JP2017139403A - Multilayer penetration capacitor and electronic component device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a multilayer penetration capacitor which attains ESL reduction, and an electronic component device.SOLUTION: A multilayer penetration capacitor 1 comprises an element assembly 2, a pair of terminal electrodes 3 and 4 for signaling, a pair of terminal electrodes 5 and 6 for grounding, multiple internal electrodes for signaling, and multiple internal electrodes 12 for grounding. Each of the internal electrodes for signaling is connected to the pair of terminal electrodes 3 and 4 for signaling. Each of the internal electrodes 12 for grounding is connected to the pair of terminal electrodes 5 and 6 for grounding. When a length of the element assembly 2 in a second direction D2 is defined as L, a length of connection parts 12b and 12c of the internal electrode 12 for grounding connected to the terminal electrodes 5 and 6 for grounding in the second direction D2 is defined as A and a length of the terminal electrodes 5 and 6 for grounding in the second direction D2 is defined as C, L≤1.6 mm, C/L≥0.40 and A/L≥0.20 are satisfied.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a multilayer feedthrough capacitor and an electronic component device.

  As a multilayer feedthrough capacitor, an element body, a pair of signal terminal electrodes and a pair of ground terminal electrodes arranged on the outer surface of the element body, and a plurality of signal internal electrodes arranged alternately in the element body and A device including a grounding internal electrode is known (see, for example, Patent Document 1).

JP-A-9-55335

  SUMMARY OF THE INVENTION An object of the present invention is to provide a multilayer feedthrough capacitor and an electronic component device that have a low ESL (equivalent series inductance).

The multilayer feedthrough capacitor according to the present invention extends in the short side direction of the first and second main surfaces so as to connect the rectangular first and second main surfaces facing each other and the first and second main surfaces. And the first and second side surfaces facing each other and the third and second surfaces extending in the long side direction of the first and second main surfaces so as to connect the first and second main surfaces and facing each other. An element body having four side surfaces, a pair of signal terminal electrodes disposed on the first and second side surfaces of the element body, and a pair of grounding elements disposed on the third and fourth side surfaces of the element body. A plurality of signal internal electrodes and grounding internal electrodes, which are alternately arranged in the element body in the opposing direction of the first and second main surfaces, and each signal internal electrode comprises a pair of Connected to the signal terminal electrode, each grounding internal electrode is connected to a pair of grounding terminal electrodes, and is long in the long side direction of the element body. L, and the when the length in the long side direction of the connection portion to be connected to the grounding terminal electrodes ground internal electrodes A, the length of the long side direction of the ground terminal electrode is C,
L ≦ 1.6mm
C / L ≧ 0.40
A / L ≧ 0.20
Meet.

  In the multilayer feedthrough capacitor according to the present invention, the length in the long side direction of the element body is 1.6 mm or less, and the length in the long side direction of the ground terminal electrode is in the long side direction of the element body. The length in the long side direction of the connection portion is 0.40 or more with respect to the length, and is 0.20 or more with respect to the length in the long side direction of the element body. Thereby, low ESL is achieved.

  An electronic component device according to the present invention includes the multilayer feedthrough capacitor and a mounting substrate on which the multilayer feedthrough capacitor is mounted. The mounting substrate includes a substrate body including a mounting surface facing the multilayer feedthrough capacitor, and a mounting surface. A pair of signal mounting electrodes that are disposed and electrically connected to the pair of signal terminal electrodes, disposed on the mounting surface apart from each other, and electrically connected to the pair of ground terminal electrodes A pair of grounding mounting electrodes, a conductor portion facing each grounding mounting electrode across at least a portion of the substrate body, and a plurality of via conductors connected to each grounding mounting electrode and the conductor portion, Have.

  An electronic component device according to the present invention includes the multilayer feedthrough capacitor. Thereby, low ESL is achieved.

  According to the present invention, it is possible to provide a multilayer feedthrough capacitor and an electronic component device in which low ESL is achieved.

