JP2014183241A - Penetration type capacitor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress in a practical level a direct current resistance in a signal path, in a penetration type capacitor provided with a first penetrating inner electrode for signals and a second penetrating inner electrode for an earth, even if the capacitor becomes with lower capacity and if the first inner electrode for signals and the second inner electrode for earth are used in an opposite way.SOLUTION: A first inner electrode 3 includes a first capacity formation inner electrode 3(A) to form an electrostatic capacitance facing to a second inner electrode 4; and a first DC resistance degradation inner electrode 3(B) which does not face to the second inner electrode 4. The second inner electrode 4 includes: a second capacity formation inner electrode 4(A) to form an electrostatic capacitance facing to the first inner electrode 3; and a second DC resistance degradation inner electrode 4(B) which does not face to the first inner electrode 3. The DC resistance degradation inner electrodes 3(B), 4(B) do not work for forming the electrostatic capacitance, but are provided only for degradation of DC resistance.

Description

  The present invention relates to a feedthrough capacitor, and more particularly to a feedthrough capacitor having a structure in which a plurality of internal electrodes are laminated.

  A feedthrough capacitor having a multilayer structure is described in, for example, Japanese Patent Laid-Open No. 2000-58376 (Patent Document 1). The feedthrough capacitor described in Patent Document 1 has a general structure, and includes first and second main surfaces facing each other, first and second side surfaces facing each other, and first and second surfaces facing each other. A ceramic substrate (dielectric body) having an outer surface made of a second end surface is provided. Inside the ceramic substrate, a plurality of first and second internal electrodes are alternately arranged in the stacking direction. Both ends of the first internal electrode are led out to the first and second end faces, and both ends of the second internal electrode are led out to the first and second side faces.

  In such a feedthrough capacitor, if it is attempted to reduce the capacity, the number of internal electrodes is reduced. This leads to an increase in DC resistance. An increase in the direct current resistance causes an increase in the amount of heat generated by the feedthrough capacitor. Therefore, in order to suppress this, the rated current must be reduced.

  Japanese Patent Laid-Open No. 9-565335 (Patent Document 2) also describes a feedthrough capacitor having a multilayer structure. The feedthrough capacitor described in Patent Document 2 also has an outer surface including first and second main surfaces facing each other, first and second side surfaces facing each other, and first and second end surfaces facing each other. And a laminated body (dielectric body). The laminated body includes a signal through electrode whose both ends are drawn to the first and second end faces, and a ground which is drawn to the first and second side faces on the upper and lower sides of the through electrode. Electrodes.

  In the invention described in Patent Document 2, in order to increase the current capacity without increasing the capacitance, at least three signal through electrodes are laminated so as to overlap each other between the ground electrodes. Therefore, according to the invention described in Patent Document 2, it is possible to reduce the DC resistance of the signal through electrode. Patent Document 2 describes an example in which one earth electrode is disposed on each of the upper and lower sides of the signal through electrode.

  On the other hand, in recent years, as a result of further downsizing and multi-functionalization of electronic devices, mounting land design has been limited in circuit boards and the like for mounting various chip-like electronic components used there. As a result, in the original design, even if the chip-like electronic component was intended to use the external electrode on the end face for signal and the external electrode on the side face for grounding, the external electrode on the end face May need to be used for grounding and the external electrode on the side for signal use. Therefore, it is desirable that the chip-shaped electronic component mounted on the circuit board or the like has a structure that enables such so-called “reverse use”.

  However, when such “reverse use” is applied to the feedthrough capacitor described in Patent Document 2, what was originally a ground electrode is used as a signal electrode. As described above, since the original earth electrode has only one above and below the original signal electrode, that is, only two in total, it can encounter a problem that the DC resistance becomes high in the signal path. .

JP 2000-58376 A Japanese Patent Laid-Open No. 9-565335

  Therefore, the object of the present invention is to solve the above-mentioned problem, that is, even if the capacity is reduced and “reverse use” is performed, the increase in DC resistance in the signal path is suppressed. It is to provide a feedthrough capacitor that can.

  It should be noted that, even if “reverse use” is used, suppressing the increase in DC resistance does not necessarily mean that the same DC resistance is obtained in the original mounting direction and in the “reverse use” case. Absent. That is, even if “reverse use” is performed, the DC resistance in the signal path can be suppressed to a practical level.

  The present invention includes a dielectric element body having first and second main surfaces facing each other, first and second side surfaces facing each other and first and second end surfaces facing each other, and First to fourth external electrodes formed separately from each other on the outer surface of the dielectric body, and disposed inside the dielectric body, the main portion and the first and second external electrodes A plurality of first internal electrodes each having first and second lead portions drawn to the outer surface so as to be electrically connected to each other; a main portion disposed inside the dielectric body; and A plurality of second internal electrodes having third and fourth lead portions drawn to the outer surface so as to be electrically connected to the third and fourth external electrodes, respectively. The technical problem mentioned above To solve, it is characterized in that it comprises the following arrangement.

  In the first aspect of the present invention, the first internal electrode includes a first capacitance forming internal electrode that forms a capacitance opposite to the second internal electrode, and a first internal electrode that does not oppose the second internal electrode. The first internal electrode for reducing DC resistance, the second internal electrode being opposite to the first internal electrode and forming a capacitance, and the first internal electrode for forming capacitance. And a second direct current resistance reducing internal electrode that is not opposed to the first electrode.

