JP2020035780A - Printed circuit board dividing device, printed circuit board dividing holding jig, printed circuit board dividing method, and manufacturing method of printed circuit device - Google Patents

Abstract

To prevent an electronic component from being damaged when a printed circuit board is divided.SOLUTION: A first holding jig 10 includes a first surface 11 and a first protrusion 12 protruding from the first surface 11. The first surface 11 comes into surface contact with a first region 4a of a first main surface 4 of a printed circuit board 3 on which an electronic component 3e is mounted. A first surface portion 12a of the first protrusion 12 comes into surface contact with a first side surface 6a of a first groove 6 of the printed circuit board 3. The first groove 6 has the first side surface 6a connected to the first region 4a, and a second side surface 6b facing the first side surface 6a. A pressing member 18 presses the second region 4b of the first main surface 4 connected to the second side surface 6b.SELECTED DRAWING: Figure 12

Description

  The present invention relates to a printed circuit board dividing apparatus, a holding jig for dividing a printed circuit board, a printed circuit board dividing method, and a method of manufacturing a printed circuit device.

  Japanese Patent Laying-Open No. 7-231148 (Patent Document 1) discloses a substrate dividing device and a method of dividing a circuit board using the substrate dividing device. The substrate dividing device includes a substrate holding mechanism, a substrate receiving section, a cutting blade, and a movable body. The circuit board includes a component mounting area where electronic components are mounted, and a component non-mounting area where electronic components are not mounted. The circuit board is clamped by the board holding mechanism and the board receiving portion. Align the cutting blade with the dividing line on the circuit board. The non-component mounting area of the circuit board is pressed using the movable body. Thus, the circuit board is divided along the division line.

JP-A-7-231148

  In the board dividing device disclosed in Patent Document 1 and the circuit board dividing method using the board dividing device, electronic components may be damaged when the circuit board is divided. The present invention has been made in view of the above problems, and an object of the present invention is to provide a printed circuit board dividing apparatus and a printed circuit that can prevent electronic components from being damaged when the printed circuit board is divided. An object of the present invention is to provide a holding jig for dividing a substrate, a method of dividing a printed circuit board, and a method of manufacturing a printed circuit device.

  The printed circuit board dividing device of the present invention includes a first holding jig and a pressing member. The first holding jig includes a first surface and a first protrusion protruding from the first surface. The first surface is configured to be in surface contact with a first region of the first main surface of the printed circuit board on which the electronic component is mounted. The first protrusion includes a first surface portion configured to make surface contact with a first side surface of the first groove of the printed circuit board. The first groove is formed on the first main surface. The first groove has a first side surface connected to the first region, and a second side surface facing the first side surface. The pressing member is configured to press the second region of the first main surface connected to the second side surface.

  The holding jig for dividing a printed circuit board according to the present invention includes a first surface and a first protrusion protruding from the first surface. The first surface is configured to be in surface contact with a first region of the first main surface of the printed circuit board on which the electronic component is mounted. The first protrusion includes a first surface portion configured to make surface contact with a first side surface of the first groove of the printed circuit board. The first groove is formed on the first main surface. The first groove has a first side surface connected to the first region, and a second side surface facing the first side surface.

  A printed circuit board dividing method according to the present invention includes clamping a printed circuit board using a first holding jig. The first holding jig includes a first surface and a first protrusion protruding from the first surface. The first surface is in surface contact with the first region of the first main surface of the printed circuit board on which the electronic component is mounted. The first protrusion includes a first surface portion in surface contact with a first side surface of the first groove of the printed circuit board. The first groove is formed on the first main surface. The first groove has a first side surface connected to the first region, and a second side surface facing the first side surface. The method for dividing a printed circuit board according to the present invention includes dividing the printed circuit board by pressing a second region of the first main surface connected to the second side surface using a pressing member.

  A method of manufacturing a printed circuit device according to the present invention includes mounting an electronic component on a first region of a first main surface of a printed circuit board, and dividing the printed circuit board by the printed circuit board dividing method of the present invention. Prepare.

  In the printed circuit board dividing device, the printed circuit board dividing holding jig, the printed circuit board dividing method and the printed circuit device manufacturing method of the present invention, when the printed circuit board is divided, the first surface of the first holding jig and Between the first region of the first main surface of the printed circuit board, and between the first surface portion of the first protrusion of the first holding jig and the first side surface of the first groove of the printed circuit board. , Frictional force acts. When a printed circuit board is divided, the frictional force reduces the amount of deformation of the printed circuit board. The reduced amount of deformation of the printed circuit board reduces the stress applied to the electronic components when dividing the printed circuit board. In this way, it is possible to prevent the electronic components from being damaged when the printed circuit board is divided.