1 is a perspective view showing a multilayer feedthrough capacitor according to an embodiment. It is sectional drawing which follows the II-II line in FIG. It is sectional drawing which follows the III-III line in FIG. It is sectional drawing which follows the IV-IV line in FIG. It is a perspective view which shows the electronic component apparatus which concerns on embodiment. It is sectional drawing which follows the VI-VI line in FIG. It is a top view of the electronic component device concerning an embodiment and a comparative form.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same reference numerals are used for the same elements or elements having the same function, and redundant description is omitted.

(Multilayer feedthrough capacitor)
FIG. 1 is a perspective view illustrating the multilayer feedthrough capacitor according to the embodiment. FIG. 2 is a cross-sectional view taken along the line II-II in FIG. As shown in FIGS. 1 and 2, the multilayer feedthrough capacitor 1 includes an element body 2, a pair of signal terminal electrodes 3 and 4, a pair of ground terminal electrodes 5 and 6, and a plurality of signal internal electrodes. 11 and a plurality of grounding internal electrodes 12.

  The element body 2 has a rectangular parallelepiped shape. The rectangular parallelepiped shape includes a rectangular parallelepiped shape in which corners and ridge lines are chamfered and a rectangular parallelepiped shape in which corners and ridge lines are rounded. The element body 2 has first and second main surfaces 2a and 2b and first to fourth side surfaces 2c to 2f as outer surfaces thereof.

  The first and second main surfaces 2a and 2b have a rectangular shape and face each other. In the present embodiment, the opposing direction of the first and second main surfaces 2a, 2b is the first direction D1, the long side direction of the first and second main surfaces 2a, 2b is the second direction D2, and the first and second The description will be made with the short side direction of the two principal surfaces 2a and 2b as the third direction D3. The first to third directions D1 to D3 are orthogonal to each other.

  The first and second side surfaces 2c and 2d have a rectangular shape and face each other in the second direction D2. The first and second side surfaces 2c and 2d extend in the third direction D3 so as to connect the first and second main surfaces 2a and 2b. The third and fourth side surfaces 2e and 2f have a rectangular shape and face each other in the third direction D3. The third and fourth side surfaces 2e and 2f extend in the second direction D2 so as to connect the first and second main surfaces 2a and 2b.

  The length (height) of the element body 2 in the first direction D1 is, for example, 0.3 mm. The length (length) of the element body 2 in the second direction D2 is 1.6 mm or less, for example, 1.3 mm. The length (width) of the element body 2 in the third direction D3 is, for example, 0.5 mm. The length of the element body 2 in the second direction D2 corresponds to the length of the long sides of the first and second main surfaces 2a and 2b. The length of the element body 2 in the third direction D3 corresponds to the length of the short sides of the first and second main surfaces 2a and 2b.

The element body 2 is configured by laminating a plurality of dielectric layers in the first direction D1. Each dielectric layer is composed of a sintered body of a ceramic green sheet containing a dielectric ceramic such as BaTiO ₃ , CaTiO ₃ , SrTiO ₃ , CaZrO ₃ , for example. In the actual element body 2, the dielectric layers are integrated to such an extent that the boundary between the dielectric layers is not visible.

  The pair of signal terminal electrodes 3 and 4 are separated from each other in the second direction D2. The signal terminal electrode 3 is disposed on the first side surface 2 c side of the element body 2. The signal terminal electrode 3 covers the entire surface of the first side surface 2c so that the first and second main surfaces 2a and 2b and the end portions of the third and fourth side surfaces 2e and 2f (end portions on the first side surface 2c side). ).

  The signal terminal electrode 4 is disposed on the second side surface 2 d side of the element body 2. The signal terminal electrode 4 covers the entire surface of the second side surface 2d so that the first and second main surfaces 2a and 2b and the end portions of the third and fourth side surfaces 2e and 2f (end portions on the second side surface 2d side). ).

