JP6373247B2 - Multilayer ceramic electronic component and manufacturing method thereof - Google Patents

Description

  The present invention relates to a multilayer ceramic electronic component and a method for manufacturing the same.

  A through-type multilayer ceramic capacitor, which is one of multilayer ceramic electronic components, is known as a multilayer ceramic capacitor having a configuration in which an inductance component is reduced. A general through-type multilayer ceramic capacitor has an end face external electrode that connects an internal electrode drawn to the end face, and a side face external electrode that connects the internal electrode drawn to the side face.

  A feedthrough multilayer ceramic capacitor is generally mounted on a component mounting board or a component built-in board. For example, when mounted on a component built-in board provided with a via (through electrode), the side surface external electrode is used as a via. A configuration that can be easily connected is preferable. Such a configuration can be realized by providing the side external electrodes not only on the two side surfaces from which the internal electrodes are drawn but also on the entire circumference of the four side surfaces.

  Patent Document 1 discloses a technique of providing side surface external electrodes on four side surfaces of a feedthrough multilayer ceramic capacitor. In this technique, the side external electrodes are provided by applying and baking a conductive paste on each of the four side surfaces. Moreover, in the said technique, in order to ensure reliability, the electrically conductive paste is apply | coated so that it may wrap around to the side surface adjacent to each side surface.

JP 2014-27077 A

  In the technique according to the above-mentioned document, the conductive paste overlaps the two layers beyond the ridges connecting the side surfaces. Thereby, the conductive paste becomes excessive in the vicinity of the ridge portion, and the conductive paste spreads toward the end surface in the ridge portion direction. For this reason, in the through-type multilayer ceramic capacitor obtained by the technique, the width of the side external electrode tends to be wide in the vicinity of the ridge.

  If there is a portion where the width of the side external electrode is wide, the distance between the end surface external electrode and the side external electrode becomes short. Thereby, in the feedthrough multilayer ceramic capacitor, for example, in a moisture resistance test, an insulation failure is likely to occur.

  In view of the circumstances as described above, an object of the present invention is to provide a multilayer ceramic electronic component in which insulation failure is unlikely to occur and a method for manufacturing the same.

In order to achieve the above object, a multilayer ceramic electronic component according to an aspect of the present invention includes a ceramic body, an end external electrode portion, and a side external electrode portion.
The ceramic body includes a pair of end surfaces, a pair of first side surfaces, and a pair of second side surfaces that face each other. The ceramic body includes a plurality of ceramic layers and internal electrode portions. The plurality of ceramic layers extend along the pair of first side surfaces and are stacked along the pair of second side surfaces. The internal electrode portion includes first and second internal electrodes arranged alternately between the plurality of ceramic layers, and the first internal electrode is drawn to both end portions on the pair of end surfaces, and the second The internal electrode is drawn out to a region between the both end portions of the pair of second side surfaces.
The end external electrode portion is connected to the first internal electrode.
The side external electrode section includes first and second side external electrodes that wrap around from one of the pair of first and second side surfaces to the other and are directly or indirectly connected to each other on the other side, Connected to the second internal electrode.

  In this configuration, only one of the first and second side surface external electrodes is disposed in the vicinity of the ridge portion connecting the first and second side surfaces of the ceramic body. That is, the side external electrode portion does not have a configuration in which both the first and second side external electrodes overlap beyond the ridge. For this reason, it is possible to prevent the width of the side external electrode portion from increasing in the vicinity of the ridge. Therefore, according to this configuration, it is possible to obtain a multilayer ceramic electronic component in which insulation failure is unlikely to occur.

The first and second side surface external electrodes may wrap around the pair of second side surfaces from the pair of first side surfaces and be connected to each other on the pair of second side surfaces.
In this configuration, only one of the first and second side surface external electrodes is disposed on the first side surface from which the internal electrode portion is not drawn. For this reason, the flatness of the side surface external electrode portion is not impaired on the first side surface. Thereby, the multilayer ceramic electronic component can maintain an appropriate posture when mounted with the first side surface facing the mounting surface of the substrate.

Any one of the first and second side surface external electrodes may be connected to a via provided in the component-embedded substrate in any one of the pair of first side surfaces.
With this configuration, the multilayer ceramic electronic component mounted on the component built-in substrate can maintain an appropriate posture, and the side surface external electrode portion can be easily connected to the via of the component built-in substrate.

In each of the pair of second side surfaces, either one of the first and second side surface external electrodes may be connected to all the second internal electrodes without passing through the other.
In this configuration, the second internal electrodes respectively drawn out to the pair of second side surfaces are collectively connected by one of the first and second side external electrodes. Thereby, a 2nd internal electrode and a side surface external electrode part can be connected more reliably.

The side surface external electrode part may further include a third side surface external electrode that connects the first side surface external electrode and the second side surface external electrode.
In this configuration, by using the third side surface external electrode, the amount of wraparound of the first and second side surface external electrodes to the second side surface can be reduced. Thereby, the first and second side surface external electrodes can be formed more easily.

The first and second side surface external electrodes may wrap around the pair of second side surfaces from the pair of first side surfaces and be connected to each other on the pair of second side surfaces.
The third side surface external electrode may be connected to the second internal electrode.
In this configuration, the second internal electrodes drawn out to the pair of second side surfaces are collectively connected by the third side external electrodes. Thereby, a 2nd internal electrode and a side surface external electrode part can be connected more reliably.

In the direction perpendicular to the pair of end surfaces, at least one of the first, second, and third side surface external electrodes may be relatively narrow.
In the direction perpendicular to the pair of end surfaces, the third side surface external electrode may be narrower than the first and second side surface external electrodes.
In this configuration, by providing a portion having a relatively narrow width in the side surface external electrode portion, the interval between the side surface external electrode portion and the end portion external electrode can be widened in the portion. Thereby, a short circuit between the side external electrode portion and the end external electrode portion can be prevented.
In addition, by relatively widening the width of the portion connected to the mounting surface of the substrate in the side surface external electrode portion, it is possible to easily obtain a good connection between the side surface external electrode portion and the mounting surface of the substrate. .

