JPH06270100A - Substrate dividing method and device - Google Patents

Abstract

PURPOSE:To drivide a substrate accurately along a slit without forming a burr or the edge on a divided surface. CONSTITUTION:The front and rear ends of a product substrate (a) carried in the direction orthogonal to a slit are held, and a rear upper surface of the most forward divided slit (b) is pressed by prescribed pressure, and a fulcrum member 14 having a sharp fulcrum 14a is made to act on the reverse of the substrate in a position just under the slit (b).

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for dividing a substrate, for example, in the production of a chip type electronic component such as a chip resistor, a production substrate having a slit formed on its upper surface is accurately divided along the slit. Regarding what you can do.

[0002]

2. Description of the Related Art For example, a chip-type electronic component such as a chip resistor has a planar shape as schematically shown in FIG. 5 in which a plurality of dividing slits b and c are formed in a grid pattern on the upper surface, and is made of ceramic. It is manufactured using the manufacturing substrate a made of.

First, electrode terminals and resistors (not shown) are collectively formed on the upper surface of the manufacturing substrate a by thick film printing, and if necessary, the resistance value is adjusted by laser trimming or the like, and then the glass is formed. A protective layer (not shown) is formed by printing and firing.

Next, the above-mentioned manufacturing substrate a is divided along the division slits b in the vertical direction to obtain a rod-shaped substrate d.

A secondary electrode is formed on the divided surface of the rod-shaped substrate d, or a tertiary electrode is formed which is electrically connected to the secondary electrode and wraps around the back surface of the substrate. Then, the rod-shaped substrate a is divided along the lateral division slits c to obtain a final chip resistor e.

By the way, the above-described substrate division, that is, a step of dividing the manufacturing substrate a along the vertical slit b to obtain a rod-shaped substrate, and dividing the rod-shaped substrate d along the horizontal slit c Conventionally, the process of obtaining a unit chip component has generally been performed using the following substrate dividing device.

That is, as shown in FIGS. 6 and 7,
In each case, a large-diameter upper roller f whose surface is made of rubber,
The substrate a is passed while being sandwiched between the lower roller g having a small diameter and a predetermined pressure. Then, due to the difference in the diameters of the upper and lower rollers, the bending moment indicated by the symbol m in FIG. 7 always acts on the substrate a. When the slit b just passes between the upper and lower rollers f and g, the pressing force concentration due to the bending moment m reaches the vicinity of the slit b, whereby the substrate a is divided at the slit b. Become.

Further, as shown in FIG. 8, there is an apparatus in which an upper roller f and a lower roller g similar to the above are combined with a belt conveying mechanism, but the dividing action is the same as that of the apparatus shown in FIG.

[0009]

By the way, as described above, the substrate a is interposed between the large-diameter upper roller f and the small-diameter lower roller g.
When the substrate is divided by passing through, there are the following problems. As shown in detail in FIG. 7, the surfaces of the upper roller f and the lower roller g are both made of rubber, and the substrate a must be sandwiched between the rollers f and g at a predetermined pressure. The surfaces of the rollers f and g are elastically deformed and come into surface contact with the surface of the substrate a instead of making line contact.

Moreover, since the rollers f and g are rotated, the divided end surface of the substrate a is not constant, and a large burr h may be formed as shown in FIG.

When the above-mentioned burr h is generated on the divided chips, the product size varies, which makes it unsuitable for high-density mounting on a circuit board.

The present invention has been devised under the circumstances as described above, and in the case where a chip-shaped final product is obtained by dividing a substrate for manufacturing along a slit, the substrate is obtained. The task is to significantly reduce dimensional variations.

[0013]

In order to solve the above problems, the present invention takes the following technical means.

That is, in the invention described in claim 1 of the present application, the manufacturing substrate having a plurality of parallel division slits formed on its surface is conveyed along the division slits while being conveyed in a direction orthogonal to the division slits. A substrate dividing method for dividing, wherein the operation of holding the front and rear edges in the transport direction of the manufacturing substrate, the operation of positioning a sharp fulcrum member extending in the slit direction at a position immediately below the foremost dividing slit, the most forward The operation of pressing the rear upper surface of the divided slit with a predetermined pressure and the operation of moving the fulcrum member upward by a predetermined distance are repeated.

