JP5198924B2 - Board height measuring system, electronic component mounting machine, and board height measuring method - Google Patents

Description

  The present invention relates to a substrate height measuring system capable of measuring warpage of a substrate in an apparatus that handles the substrate. Moreover, it is related with the electronic component mounting machine using the same. The present invention also relates to a substrate height measuring method.

  For example, Patent Document 1 discloses an electronic component mounting machine that measures the altitude of measurement areas set at various locations on a board and adjusts the stroke of a component mounting head when mounting an electronic component according to the measured altitude data. It is disclosed. In the drawings shown below, the left-right direction is defined as the X direction, the front-rear direction is defined as the Y direction, and the up-down direction is defined as the Z direction. The X direction corresponds to the substrate transport direction.

  FIG. 14A shows a schematic diagram of an image of the substrate height measuring method described in the document. FIG. 14B shows a schematic diagram of a measurable range in the same method. The board height measuring method is executed before the electronic component mounting machine mounts the electronic components on the board. As illustrated in FIG. 14B, the irradiation apparatus 101 irradiates the substrate 100 with light from a direction obliquely 45 ° with respect to the Z axis. As shown in FIG. 14A, a figure S100 is formed in the measurement area A100 on the upper surface of the substrate 100 by the irradiated light. The measurement area A100 is included in the imaging area B100. The imaging data in the imaging area B100 is subjected to image processing by an image processing device (not shown). The height of the substrate 100 is measured based on the position of the figure S100 in the measurement area A100 of the image.

For example, when irradiating light from the front, if the height of the substrate 100 is high, the figure S100 is formed in front of the measurement area A100. On the other hand, when the height of the substrate 100 is low, the figure S100 is formed behind the measurement area A100. Thus, according to the substrate height measuring method described in Patent Document 1, the height of the substrate 100 is measured from the position of the figure S100 in the measurement area A100. Then, the stroke of the component mounting head when the electronic component is mounted is adjusted according to the altitude. That is, the pushing force of the electronic component against the substrate is made uniform.
JP 2003-298294 A

  As described above, light is incident on the upper surface of the substrate 100 from an oblique 45 ° direction. For this reason, the width of the measurement area A100 extending in the XY plane direction and the measurable range C100 in the Z direction correspond to approximately 1: 1. Therefore, if the measurement area A100 is wide, the measurable range C100 is also widened, and if the measurement area A100 is narrow, the measurable range C100 is also narrowed. Further, when determining the measurement area A100, it is necessary to select a portion of the substrate 100 where no electronic components are arranged for the purpose of measuring the altitude of the substrate 100.

  However, in recent years, high-density mounting of electronic components has been remarkable, and it is difficult to ensure a wide measurement area A100 in the substrate 100. For this reason, the measurable range C100 in the Z direction also tends to be narrowed.

  The board height measuring system, electronic component mounting machine, and board height measuring method of the present invention have been completed in view of the above problems. Accordingly, an object of the present invention is to provide a board height measuring system, an electronic component mounting machine, and a board height measuring method capable of measuring a board height in a wide range even when a measurement area on the board is narrow.

  The numbers in parentheses below correspond to the numbers in the claims.

  (1) In order to solve the above problems, a substrate height measurement system according to the present invention irradiates light to a measurement area set at a predetermined position on the upper surface of a substrate, and forms an image on the measurement area; An image pickup apparatus that picks up an image pickup area including the measurement area from a direction intersecting the light irradiation direction, image processing of the image pickup data of the image pickup area, and based on the position of the figure in the measurement area of the image, An image processing apparatus for measuring the height of the figure, and when the figure is not formed in the measurement area, the figure is placed in the measurement area. The shape and the imaging area are moved by a predetermined amount relative to the measurement area.

  The substrate height measurement system according to the present invention is configured to display a figure and an imaging area relative to the measurement area when the figure is not formed in the measurement area, that is, when the figure height exceeds the measurable range. It moves by a predetermined amount and puts a figure in the measurement area. Then, the height of the figure is measured from the image.

  When the figure and the imaging area are moved relative to the measurement area, the measurable range can be moved in the height direction. For this reason, even if the measurement area on the substrate is narrow, the altitude of the substrate can be measured over a wide range.