In the ceramic body, a thickness in a direction perpendicular to the pair of first side surfaces may be 50% or less of a width in a direction perpendicular to the pair of second side surfaces.
The thickness of the ceramic body in the direction perpendicular to the pair of first side surfaces may be 80% or less of the width of the side external electrode portion in the direction perpendicular to the pair of end surfaces.
In these configurations, since the amount of wraparound of the first and second side surface external electrodes can be small, the side surface external electrode portion can be easily formed.

In the method for manufacturing a multilayer ceramic electronic component according to an aspect of the present invention, a ceramic body including a pair of end faces, a pair of first side faces, and a pair of second side faces that face each other and face each other is prepared. The ceramic body includes a plurality of ceramic layers and internal electrode portions. The plurality of ceramic layers extend along the pair of first side surfaces and are stacked along the pair of second side surfaces. The internal electrode portion includes first and second internal electrodes arranged alternately between the plurality of ceramic layers, and the first internal electrode is drawn to both end portions on the pair of end surfaces, and the second The internal electrode is drawn out to a region between the both end portions of the pair of second side surfaces.
End external electrode portions connected to the first internal electrode are respectively provided at the both end portions.
One of the pair of first and second side surfaces wraps around from one side to the other, and has the first and second side surface external electrodes connected to each other directly or indirectly on the other side, and is connected to the second internal electrode A side external electrode portion is provided.

  A third side external electrode for connecting the first and second side external electrodes may be provided on the other of the pair of first and second side surfaces.

  It is possible to provide a multilayer ceramic electronic component in which insulation failure is unlikely to occur and a method for manufacturing the same.

1 is a perspective view of a multilayer ceramic capacitor according to a first embodiment of the present invention. It is a top view of the said multilayer ceramic capacitor. It is a side view of the said multilayer ceramic capacitor. It is a disassembled perspective view of the said multilayer ceramic capacitor. It is sectional drawing along the AA 'line of FIG. 1 of the said multilayer ceramic capacitor. It is sectional drawing along the BB 'line | wire of FIG. 1 of the said multilayer ceramic capacitor. It is sectional drawing along the BB 'line | wire of FIG. 1 of the said multilayer ceramic capacitor. It is a flowchart which shows the manufacturing method of the said multilayer ceramic capacitor. It is a top view of the ceramic sheet used with the said manufacturing method. It is a perspective view of the ceramic body of the multilayer ceramic capacitor. It is a perspective view which shows the external electrode formation process of the said manufacturing method. It is sectional drawing of the multilayer ceramic capacitor which concerns on the modifications 1 and 2 of 1st Embodiment. It is a side view which shows the structural example of the multilayer ceramic capacitor which concerns on the modifications 1 and 2 of 1st Embodiment. It is a perspective view of the multilayer ceramic capacitor which concerns on the modification 3 of 1st Embodiment. It is a side view of the multilayer ceramic capacitor which concerns on the modification 3 of 1st Embodiment. It is a disassembled perspective view of the multilayer ceramic capacitor which concerns on the modification 3 of 1st Embodiment. It is a disassembled perspective view which shows the structural example of the multilayer ceramic capacitor which concerns on the modification 3 of 1st Embodiment. It is a perspective view of the multilayer ceramic capacitor which concerns on the 2nd Embodiment of this invention. It is sectional drawing along CC 'line of FIG. 18 of the said multilayer ceramic capacitor. It is a perspective view which shows the manufacturing process of the said multilayer ceramic capacitor. It is a figure which shows the multilayer ceramic capacitor which concerns on the modification 1 of 2nd Embodiment. It is a figure which shows the multilayer ceramic capacitor which concerns on the modification 2 of 2nd Embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In the drawing, an X axis, a Y axis, and a Z axis that are orthogonal to each other are shown as appropriate. The X axis, the Y axis, and the Z axis are common in all drawings.

<First Embodiment>
[Overall Configuration of Multilayer Ceramic Capacitor 10]
FIG. 1 is a perspective view of a multilayer ceramic capacitor 10 according to a first embodiment of the present invention. FIG. 2 is a plan view of the multilayer ceramic capacitor 10, and FIG. 3 is a side view of the multilayer ceramic capacitor 10.

  The multilayer ceramic capacitor 10 includes a through-type (three-terminal type) multilayer including a ceramic body 11, first and second end external electrodes 14a and 14b, and first and second side surface external electrodes 15a and 15b. It is a ceramic capacitor. In the multilayer ceramic capacitor 10, the first and second end external electrodes 14a and 14b constitute an end external electrode portion, and the first and second side external electrodes 15a and 15b form a pair with the end external electrode portion. The external electrode part is configured.

  In the multilayer ceramic capacitor 10, for example, the first and second end external electrodes 14a and 14b are configured as through electrodes, and the first and second side external electrodes 15a and 15b are configured as ground electrodes. In FIG. 1, the end body external electrodes 14 a and 14 b and the side surface external electrodes 15 a and 15 b are shown by broken lines and the ceramic body 11 is shown through.

  The ceramic body 11 is formed in a substantially rectangular parallelepiped shape having ridges extending substantially in the X-axis, Y-axis, and Z-axis directions. The ridge portion of the ceramic body 11 is configured as a curved surface that is chamfered and rounded. The ceramic body 11 includes a pair of end faces T1 and T2 perpendicular to the X axis, a pair of first side faces S1 and S2 perpendicular to the Z axis, and a pair of second side faces S3 and S4 perpendicular to the Y axis. Have. Each surface T1, T2, S1, S2, S3, S4 of the ceramic body 11 may be a flat surface or a curved surface.