1 is a schematic perspective view of a printed circuit board dividing device according to a first embodiment. FIG. 2 is a schematic partial side view of the printed circuit board dividing device according to the first embodiment. FIG. 2 is a schematic partial side view of the printed circuit board dividing device according to the first embodiment. FIG. 2 is a schematic partial side view of the printed circuit board dividing device according to the first embodiment. FIG. 2 is a schematic partial side view of the printed circuit board dividing device according to the first embodiment. FIG. 2 is a schematic partial enlarged cross-sectional view of a first holding jig according to Embodiment 1. FIG. 4 is a schematic partial enlarged cross-sectional view of a second holding jig according to Embodiment 1. FIG. 2 is a schematic perspective view of a printed circuit board. FIG. 2 is a schematic partial enlarged sectional view of a printed circuit board. FIG. 3 is a diagram showing a flowchart of a printed circuit board dividing method and a printed circuit device manufacturing method according to the first embodiment. FIG. 3 is a schematic partial enlarged cross-sectional view showing one step of the printed circuit board dividing method according to the first embodiment. FIG. 12 is a schematic partial enlarged sectional view showing a step subsequent to the step shown in FIG. 11 in the printed circuit board dividing method according to the first embodiment. FIG. 13 is a schematic partial enlarged cross-sectional view showing a step subsequent to the step shown in FIG. 12 in the printed circuit board dividing method according to the first embodiment. FIG. 3 is a schematic partial enlarged cross-sectional view illustrating a distribution of a deformation amount of the printed circuit board when the printed circuit board is divided in the printed circuit board dividing method according to Embodiment 1. FIG. 4 is a schematic partial enlarged cross-sectional view showing one step of a printed circuit board dividing method of a comparative example. FIG. 9 is a schematic partial enlarged cross-sectional view showing a distribution of a deformation amount of the printed circuit board when the printed circuit board is divided in the printed circuit board dividing method of the comparative example. FIG. 5 is a schematic partial enlarged cross-sectional view of a first holding jig according to a modification of the first embodiment. FIG. 10 is a schematic partial enlarged cross-sectional view of a first holding jig according to a second embodiment. FIG. 10 is a schematic partial enlarged cross-sectional view of a first holding jig according to Embodiment 3. FIG. 14 is a schematic partial enlarged cross-sectional view of a first holding jig according to a modification of the third embodiment. FIG. 13 is a schematic partial enlarged cross-sectional view of a first holding jig according to Embodiment 4. FIG. 15 is a schematic partial enlarged cross-sectional view of a first holding jig according to a first modification of the fourth embodiment. FIG. 14 is a schematic partial enlarged cross-sectional view of a first holding jig according to a second modification of the fourth embodiment. FIG. 14 is a schematic partial enlarged cross-sectional view of a first holding jig according to a third modification of the fourth embodiment.

  Hereinafter, embodiments of the present invention will be described. Note that the same components are denoted by the same reference numerals, and description thereof will not be repeated.

Embodiment 1 FIG.
A printed circuit board dividing apparatus 1 according to a first embodiment will be described with reference to FIGS. The printed circuit board dividing device 1 mainly includes a first holding jig 10 and a pressing member 18. The printed circuit board dividing device 1 further includes a second holding jig 14. The printed circuit board dividing device 1 further includes a second shaft 30, a cam 32, and a gear. The printed circuit board dividing device 1 further includes a handle 24.

  With reference to FIGS. 8 and 9, the printed circuit board 3 that is divided by using the printed circuit board dividing device 1 will be described. The printed circuit board 3 includes a first main surface 4 and a second main surface 5 opposite to the first main surface 4. The substrate of the printed circuit board 3 is not particularly limited, but is formed of, for example, glass fiber impregnated with an epoxy resin or a polyimide resin, or paper fiber impregnated with an epoxy resin or a phenol resin.

  First main surface 4 includes a first region 4a and a second region 4b. The electronic component 3e is mounted on the first area 4a. The electronic component 3e is not mounted on the second area 4b. The electronic component 3e is not particularly limited, but is, for example, a capacitor, a resistor, an inductor, an integrated circuit (IC) chip, or a semiconductor module. The first groove 6 is formed on the first main surface 4. The first groove 6 is formed, for example, by moving the cutting blade relative to the printed circuit board 3 with the cutting blade in contact with the first main surface 4.

  The first groove 6 is formed between the first region 4a and the second region 4b. The first groove 6 defines a first region 4a and a second region 4b. The first groove 6 extends along the first main surface 4. The first groove 6 is, for example, a V-groove. The first groove 6 has a first side surface 6a and a second side surface 6b facing the first side surface 6a. The first side surface 6a is connected to the first region 4a. The second side surface 6b is connected to the second region 4b. The depth of the first groove 6 is, for example, one-fourth or more of the thickness of the printed circuit board 3. The depth of the first groove 6 is, for example, one third or less of the thickness of the printed circuit board 3.

  The second main surface 5 includes a third region 5a opposite to the first region 4a and a fourth region 5b opposite to the second region 4b. The second groove 7 is formed on the second main surface 5. The second groove 7 is formed, for example, by moving the cutting blade relative to the printed circuit board 3 with the cutting blade in contact with the second main surface 5.

  The second groove 7 is formed between the third region 5a and the fourth region 5b. The second groove 7 defines a third region 5a and a fourth region 5b. The second groove 7 extends along the second main surface 5. The second groove 7 is, for example, a V-groove. The second groove 7 has a third side surface 7a and a fourth side surface 7b facing the third side surface 7a. The third side surface 7a is connected to the third region 5a. The fourth side surface 7b is connected to the fourth region 5b. The depth of the second groove 7 is, for example, one-fourth or more of the thickness of the printed circuit board 3. The depth of the second groove 7 is, for example, one third or less of the thickness of the printed circuit board 3.

  The second groove 7 overlaps the first groove 6 in a plan view of the first main surface 4 of the printed circuit board 3. In a plan view of the first main surface 4 of the printed circuit board 3, the second corner of the second groove 7 (for example, the tip of the V-groove) is the first corner of the first groove 6 (for example, V (The end of the groove). The first corner of the first groove 6 and the second corner of the second groove 7 serve as starting points for dividing the printed circuit board 3 when dividing the printed circuit board 3.