The invention described in claim 2 of the present application is
A substrate dividing device for dividing a manufacturing substrate having a plurality of parallel division slits formed on the surface in a direction orthogonal to the dividing slit, and dividing the manufacturing substrate along the dividing slit. A belt transport mechanism that supports and transports both sides thereof, a stopper that moves in and out of the transport path of the manufacturing substrate, contacts the front end of the substrate to stop the manufacturing substrate, and the manufacturing substrate. And a guide for holding the front and rear edges of the substrate stopped by the stopper and the frontmost of the substrate stopped by the stopper and holding the front and rear edges by the guide. A pressing member that presses the rear upper surface of the division slit with a predetermined pressure and a sharp fulcrum extending in the direction of the division slit are provided. It is characterized by comprising a fulcrum member which is moved up and down, the immediately below the.

[0016]

When the manufacturing substrate conveyed in the direction orthogonal to the slit direction is held by the guides in the front and rear thereof, the pressing member presses the rearmost part of the slit. At this time, the frontmost portion is substantially supported by the holding guide, and the rearward portion is substantially supported by the pressing member, with the frontmost slit to be divided. On the other hand, the fulcrum member has a sharp fulcrum having a predetermined length in the direction in which the slit extends, and the fulcrum member pushes the position directly below the slit to be divided, precisely upward.

Thus, when the position directly below the slit is pressed upward with a sharp fulcrum, the reaction force is effectively supported by the holding guide and the pressing member on the upper surface of the substrate, so that the substrate has the slit. A bending moment acts in the direction of being convex upward with the position directly below as the fulcrum. Then, the stress due to the bending moment concentrates on the portion where the slit is formed, and the substrate is divided at this portion.

Thus, when one rod-shaped substrate is separated from the material substrate at the frontmost slit, the second slit from the front of the material substrate becomes the frontmost slit to be divided next.

The substrate division in this slit is also performed in the same manner as described above. In this way, by sequentially dividing the rod-shaped substrate from the front side of the material substrate along each slit, the material substrate is separated into a plurality of rod-shaped substrates divided in each slit.

In the present invention, since a fulcrum member having a sharp fulcrum is made to act on the lower surface of the substrate in order to act a bending moment that makes the slit convex upward on the substrate, the slit is the boundary. The board to be divided is
It is clearly divided before and after the sharp fulcrum. for that reason,
Irregular burrs or edges are extremely rarely formed on the dividing surface.

In the finally obtained chip-shaped electronic component, the variation in the outer diameter dimension is reduced, the product quality is uniform, and higher-density mounting on the circuit board can be performed without any inconvenience. .

[0022]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The preferred embodiments of the present invention will be described below.
A specific description will be given with reference to the drawings.

The substrate dividing apparatus 1 of the present invention described below is constructed so as to be suitable for obtaining the rod-shaped substrate d by dividing the material substrate a as shown in FIG. 5 along the vertical slits b. It is a thing.

As shown in FIG. 1, the material substrate a is transported by the belt transport mechanism 2 in the direction orthogonal to the vertical slit b. The belt transport mechanism 2 includes a pair of left and right flat belts 3 and 3 at least a pair of front and rear pulleys 3a,
It is configured to be wound around 3b, and by driving either one of the pulleys, the flat belts 3 are moved forward.

The distance between the two belts 3, 3 is set so that the upper surfaces of the two belts 3, 3 can support the lower surfaces of both side portions of the material substrate a. The material substrate a is carried onto the belt by an appropriate handling mechanism (not shown).

The belts 3 and 3 are provided at appropriate positions on the conveying path of the belt conveying mechanism 2 inside the flat belts 3 and 3, respectively.
There are stoppers 4 and 4 that can appear and disappear relative to the height of the upper surface of the. These stoppers 4 and 4 are, as shown in FIG.
A reciprocating actuator 5 such as a solenoid or a small air cylinder can be moved up and down in the vertical direction.

At the position where the stoppers 4 and 4 are provided, it is possible to further hold the front edge of the material substrate a which is stopped by the front end coming into contact with the stoppers 4 and 4. The holding guide 6 is arranged.

As shown in detail in FIG. 3, this first holding guide 6 is provided with an engaging and holding portion 6a bent backward in a hook shape, and is shown in a standing state shown by a solid line in FIG. It is designed to rotate up and down between the state of falling forward. A rotary actuator 7 such as a rotary solenoid can be used to move the first holding guide 6 up and down.

On the other hand, at a position a predetermined distance behind the position where the stoppers 4 and 4 and the first holding guide 6 are provided, the rear surface of the material substrate a stopped by the stoppers 4 and 4 as described above. A second holding guide 8 capable of holding the edge is provided. This second holding guide 8 is
A support base 10 that is reciprocally moved in the front-rear direction by an air cylinder 9 or the like can be oscillated. As shown in FIG. 3, the second holding guide 8 also includes an engagement holding portion 8a that is bent in a hook shape toward the front, and stands upright with respect to the support base 10 as shown by a solid line in FIG. And the rearward tilted state shown by the phantom line can be rotated up and down by the rotary actuator 11.