  The multilayer ceramic capacitor 10 is mounted with, for example, the first side surface S1 or the first side surface S2 facing the mounting surface of the substrate. The multilayer ceramic capacitor 10 can be mounted, for example, on a component built-in substrate provided with vias (through electrodes). In this case, the first end external electrode 14a and the second end external electrode 14b, and the first side external electrode 15a or the second side external electrode 15b are arranged on the first side S1 or the first side facing the mounting surface of the component-embedded substrate. One side S2 is connected to a via provided in the substrate.

  The ceramic body 11 includes first and second internal electrodes 12 and 13 that extend along the XY plane and are alternately arranged in the Z-axis direction. The first internal electrode 12 is drawn out to the end faces T1 and T2, and the second internal electrode 13 is drawn out to the second side faces S3 and S4. The first and second internal electrodes 12 and 13 that make a pair constitute an internal electrode portion of the multilayer ceramic capacitor 10.

  Note that “alternately arranged” in the present invention is not limited to the case where all the first and second internal electrodes 12 and 13 are completely arranged alternately, but a plurality of first internal parts in a part of the laminated structure. This includes the case where the electrode 12 or the second internal electrode 13 is continuously arranged.

  The end external electrodes 14a and 14b cover both ends including the end faces T1 and T2 of the ceramic body 11, and connect the first internal electrodes 12 drawn to the end faces T1 and T2. The end external electrodes 14a and 14b extend from the end surfaces T1 and T2 to the side surfaces S1, S2, S3 and S4, and have a cup shape opened in the X-axis direction.

  The side external electrodes 15a and 15b are provided in the central region of the ceramic body 11 in the X-axis direction with a space from the end external electrodes 14a and 14b, and are drawn to the second side S3 and S4. 13 is connected.

  The side surface external electrodes 15a and 15b cover the first side surfaces S1 and S2 of the ceramic body 11, respectively, and extend from the first side surfaces S1 and S2 to the second side surfaces S3 and S4. The side surface external electrodes 15a and 15b are connected to each other at the connection portion 15j in the center region in the Z-axis direction of the second side surfaces S3 and S4. With such a configuration, the side external electrodes 15a and 15b are configured to be continuous over the entire circumference of the side surfaces S1, S2, S3, and S4.

  FIG. 4 is an exploded perspective view of the ceramic body 11. 5 is a cross-sectional view of the multilayer ceramic capacitor 10 taken along the line AA ′ of FIG. 1, and FIG. 6 is a cross-sectional view of the multilayer ceramic capacitor 10 taken along the line BB ′ of FIG. In practice, the fired ceramic body 11 cannot be disassembled, but FIG. 4 shows the ceramic body 11 disassembled for convenience of explanation.

  The ceramic body 11 includes a capacitance forming portion 17 in which internal electrodes 12 and 13 in the center region in the Z-axis direction are disposed, and cover portions 18 and 19 that sandwich the capacitance forming portion 17 in the Z-axis direction. The capacitance forming unit 17 has a function of forming a capacitance. The cover portions 18 and 19 do not form a capacitance and mainly have a function of protecting the capacitance forming portion 17.

  As shown in FIG. 4, the ceramic body 11 has a laminated structure in which a plurality of ceramic layers 16 extending along the XY plane are laminated in the Z-axis direction. In the capacitance forming unit 17, the ceramic layers 16 in which the first internal electrodes 12 are formed and the ceramic layers 16 in which the second internal electrodes 13 are formed are alternately stacked. In the cover portions 18 and 19, a plurality of ceramic layers 16 in which the internal electrodes 12 and 13 are not formed are laminated.

  The first internal electrode 12 has a strip shape and is drawn out to the end faces T1 and T2 with a width equal to the facing surface facing the second internal electrode 13. The second internal electrode 13 is led out to the second side surfaces S3 and S4 in the central region in the X-axis direction with a narrower width than the facing surface facing the first internal electrode 12. Note that the number of laminated ceramic layers 16 in the capacitance forming portion 17 and the cover portions 18 and 19 can be arbitrarily determined according to the performance and shape required of the laminated ceramic capacitor 10.

  In the capacitance forming portion 17, the first internal electrode 12 is connected to each other by the end external electrodes 14a and 14b, and the second internal electrode 13 is connected to each other by the side surface external electrodes 15a and 15b. For this reason, when a voltage is applied between the end external electrodes 14a, 14b and the side external electrodes 15a, 15b, a voltage is applied to the ceramic layer 16 between the internal electrodes 12, 13. As a result, charges corresponding to the voltage are stored in the capacitance forming unit 17.

Each ceramic layer 16 is formed of dielectric ceramics.
Examples of the dielectric ceramic forming each ceramic layer 16 include barium titanate, strontium titanate, calcium titanate, magnesium titanate, calcium zirconate, calcium zirconate titanate, barium zirconate, and titanium oxide. Materials as ingredients can be used.

  In addition, since the cover parts 18 and 19 do not form a capacitance, a high dielectric constant is not required for the dielectric ceramics forming the ceramic layer 16 constituting the cover parts 18 and 19. Therefore, different dielectric ceramics may be used for the ceramic layer 16 constituting the cover portions 18 and 19 and the ceramic layer 16 constituting the capacitance forming portion 17. However, from the viewpoint of structural stability and the like, it is preferable to use the same dielectric ceramics for the ceramic layer 16 constituting the cover portions 18 and 19 and the ceramic layer 16 constituting the capacitance forming portion 17.

  The internal electrodes 12 and 13 are formed of a good conductor. As a good conductor for forming the internal electrodes 12 and 13, for example, a metal or alloy containing nickel, copper, palladium, platinum, silver, gold or the like as a main component can be used.

  The end external electrodes 14a and 14b and the side external electrodes 15a and 15b are also formed of a good conductor. As a good conductor for forming the end external electrodes 14a and 14b and the side external electrodes 15a and 15b, for example, a metal or alloy mainly composed of nickel, copper, palladium, platinum, silver, gold, or the like can be used.