  The pair of ground terminal electrodes 5 and 6 are separated from each other in the third direction D3. The ground terminal electrode 5 is arranged on the third side surface 2 e side of the element body 2. The ground terminal electrode 5 covers substantially the center of the third side surface 2e in the second direction D2 so as to cross the first direction D1. The ground terminal electrode 5 further covers part of the end portions of the first and second main surfaces 2a and 2b on the third side surface 2e side.

  The ground terminal electrode 6 is disposed on the fourth side surface 2 f side of the element body 2. The ground terminal electrode 6 covers substantially the center of the fourth side surface 2f in the second direction D2 so as to cross the first direction D1. The grounding terminal electrode 6 also covers part of the end portions on the fourth side surface 2f side of the first and second main surfaces 2a, 2b.

  The signal internal electrode 11 and the ground internal electrode 12 are made of a conductive material (for example, Ni or Cu) that is usually used as an internal electrode of a laminated electric element. The signal internal electrode 11 and the ground internal electrode 12 are configured as a sintered body of a conductive paste containing the conductive material. The signal internal electrode 11 and the ground internal electrode 12 are arranged at different positions (layers) in the first direction D1. That is, the signal internal electrodes 11 and the ground internal electrodes 12 are alternately arranged in the element body 2 so as to face each other with a gap in the first direction D1.

  3 is a cross-sectional view taken along line III-III in FIG. As shown in FIG. 3, the signal internal electrode 11 has a rectangular shape with the second direction D2 as the long side direction. The signal internal electrode 11 extends from the first side surface 2c to the second side surface 2d. The signal internal electrode 11 is connected to a pair of signal terminal electrodes 3 and 4. Specifically, the end portion on the first side face 2 c side of the signal internal electrode 11 is exposed to the first side face 2 c and connected to the signal terminal electrode 3. An end of the signal inner electrode 11 on the second side surface 2d side is exposed to the second side surface 2d and is connected to the signal terminal electrode 4. The signal internal electrode 11 is not exposed on the first and second main surfaces 2a and 2b and the third and fourth side surfaces 2e and 2f.

  4 is a cross-sectional view taken along line IV-IV in FIG. As shown in FIG. 4, the grounding internal electrode 12 includes a main electrode portion 12 a and a pair of connection portions 12 b and 12 c. The main electrode portion 12a and the pair of connection portions 12b and 12c are integrally formed. The main electrode portion 12a has a rectangular shape with the second direction D2 as the long side direction. The pair of connection portions 12b and 12c have, for example, the same rectangular shape. The pair of connection portions 12b and 12c oppose each other in the third direction D3 via the main electrode portion 12a.

  The connection portion 12b extends from the end of the main electrode portion 12a on the third side surface 2e side and from the center portion in the second direction D2 to the third side surface 2e. The connection portion 12c extends from the end of the main electrode portion 12a on the fourth side surface 2f side and from the center portion in the second direction D2 to the fourth side surface 2f. The grounding internal electrode 12 is connected to a pair of grounding terminal electrodes 5 and 6. Specifically, the end portion on the third side surface 2 e side of the connection portion 12 b is exposed to the third side surface 2 e and connected to the ground terminal electrode 5. The end of the connecting portion 12c on the fourth side surface 2f side is exposed to the fourth side surface 2f and is connected to the ground terminal electrode 6. The grounding internal electrode 12 is not exposed on the first and second main surfaces 2a and 2b and the first and second side surfaces 2c and 2d.

Here, the length in the second direction D2 of the element body 2 is L, and the length in the second direction D2 of the connection portions 12b and 12c connected to the grounding terminal electrodes 5 and 6 of the grounding internal electrode 12 is. A, When the length of the ground terminal electrodes 5 and 6 in the second direction D2 is C,
L ≦ 1.6mm
C / L ≧ 0.40
A / L ≧ 0.20
Meet.