  Referring to FIG. 6, first holding jig 10 includes a first surface 11 at a distal end thereof. The first holding jig 10 further includes a first protrusion 12 protruding from the first surface 11. The first surface 11 is configured to be in surface contact with the first region 4a of the first main surface 4 of the printed circuit board 3 (see FIGS. 11 and 12). The first protrusion 12 includes a first surface portion 12a. The first surface portion 12a is configured to be in surface contact with the first side surface 6a of the first groove 6 of the printed circuit board 3 (see FIGS. 11 and 12). As shown in FIGS. 1 to 3, the first holding jig 10 is supported by a first support member 46. The first support member 46 is, for example, a metal fitting having an L-shape. The first holding jig 10 is made of, for example, iron.

  Referring to FIG. 7, second holding jig 14 includes a second surface 15 at a tip end thereof. The second holding jig 14 further includes a second protrusion 16 protruding from the second surface 15. The second surface 15 is configured to be in surface contact with the third region 5a of the second main surface 5 of the printed circuit board 3 (see FIGS. 11 and 12). The second protrusion 16 includes a third surface portion 16a. The third surface portion 16a is configured to make surface contact with the third side surface 7a of the second groove 7 of the printed circuit board 3 (see FIGS. 11 and 12). As shown in FIGS. 1 to 3, the second holding jig 14 is supported by the second support member 21. The second support member 21 is, for example, a metal fitting having an L-shape. The second support member 21 is fixed to the base 20. The second holding jig 14 is made of, for example, iron.

  The pressing member 18 is configured to press the second area 4b of the first main surface 4 (see FIG. 12). In a plan view of the first surface 11, the pressing member 18 is disposed on the opposite side of the first protrusion 11 from the first surface 11. As shown in FIGS. 1, 4 and 5, the pressing member 18 is supported by a third support member 35. Specifically, the pressing member 18 includes a pressing portion 18a and a mounting portion 18b connected to the pressing portion 18a. The pressing portion 18a extends along the base 20. The pressing portion 18a extends along the printed circuit board 3. The attachment portion 18b is attached to the third support member 35.

  The printed circuit board dividing device 1 is configured such that the first holding jig 10 and the pressing member 18 are interlocked. Specifically, as shown in FIG. 1, the handle 24 is attached to a first shaft 25. The first shaft 25 is rotatably supported by the fourth support member 26. The fourth support member 26 is fixed to the first side plate 22a. The first side plate 22a is fixed to the base 20. A first bevel gear 27 is provided at an end of the first shaft 25.

  The second side plate 22b is fixed to the base 20. The second side plate 22b faces the first side plate 22a. The second shaft 30 is rotatably supported by the first side plate 22a and the second side plate 22b. A second bevel gear 31 is provided at an end of the second shaft 30. The second bevel gear 31 meshes with the first bevel gear 27. A cam 32 is attached to the second shaft 30. The cam 32 is configured to rotate coaxially with the second shaft 30. As shown in FIGS. 2 and 3, the cam 32 includes a first cam surface 32a and a second cam surface 32b. The first cam surface 32a is configured such that the distance from the rotation center of the cam 32 to the first cam surface 32a gradually increases from the center of the first cam surface 32a toward the end of the first cam surface 32a. I have. The second cam surface 32b is a circumferential surface. In the entire second cam surface 32b, the distance from the rotation center of the cam 32 to the second cam surface 32ba is constant.

  The outer peripheral surface of the ring member 40 is pressed against the first cam surface 32a and the second cam surface 32b by the elastic member 44. Specifically, the ring member 40 is attached to the first fixing member 41. The first fixing member 41 is, for example, a metal fitting having an L-shape. The first fixing member 41 is attached to the second fixing member 42. The second fixing member 42 is, for example, a metal fitting having an L-shape. One end of the elastic member 44 is attached to the second fixing member 42 via the first attaching member 43. The other end of the elastic member 44 is attached to the first support member 46 via the second attachment member 45. The elastic member 44 is, for example, a compression spring.

  The first support member 46 is attached to the first movable member 47. The second fixed member 42 is attached to the second movable member 48. The first movable member 47 and the second movable member 48 are configured to move along the third shaft 49. The third shaft 49 is attached to the first side plate 22a and the second side plate 22b. The first movable member 47, the second movable member 48, and the third shaft 49 move the ring member 40, the first fixed member 41, the second fixed member 42, the first support member 46, and the first holding jig 10 in the moving direction. Stipulate. The first holding jig 10 is configured to move with respect to the printed circuit board 3 according to the rotation of the cam 32 (see FIGS. 2 and 3). The first holding jig 10 is configured to move toward the printed circuit board 3 or in a direction opposite to the printed circuit board 3 according to the rotation of the cam 32.

  The gear 34 is attached to the second shaft 30. The gear 34 is configured to rotate coaxially with the second shaft 30. As shown in FIGS. 4 and 5, the teeth 34 t of the gear 34 mesh with the teeth 35 t provided on the third support member 35. When the gear 34 rotates, the third support member 35 moves with respect to the printed circuit board 3, and the pressing member 18 supported by the third support member 35 also moves with respect to the printed circuit board 3. The third support member 35 is attached to the third movable member 36. The third movable member 36 is configured to move along the fourth shaft 37. The fourth shaft 37 is attached to the first side plate 22a and the second side plate 22b. The third movable member 36 and the fourth shaft 37 define a moving direction of the third movable member 36 and the pressing member 18. The pressing member 18 is configured to move with respect to the printed circuit board 3 according to the rotation of the gear 34. The pressing member 18 is configured to move toward the printed circuit board 3 or in a direction opposite to the printed circuit board 3 according to the rotation of the gear 34.