  The end external electrodes 14a and 14b and the side external electrodes 15a and 15b may have a single layer structure or a multilayer structure. The multilayer structure may be configured as, for example, a two-layer structure of a base film and a surface film, or a three-layer structure of a base film, an intermediate film, and a surface film.

The base film can be, for example, a baking film of a metal or alloy whose main component is nickel, copper, palladium, platinum, silver, gold or the like.
The intermediate film can be, for example, a plating film of a metal or alloy mainly composed of platinum, palladium, gold, copper, nickel, or the like.
The surface film can be, for example, a plating film of a metal or alloy containing copper, tin, palladium, gold, zinc, or the like as a main component.

  In the multilayer ceramic capacitor 10 according to the present embodiment, the first side surface external electrode 15a, the second side surface external electrode 15b, and the connection portion 15j to which the side surface external electrodes 15a and 15b are connected are provided on the second side surfaces S3 and S4. However, it does not become a structure which overlaps mutually exceeding the edge part which connects 1st side surface S1, S2 and 2nd side surface S3, S4. For this reason, it is possible to prevent the width of the side external electrodes 15a and 15b from increasing in the vicinity of the ridge in the manufacturing process.

  As described above, in the multilayer ceramic capacitor 10, the width of the side external electrodes 15a and 15b does not become wide in the vicinity of the ridge, and therefore, a sufficiently large interval between the end external electrodes 14a and 14b and the side external electrodes 15a and 15b is secured. be able to. Therefore, the multilayer ceramic capacitor 10 is less likely to cause an insulation failure, for example, during a moisture resistance test.

  Further, the side external electrodes 15a and 15b are likely to have non-uniform thickness at the connection portion 15j. That is, the connecting portion 15j may be thin because it is an end portion of the side external electrodes 15a and 15b as shown in FIG. 6, and on the contrary, it is thick due to the overlap of the side external electrodes 15a and 15b as shown in FIG. Sometimes. For this reason, the flatness is easily impaired on the surface provided with the connecting portion 15j.

  In this regard, in the multilayer ceramic capacitor 10, the connecting portion 15j is provided on the second side surfaces S3 and S4, not on the first side surfaces S1 and S2 which are mounting surfaces on the substrate. That is, on the first side surfaces S1 and S2, a series of side surface external electrodes 15a and 15b having a uniform thickness are arranged. For this reason, the flatness of the side surface external electrodes 15a and 15b is kept good in the first side surfaces S1 and S2.

  Thus, in the multilayer ceramic capacitor 10, since the flatness of the side external electrodes 15a and 15b is maintained on the first side surfaces S1 and S2, the first side surfaces S1 and S2 are mounted facing the mounting surface of the substrate. Even in this case, it is possible to maintain an appropriate posture without tilting. Further, when the first side surface external electrode 15a or the second side surface external electrode 15b is connected to the via of the substrate on the first side surface S1 or the first side surface S2, the connection is facilitated.

  Furthermore, the aspect ratio of the dimensions of the ceramic body 11 in the X-axis, Y-axis, and Z-axis directions can be arbitrarily determined according to the performance and shape required of the multilayer ceramic capacitor 10.

  However, the present invention is particularly useful for the thin ceramic capacitor 10 in which the thickness of the ceramic body 11 in the Z-axis direction is 100% or less of the width in the Y-axis direction. That is, in the thin ceramic capacitor 10, since the amount of wraparound of the side external electrodes 15a and 15b is small, the side external electrodes 15a and 15b can be easily connected. In particular, it has been confirmed that particularly high production efficiency can be obtained when the thickness of the ceramic body 11 in the Z-axis direction is 50% or less of the width in the Y-axis direction.

  Similarly, the present invention is particularly useful in a thin ceramic capacitor in which the thickness of the ceramic body 11 in the Z-axis direction is 100% or less of the width of the side surface external electrodes 15a and 15b in the X-axis direction. In particular, it has been confirmed that particularly high production efficiency can be obtained when the thickness of the ceramic body 11 in the Z-axis direction is 80% or less of the width of the side surface external electrodes 15a and 15b in the X-axis direction.

[Method of Manufacturing Multilayer Ceramic Capacitor 10]
FIG. 8 is a flowchart showing a method for manufacturing the multilayer ceramic capacitor 10. 9 to 11 are diagrams illustrating a manufacturing process of the multilayer ceramic capacitor 10. Hereinafter, the manufacturing method of the multilayer ceramic capacitor 10 will be described along FIG. 8 with reference to FIGS.

(Step ST1: Ceramic sheet preparation process)
In step ST1, an unfired ceramic sheet 16U is prepared.
FIG. 9 is a plan view of the ceramic sheet 16U prepared in step ST1. Specifically, the ceramic sheet 16U formed with the unfired first internal electrode 12U shown in FIG. 9A and the ceramic sheet formed with the unfired second internal electrode 13U shown in FIG. 9B. 16U and a ceramic sheet 16U in which the internal electrodes 12U and 13U shown in FIG. 9C are not formed are prepared.

  In order to produce the ceramic sheet 16U, first, a ceramic slurry is prepared. The ceramic slurry is obtained, for example, by mixing a dielectric ceramic powder (such as barium titanate powder), a solvent (such as ethanol), a binder (such as polyvinyl butyral), and an additive (such as a dispersant). .

  And the ceramic sheet | seat 16U is obtained by shape | molding said ceramic slurry in a sheet form. For forming the ceramic slurry, for example, a forming apparatus such as a die coater or a gravure coater can be used.

  In order to form the internal electrodes 12U and 13U on the ceramic sheet 16U, a metal paste is first prepared. The metal paste can be obtained, for example, by mixing a metal powder (such as nickel powder), a solvent (such as terpineol), a binder (such as ethyl cellulose), and an additive (such as a dispersant).

  The internal electrodes 12U and 13U can be formed by printing the above metal paste on the ceramic sheet 16U. For printing the metal paste, for example, a printing device such as a screen printer or a gravure printer can be used.