  The first and second DC resistance reducing internal electrodes described above do not contribute to the formation of the capacitance, but are provided exclusively for reducing the DC resistance.

  In the second aspect of the present invention, the dielectric element body includes a capacitance forming portion in which the first internal electrode and the second internal electrode face each other to form a capacitance, and the first internal electrode A first continuous stacked portion in which the electrodes are continuously stacked and at least one of the continuously stacked first internal electrodes is not opposed to the second internal electrode; An electrode is continuously stacked, and at least one of the continuously stacked second internal electrodes is not opposed to the first internal electrode, and a second continuous stacked portion is formed. It is characterized by being.

  The second aspect defines the present invention from a viewpoint different from the first aspect. In the second aspect, some internal electrodes are included in both the capacitance forming portion and the first or second continuous laminated portion.

  In the present invention, the DC resistance provided by the plurality of first internal electrodes and the DC resistance provided by the plurality of second internal electrodes may be different from each other or may be substantially the same.

  In the former case, the DC resistance in the signal path during “reverse use” is different from that in the original mounting direction, but the DC resistance during “reverse use” can also be suppressed to a practical level. If it does not matter.

  In the latter case, since the direct current resistance in the signal path is not easily changed by “reverse use”, the degree of freedom in designing the mounting land is increased. Actually, in many cases, the first internal electrode and the second internal electrode are different in shape from each other, so that it is normal that there is a difference in DC resistance. It can be said that it is rather impossible to completely eliminate. Therefore, in the latter case, as described above, the expression that the DC resistance provided by the plurality of first internal electrodes and the DC resistance provided by the plurality of second internal electrodes are “almost” the same is used.

  The difference between the direct current resistance provided by the plurality of first internal electrodes and the direct current resistance provided by the plurality of second internal electrodes is reduced. Preferably, as in the latter case described above, the plurality of first internal electrodes In order to make the direct-current resistance provided and the direct-current resistance provided by the plurality of second internal electrodes substantially the same, the following preferred embodiment is adopted.

  In the first preferred embodiment, one of the first and second internal electrodes has a narrower extraction portion width than the other, but is thicker. Since the width of the lead-out portion is narrow, the direct current resistance increases. However, since the resistance can be lowered by increasing the thickness, the direct current resistances of the first and second internal electrodes can be made closer to each other.

  In a second preferred embodiment, any one of the first and second internal electrodes is compared with either one from the position on the outer surface of one of the lead portions, and the outer surface of the other lead portion. Although the shortest distance on the internal electrode to the upper position is long, the width of the lead portion is wide. The longer the distance, the higher the DC resistance. However, since the resistance can be lowered by increasing the width of the lead portion, the DC resistance of each of the first and second internal electrodes can be made closer to each other. .

  In the third preferred embodiment, any one of the first and second internal electrodes has a narrower lead-out portion than the other, but has a larger number of stacked layers. Since the width of the lead-out portion is narrow, the direct current resistance is increased. However, since the resistance can be lowered by increasing the number of stacked layers, the direct current resistances of the first and second internal electrodes can be made closer to each other. it can.

  In a fourth preferred embodiment, any one of the first and second internal electrodes has an outer surface of the other lead portion from a position on the outer surface of the one lead portion as compared to the other. Although the shortest distance on the internal electrode to the upper position is long, the number of stacked layers is large. Although the direct current resistance increases as the distance increases, the direct current resistance of each of the first and second internal electrodes can be made closer to each other because the resistance can be lowered by increasing the number of stacked layers.

  In the first aspect described above, the DC resistance reducing internal electrode may be located on the outermost side in the stacking direction of the first and second internal electrodes. This means that the capacitance forming internal electrode is not located on the outermost side in the stacking direction. Since the exposed portion of the internal electrode located in the outermost layer is likely to be oxidized and the electrical contact property with the external electrode may be lowered, it is better not to place the capacitance forming internal electrode in such an outermost layer. In addition, in a feedthrough capacitor with reduced capacitance, the thickness ratio of the outer layer portion of the dielectric element body in which the capacitance forming internal electrode is not disposed is relatively high, and the mechanical strength of the dielectric element body Tends to decrease. However, if the configuration as described above is employed, the mechanical strength of the dielectric body can be improved by disposing the DC resistance reducing internal electrode in the outer layer portion of the dielectric body.

  In the above-described second aspect, the capacitance forming portion may include a portion that is located more biased toward the first main surface side of the dielectric element body than the first and second continuous laminated portions. In this configuration, if the first main surface of the dielectric body is mounted toward the circuit board or the like, the path of the current flowing from the mounting land on the circuit board or the like can be shortened. ) Can be lowered.

  In the above-described embodiment, the capacitance forming portion may further include a capacitor that is located more biased toward the second main surface side of the dielectric body than the first and second continuous stacked portions. According to this configuration, the path of the current flowing from the mounting land on the circuit board or the like can be shortened regardless of which of the first and second main surfaces of the dielectric substrate is mounted on the circuit board or the like. , ESL can be lowered.

  Further, in the second aspect, normally, the first continuous laminated portion has three or more first internal electrodes, and the second continuous laminated portion has three or more second internal electrodes. Is done. For example, when the first and second continuous laminated portions each have three first and second internal electrodes, the internal electrodes that do not contribute to capacitance formation are the first and second continuous laminated portions, respectively. In each part, there is only one sheet located in the center. This means that only the internal electrodes that do not contribute to capacity formation are not necessarily continuously stacked in the continuous stacked portion.