  A method of manufacturing the printed circuit device according to the first embodiment will be described mainly with reference to FIGS. The method of manufacturing a printed circuit device according to the present embodiment includes mounting an electronic component 3e on the first region 4a of the first main surface 4 of the printed circuit board 3 (S10). For example, the electronic component 3e is soldered on the first region 4a of the first main surface 4 of the printed circuit board 3. The method for manufacturing a printed circuit device according to the present embodiment includes dividing the printed circuit board 3 by the printed circuit board dividing method according to the present embodiment (S20).

  The printed circuit board dividing method according to the present embodiment includes clamping the printed circuit board 3 using the first holding jig 10 (S21). Specifically, the printed circuit board 3 is clamped using the first holding jig 10 and the second holding jig 14. Specifically, as shown in FIG. 2, the printed circuit board 3 is brought into contact with the second holding jig 14. As shown in FIG. 11, the second surface 15 of the second holding jig 14 comes into surface contact with the third region 5 a of the second main surface 5 of the printed circuit board 3. The third surface portion 16 a of the second protrusion 16 of the second holding jig 14 comes into surface contact with the third side surface 7 a of the second groove 7 of the printed circuit board 3.

  Then, the operator moves the handle 24. The first shaft 25 rotates. The second shaft 30 rotates via the first bevel gear 27 and the second bevel gear 31. As the second shaft 30 rotates, the cam 32 rotates. The outer peripheral surface of the ring member 40 is in contact with the first cam surface 32a. As the cam 32 rotates, the ring member 40, the first fixed member 41, the second fixed member 42, the first support member 46, the first movable member 47, the second movable member according to the shape of the first cam surface 32a. 48 and the first holding jig 10 move toward the first main surface 4 of the printed circuit board 3. As shown in FIGS. 3 and 11, the first surface 11 of the first holding jig 10 comes into surface contact with the first region 4 a of the first main surface 4 of the printed circuit board 3. The first surface portion 12 a of the first protrusion 12 of the first holding jig 10 comes into surface contact with the first side surface 6 a of the first groove 6 of the printed circuit board 3. Thus, the printed circuit board 3 is clamped using the first holding jig 10 and the second holding jig 14.

  While the operator is moving the handle 24 to clamp the printed circuit board 3, the gear 34 also rotates as the second shaft 30 rotates. The pressing member 18 moves toward the printed circuit board 3 while the operator moves the handle 24 to clamp the printed circuit board 3. As shown in FIG. 4, until the printed circuit board 3 is clamped, the pressing member 18 is separated from the first main surface 4 of the printed circuit board 3.

  The printed circuit board dividing method according to the present embodiment includes dividing the printed circuit board 3 by pressing the second region 4b of the first main surface 4 of the printed circuit board 3 using the pressing member 18 (S22). Prepare. Specifically, after the printed circuit board 3 is clamped, the operator continues to move the handle 24 further. As the second shaft 30 rotates, the gear 34 rotates. The pressing member 18 moves further toward the printed circuit board 3. As shown in FIGS. 5 and 12, the pressing member 18 presses the second area 4 b of the first main surface 4. As shown in FIG. 13, the printed circuit board 3 is divided starting from the first groove 6.

  After the printed circuit board 3 is clamped, the outer peripheral surface of the ring member 40 contacts the second cam surface 32b. Since the second cam surface 32b is a circumferential surface, even if the operator continues to move the handle 24 after the printed circuit board 3 is clamped, the first holding jig 10 is further moved toward the second holding jig 14. Do not move.

  In the present embodiment, the first surface 11 of the first holding jig 10 is in surface contact with the first region 4 a of the first main surface 4 of the printed circuit board 3. The first surface portion 12 a of the first protrusion 12 of the first holding jig 10 is in surface contact with the first side surface 6 a of the first groove 6 of the printed circuit board 3. Therefore, between the first surface 11 of the first holding jig 10 and the first region 4 a of the first main surface 4 of the printed circuit board 3, and the first protruding portion 12 of the first holding jig 10. A frictional force acts between the surface portion 12a and the first side surface 6a of the first groove 6 of the printed circuit board 3.

  As shown in FIG. 14, when the printed circuit board 3 is divided, the frictional force reduces the amount of deformation of the printed circuit board 3. The reduced amount of deformation of the printed circuit board 3 reduces the stress applied to the electronic component 3e when dividing the printed circuit board 3. Thus, when the printed circuit board 3 is divided, the electronic components 3e are prevented from being damaged. The amount of deformation of the lattice shown in FIG. 14 indicates the amount of deformation of the printed circuit board 3 when the printed circuit board 3 is divided using the pressing member 18. When the stress applied to the printed circuit board 3 is a tensile stress, the grid spacing increases. When the stress applied to the printed circuit board 3 is a compressive stress, the spacing between the lattices is reduced.

  In contrast, the first holding jig 10a of the comparative example shown in FIG. The first holding jig 10 a is not in surface contact with the first side surface 6 a of the first groove 6 of the printed circuit board 3. No frictional force acts between the first holding jig 10a and the first side surface 6a of the first groove 6 of the printed circuit board 3. Therefore, as shown in FIG. 16, the amount of deformation of the printed circuit board 3 when the printed circuit board 3 is divided increases. When the printed circuit board 3 is divided, the stress applied to the electronic component 3e increases. When the printed circuit board 3 is divided, the electronic components 3e are easily damaged.

