlapped so that the electrode surface of the internal electrode layer was parallel to the direction in which the terminal extension of the metal terminal extends. Other conditions were the same as in the example.

  Note that the number of samples in the reference example was 10, and the number of samples in each of the example, comparative example 1, and comparative example 2 was 20.

(Evaluation by dielectric breakdown voltage (BDV))
First, the metal terminal of each sample of the multilayer ceramic electronic component with metal terminals (in the case of the reference example, the external electrode of the electronic component main body) was placed on the electrode of the BDV measuring apparatus.
Next, at room temperature, the electronic component main body was placed so as to be immersed in fluorinate (fluorine-based inert liquid).
In the state immersed in Fluorinert (fluorine-based inert liquid), the voltage was applied under the conditions of initial voltage: 0 V, boosting speed: 100 V / sec, detection current (setting of current value for determining failure): 10 mA. Started. And the voltage immediately before exceeding detection current was recorded, and this value was made into BDV.

  FIG. 8 shows the measurement result of the dielectric breakdown voltage in a frequency distribution. 8A shows the measurement result of the breakdown voltage in the sample according to the reference example, FIG. 8B shows the measurement result of the breakdown voltage in the sample according to the example, and FIG. 8C shows the comparative example. FIG. 8D shows the measurement result of the dielectric breakdown voltage in the sample according to Comparative Example 2. FIG.

  Based on the above results, the multilayer ceramic electronic component with metal terminals according to the example is laminated so that the electrode surfaces of the internal electrode layers are aligned in the stacking direction and perpendicular to the direction in which the terminal extension of the metal terminal extends. Thus, it was confirmed that a BDV (dielectric breakdown voltage) close to that when the electronic component main body (multilayer ceramic capacitor) was used alone was obtained, and the characteristics of the multilayer ceramic electronic component with metal terminals were sufficiently satisfied.

  On the other hand, in the multilayer ceramic electronic component with metal terminals according to Comparative Example 1, it was confirmed that the obtained BDV tends to decrease and greatly varies when compared with the BDV obtained in the reference examples and examples. It was. Moreover, in the multilayer ceramic electronic component with a metal terminal concerning the comparative example 2, when the obtained BDV was compared with BDV obtained in a reference example or an Example, it was confirmed that there are many samples which fell further.

DESCRIPTION OF SYMBOLS 10 Multilayer ceramic electronic component with metal terminal 12 Electronic component main body 14 Laminated body 16 External electrode 16a 1st external electrode 16b 2nd external electrode 18 Metal terminal 18a 1st metal terminal 18b 2nd metal terminal 20 Ceramic layer 20a Outer layer Part 20b Inner layer part 22 Internal electrode layer 22a First internal electrode layer 22b Second internal electrode layer 24a, 24b Extraction electrode part 26a Counter electrode part 26b W gap 26c L gap 28a, 28b Terminal joint part 30a, 30b Terminal extension part 32 Bonding material 34 Exterior material

Claims (3)

Including a plurality of laminated ceramic layers and a plurality of internal electrode layers; a first main surface and a second main surface facing the stacking direction; a first side surface facing the width direction orthogonal to the stacking direction; A laminate including a second side surface, and a first end face and a second end face facing in the length direction perpendicular to the lamination direction and the width direction;
A plurality of electronic component bodies having an external electrode formed on an end face of the laminate,
Two metal terminals connected to the external electrodes of the plurality of electronic component bodies;
A multilayer ceramic electronic component with metal terminals having
The plurality of electronic component main bodies have dimensions in the stacking direction connecting the first main surface and the second main surface, and width dimensions connecting the first side surface and the second side surface. Have approximately the same dimensions,
The metal terminal is a lead terminal;
The multilayer ceramic electronic component with metal terminals, wherein electrode surfaces of the plurality of internal electrode layers of the plurality of electronic component bodies are arranged perpendicular to a direction in which the metal terminals extend. The metal terminal has a terminal joint connected to the external electrode, and a terminal extension extending from the terminal joint in the direction of the mounting surface,
2. The multilayer ceramic electronic component with metal terminals according to claim 1, wherein the terminal extension is curved to support the electronic component main body below the electronic component main body closest to the mounting surface side.   The multilayer ceramic electronic component with metal terminals according to claim 2, wherein the multilayer ceramic electronic component with metal terminals includes an exterior material that covers the plurality of electronic component main bodies, the terminal joint portion, and a part of the terminal extension portion. .