Further, in a portion located a predetermined distance behind the stoppers 4 and 4, more specifically, the frontmost slit b to be divided in the material substrate a.
Is moved up and down to a position immediately behind the substrate a
A pressing member 12 that presses is arranged. In order to drive the pressing member 12 up and down, a reciprocating actuator such as an air cylinder or a solenoid may be used, and it may be reciprocated by driving a cam. The pressing surface of the pressing member 12 has an elastically deformable pressing pad 1 made of rubber or the like.
2a is attached.

It is desirable that the pressing member 12 or the mechanism for reciprocating the pressing member 12 can be changed in the front-rear position according to the interval between the slits of the material substrate a.

Further, a sensor 13 for detecting the position of the slit is arranged above the substrate a. A laser sensor is suitable for this sensor 13 and detects the position of the slit b by the change of the reflected light.

Further, a fulcrum member 14 having a sharp fulcrum 14a extending in the slit direction is provided below the substrate a.
However, it is arranged so that it can be reciprocally driven up and down. An air cylinder 15, for example, is used to reciprocate the fulcrum member 14. The fulcrum member 14 including the reciprocating drive mechanism can be finely adjusted in position in the front-rear direction by, for example, a ball screw mechanism 16 or the like.

Next, the operation of the substrate dividing apparatus 1 having the above structure will be described.

In the initial state, the first and second holding guides 6, 8 are tilted forward and backward, and the second holding guide 8 is positioned rearmost by the air cylinder 9. There is. The pressing member 12 is in the upper moving position, and the fulcrum member 14 is in the lower moving position.

The material substrate a is loaded onto the belt transport mechanism by a handling mechanism (not shown), and this substrate is transported forward by the belt drive. At this point, as shown in FIG.
Takes an upper moving position, and therefore the material substrate a is stopped by its front end abutting the stoppers 4, 4. At this point, the belt transport mechanism may be stopped, or the operating state may be maintained and the substrate a may slide on the belt at a fixed position.

As described above, the manufacturing substrate a is provided with the stopper 4,
4, the laser sensor 13 detects the slit spacing on the substrate while being conveyed at a constant speed until it comes into contact with the slit 4, and the front-back direction position of the fulcrum member 14 is determined according to the slit spacing thus detected. Adjusted. That is, the ball screw mechanism 16 (FIG. 3) driven by a stepping motor or the like is driven so that the fulcrum member 14 is located immediately below the foremost slit b to be divided first. If necessary, the position of the pressing member 12 in the front-rear direction is also adjusted. That is, the pressing member 12 is adjusted to be located rearward of the frontmost slit b to be divided.

Subsequently, as shown in FIG. 4 (b), the first holding guide 6 stands up to engage and hold the front end of the substrate a by the engaging and holding portion 6a, and the second holding guide 8
Is also moved up and moved forward by the operation of the air cylinder 9, and the rear end edge of the substrate a is engaged and held by the engaging and holding portion 8a.

After the pressing member 12 moves downward to press the upper surface of the substrate immediately behind the foremost slit b, the fulcrum member 14 is moved upward as shown in FIG. 4 (c). .

As is apparent from the above, the front of the frontmost slit b to be divided is engaged and held by the first holding guide 6, and the rear of the slit b is pressed by the pressing member 12. . Therefore, when the fulcrum member 14 moves upward and pushes the back surface of the substrate immediately below the slit b so as to push it up, the substrate a will be bent upward with the portion where the slit b is provided as the fulcrum. The moment to act acts. The moment concentrates the stress on the portion where the slit b is provided, and the stress a concentrates the substrate a along the slit b.

At this time, since the fulcrum member 14 for pressing the back surface of the substrate a presses a very limited range in the front-rear direction by the sharp fulcrum 14a, the substrate a is clearly defined with the sharp fulcrum 14a as a boundary. It is effectively prevented from being split and burrs and edges protruding to the split surface unnecessarily.

When the frontmost rod-shaped substrate is separated as described above, both the fulcrum member 14 and the pressing member 12 are retracted as shown in FIG.
Fell forward and evacuated. At this time, the second holding guide may be tilted backward and may not be retracted.