(Step ST2: Lamination process)
In step ST2, the ceramic sheet 16U prepared in step ST1 is laminated in the Z-axis direction. That is, the unfired ceramic body 11U is obtained by stacking the ceramic sheets 16U shown in FIG. 9 and thermocompression bonding so as to have the configuration shown in FIG. For stacking the ceramic sheets 16U, for example, a stacking device such as a movable suction head can be used.

(Step ST3: Firing step)
In step ST3, the unfired ceramic body 11U obtained in step ST2 is fired. That is, the unfired ceramic body 11U is heated and sintered. Then, the ceramic body 11 shown in FIG. 10 is obtained by chamfering by barrel polishing or the like. The firing of the ceramic body 11U can be performed in a reducing atmosphere or a low oxygen partial pressure atmosphere using a firing apparatus such as a tunnel-type firing furnace or a box-type firing furnace.

(Step ST4: External electrode forming step)
In step ST4, end external electrodes 14a and 14b and side external electrodes 15a and 15b are formed on the ceramic body 11 obtained in step ST3. The end external electrodes 14a and 14b and the side external electrodes 15a and 15b are formed by applying a conductive paste to the ceramic body 11 and baking it.

FIG. 11 is a perspective view of the ceramic body 11 showing the process of step ST4.
First, as shown in FIG. 11A, unfired first and second end external electrodes 14aU and 14bU are formed by applying a conductive paste to the ceramic body 11.
Next, as shown in FIG. 11B, an unfired first side surface external electrode 15 a U is formed by applying a conductive paste to the ceramic body 11.
Further, as shown in FIG. 11C, the ceramic body 11 is coated with a conductive paste to form the unfired second side external electrode 15bU.

  For the application of the conductive paste to the ceramic body 11, for example, a coating device such as a roller coating machine or a dip coating machine can be used. The order of forming the end external electrodes 14aU and 14bU and the side external electrodes 15aU and 15bU can be arbitrarily determined.

  Then, the end external electrodes 14a and 14b and the side external electrodes 15a and 15b are formed by baking the end external electrodes 14aU and 14bU and the side external electrodes 15aU and 15bU shown in FIG. 11C on the ceramic body 11. A multilayer ceramic capacitor 10 shown in FIG.

  The end external electrodes 14aU and 14bU and the side external electrodes 15aU and 15bU can be baked on the ceramic body 11 in, for example, a reducing atmosphere or a low oxygen partial pressure atmosphere. The end external electrodes 14a and 14b and the side external electrodes 15a and 15b have the above-described conductive paste baking film as a base film, a two-layer structure of a base film and a surface film, or a base film, an intermediate film, and a surface. A three-layer structure with a film may be used.

  In the manufacturing method according to the present embodiment, a conductive paste is applied from the first side surface S1 and the first side surface S2 of the ceramic body 11 to form the side external electrodes 15a and 15b. That is, the side external electrodes 15a and 15b can be formed by applying the conductive paste twice. As described above, in the manufacturing method according to the present embodiment, since the number of times of applying the conductive paste is small, the manufacturing process is simplified and the conductive paste is not easily displaced.

  From the standpoint of manufacturing efficiency and the like, a large-diameter ceramic sheet 16U that is not separated for each of the plurality of multilayer ceramic capacitors 10 is prepared in step ST1 (ceramic sheet preparation process), and after step ST2 (lamination process). It is preferable to be singulated. In the present embodiment, for convenience of explanation, the ceramic sheet 16U separated in step ST1 is prepared. However, the timing of individualization can be arbitrarily determined.

  In the above description, the example in which the end external electrodes 14a and 14b and the side external electrodes 15a and 15b are baked after the ceramic body 11 is fired has been described. However, the ceramic body 11, the end external electrodes 14a and 14b, and the side external electrodes 15a and 15b may be fired simultaneously.

[Multilayer Ceramic Capacitor 10 According to Modifications 1 and 2]
FIG. 12 is a cross-sectional view of the multilayer ceramic capacitor 10 according to Modifications 1 and 2 of the first embodiment.

  In the multilayer ceramic capacitor 10 according to Modification 1 shown in FIG. 12A, the amount of wraparound of the first side surface external electrode 15a to the second side surfaces S3, S4 is the second side surface S3, S4 of the second side surface external electrode 15b. It is larger than the amount of wraparound. Thereby, in any of the second side surfaces S3 and S4, the first side surface external electrode 15a is connected to all the second internal electrodes 13 without passing through the second side surface external electrode 15b.

  Here, in each of the second side surfaces S3 and S4, the second internal electrode 13 connected only to the first side external electrode 15a, and the second internal electrode 13 connected only to the second side external electrode 15b, Assume that it exists. In this case, the connection between the second internal electrode 13 and the side external electrodes 15a and 15b may become unstable at the boundary between the first side external electrode 15a and the second side external electrode 15b.

  In this regard, in the multilayer ceramic capacitor 10 according to Modification 1, the second internal electrodes 13 drawn to the second side surfaces S3 and S4 are collectively connected by the first side surface external electrode 15a. Thereby, the 2nd internal electrode 13 and the side surface external electrodes 15a and 15b can be connected more reliably.

  In addition, the 1st side surface external electrode 15a may reach the edge part which connects 2nd side surface S3, S4 and 1st side surface S2. However, from the viewpoint of ensuring the flatness of the second side external electrode 15b, it is not preferable that the first side external electrode 15a reaches the first side S2.

  Similarly to the first modification, the multilayer ceramic capacitor 10 according to the second modification shown in FIG. 12B also has a configuration that can more reliably connect the second internal electrode 13 and the side surface external electrodes 15a and 15b. .

  That is, in the multilayer ceramic capacitor 10 according to the second modification, unlike the first modification, the amount of wraparound of the second side external electrode 15b to the second side S3 is reduced to the second side S3 of the first side external electrode 15a. It is larger than the amount of wraparound. Thereby, in 2nd side surface S3, the 2nd side surface external electrode 15b is connected to all the 2nd internal electrodes 13 via the 1st side surface external electrode 15a.