  In addition, when the connection parts 12b and 12c exhibit the mutually same rectangular shape and the length in the 2nd direction D2 of the connection parts 12b and 12c is decided to one value, the value can be set to A. When the connecting portions 12b and 12c have different shapes, the length of the connecting portions 12b and 12c in the second direction D2 as in the case where the connecting portions 12b and 12c have a shape other than a rectangular shape, etc. Is not determined to be a single value, the minimum value can be A.

  Subsequently, the embodiment and the comparative example specifically show that the ESL is reduced in this embodiment. As the multilayer feedthrough capacitor according to Examples 1 to 5, the one corresponding to the multilayer feedthrough capacitor 1 was used. The multilayer feedthrough capacitors according to Comparative Examples 1 and 2 were different from the multilayer feedthrough capacitor 1 in that A / L was smaller than 0.20 and C / L was smaller than 0.40. Table 1 shows values of L, A, A / L, C, and C / L, ESL measurement results, and determination results of the multilayer feedthrough capacitors according to Examples 1 to 5 and Comparative Examples 1 and 2.

  The determination result is “A” if the ESL value of the multilayer feedthrough capacitor according to Comparative Example 1 is a reference value, and “B” if the ESL value is greater than half the reference value. It is shown. As shown in Table 1, the determination results of Examples 1 to 5 are all “A”. That is, in Examples 1 to 5, ESL is less than half of the reference value.

  As described above, the length of the element body 2 in the second direction D2 is 1.6 mm or less, and the length of the ground terminal electrodes 5 and 6 in the second direction D2 is equal to the length of the element body 2. 0.40 or more with respect to the length in the two directions D2, and the length of the connecting portions 12b and 12c in the second direction D2 is 0. 0 with respect to the length of the element body 2 in the second direction D2. 20 or more. Thus, in the multilayer feedthrough capacitor 1, the lengths of the ground terminal electrodes 5 and 6 and the connection portions 12 b and 12 c in the second direction D <b> 2 are different from the length of the element body 2 in the second direction D <b> 2, respectively. It is set to a predetermined value or more. Thereby, in this embodiment, the length in the second direction D2 of the grounding terminal electrodes 5 and 6 and the connection portions 12b and 12c is predetermined with respect to the length in the second direction D2 of the element body 2, respectively. Compared to the case where the value is less than the value, the ESL is reduced.

(Electronic component equipment)
FIG. 5 is a perspective view showing the electronic component device according to the embodiment. 6 is a cross-sectional view taken along line VI-VI in FIG. As shown in FIGS. 5 and 6, the electronic component device 10 includes a multilayer feedthrough capacitor 1 and a mounting substrate 20 on which the multilayer feedthrough capacitor 1 is mounted. The mounting substrate 20 includes a substrate body 21, a pair of signal mounting electrodes 23 and 24, a pair of ground mounting electrodes 25 and 26, a conductor layer 27, and a plurality of via conductors 28.

  The substrate body 21 includes a mounting surface 21 a that faces the multilayer feedthrough capacitor 1. The substrate body 21 may be constituted by a resin substrate, for example, or may be constituted by a resin substrate including a filler such as a glass epoxy substrate. The type of the substrate body 21 is not particularly limited. The substrate body 21 includes first and second insulator layers 31 and 32 that face each other in the first direction D1 with the conductor layer 27 interposed therebetween. One main surface of the second insulator layer 32 is a mounting surface 21a. A plurality of via holes 29 are formed in the second insulator layer 32. The via hole 29 penetrates the second insulator layer 32 in the first direction D1.

  The pair of signal mounting electrodes 23 and 24 are arranged on the mounting surface 21a so as to be separated from each other in the second direction D2. The pair of signal mounting electrodes 23 and 24 has a rectangular shape when viewed from the first direction D1. The length of the pair of signal mounting electrodes 23 and 24 in the second direction D2 is, for example, 0.3 mm. The length of the pair of signal mounting electrodes 23, 24 in the third direction D3 is 0.5 mm to 0.8 mm, for example, 0.5 mm.