  As shown in FIG. 17, a first holding jig 10b according to a modification of the present embodiment may include a first jig portion 13a and a second jig portion 13b. The first jig portion 13a includes the first surface 11. The second jig portion 13b includes the first protrusion 12. The second jig portion 13b may be attached to the first jig portion 13a using a fixing member such as a screw, or may be welded to the first jig portion 13a. The second jig portion 13b may be made of the same material as the first jig portion 13a, or may be made of a different material from the first jig portion 13a. The second holding jig 14 may be configured similarly to the first holding jig 10b.

  The effects of the printed circuit board dividing apparatus 1, the holding jig for dividing the printed circuit board (first holding jigs 10 and 10b), the printed circuit board dividing method, and the manufacturing method of the printed circuit device of the present embodiment will be described.

  The printed circuit board dividing device 1 of the present embodiment includes first holding jigs 10 and 10b and a pressing member 18. The first holding jigs 10 and 10b include a first surface 11 and a first protrusion 12 protruding from the first surface 11. The first surface 11 is configured to be in surface contact with the first region 4a of the first main surface 4 of the printed circuit board 3 on which the electronic component 3e is mounted. The first protrusion 12 includes a first surface portion 12 a configured to make surface contact with the first side surface 6 a of the first groove 6 of the printed circuit board 3. The first groove 6 is formed on the first main surface 4. The first groove 6 has a first side surface 6a connected to the first region 4a, and a second side surface 6b facing the first side surface 6a. The pressing member 18 is configured to press the second region 4b of the first main surface 4 connected to the second side surface 6b.

  The holding jig for dividing a printed circuit board (first holding jigs 10 and 10b) of the present embodiment includes a first surface 11 and a first protrusion 12 protruding from the first surface 11. The first surface 11 is configured to be in surface contact with the first region 4a of the first main surface 4 of the printed circuit board 3 on which the electronic component 3e is mounted. The first protrusion 12 includes a first surface portion 12 a configured to make surface contact with the first side surface 6 a of the first groove 6 of the printed circuit board 3. The first groove 6 is formed on the first main surface 4. The first groove 6 has a first side surface 6a connected to the first region 4a, and a second side surface 6b facing the first side surface 6a.

  When the printed circuit board 3 is divided using the printed circuit board dividing apparatus 1 and the printed circuit board dividing holding jigs (first holding jigs 10 and 10b) of the present embodiment, the first holding jigs 10 and 10b are used. Between the first surface 11 and the first region 4a of the first main surface 4 of the printed circuit board 3, and the first surface portion 12a of the first protrusion 12 of the first holding jigs 10 and 10b and the printed circuit. A frictional force acts between the first groove 6 of the substrate 3 and the first side surface 6a. When the printed circuit board 3 is divided, the frictional force reduces the amount of deformation of the printed circuit board 3. The reduced amount of deformation of the printed circuit board 3 reduces the stress applied to the electronic component 3e when dividing the printed circuit board 3. Thus, when the printed circuit board 3 is divided, the electronic components 3e are prevented from being damaged.

  The printed circuit board dividing method according to the present embodiment includes clamping the printed circuit board 3 using the first holding jigs 10 and 10b (S21). The first holding jigs 10 and 10b include a first surface 11 and a first protrusion 12 protruding from the first surface 11. The first surface 11 is in surface contact with the first region 4a of the first main surface 4 of the printed circuit board 3 on which the electronic component 3e is mounted. The first protrusion 12 includes a first surface portion 12a that is in surface contact with the first side surface 6a of the first groove 6 of the printed circuit board 3. The first groove 6 is formed on the first main surface 4. The first groove 6 has a first side surface 6a connected to the first region 4a, and a second side surface 6b facing the first side surface 6a. In the printed circuit board dividing method according to the present embodiment, the printed circuit board 3 is divided by pressing the second region 4b of the first main surface 4 connected to the second side surface 6b using the pressing member 18. (S22) is provided.

  The method of manufacturing the printed circuit device according to the present embodiment includes mounting the electronic component 3e on the first region 4a of the first main surface 4 of the printed circuit board 3 (S10), Dividing the printed circuit board 3 by a dividing method (S20).

  When the printed circuit board 3 is divided by the printed circuit board dividing method and the printed circuit device manufacturing method of the present embodiment, the first surface 11 of the first holding jigs 10 and 10b and the first main surface of the printed circuit board 3 are used. 4 and between the first surface portion 12a of the first projecting portion 12 of the first holding jigs 10 and 10b and the first side surface 6a of the first groove 6 of the printed circuit board 3. In between, frictional force acts. When the printed circuit board 3 is divided, the frictional force reduces the amount of deformation of the printed circuit board 3. The reduced amount of deformation of the printed circuit board 3 reduces the stress applied to the electronic component 3e when dividing the printed circuit board 3. Thus, when the printed circuit board 3 is divided, the electronic components 3e are prevented from being damaged.

Embodiment 2 FIG.
With reference to FIG. 18, a holding jig (first holding jig 10c) for dividing a printed circuit board according to the second embodiment will be described. The holding jig for dividing a printed circuit board (first holding jig 10c) of the present embodiment has a configuration similar to that of the holding jig for holding a printed circuit board (first holding jig 10) of the first embodiment. However, they differ mainly in the following points.