  As described above, in each of the second side surfaces S3 and S4, if any one of the side surface external electrodes 15a and 15b is connected to all the second internal electrodes 13 without passing through the other, the same as in the first modification example. An effect is obtained.

In addition, in each of 2nd side surface S3, S4, the structure by which the whole area | region where the 2nd internal electrode 13 was pulled out is covered with either one of the side surface external electrodes 15a and 15b is not essential.
For example, as shown in FIG. 13, even if the first side surface external electrode 15a covers only the center portion in the X-axis direction of the second internal electrode 13 at the lowest position in the Z-axis direction and does not cover both ends in the X-axis direction. Good. Also in this case, since the first side external electrode 15a collectively connects all the second internal electrodes 13, the second internal electrode 13 and the side external electrodes 15a and 15b can be connected more reliably. it can.

[Multilayer Ceramic Capacitor 10 According to Modification 3]
FIG. 14 is a perspective view of the multilayer ceramic capacitor 10 according to Modification 3 of the first embodiment. FIG. 15 is a side view of the multilayer ceramic capacitor 10, and FIG. 16 is an exploded perspective view of the multilayer ceramic capacitor 10.

  In the multilayer ceramic capacitor 10 according to the modified example 3, unlike the first embodiment, the first internal electrodes 12 are not the end faces T1 and T2, but both end portions of the second side faces S3 and S4 on the end faces T1 and T2 side. Has been drawn to. That is, the first internal electrode is covered with the extending portion of the end external electrodes 14a and 14b to the second side surfaces S3 and S4. For this reason, also in the multilayer ceramic capacitor 10 according to the modification 3, the first internal electrode 12 is connected by the end external electrodes 14a and 14b.

  Even in the multilayer ceramic capacitor 10 according to Modification 3, the same effects as those of the multilayer ceramic capacitor 10 according to the first embodiment can be obtained.

  As described above, the first internal electrode 12 of the multilayer ceramic capacitor 10 only needs to be drawn out to the end portions on the end surfaces T1 and T2 side of the ceramic body 11 covered with the end portion external electrodes 14a and 14b. It may be drawn to S3 and S4.

  In this case, the end external electrodes 14a and 14b may not cover the end faces T1 and T2, but may cover only both ends in the X-axis direction of the side faces S1, S2, S3 and S4. Further, the end external electrode 14 may cover only the region where the first internal electrode 12 of the second side surfaces S3 and S4 is drawn.

  In addition, as shown in FIG. 17, the first internal electrode 12 may be drawn over both the end faces T1 and T2 and the second side faces S3 and S4.

<Second Embodiment>
A multilayer ceramic capacitor 10 according to a second embodiment of the present invention will be described. In the present embodiment, the description of the configuration common to the first embodiment will be omitted as appropriate. Moreover, the code | symbol similar to 1st Embodiment is used for the structure corresponding to 1st Embodiment among the structures of this embodiment.

[Configuration of Multilayer Ceramic Capacitor 10]
18 is a perspective view of the multilayer ceramic capacitor 10 according to this embodiment, and FIG. 19 is a cross-sectional view of the multilayer ceramic capacitor 10 taken along the line CC ′ of FIG.

  The multilayer ceramic capacitor 10 according to the present embodiment includes third side external electrodes 15c provided on the second side surfaces S3 and S4 in the same manner as the first and second side external electrodes 15a and 15b. The third side external electrode 15c has the same dimension in the X-axis direction as the first and second side external electrodes 15a and 15b, and covers the central region in the Z-axis direction of the second side surfaces S3 and S4.

  The first and second side surface external electrodes 15a and 15b are connected via a third side surface external electrode 15c. That is, the second side surfaces S3 and S4 have a connection portion 15j between the first side surface external electrode 15a and the third side surface external electrode 15c, and a connection portion 15j between the second side surface external electrode 15b and the third side surface external electrode 15c, respectively. And are provided.

  In the multilayer ceramic capacitor 10 according to this embodiment, since the amount of the first and second side surface external electrodes 15a and 15b wraps around the second side surfaces S3 and S4 is small, the first and second side surface external electrodes 15a and 15b can be easily provided. Can be formed.

  The third side surface external electrode 15 c preferably covers the capacitance forming portion 17 of the ceramic body 11. That is, it is preferable that the connection portions 15j provided on the second side surfaces S3 and S4 are all disposed on the cover portions 18 and 19. In this case, since the second internal electrode 13 is collectively connected only by the third side surface external electrode 15c, the second internal electrode 13 and the side surface external electrodes 15a, 15b, 15c can be more reliably connected. .

[Method of Manufacturing Multilayer Ceramic Capacitor 10]
The manufacturing method of the multilayer ceramic capacitor 10 according to the present embodiment is common to the first embodiment in steps ST1 to ST3 shown in FIG. 8, and only step ST4 is different from the first embodiment.

FIG. 20 is a perspective view of the ceramic body 11 showing the process of step ST4.
First, as shown in FIG. 20A, by applying a conductive paste to the ceramic body 11 on which the unfired first and second end external electrodes 14aU and 14bU are formed, the unfired third Side external electrodes 15cU are formed.
Next, as shown in FIG. 20B, an unfired first side surface external electrode 15 a U is formed by applying a conductive paste to the ceramic body 11. Further, by applying a conductive paste to the ceramic body 11, an unfired second side external electrode 15bU is formed.

  Then, the end external electrodes 14aU, 14bU and the side surface external electrodes 15aU, 15bU, 15cU are baked on the ceramic body 11, thereby forming the end portion external electrodes 14a, 14b and the side surface external electrodes 15a, 15b, 15c. A multilayer ceramic capacitor 10 shown in FIG.