  The signal mounting electrode 23 is electrically connected to the signal terminal electrode 3. The signal mounting electrode 24 is electrically connected to the signal terminal electrode 4. The pair of signal mounting electrodes 23 and 24 are electrically connected to the pair of signal terminal electrodes 3 and 4 by, for example, solder, conductive resin or the like.

  The pair of grounding mounting electrodes 25 and 26 are disposed on the mounting surface 21a so as to be separated from each other in the third direction D3. The pair of grounding mounting electrodes 25 and 26 have a rectangular shape when viewed from the first direction D1. The length of the pair of ground mounting electrodes 25 and 26 in the second direction D2 is, for example, 0.5 mm, and the length of the pair of ground mounting electrodes 25 and 26 in the third direction D3 is, for example, 0. 3 mm.

  The grounding mounting electrode 25 is electrically connected to the grounding terminal electrode 5. The grounding mounting electrode 26 is electrically connected to the grounding terminal electrode 6. The pair of ground mounting electrodes 25 and 26 are electrically connected to the pair of ground terminal electrodes 5 and 6 by, for example, solder, conductive resin, or the like.

  The conductor layer 27 is disposed between the first insulator layer 31 and the second insulator layer 32. The conductor layer 27 faces the ground mounting electrodes 25 and 26 in the first direction D1 with the second insulator layer 32 interposed therebetween. The conductor layer 27 is made of a conductive material (for example, Ni or Cu). The conductor layer 27 is configured as, for example, a sintered body of a conductive paste containing the conductive material.

  The via conductor 28 is provided in the via hole 29. The via conductor 28 is formed, for example, by growing a conductive metal (for example, Cu or the like) in the via hole 29 by electroless plating. The via conductor 28 is connected to the grounding mounting electrodes 25 and 26 and the conductor layer 27. In the present embodiment, two via conductors 28 are connected to the ground mounting electrode 25, and the two via conductors 28 are arranged in the second direction D2. In addition, two via conductors 28 are connected to the grounding mounting electrode 26, and the two via conductors 28 are arranged in the second direction D2.

  As described above, the electronic component device 10 includes the multilayer feedthrough capacitor 1. Thereby, low ESL is achieved.

  FIG. 7A is a plan view of the electronic component device according to the embodiment. The multilayer feedthrough capacitor 1 is indicated by a broken line. As shown in FIG. 7A, in the electronic component device 10, two via conductors 28 are connected to each of the ground mounting electrodes 25 and 26, and the total number of via conductors 28 is four. .

  FIG.7 (b) is a top view of the electronic component apparatus which concerns on a comparison form. FIG. 7B shows a state in which two electronic component devices 10A according to the comparative form are arranged side by side in the second direction D2. As shown in FIG. 7B, the electronic component device 10A according to the comparative example includes a multilayer feedthrough capacitor 1A and a mounting substrate 20A. Here, two electronic component devices 10A share one mounting board 20A.

  The multilayer feedthrough capacitor 1A is indicated by a broken line. The multilayer feedthrough capacitor 1A is different from the multilayer feedthrough capacitor 1 mainly in that A / L is smaller than 0.20 and C / L is smaller than 0.40. The mounting substrate 20A is different from the mounting substrate 20 mainly in the dimensions of the ground mounting electrodes 25 and 26. In the electronic component device 10A, one via conductor 28 is connected to each of the ground mounting electrodes 25 and 26, and the total number of via conductors 28 is two.

  The length of the multilayer feedthrough capacitor 1 in the second direction D2 is longer than the length of the multilayer feedthrough capacitor 1A in the second direction D2, and the capacitance of the multilayer feedthrough capacitor 1 is larger than the capacitance of the multilayer feedthrough capacitor 1A. If the capacitance of the multilayer feedthrough capacitor 1 is twice that of the multilayer feedthrough capacitor 1A, the mounting area is larger when the multilayer feedthrough capacitor 1 is used than when two multilayer feedthrough capacitors 1A are used. While reducing, it is possible to maintain the same capacitance as when two multilayer feedthrough capacitors 1A are used.