  In the present invention, the first and second internal electrodes are formed on the same plane, separated from each of the first and second internal electrodes, and drawn to the outer surface of the dielectric body. It is preferable to further include an auxiliary electrode. As described above, when the auxiliary electrode is provided, the electrode material is exposed on the outer surface of the dielectric element body, so that the adhesion of the external electrode can be improved.

  According to the present invention, even in a feedthrough capacitor in which the capacity is reduced by reducing the number of internal electrodes contributing to electrostatic capacity formation, the presence of the internal electrode for reducing DC resistance or the continuous laminated portion is present. Thus, both the DC resistance between the first and second external electrodes and the DC resistance between the third and fourth external electrodes can be lowered. Therefore, the DC resistance in the signal path can be suppressed to a practical level regardless of the original mounting direction or “reverse use”.

  Therefore, heat generation of the feedthrough capacitor is suppressed, and as a result, the rated current can be increased. In addition, since “reverse use” can be adopted without any problem, it is possible to increase the degree of freedom of mounting land design in a circuit board or the like on which a feedthrough capacitor is mounted. Can be advanced more easily.

1 is a perspective view showing an appearance of a feedthrough capacitor 1 according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view of a dielectric element body 2 provided in the feedthrough capacitor 1 shown in FIG. 1, which is a plane parallel to main surfaces 11 and 12 and along which a first internal electrode 3 is disposed. FIG. 2 is a cross-sectional view of a dielectric element body 2 provided in the feedthrough capacitor 1 shown in FIG. 1, which is a plane parallel to main surfaces 11 and 12 and on which a second internal electrode 4 is disposed. FIG. 2 is a cross-sectional view of the feedthrough capacitor 1 shown in FIG. 1 along a plane parallel to the side surfaces 13 and 14 of the dielectric body 2. FIG. 2 is a cross-sectional view of the feedthrough capacitor 1 shown in FIG. 1 along a plane parallel to the end faces 15 and 16 of the dielectric body 2. It is sectional drawing which follows the surface parallel to the side surfaces 13 and 14 of the dielectric body 2a of the feedthrough capacitor 1a by 2nd Embodiment of this invention. 7 is a cross-sectional view of the feedthrough capacitor 1a shown in FIG. 6 along a plane parallel to the end faces 15 and 16 of the dielectric body 2a. FIG. It is sectional drawing which follows the surface parallel to the side surfaces 13 and 14 of the dielectric body 2b of the feedthrough capacitor 1b by 3rd Embodiment of this invention. FIG. 9 is a cross-sectional view of the feedthrough capacitor 1b shown in FIG. 8 along a plane parallel to the end faces 15 and 16 of the dielectric element body 2b. It is sectional drawing which follows the surface parallel to the side surfaces 13 and 14 of the dielectric body 2c of the feedthrough capacitor 1c by 4th Embodiment of this invention. 11 is a cross-sectional view of the feedthrough capacitor 1c shown in FIG. 10 along a plane parallel to the end faces 15 and 16 of the dielectric body 2c. FIG. It is sectional drawing which follows the surface parallel to the side surfaces 13 and 14 of the dielectric body 2d of the feedthrough capacitor 1d by 5th Embodiment of this invention. FIG. 13 is a cross-sectional view of the feedthrough capacitor 1d shown in FIG. 12 along a plane parallel to the end faces 15 and 16 of the dielectric body 2d. It is the top view shown from principal surface 11 and 12 direction of dielectric body 2e of penetration type capacitor 1e by a 6th embodiment of this invention. FIG. 15 is a cross-sectional view of a dielectric element body 2e provided in the feedthrough capacitor 1e shown in FIG. 14 that is parallel to the main surfaces 11 and 12 and along which the first internal electrode 3 is disposed. FIG. 15 is a cross-sectional view of a dielectric element body 2e included in the feedthrough capacitor 1e illustrated in FIG. 14 that is parallel to the main surfaces 11 and 12 and along which a second internal electrode 4 is disposed. It is the top view shown from principal surface 11 and 12 direction of dielectric body 2f of penetration type capacitor 1f by a 7th embodiment of this invention. FIG. 18 is a cross-sectional view of a dielectric element body 2f provided in the feedthrough capacitor 1f shown in FIG. 17 that is parallel to the main surfaces 11 and 12 and along which the first internal electrode 3 is disposed. FIG. 18 is a cross-sectional view of a dielectric element body 2f provided in the feedthrough capacitor 1f shown in FIG. 17 that is parallel to the main surfaces 11 and 12 and along which the second internal electrode 4 is disposed. It is a perspective view which shows the external appearance of the feedthrough capacitor 1g by 8th Embodiment of this invention. FIG. 21 is a cross-sectional view of a dielectric element body 2g provided in the feedthrough capacitor 1g shown in FIG. 20 that is parallel to the main surfaces 11 and 12 and along which the first internal electrode 3 is disposed. FIG. 21 is a cross-sectional view of a dielectric element body 2g included in the feedthrough capacitor 1g illustrated in FIG. 20 that is parallel to the main surfaces 11 and 12 and along which the second internal electrode 4 is disposed. FIG. 21 is a cross-sectional view of the feedthrough capacitor 1g shown in FIG. 20 along a plane parallel to the side surfaces 13 and 14 of the dielectric body 2g. FIG. 21 is a cross-sectional view of the feedthrough capacitor 1g shown in FIG. 20 along a plane parallel to the end faces 15 and 16 of the dielectric body 2g.