  The third side surface external electrode 15c only needs to be provided on the second side surfaces S3 and S4, and does not need to go around the first side surfaces S1 and S2. Therefore, the third side surface external electrode 15c is not limited to the method of baking the conductive paste, but various methods. Can be formed. Examples of such methods include vapor deposition, sputtering, plating, and printing.

[Multilayer Ceramic Capacitor 10 According to Modification 1]
FIG. 21 is a diagram illustrating a multilayer ceramic capacitor 10 according to Modification 1 of the second embodiment. FIG. 21A is a side view of the multilayer ceramic capacitor 10, and FIG. 21B is a plan view of the multilayer ceramic capacitor 10.

  In the multilayer ceramic capacitor 10 according to Modification 1, the third side surface external electrode 15c is provided so as to cover the entire second internal electrode 13 drawn out to the second side surfaces S3 and S4. The third side surface external electrode 15c is formed so that the width d1 in the X-axis direction is as narrow as possible in accordance with the lead width of the second internal electrode 13.

  Thereby, the third side surface external electrode 15c connected to the second internal electrode 13 is sufficiently connected from the end external electrodes 14a and 14b while ensuring a good connection between the third side surface external electrode 15c and the second internal electrode 13. It is possible to place them apart. Therefore, a short circuit due to creeping discharge or the like can be prevented between the third side surface external electrode 15c and the end external electrodes 14a and 14b.

  However, if the widths in the X-axis direction of the side surface external electrodes 15a, 15b, and 15c are all equal as in the second embodiment (FIG. 18 and the like), the first side surface external electrode 15a or the second side surface external electrode 15b In some cases, the area of the region connected to the mounting surface of the substrate cannot be secured sufficiently large. As a result, the multilayer ceramic capacitor 10 cannot obtain a good connection to the mounting surface of the substrate.

Therefore, in the multilayer ceramic capacitor 10 according to Modification 1, as shown in FIG. 21, the width d2 in the X-axis direction of the first side surface external electrode 15a and the second side surface external electrode 15b is set to X of the third side surface external electrode 15c. It is made wider than the axial width d1.
The width d2 of the first side surface external electrode 15a and the second side surface external electrode 15b can be a value measured at the center of the first side surfaces S1, S2 in the Y-axis direction. Further, the width d1 of the third side surface external electrode 15c can be a value measured at the center in the Z-axis direction of the second side surfaces S3 and S4.

  Thereby, in the multilayer ceramic capacitor 10 according to the first modification, the areas of the first and second side surface external electrodes 15a and 15b can be widely secured on the first side surfaces S1 and S2. For this reason, in the structure of the modification 1, the favorable connection of the multilayer ceramic capacitor 10 and the mounting surface of a board | substrate can be obtained easily.

Note that the width d2 may be different between the first side surface external electrode 15a and the second side surface external electrode 15b. In particular, only the width d2 of either the first side surface external electrode 15a or the second side surface external electrode 15b may be wider than the width d1 of the third side surface external electrode 15c.
For example, when the mounting surface on the substrate is determined in advance as the first side surface S1, only the width d2 of the first side surface external electrode 15a may be increased. On the contrary, when the mounting surface on the substrate is determined in advance as the first side surface S2, only the width d2 of the second side surface external electrode 15b may be widened.

  Further, in the multilayer ceramic capacitor 10 according to the modified example 1, the first and second side surface external electrodes 15a and 15b are provided over a wide range in the X axis direction, and therefore the third side surface external electrode 15c is slightly shifted in the X axis direction. Even if it exists, the favorable connection of the 1st and 2nd side surface external electrodes 15a and 15b and the 3rd side surface external electrode 15c is ensured. Thereby, in the multilayer ceramic capacitor 10 according to Modification 1, high reliability can be ensured.

[Multilayer Ceramic Capacitor 10 According to Modification 2]
FIG. 22 is a view showing a multilayer ceramic capacitor 10 according to Modification 2 of the second embodiment. FIG. 22A is a side view of the multilayer ceramic capacitor 10, and FIG. 22B is a plan view of the multilayer ceramic capacitor 10.

  Also in the multilayer ceramic capacitor 10 according to the modified example 2, the third side surface external electrode 15c is provided so as to cover the entire second internal electrode 13 drawn out to the second side surfaces S3 and S4. The third side surface external electrode 15c is formed so that the width d1 in the X-axis direction is as narrow as possible in accordance with the lead width of the second internal electrode 13.

  However, if the widths in the X-axis direction of the side surface external electrodes 15a, 15b, and 15c are all equal as in the second embodiment, the side surface external electrodes 15a and 15b can be obtained when the lead-out width of the second internal electrode 13 is wide. , 15c, the distance from the end external electrodes 14a, 14b is reduced. As a result, a short circuit is likely to occur between the side external electrodes 15a, 15b, 15c and the end external electrodes 14a, 14b.

  Therefore, in the multilayer ceramic capacitor 10 according to Modification 2, the width d2 in the X-axis direction of the first side surface external electrode 15a and the second side surface external electrode 15b is larger than the width d1 in the X-axis direction of the third side surface external electrode 15c. Narrow.

  Thereby, in the multilayer ceramic capacitor 10 according to the modified example 2, the first and second side surface external electrodes 15a and 15b can be disposed sufficiently apart from the end external electrodes 14a and 14b. Thereby, it is possible to prevent a short circuit from occurring between the first and second side surface external electrodes 15a and 15b and the end external electrodes 14a and 14b.

  In particular, in the multilayer ceramic capacitor 10 according to the modified example 2, the first side external electrode 15a or the second side external electrode 15b is short-circuited with the end external electrodes 14a and 14b via the solder on the mounting surface of the substrate. It can be effectively prevented. Thereby, in the multilayer ceramic capacitor 10, high reliability can be ensured.