  The first protrusion 12 of the first holding jig 10c further includes a second surface portion 12b. The second surface portion 12b is configured to be in surface contact with the second side surface 6b of the first groove 6. The second surface portion 12b is on the opposite side of the first surface portion 12a. Specifically, the first protrusion 12 has a similar shape to the first groove 6. More specifically, the first protrusion 12 has the same shape as the first groove 6. The second holding jig 14 may be configured similarly to the first holding jig 10c.

  The printed circuit board dividing device according to the present embodiment has the same configuration as that of the printed circuit board dividing device 1 according to the first embodiment, but is replaced with the first holding jig 10 according to the first embodiment. Is provided with the first holding jig 10c of the first embodiment. The printed circuit board dividing method and the printed circuit device manufacturing method according to the present embodiment include the same steps as the printed circuit board dividing method and the printed circuit device manufacturing method according to the first embodiment. The first holding jig 10c of the present embodiment is used instead of the first holding jig 10 described above.

  The printed circuit board dividing apparatus, the holding jig for dividing the printed circuit board (the first holding jig 10c), the printed circuit board dividing method, and the method for manufacturing the printed circuit apparatus according to the present embodiment have the following effects.

  When dividing the printed circuit board 3, between the first surface 11 of the first holding jig 10c and the first region 4a of the first main surface 4 of the printed circuit board 3 (see FIGS. 11 and 12), and Not only between the first surface portion 12a of the first protrusion 12 of the first holding jig 10c and the first side surface 6a of the first groove 6 of the printed circuit board 3 (see FIGS. 11 and 12). Between the second surface portion 12b of the first protrusion 12 of the first holding jig 10c and the second side surface 6b of the first groove 6 of the printed circuit board 3 (see FIGS. 11 and 12). Friction acts. When the printed circuit board 3 is divided, the frictional force reduces the amount of deformation of the printed circuit board 3. The reduced amount of deformation of the printed circuit board 3 reduces the stress applied to the electronic component 3e (see FIGS. 2 to 5 and 8) when the printed circuit board 3 is divided. Thus, when the printed circuit board 3 is divided, the electronic components 3e are prevented from being damaged.

Embodiment 3 FIG.
With reference to FIG. 19, a holding jig (first holding jig 10d) for dividing a printed circuit board according to the third embodiment will be described. The holding jig for dividing the printed circuit board (first holding jig 10d) of the present embodiment has the same configuration as the holding jig for dividing the printed circuit board of the first embodiment (first holding jig 10). However, they differ mainly in the following points.

  In the first holding jig 10d of the present embodiment, the first surface portion 12a is a first rough surface. The first rough surface may include a random uneven structure, or may include a regular uneven structure. The second holding jig 14 may be configured similarly to the first holding jig 10d.

  Referring to FIG. 20, a description will be given of a holding jig for dividing a printed circuit board (first holding jig 10e) according to a modification of the third embodiment. The holding jig for dividing the printed circuit board (first holding jig 10e) of the modification of the present embodiment is the same as the holding jig for dividing the printed circuit board (first holding jig 10c) of the second embodiment. It has a configuration, but differs mainly in the following points.

  In the first holding jig 10e of the modified example of the present embodiment, the first surface portion 12a is a first rough surface, and the second surface portion 12b is a second rough surface. The first rough surface may include a random uneven structure, or may include a regular uneven structure. The second rough surface may include a random uneven structure, or may include a regular uneven structure. The second holding jig 14 may be configured similarly to the first holding jig 10e.

  The printed circuit board dividing device according to the present embodiment has the same configuration as that of the printed circuit board dividing device 1 according to the first embodiment, but is replaced with the first holding jig 10 according to the first embodiment. The first holding jigs 10d and 10e of the first embodiment are provided. The printed circuit board dividing method and the printed circuit device manufacturing method according to the present embodiment include the same steps as the printed circuit board dividing method and the printed circuit device manufacturing method according to the first embodiment. Instead of the first holding jig 10, the first holding jigs 10d and 10e of the present embodiment are used.

  The printed circuit board dividing apparatus, the holding jig for dividing the printed circuit board (first holding jigs 10d and 10e), the printed circuit board dividing method, and the method of manufacturing the printed circuit device according to the first embodiment are described in the first embodiment. In addition to the effects of the circuit board dividing apparatus 1, the holding jig for dividing the printed circuit board (the first holding jig 10), the method of dividing the printed circuit board, and the method of manufacturing the printed circuit device, the following effects are obtained.

  Since the first surface portion 12a is a first rough surface, the first surface portion 12a of the first protrusion 12 of the first holding jigs 10d and 10e and the first side surface 6a of the first groove 6 of the printed circuit board 3 are provided. (See FIG. 11 and FIG. 12). When the printed circuit board 3 is divided, the increased frictional force further reduces the amount of deformation of the printed circuit board 3. The reduced amount of deformation of the printed circuit board 3 reduces the stress applied to the electronic component 3e (see FIGS. 2 to 5 and 8) when the printed circuit board 3 is divided. When the printed circuit board 3 is divided, the electronic components 3e are prevented from being damaged.

  Since the second surface portion 12b is a second rough surface, the second surface portion 12b of the first protrusion 12 of the first holding jig 10e and the second side surface 6b of the first groove 6 of the printed circuit board 3 (FIG. 11 and FIG. 12). When the printed circuit board 3 is divided, the increased frictional force further reduces the amount of deformation of the printed circuit board 3. The reduced amount of deformation of the printed circuit board 3 reduces the stress applied to the electronic component 3e (see FIGS. 2 to 5 and 8) when the printed circuit board 3 is divided. When the printed circuit board 3 is divided, the electronic components 3e are prevented from being damaged.