[First Embodiment]
1 to 5 are for explaining a first embodiment of the present invention. The feedthrough capacitor 1 according to the first embodiment includes a dielectric body 2, first and second internal electrodes 3 and 4 disposed inside the dielectric body 2, and a dielectric body 2. First to fourth outer electrodes 5 to 8 disposed on the outer surface of the first to fourth outer electrodes. Hereinafter, the details of the structure of the feedthrough capacitor 1 will be described separately for (1) dielectric body, (2) external electrode, (3) internal electrode, and (4) others.

(1) Dielectric body The dielectric body 2 has, as its outer surface, first and second main surfaces 11 and 12 facing each other and a pair of side surfaces 13 and 14 facing each other. It has a substantially rectangular parallelepiped shape having a pair of end faces 15 and 16. As shown in FIGS. 2 to 5, the dielectric body 2 has a laminated structure composed of a plurality of dielectric layers 17 extending and laminated in the directions of the main surfaces 11 and 12.

  It is preferable that the dielectric body 2 has rounded corners and ridges.

The dielectric body 2 is preferably made of a dielectric ceramic. When the dielectric body 2 is made of a dielectric ceramic, as the dielectric ceramic material, for example, a material mainly composed of BaTiO ₃ , CaTiO ₃ , SrTiO ₃ , CaZrO ₃ or the like can be used. Moreover, you may use what added subcomponents, such as a Mn compound, Fe compound, Cr compound, Co compound, Ni compound, to these main components.

  The dielectric body 2 may be made of a dielectric other than ceramic.

(2) External Electrodes The first to fourth external electrodes 5 to 8 are formed on the outer surface of the dielectric body 2 so as to be separated from each other.

  More specifically, the first and second external electrodes 5 and 6 are formed on the first and second end faces 15 and 16 of the dielectric element body 2, respectively. In this embodiment, the first and second external electrodes 5 and 6 wrap around the main surfaces 11 and 12 and part of the side surfaces 13 and 14.

  The third and fourth external electrodes 7 and 8 are formed on part of the first and second side surfaces 13 and 14 of the dielectric body 2, respectively. In this embodiment, the third and fourth external electrodes 7 and 8 wrap around part of the main surfaces 11 and 12.

  The external electrodes 5 to 8 are formed, for example, by baking a conductive paste containing Ni.

(3) Internal electrode The internal electrodes 3 and 4 are classified into a first internal electrode 3 and a second internal electrode 4 based on their shapes and functions. 4 and 5, which are cross-sectional views, the first internal electrode 3 and the first internal electrode 3 and the first internal electrode 3 are shown in order to make the first internal electrode 3 and the second internal electrode 4 clearer on the display. Auxiliary electrodes 27 and 28 to be described later on the same plane as the electrode 3 are indicated by solid lines, and the auxiliary electrodes 29 and 28 to be described later are positioned on the same plane as the second internal electrode 4 and the second internal electrode 4. 30 is indicated by a dotted line. This display method is also employed in FIGS. 6 to 13, 23 and 24 described later.

  As shown in FIG. 2, the first inner electrode 3 extends between the first end face 15 and the second end face 5 of the dielectric element body 2, and has a main part 18 corresponding to the center thereof, First and second lead portions 19 and 20 led out to the first and second end faces 15 and 16 so as to be electrically connected to the second external electrodes 5 and 6, respectively.

  As shown in FIG. 3, the second inner electrode 4 extends between the first side surface 13 and the second side surface 14 of the dielectric element body 2, and includes a main portion 21 corresponding to the central portion thereof, Third and fourth lead portions 22 and 23 led to the first and second side surfaces 13 and 14 so as to be electrically connected to the fourth external electrodes 7 and 8, respectively.

  As can be seen by comparing FIG. 2 and FIG. 3, the main portion 18 of the first internal electrode 3 and the main portion 21 of the second internal electrode 4 are at the same projection position when viewed in the stacking direction. .

  The internal electrodes 3 and 4 are classified according to their functions into a capacitance forming internal electrode (A) and a DC resistance reducing internal electrode (B).

  The first capacitance forming internal electrode 3 (A) provided by the first internal electrode 3 forms a capacitance opposite to the second internal electrode 4, and is shown in FIGS. 4 and 5. Located in the capacitor forming portion 24. The first DC resistance reducing internal electrode 3 (B) provided by the first internal electrode 3 does not oppose the second internal electrode 4, and the first continuous laminated structure shown in FIGS. 4 and 5 is used. It is located in the part 25.

  The second capacitance forming internal electrode 4 (A) provided by the second internal electrode 4 forms a capacitance opposite to the first internal electrode 3, and is shown in FIGS. 4 and 5. Located in the capacitor forming portion 24. The second DC resistance reducing internal electrode 4 (B) provided by the second internal electrode 4 is not opposed to the first internal electrode 3, and is the second continuous laminated layer shown in FIGS. 4 and 5. Located in the portion 26.