Note that the width d2 may be different between the first side surface external electrode 15a and the second side surface external electrode 15b. In particular, only the width d2 of one of the first side surface external electrode 15a and the second side surface external electrode 15b may be narrower than the width d1 of the third side surface external electrode 15c.
For example, when the mounting surface on the substrate is determined in advance as the first side surface S1, only the width d2 of the first side surface external electrode 15a may be narrowed. On the contrary, when the mounting surface on the substrate is determined in advance as the first side surface S2, only the width d2 of the second side surface external electrode 15b may be narrowed.

<Other embodiments>
The embodiment of the present invention has been described above, but the present invention is not limited to the above-described embodiment, and it is needless to say that various modifications can be made without departing from the gist of the present invention.

  For example, the connection portions 15j of the side surface external electrodes 15a and 15b are provided on the second side surfaces S3 and S4 from which the second internal electrode 13 of the ceramic body 11 is drawn in the above embodiment. Not required.

  More specifically, the connection part 15j of the side surface external electrodes 15a and 15b may be provided on the first side surfaces S1 and S2 from which the second internal electrode 13 is not drawn out as necessary. That is, the side external electrodes 15a and 15b may be formed so as to go from the second side S3 and S4 to the first side S1 and S2.

  Also in this case, it is possible to prevent the width of the side external electrodes 15a and 15b from increasing in the vicinity of the ridge portion of the ceramic body 11, and to obtain the multilayer ceramic capacitor 10 in which insulation failure is unlikely to occur.

  Further, in this case, the second internal electrodes 13 drawn out to the second side surfaces S3 and S4 are collectively connected by the first side surface external electrode 15a or the second side surface external electrode 15b. For this reason, the 2nd internal electrode 13 and the side surface external electrodes 15a and 15b can be connected more reliably irrespective of the connection mode of the side surface external electrodes 15a and 15b.

  In addition to the multilayer ceramic capacitor, the present invention is applicable to any multilayer ceramic electronic component in which side external electrodes are provided over the entire circumference of the four side surfaces. Examples of the multilayer ceramic electronic component other than the multilayer ceramic capacitor to which the present invention can be applied include a dielectric filter.

  In addition, the dimension of each structure (side external electrode etc.) of a multilayer ceramic capacitor can be made into the average value of the dimension which measured 25 samples arbitrarily extracted so that a lot might be represented, for example. Moreover, the dimension of each sample may be measured with a factory microscope, or a numerical value may be read with reference to a scale from an image obtained by an optical microscope, a scanning electron microscope, or the like. At this time, if necessary, the measurement may be performed with a cross section of the target sample polished.

DESCRIPTION OF SYMBOLS 10 ... Multilayer ceramic capacitor 11 ... Ceramic body 12, 13 ... Internal electrode 14a, 14b ... End part external electrode 15a, 15b, 15c ... Side surface external electrode 15j ... Connection part 16 ... Ceramic layer 17 ... Capacitance formation part 18, 19 ... Cover part T1, T2 ... end face S1, S2 ... 1st side S3, S4 ... 2nd side

Claims (6)

Including a pair of end faces, a pair of first side faces, and a pair of second side faces facing each other,
A plurality of ceramic layers extending along the pair of first side surfaces and stacked along the pair of second side surfaces;
Including first and second internal electrodes arranged alternately between the plurality of ceramic layers, wherein the first internal electrodes are drawn to both ends of the pair of end faces, and the second internal electrodes are An internal electrode portion drawn into a region between the both end portions of the second side surface;
A ceramic body having
An end external electrode portion connected to the first internal electrode;
Wherein a pair of first side wraparound to the second side surface of the pair has first and second side external electrodes connected to each other physician Te said pair of second side smell, of the first side surface external electrode The amount of wraparound to one of the pair of second side surfaces is larger than the second side surface external electrode of the surface, and the amount of wraparound of the second side surface external electrode to the other of the pair of second side surfaces is the surface of the surface. A side external electrode portion that is larger than the first side external electrode and connected to the second internal electrode;
A multilayer ceramic electronic component comprising: The multilayer ceramic electronic component according to claim 1 ,
Any one of the first and second side surface external electrodes is connected to a via provided in a component-embedded substrate in any one of the pair of first side surfaces. Multilayer ceramic electronic component. The multilayer ceramic electronic component according to claim 1 or 2 ,
The first side external electrode connects all the second internal electrodes on one of the pair of second side surfaces, and the second side external electrode connects all the second internal electrodes on the other of the pair of second side surfaces. Connecting multilayer ceramic electronic components. The multilayer ceramic electronic component according to any one of claims 1 to 3 ,
In the ceramic body, a thickness in a direction perpendicular to the pair of first side surfaces is 50% or less of a width in a direction perpendicular to the pair of second side surfaces. The multilayer ceramic electronic component according to any one of claims 1 to 4 ,
The multilayer ceramic electronic component, wherein a thickness of the ceramic body in a direction perpendicular to the pair of first side surfaces is 80% or less of a width of the side external electrode portion in a direction perpendicular to the pair of end surfaces. Including a pair of end faces, a pair of first side faces, and a pair of second side faces facing each other,
A plurality of ceramic layers extending along the pair of first side surfaces and stacked along the pair of second side surfaces;
The first and second internal electrodes are alternately arranged between the plurality of ceramic layers, the first internal electrodes are drawn to both ends on the pair of end faces, and the second internal electrodes are An internal electrode portion drawn into a region between the both end portions of the second side surface of
Prepare a ceramic body with
End external electrode portions connected to the first internal electrodes are provided at both end portions,
Wherein a pair of first side wraparound to the second side surface of the pair has first and second side external electrodes connected to each other physician Te said pair of second side smell, of the first side surface external electrode The amount of wraparound to one of the pair of second side surfaces is larger than the second side surface external electrode of the surface, and the amount of wraparound of the second side surface external electrode to the other of the pair of second side surfaces is the surface of the surface. A method for manufacturing a multilayer ceramic electronic component , comprising a side external electrode portion that is larger than the first side external electrode and connected to the second internal electrode.

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