  The effect of reducing the mounting area of the present embodiment will be specifically shown by examples and comparative examples. As the electronic component devices according to Examples 1 and 4 to 6, devices corresponding to the electronic component device 10 including the multilayer feedthrough capacitors according to the above-described Examples 1 and 4 to 6, respectively, were used. As the electronic component device according to Comparative Example 1, a multilayer feedthrough capacitor according to Comparative Example 1 described above and corresponding to the electronic component device 10A was used.

  Table 2 shows the total number of via conductors and the mounting area reduction rate of the electronic component devices according to Examples 1 and 4 to 6 and Comparative Example 1. The mounting area reduction rate is calculated on the basis of the mounting area when two multilayer feedthrough capacitors according to Comparative Example 1 are used. Since it is necessary to provide a predetermined interval between the two multilayer feedthrough capacitors, the reference mounting area is larger than twice the mounting area of the multilayer feedthrough capacitor according to Comparative Example 1.

  As shown in Table 2, in the electronic component devices according to Examples 1 and 4 to 6, the mounting area was reduced by 40% or more. Thus, in this embodiment, in addition to the reduction in ESL, the mounting area is reduced.

  As mentioned above, although embodiment of this invention has been described, this invention is not necessarily limited to embodiment mentioned above, A various change is possible in the range which does not deviate from the summary.

  DESCRIPTION OF SYMBOLS 1 ... Multilayer feedthrough capacitor, 2 ... Element body, 2a ... 1st main surface, 2b ... 2nd main surface, 2c ... 1st side surface, 2d ... 2nd side surface, 2e ... 3rd side surface, 2f ... 4th side surface, 3 , 4... Signal terminal electrode, 5, 6... Ground terminal electrode, 11... Signal internal electrode, 12... Ground internal electrode, 12 b and 12 c. Mounting surface, 23, 24 ... Signal mounting electrode, 24, 25 ... Ground mounting electrode, 27 ... Conductor layer, 28 ... Via conductor, 32 ... Second insulator layer.

Claims (2)

A rectangular first and second main surfaces that face each other, and a first side that extends in the short side direction of the first and second main surfaces so as to connect the first and second main surfaces and that face each other. One and second side surfaces, and third and fourth side surfaces extending in the long side direction of the first and second main surfaces so as to connect the first and second main surfaces and facing each other. An element body,
A pair of signal terminal electrodes disposed on the first and second side surfaces of the element body;
A pair of grounding terminal electrodes disposed on the third and fourth side surfaces of the element body;
A plurality of signal internal electrodes and ground internal electrodes, which are alternately arranged in the element body in the opposing direction of the first and second main surfaces,
Each of the signal internal electrodes is connected to the pair of signal terminal electrodes,
Each of the grounding internal electrodes is connected to the pair of grounding terminal electrodes,
The length of the element body in the long side direction is L, the length of the connecting portion connected to the grounding terminal electrode of the grounding internal electrode is A, and the length of the grounding terminal electrode is When the length in the long side direction is C,
L ≦ 1.6mm
C / L ≧ 0.40
A / L ≧ 0.20
Meets the multilayer feedthrough capacitor. A multilayer feedthrough capacitor according to claim 1;
A mounting substrate on which the multilayer feedthrough capacitor is mounted,
The mounting substrate is
A substrate body including a mounting surface facing the multilayer feedthrough capacitor;
A pair of signal mounting electrodes disposed on the mounting surface and electrically connected to the pair of signal terminal electrodes;
A pair of grounding mounting electrodes disposed on the mounting surface apart from each other and electrically connected to the pair of grounding terminal electrodes;
A conductor portion facing each grounding mounting electrode across at least a portion of the substrate body;
An electronic component device comprising: a plurality of via conductors connected to each of the grounding mounting electrodes and the conductor portion.

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