  Note that not all of the first internal electrodes 3 positioned in the first continuous laminated portion 25 necessarily become the first DC resistance reducing internal electrode 3 (B). Of the first internal electrodes 3 that are continuously stacked in the first continuous stacked portion 25, those that are located adjacent to the capacitance forming portion 24 or the second continuous stacked portion 26 have the first DC resistance reduction. It is not the internal electrode 3 (B) for use, but the first internal electrode 3 (A) for capacity formation. Therefore, in the first continuous laminated portion 25, adjacent to at least one of the first inner electrodes 3 continuously laminated, more specifically, the capacitance forming portion 24 or the second continuous laminated portion 26. The first internal electrode 3 except for the one located at the position where the first internal electrode 3 is not opposed to the second internal electrode is the first direct current resistance reducing internal electrode 3 (B).

  The same can be said for the second internal electrode 4 located in the second continuous laminated portion 26. Of the second internal electrodes 4 that are continuously laminated in the second continuous laminated portion 26, those that are adjacent to the capacitance forming portion 24 or the first continuous laminated portion 25 have a second DC resistance reduction. This is not the internal electrode 4 (B) for use, but the second internal electrode 4 (A) for forming a capacitance.

  Usually, the first continuous laminated portion 25 has three or more first internal electrodes 3, and the second continuous laminated portion 26 has three or more second internal electrodes 4. In the illustrated embodiment, for example, the first and second continuous laminated portions 25 and 26 each have four first and second inner electrodes 3 and 4, respectively. In this case, the number of internal electrodes 3 and 4 that do not contribute to capacitance formation is only two at the center in the stacking direction.

  In this embodiment, capacitance forming internal electrodes 3 (A) and 4 (A) included in the capacitance forming portion 24 are located on the outermost side in the stacking direction of the first and second internal electrodes 3 and 4. . In other words, the capacitance forming part 24 is positioned more biased to the first and second main surfaces 11 and 12 of the dielectric element body 2 than the first and second continuous laminated parts 25 and 26. . According to this configuration, even if any of the first and second main surfaces 11 and 12 of the dielectric element body 2 is mounted on the circuit board or the like, the path of the current flowing from the mounting land on the circuit board or the like is reduced. Since it can be shortened, ESL can be lowered.

  The DC resistance provided by the plurality of first internal electrodes 3 and the DC resistance provided by the plurality of second internal electrodes 4 are preferably substantially the same as each other, but may be different from each other.

  When the direct current resistance provided by the plurality of first internal electrodes 3 and the direct current resistance provided by the plurality of second internal electrodes 4 are different from each other, the direct current resistance in the signal path is different from that in the original mounting direction in “reverse use”. Although it is different from the case, the direct current resistance during “reverse use” is not a problem as long as it is suppressed to a practical level.

  When the DC resistance provided by the plurality of first internal electrodes 3 and the DC resistance provided by the plurality of second internal electrodes 4 are substantially the same, the DC resistance in the signal path is not easily changed by “reverse use”. Increase design freedom.

  The difference between the DC resistance provided by the plurality of first internal electrodes 3 and the DC resistance provided by the plurality of second internal electrodes 4 is reduced, and preferably, the plurality of first internal electrodes 3 provide as described above. In order to make the direct current resistance and the direct current resistance provided by the plurality of second internal electrodes 4 substantially the same, means for changing the number of laminated internal electrodes, the thickness, the distance between the lead portions, and / or the width of the lead portions. Can be adopted. For example, for example, if the number of stacked layers increases, the direct current resistance decreases. Further, as the thickness of the internal electrode increases, the direct current resistance decreases. If the distance between the drawers is shortened, the direct current resistance decreases. If the width | variety of a drawer | drawing-out part is wide, direct current | flow resistance will fall. In the illustrated embodiment, specifically, the following means can be employed.

  First, the lead portions 22 and 23 of the second internal electrode 4 are narrower but thicker than the lead portions 19 and 20 of the first internal electrode 3. Since the width of the lead-out portion is narrow, the direct current resistance increases. However, since the resistance can be lowered by increasing the thickness, the direct current resistances of the first and second internal electrodes 3 and 4 are brought close to each other. Can do. In order to increase the thickness of the drawer portion, for example, the conductive paste may be printed several times, or the viscosity of the conductive paste used for printing may be increased.

  Secondly, the internal electrode 3 from the position on the first end face 15 of the first lead portion 19 in the first internal electrode 3 to the position on the second end face 16 of the second lead portion 20 in the same manner. The shortest distance on the second internal electrode 4 is from the position on the first side surface 13 of the third lead portion 22 to the position on the second side surface 14 of the fourth lead portion 23. Although longer than the shortest distance on the internal electrode 4, the widths of the lead portions 19 and 20 of the first internal electrode 3 are made wider than the widths of the lead portions 22 and 23 of the second internal electrode 4. The longer the distance, the higher the DC resistance. However, since the resistance can be lowered by increasing the width of the lead portion, the DC resistances of the first and second internal electrodes 3 and 4 are brought closer to each other. be able to.

  Third, although not appearing in FIGS. 4 and 5, the lead portions 22 and 23 of the second internal electrode 4 are narrower than the lead portions 19 and 20 of the first internal electrode 3. The number of stacked second internal electrodes 4 is larger than the number of stacked first internal electrodes 3. Since the width of the lead-out portion is narrow, the direct current resistance is increased. However, since the resistance can be further decreased by increasing the number of stacked layers, the direct current resistances of the first and second internal electrodes 3 and 4 are mutually reduced. You can get closer.