Next, the belts 3, 3 are set in a running state, the stoppers 4, 4 are momentarily moved down, and then returned upward ((e) in FIG. 4). By doing so,
The material substrate a is moved forward by one pitch in the front-rear direction, that is, by the slit interval, and then stopped again by the stoppers 4 and 4 ((a) in FIG. 4). The rod-shaped substrate d separated from the substrate a is transferred to the front while being mounted on the belts 3, 3 which are still in the traveling state, and is conveyed to the post-process apparatus.

After that, the same operation as described above is repeated. That is, first, the first holding guide 6 is erected to engage and hold a new front edge of the substrate a, and the second holding guide 8 is advanced by the air cylinder 9 to move the rear edge of the substrate a again. Engage and hold. Then, the pressing member 12 presses the upper surface immediately behind the foremost slit (the second slit in the initial material substrate),
The fulcrum member 14 is moved upward to divide the rod-shaped substrate d along the slit b.

The above-described operation is repeated until division is performed at the rearmost slit. However, in the case of division of the rearmost slit, the pressing member 12 does not move downward, and is divided while being engaged and held only by the first holding guide 6 and the second holding guide 8. After the division is performed in all the slits, all the mechanisms return to the initial state to wait for the introduction of a new material substrate.

As is apparent from the above, according to the substrate dividing apparatus of the present invention, a bending moment is applied to the substrate by pressing a very limited area on the back surface of the substrate that exactly corresponds to the slit, and stress concentration due to this is applied. Since the substrate is divided along the dividing slits, the substrate can be divided more accurately than the conventional one, in other words, it is possible to divide the substrate in which unnecessary burrs and edges are less likely to occur. As a result, the final chip-shaped electronic component will have a uniform shape with no unnecessary edges or burrs on the periphery, significantly improving the product quality, and making it more dense without considering the existence of burrs and edges. It is possible to achieve various implementations.

Of course, the scope of the present invention is not limited to the above embodiments. Chip-shaped electronic components manufactured by dividing the substrate include chip resistors, chip capacitors, and chip resistor networks.

Further, it goes without saying that the structure for operating each mechanism constituting the device can be variously changed within the range that can be recognized by those skilled in the art.

Further, the substrate dividing method of the present invention can be applied not only when the rod-shaped substrate is obtained from the material substrate as in the above-mentioned embodiment but also when the unit chip is obtained from the rod-shaped substrate.

[Brief description of drawings]

FIG. 1 is a plan view of an embodiment of the present invention.

FIG. 2 is a sectional view taken along line II-II in FIG.

FIG. 3 is a sectional view taken along the line III-III in FIG.

FIG. 4 is an explanatory diagram of a method of the present invention.

FIG. 5 is an explanatory diagram of a mode of substrate division.

FIG. 6 is an explanatory diagram of a conventional substrate dividing device.

FIG. 7 is a diagram illustrating the operation of a conventional substrate dividing device.

FIG. 8 is an explanatory diagram of another example of the conventional substrate dividing apparatus.

FIG. 9 is a side view of a chip substrate divided by a conventional substrate dividing device.

[Explanation of symbols]

 1 Substrate Dividing Device 6 First Holding Guide 8 Second Holding Guide 12 Pressing Member 14 Support Point Member a Substrate b Dividing Slit (of Substrate)

Claims (2)

[Claims] 1. A method of dividing a substrate, wherein a manufacturing substrate having a plurality of parallel division slits formed on its surface is conveyed along a direction orthogonal to the division slits and divided along the division slits. Operation of holding the front and rear edges of the substrate for conveyance in the conveying direction, operation of positioning a sharp fulcrum member extending in the slit direction immediately below the frontmost split slit, and applying a predetermined pressure to the rear upper surface of the frontmost split slit. A substrate dividing method, characterized in that a pressing operation and an operation of moving the fulcrum member upward by a predetermined distance are repeated. 2. A substrate dividing device for dividing a manufacturing substrate, on the surface of which a plurality of parallel dividing slits are formed, in a direction orthogonal to the dividing slits and dividing the manufacturing substrate along the dividing slits. A belt transport mechanism that transports the manufacturing substrate while supporting both sides of the manufacturing substrate, and a stopper that can move the manufacturing substrate into and out of the transportation path and contact the front end of the substrate to stop the manufacturing substrate. A guide that holds the front and rear edges of the substrate that has moved back and forth in the transport path of the manufacturing substrate and is stopped by the stopper, and is stopped by the stopper and the front and rear edges are held by the guide. A pressing member that presses the rear upper surface of the frontmost split slit of the substrate with a predetermined pressure, and a sharp fulcrum extending in the direction of the split slit, Characterized in that it and a fulcrum member which is raised and lowered immediately below the square of the division slit, the substrate dividing apparatus.