Embodiment 4 FIG.
Fourth Embodiment A holding jig for dividing a printed circuit board (first holding jig 10f) according to a fourth embodiment will be described with reference to FIG. The holding jig for dividing a printed circuit board (first holding jig 10f) of the present embodiment has a configuration similar to that of the holding jig for dividing a printed circuit board (first holding jig 10) of the first embodiment. However, they differ mainly in the following points.

  In the first holding jig 10f of the present embodiment, a recess 13f is formed between the first surface 11 and the first surface portion 12a. The concave portion 13f functions as a slack portion. In the first holding jig 10g of the first modification of the present embodiment, a recess 13g may be formed as shown in FIG. Due to the recess 13g, the first holding jig 10g allows the first region 4a of the first main surface 4 (see FIGS. 11 and 12) and the first side surface 6a of the first groove 6 (see FIGS. 11 and 12). ) So as not to come into contact with a part of the first region 4a of the first main surface 4 in the vicinity of the boundary between the first region 4a and the first region 4a.

  In the first holding jig 10h of the second modification of the present embodiment, a recess 13h may be formed as shown in FIG. The recess 13h allows the first holding jig 10h to move the first holding surface 10a of the first main surface 4 near the boundary between the first region 4a of the first main surface 4 and the first side surface 6a of the first groove 6. It is configured not to contact a part of the region 4a and a part of the first side surface 6a near the boundary. As shown in FIG. 24, in the first holding jig 10i of the third modification of the present embodiment, a recess 13i is provided in the first holding jig 10b (see FIG. 17) of the modification of the first embodiment. It may be formed. Due to the recess 13i, the first holding jig 10i is attached to a part of the first side surface 6a near the boundary between the first region 4a of the first main surface 4 and the first side surface 6a of the first groove 6. It is configured not to touch. The second holding jig 14 may be configured similarly to the first holding jigs 10f, 10g, 10h, and 10i.

  In the first holding jigs 10g and 10h shown in FIGS. 22 and 23, the first surface portion 12a of the first holding jigs 10g and 10h is, for example, at least the first side surface 6a (see FIGS. 11 and 12). Are in surface contact with the first part of The first portion of the first side surface 6 a is formed from the first corner of the first groove 6 (the tip of the V-groove), which is the starting point of division of the printed circuit board 3, and the first corner of the first groove 6. A region between the first groove 6 and a point on the first side surface 6a corresponding to a half of the depth of the first groove 6 is meant. The first surface portions 12a of the first holding jigs 10g and 10h are in surface contact with at least the second portion of the first side surface 6a, for example. The second portion of the first side surface 6a is formed by a first corner of the first groove 6 serving as a starting point of division of the printed circuit board 3, and a depth from the first corner of the first groove 6 to the depth of the first groove 6. Means a region between the first side surface 6a and a point corresponding to two thirds of the depth.

  The printed circuit board dividing device according to the present embodiment has the same configuration as that of the printed circuit board dividing device 1 according to the first embodiment, but is replaced with the first holding jig 10 according to the first embodiment. The first holding jigs 10f, 10g, 10h, and 10i of the first embodiment are provided. The printed circuit board dividing method and the printed circuit device manufacturing method according to the present embodiment include the same steps as the printed circuit board dividing method and the printed circuit device manufacturing method according to the first embodiment. Instead of the first holding jig 10, the first holding jigs 10f, 10g, 10h, and 10i of the present embodiment are used.

  A printed circuit board dividing apparatus, a holding jig for dividing a printed circuit board (first holding jigs 10f, 10g, 10h, and 10i), a printed circuit board dividing method, and a method for manufacturing a printed circuit apparatus according to the present embodiment are described in In addition to the effects of the printed circuit board dividing apparatus 1, the holding jig for dividing the printed circuit board (first holding jigs 10 and 10b), the method of dividing the printed circuit board, and the method of manufacturing the printed circuit device, the following effects are provided. To play.

  When forming the first groove 6 in the first main surface 4 of the printed circuit board 3, the first region 4 a of the first main surface 4 (see FIGS. 11 and 12) and the first groove 6 Even if burrs occur at the boundary between the side surface 6a (see FIGS. 11 and 12), the recesses 13f, 13g, 13h, and 13i accommodate the burrs. The recesses 13f, 13g, 13h, 13i are formed on the first surface portion 12a of the first protrusion 12 of the first holding jigs 10f, 10g, 10h, 10i and the first side surface 6a of the first groove 6 of the printed circuit board 3. And make sure that they are in surface contact.

  When the printed circuit board 3 is divided, the first surface 11 of the first holding jigs 10f, 10g, 10h, and 10i and the first region 4a of the first main surface 4 of the printed circuit board 3 (see FIGS. 11 and 12). ), And the first side surface 6a of the first protrusion 6 of the first holding jigs 10f, 10g, 10h, and 10i and the first groove 6 of the printed circuit board 3 (FIG. 11). And FIG. 12) reliably exerts a frictional force. When the printed circuit board 3 is divided, the frictional force reduces the amount of deformation of the printed circuit board 3. The reduced amount of deformation of the printed circuit board 3 reduces the stress applied to the electronic component 3e (see FIGS. 2 to 5 and 8) when the printed circuit board 3 is divided. In this way, the electronic component 3e is more reliably prevented from being damaged when the printed circuit board 3 is divided.