  Fourth, although not appearing in FIG. 4 and FIG. 5, the second of the second lead-out portion 20 is also from the position on the first end face 15 of the first lead-out portion 19 in the first internal electrode 3. The shortest distance on the internal electrode 3 to the position on the end face 16 is the fourth lead part 23 from the position on the first side surface 13 of the third lead part 22 in the second internal electrode 4. This is longer than the shortest distance on the internal electrode 4 to the position on the second side surface 14, but the number of stacked second internal electrodes 4 is made larger than the number of stacked first internal electrodes 3. The longer the distance, the higher the DC resistance. However, since the resistance can be lowered by increasing the number of stacked layers, the DC resistances of the first and second internal electrodes 3 and 4 can be made closer to each other. .

(4) Others In this embodiment, as shown in FIGS. 2 to 5, auxiliary electrodes 27 to 30 that do not substantially contribute to capacitance acquisition are provided.

  The auxiliary electrodes 27 and 28 are separated from the first internal electrode 3 on the same plane as the first internal electrode 3 and are respectively formed on the first and second side surfaces 13 and 14 of the dielectric body 2. It is formed in the state pulled out to. As a result, as shown in FIG. 5, the auxiliary electrodes 27 and 28 are joined to the third and fourth external electrodes 7 and 8, respectively. From this, the auxiliary electrodes 27 and 28 contribute to the improvement of the adhesion of the external electrodes 7 and 8.

  On the other hand, the auxiliary electrodes 29 and 30 are separated from the second internal electrode 4 on the same plane as the second internal electrode 4 and are respectively separated from the first and second end faces 15 and 15 of the dielectric body 2. It is formed in the state pulled out to 16. As a result, as shown in FIG. 4, the auxiliary electrodes 29 and 30 are joined to the first and second external electrodes 5 and 6, respectively. From this, the auxiliary electrodes 29 and 30 contribute to the improvement of the adhesion of the external electrodes 5 and 6.

[Second Embodiment]
A second embodiment of the invention is shown in FIGS. 6 and 7 correspond to FIGS. 4 and 5, respectively. 6 and 7, elements corresponding to those shown in FIGS. 4 and 5 are denoted by the same reference numerals, and redundant description is omitted.

  In the feedthrough capacitor 1a according to the second embodiment, the DC resistance reducing internal electrodes 3 (B) and 4 (B) are also provided outside the capacitance forming portion 24 as compared with the feedthrough capacitor 1 according to the first embodiment. Are located respectively. As described above, the DC resistance reducing internal electrodes 3 (B) and 4 (B) are positioned on the outermost side in the stacking direction of the first and second internal electrodes 3 and 4 to form the capacitance forming internal electrode 3. It means that (A) and 4 (A) are not located on the outermost side in the stacking direction.

  The exposed portion of the internal electrode located in the outermost layer is likely to be oxidized, and the electrical contact with the external electrode may be reduced. If this point is emphasized, it is better not to place the capacitor forming internal electrode in such an outermost layer. Therefore, according to this embodiment, the exposed portions of the capacitance forming internal electrodes 3 (A) and 4 (A) are oxidized, so that the electrical contact with the external electrodes 5 to 8 is deteriorated. It can be made difficult to invite.

  In addition, in a feedthrough capacitor with reduced capacitance, the thickness ratio of the outer layer portion of the dielectric element body in which the capacitance forming internal electrode is not disposed is relatively high, and the mechanical strength of the dielectric element body Tends to decrease. However, if the configuration as described above is employed, the DC resistance reducing internal electrodes 3 (B) and 4 (B) are arranged in the outer layer portion of the dielectric body 2a. Strength can be improved.

[Third Embodiment]
A third embodiment of the invention is shown in FIGS. 8 and 9 correspond to FIGS. 4 and 5, respectively. 8 and 9, elements corresponding to those shown in FIGS. 4 and 5 are denoted by the same reference numerals, and redundant description is omitted.

  The dielectric body 2b of the feedthrough capacitor 1b according to the third embodiment does not include the auxiliary electrodes 27 to 30 shown in FIGS.

[Fourth Embodiment]
A fourth embodiment of the invention is shown in FIGS. 10 and 11 correspond to FIGS. 4 and 5, respectively. 10 and 11, elements corresponding to those shown in FIGS. 4 and 5 are denoted by the same reference numerals, and redundant description is omitted.

  In the feedthrough capacitor 1c according to the fourth embodiment, the capacitance forming portion 24 is positioned more biased toward the first main surface 11 side of the dielectric body 2c than either of the continuous laminated portions 25 and 26. In this configuration, if the first main surface 11 of the dielectric body 2c is mounted on the circuit board or the like, the path of the current flowing from the mounting land on the circuit board or the like can be shortened. (ESL) can be lowered.

  As a modification of the fourth embodiment, the capacitance forming unit 24 may be positioned more biased toward the second main surface 12 side of the dielectric body 2 c than any of the continuous stacked units 25 and 26.

[Fifth Embodiment]
A fifth embodiment of the invention is shown in FIGS. 12 and 13 correspond to FIGS. 4 and 5, respectively. 12 and 13, elements corresponding to those shown in FIGS. 4 and 5 are denoted by the same reference numerals, and redundant description is omitted.

  In the feedthrough capacitor 1d according to the fifth embodiment, the capacitance forming portion 24 is disposed at the center portion in the stacking direction of the dielectric body 2d, and is sandwiched from both ends in the stacking direction. The continuous laminated portions 25 and 26 are arranged.

  According to this embodiment, as in the case of the second embodiment described above, the exposed portions of the capacitance forming internal electrodes 3 (A) and 4 (A) are oxidized, so that the external electrodes 5 to 8 are connected. It is possible to make it difficult to cause a situation where the electrical contact property is lowered.

[Sixth Embodiment]
A sixth embodiment of the present invention is shown in FIGS. FIG. 14 is a plan view showing the appearance of the feedthrough capacitor 1e according to the sixth embodiment, and FIGS. 15 and 16 are views corresponding to FIGS. 2 and 3, respectively. 14 to 16, elements corresponding to those shown in FIGS. 1 to 3 are denoted by the same reference numerals, and redundant description is omitted.

  In the feedthrough capacitor 1e according to the sixth embodiment, first, as shown in FIG. 14, the positional relationship between the first to fourth external electrodes 5 to 8 is different from that in the first embodiment. That is, in the case of the first embodiment, the first and fourth external electrodes 5 and 8 are positioned on the first end face 15 and the second side face 14 of the dielectric element body 2e, respectively. , But the second external electrode 6 is positioned on the first side surface 13 and the third external electrode 7 is positioned on the second end surface 16.

  As a result of the arrangement of the external electrodes 5 to 8 as described above, the shapes of the first and second internal electrodes 3 and 4 are changed as follows as compared with the case of the first embodiment.

  As shown in FIG. 15, the first inner electrode 3 extends between the first end face 15 and the first side face 13 of the dielectric element body 2e, and includes a main part 18 corresponding to the central part thereof, First and second lead portions 19 and 20 led out to the first end face 15 and the first side face 13 so as to be electrically connected to the second external electrodes 5 and 6, respectively.

  As shown in FIG. 16, the second inner electrode 4 extends between the second end face 16 and the second side face 14 of the dielectric element body 2e, and has a main part 21 corresponding to the center thereof, Third and fourth lead portions 22 and 23 led to the second end face 16 and the second side face 14 so as to be electrically connected to the fourth external electrodes 7 and 8, respectively.

[Seventh Embodiment]
A seventh embodiment of the present invention is shown in FIGS. FIG. 17 is a plan view showing an appearance of the feedthrough capacitor 1f according to the seventh embodiment, and FIGS. 18 and 19 are views corresponding to FIGS. 2 and 3, respectively. 17 to 19, elements corresponding to those shown in FIGS. 1 to 3 are denoted by the same reference numerals, and redundant description is omitted.

  Also in the feedthrough capacitor 1f according to the seventh embodiment, as in the case of the sixth embodiment, the positional relationship between the first to fourth external electrodes 5 to 8 is different from that of the first embodiment. . That is, as shown in FIG. 17, the first external electrode 5 is disposed on the first corner 31 where the first side surface 13 and the first end surface 15 intersect, and the second external electrode 6 is the first external electrode 6. The second side face 14 and the second end face 16 are arranged on the second corner 32, and the third external electrode 7 is formed by the third side face 14 and the first end face 15 intersecting with each other. The fourth external electrode 8 is disposed on the corner portion 33, and is disposed on the fourth corner portion 34 where the first side surface 13 and the second end surface 16 intersect.

  As a result of the arrangement of the external electrodes 5 to 8 as described above, the shapes of the first and second internal electrodes 3 and 4 are changed as follows as compared with the case of the first embodiment.

  As shown in FIG. 18, the first inner electrode 3 extends diagonally between the first corner portion 31 and the second corner portion 32 of the dielectric body 2f, and the main portion 18 corresponding to the center portion thereof. The first and second lead portions 19 drawn out to the first corner portion 31 and the second corner portion 32 so as to be electrically connected to the first and second outer electrodes 5 and 6, respectively. And 20.

  As shown in FIG. 19, the second internal electrode 4 extends diagonally between the third corner portion 33 and the fourth corner portion 34 of the dielectric element body 2f, and is a main portion 21 corresponding to the center portion thereof. And the third and fourth lead portions 22 drawn out to the third corner portion 33 and the fourth corner portion 34 so as to be electrically connected to the third and fourth outer electrodes 7 and 8, respectively. And 23.

  The sixth and seventh embodiments have a significance of clearly indicating that the positions of the first to fourth external electrodes 5 to 8 on the outer surface of the dielectric body 2f are not limited.

[Eighth Embodiment]
An eighth embodiment of the invention is shown in FIGS. 20 corresponds to FIG. 1, FIG. 21 corresponds to FIG. 2, FIG. 22 corresponds to FIG. 3, FIG. 23 corresponds to FIG. 20 to 24, elements corresponding to those shown in FIGS. 1 to 5 are denoted by the same reference numerals, and redundant description is omitted.

  In the feedthrough capacitor 1g according to the eighth embodiment, when the dielectric body 2g is viewed in a planar direction, the surfaces extending in the longitudinal direction are referred to as end surfaces 15 and 16, and the surfaces extending in the direction perpendicular to the end surfaces 15 and 16 are referred to. These will be referred to as side surfaces 13 and 14.

  As shown in FIG. 20, the feedthrough capacitor 1g according to the eighth embodiment includes first and second external electrodes 5 formed on first and second end faces 15 and 16 of a dielectric body 2g, respectively. And 6 is a plurality, for example, four.