  It should be understood that Embodiments 1-4 and their modifications disclosed herein are illustrative in all respects and not restrictive. As long as there is no inconsistency, at least two of the embodiments 1-4 and the modifications disclosed herein may be combined. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  Reference Signs List 1 printed circuit board dividing device, 3 printed circuit board, 3e electronic component, 4 first main surface, 4a first region, 4b second region, 5 second main surface, 5a third region, 5b fourth region, 6th 1 groove, 6a first side, 6b second side, 7 second groove, 7a third side, 7b fourth side, 10, 10a, 10b, 10c, 10d, 10e, 10f, 10g, 10h, 10i 1 holding jig, 11 first surface, 12 first protrusion, 12a first surface portion, 12b second surface portion, 13a first jig portion, 13b second jig portion, 13f, 13g, 13h, 13i recess , 14 second holding jig, 15 second surface, 16 second projecting portion, 16a third surface portion, 18 pressing member, 18a pressing portion, 18b mounting portion, 20 base, 21 second support member, 22a first Side plate, 22b 2nd side plate, 24 handles, 25 1st shaft, 26 4th support member, 27 1st bevel gear, 30 2nd shaft, 31 2nd bevel gear, 32 cam, 32a 1st cam surface, 32b 2nd cam surface, 34 gear, 34t tooth, 35 third support member, 35t tooth, 36 third movable member, 37 fourth shaft, 40 ring member, 41 first fixed member, 42 second fixed member, 43 first mounting member, 44 elasticity Member, 45 second attachment member, 46 first support member, 47 first movable member, 48 second movable member, 49 third shaft.

Claims (19)

A first holding jig,
And a pressing member.
The first holding jig includes a first surface and a first protrusion protruding from the first surface,
The first surface is configured to be in surface contact with a first region of a first main surface of a printed circuit board on which electronic components are mounted,
The first protrusion includes a first surface portion configured to be in surface contact with a first side surface of a first groove of the printed circuit board, wherein the first groove is formed in the first main surface. The first groove has the first side surface connected to the first region, and a second side surface facing the first side surface,
The printed circuit board dividing device, wherein the pressing member is configured to press a second area of the first main surface connected to the second side surface.   The printed circuit board dividing device according to claim 1, wherein the first surface portion is a first rough surface.   The printed circuit board dividing device according to claim 1, wherein the first protrusion further includes a second surface portion configured to be in surface contact with the second side surface.   The printed circuit board dividing device according to claim 3, wherein the second surface portion is a second rough surface.   The printed circuit board dividing device according to any one of claims 1 to 4, wherein a concave portion is formed between the first surface and the first surface portion. A second holding jig, the second holding jig includes a second surface, and a second protrusion protruding from the second surface;
The second surface is configured to be in surface contact with a third region of a second main surface of the printed circuit board opposite to the first region,
The second protrusion includes a third surface portion configured to be in surface contact with a third side surface of a second groove of the printed circuit board, wherein the second groove is formed in the second main surface. The second groove has the third side surface connected to the third region, and a fourth side surface facing the third side surface, wherein the second groove has: 2. The printed circuit board dividing device according to claim 1.   The printed circuit board dividing device according to any one of claims 1 to 6, wherein the first holding jig and the pressing member are configured to interlock with each other. Shaft and
A cam configured to rotate coaxially with the shaft;
A gear configured to rotate coaxially with the shaft,
The first holding jig is configured to move with respect to the printed circuit board according to rotation of the cam,
The printed circuit board dividing device according to claim 7, wherein the pressing member is configured to move with respect to the printed circuit board in accordance with rotation of the gear. A first surface, and a first protrusion protruding from the first surface;
The first surface is configured to be in surface contact with a first region of a first main surface of a printed circuit board on which electronic components are mounted,
The first protrusion includes a first surface portion configured to make surface contact with a first side surface of a first groove of the printed circuit board, wherein the first groove is formed in the first main surface. A holding jig for dividing the printed circuit board, wherein the first groove has the first side surface connected to the first region and a second side surface facing the first side surface.   The holding jig for dividing a printed circuit board according to claim 9, wherein the first surface portion is a first rough surface.   The holding jig for dividing a printed circuit board according to claim 9, wherein the first protrusion further includes a second surface portion configured to be in surface contact with the second side surface.   The holding jig for dividing a printed circuit board according to claim 11, wherein the second surface portion is a second rough surface.   The holding jig for dividing a printed circuit board according to any one of claims 9 to 12, wherein a concave portion is formed between the first surface and the first surface portion. Clamping the printed circuit board using a first holding jig, wherein the first holding jig includes a first surface and a first protrusion protruding from the first surface; Is in surface contact with a first region of a first main surface of the printed circuit board on which an electronic component is mounted, and the first protrusion is in surface contact with a first side surface of a first groove of the printed circuit board. A first surface portion, wherein the first groove is formed in the first main surface, and wherein the first groove has the first side surface connected to the first region and the first side surface; A second side facing the side,
A printed circuit board dividing method, comprising: pressing a second region of the first main surface connected to the second side surface using a pressing member to divide the printed circuit board.   The method of claim 14, wherein the first surface portion is a first rough surface.   16. The method according to claim 14, wherein the first protrusion further includes a second surface portion configured to make surface contact with the second side surface.   17. The method according to claim 16, wherein the second surface portion is a second rough surface.   The method according to any one of claims 14 to 17, wherein a concave portion is formed between the first surface and the first surface portion. Mounting an electronic component on the first region of the first main surface of the printed circuit board;
A method of manufacturing a printed circuit device, comprising: dividing the printed circuit board by the printed circuit board dividing method according to any one of claims 14 to 18.

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