  Therefore, as shown in FIG. 21, the four first internal electrodes 3 are provided in parallel. The four first inner electrodes 3 are electrically connected to the four first and second outer electrodes 5 and 6, respectively.

  Although not an essential feature of the eighth embodiment, the third and fourth external electrodes 7 and 8 respectively cover the first and second side surfaces 13 and 14 of the dielectric body 2g. It is formed so as to cover only the central portion in the width direction. Further, the lead portions 22 and 23 of the second internal electrode 4 are narrower than the main portion 21.

1, 1a, 1b, 1c, 1d, 1e, 1f, 1g Feedthrough capacitor 2, 2a, 2b, 2c, 2d, 2e, 2f, 2g Dielectric body 3 First internal electrode 3 (A) First Capacitance formation internal electrode 3 (B) First direct current resistance reduction internal electrode 4 Second internal electrode 4 (A) Second capacitance formation internal electrode 4 (B) Second direct current resistance reduction internal electrode 5 First external electrode 6 Second external electrode 7 Third external electrode 8 Fourth external electrode 11, 12 Main surface 13, 14 Side surface 15, 16 End surface 17 Dielectric layer 18, 21 Main portion 19, 20, 22 , 23 Lead-out part 24 Capacitance forming part 25, 26 Continuous lamination part 27-30

Claims (13)

A dielectric element body having first and second main surfaces facing each other, first and second side surfaces facing each other and first and second end surfaces facing each other;
First to fourth external electrodes formed separately from each other on the outer surface of the dielectric body;
First and second lead portions disposed inside the dielectric body and drawn to the outer surface so as to be electrically connected to the main portion and the first and second external electrodes, respectively. A plurality of first internal electrodes,
Third and fourth lead portions arranged inside the dielectric element body and led to the outer surface so as to be electrically connected to the main portion and the third and fourth external electrodes, respectively. A plurality of second internal electrodes,
With
The first internal electrode includes a first capacitance forming internal electrode that forms a capacitance opposite to the second internal electrode, and a first direct current resistance reducing electrode that does not face the second internal electrode. An internal electrode,
The second internal electrode includes a second capacitance forming internal electrode that forms a capacitance opposite to the first internal electrode, and a second direct current resistance reduction that does not face the first internal electrode. With internal electrodes,
Feedthrough capacitor. A dielectric element body having first and second main surfaces facing each other, first and second side surfaces facing each other and first and second end surfaces facing each other;
First to fourth external electrodes formed separately from each other on the outer surface of the dielectric body;
First and second lead portions disposed inside the dielectric body and drawn to the outer surface so as to be electrically connected to the main portion and the first and second external electrodes, respectively. A plurality of first internal electrodes,
Third and fourth lead portions arranged inside the dielectric element body and led to the outer surface so as to be electrically connected to the main portion and the third and fourth external electrodes, respectively. A plurality of second internal electrodes,
With
In the dielectric body,
A capacitance forming portion in which the first internal electrode and the second internal electrode face each other to form a capacitance;
The first continuous stack, wherein the first internal electrodes are continuously stacked, and at least one of the continuously stacked first internal electrodes is not opposed to the second internal electrode. And
The second continuous stack, in which the second internal electrodes are continuously stacked, and at least one of the continuously stacked second internal electrodes is not opposed to the first internal electrode. And
Is a feedthrough capacitor.   3. The feedthrough capacitor according to claim 1, wherein a DC resistance provided by the plurality of first internal electrodes and a DC resistance provided by the plurality of second internal electrodes are different from each other.   3. The feedthrough capacitor according to claim 1, wherein a DC resistance provided by the plurality of first internal electrodes and a DC resistance provided by the plurality of second internal electrodes are substantially the same.   5. The through type according to claim 1, wherein one of the first and second internal electrodes has a narrower width but a larger thickness than the other. Capacitor.   Either one of the first and second internal electrodes has a position on the outer surface of the other lead portion from a position on the outer surface of the one lead portion compared to the other. The feedthrough capacitor according to claim 1, wherein the shortest distance on the internal electrode to the position is long, but the width of the lead-out portion is wide.   5. The penetration according to claim 1, wherein either one of the first and second internal electrodes has a narrower width of the lead-out portion than the other, but has a larger number of stacked layers. Type capacitor.   Either one of the first and second internal electrodes has a position on the outer surface of the other lead portion from a position on the outer surface of the one lead portion compared to the other. 5. The feedthrough capacitor according to claim 1, wherein the shortest distance on the internal electrode to the position is long, but the number of stacked layers is large.   2. The feedthrough capacitor according to claim 1, wherein the DC resistance reducing internal electrode is located on the outermost side in the stacking direction of the first and second internal electrodes.   3. The through type according to claim 2, wherein the capacitance forming portion includes a portion that is biased toward the first main surface side of the dielectric element body with respect to the first and second continuous stacked portions. Capacitor.   11. The penetration according to claim 10, wherein the capacitance forming portion further includes a portion that is located closer to the second main surface side of the dielectric body than the first and second continuous stacked portions. Type capacitor.   3. The penetration according to claim 2, wherein the first continuous laminated portion has three or more first internal electrodes, and the second continuous laminated portion has three or more second internal electrodes. Type capacitor.   An auxiliary electrode formed on the same plane as each of the first and second internal electrodes, separated from each of the first and second internal electrodes and drawn to the outer surface. The feedthrough capacitor according to any one of claims 1 to 12, further comprising:

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