  (2) Preferably, in the configuration of (1), when the relative position of the measurement area in the imaging area is at a predetermined position, a reference for searching for the figure within a reference altitude range corresponding to the measurement area An upper search mode in which the relative position of the measurement area in the imaging area is offset with respect to the search mode and the reference search mode, and the image is searched for in the upper altitude range corresponding to the measurement area after the offset. And the lower altitude corresponding to the measurement area after the offset by offsetting the relative position of the measurement area in the imaging area in the direction opposite to the offset direction in the upper search mode with respect to the reference search mode. It is better to have a configuration that can be switched to a downward search mode in which the figure is searched for within the range.

  The substrate height measuring system of this configuration can be switched to the reference search mode, the upward search mode, and the downward search mode. For this reason, when a figure is not found within the reference altitude range, the figure can be searched for within the upper altitude range or the lower altitude range. That is, the height of the image can be measured over a relatively wide altitude range centered on the reference altitude range.

  (3) Preferably, in the configuration of (1) or (2), the image processing apparatus further includes a reference block having a plurality of horizontal planes having different altitudes, and the image processing apparatus By comparing the measured value based on the position of the figure and the actual value, an offset amount of the measured value with respect to the actual value is calculated, and the figure formed on the upper surface of the substrate using the offset amount It is better to adopt a configuration that corrects the measured value of altitude. According to the board height measuring system of this configuration, the board height can be measured in a wide range and with high accuracy.

  (4) Moreover, in order to solve the said subject, the electronic component mounting machine of this invention was measured in the said board | substrate height measuring system in any one of said (1) thru | or (3), and the said several measurement area. And a component mounting head for mounting an electronic component at a predetermined position on the substrate with a stroke amount corresponding to the deformation data of the substrate calculated from a plurality of heights of the shapes. .

  According to the electronic component mounting machine of the present invention, it is possible to measure the altitude of the board in a wide range even when the measurement area on the board is narrow. For this reason, even when the deformation of the substrate is large, the altitude of the deformation portion can be measured. Therefore, the defective product can be easily identified.

  In addition, according to the electronic component mounting machine of the present invention, it is possible to adjust the stroke amount when mounting electronic components on various portions of the board according to the deformation data of the board. For example, when the distance from the component mounting head to the substrate is short, the stroke amount can be shortened. Further, when the distance from the component mounting head to the substrate is long, the stroke amount can be increased. For this reason, it can suppress that the pushing force of the electronic component with respect to a board | substrate varies.

  (5) Preferably, in the configuration of the above (4), a plurality of the modules are arranged in series from the upstream side to the downstream side in order to mount the plurality of electronic components on the substrate in stages. The modified data is preferably calculated separately for each of the plurality of modules.

  According to the electronic component mounting machine of this configuration, the plurality of modules individually calculate the deformation data of the board. For this reason, even when the substrate is deformed while being transported from the upstream side to the downstream side, the stroke amount when mounting the electronic component is adjusted for each module following the deformation. Can do.

  Further, even when the substrate is deformed while being transported from the upstream side to the downstream side and becomes a defective product, it can be determined as a defective product in the downstream module. .

  (6) Preferably, in the configuration of the above (4), a plurality of the modules are arranged in series from the upstream side to the downstream side in order to mount the plurality of electronic components on the substrate in stages. The modified data may be calculated for any single module among the plurality of modules, and the modified data may be shared by all modules.

  According to the electronic component mounting machine of this configuration, all modules use deformation data of an arbitrary single module (for example, the first module). For this reason, all the modules can mount an electronic component corresponding to the deformation of the board only by measuring the height of the board in a single module. For this reason, the time which an electronic component mounting machine spends on the height measurement of a board | substrate can be shortened.

  (7) Moreover, in order to solve the said subject, the board | substrate height measuring method of this invention irradiates light to the measurement area set to the predetermined position of the upper surface of a board | substrate, forms a figure in this measurement area, this light The imaging area including the measurement area is imaged from a direction intersecting the irradiation direction of the image, the imaging data of the imaging area is subjected to image processing, and the height of the image is determined based on the position of the image in the measurement area of the image. A substrate height measuring method for measuring the shape, and when the figure is not formed in the measurement area, the figure and the relative to the measurement area so that the figure enters the measurement area. The imaging area is moved by a predetermined amount.

  In the substrate height measuring method of the present invention, when the figure is not formed in the measurement area, that is, when the figure height exceeds the measurable range, the figure and the imaging area are set relative to the measurement area. It moves by a predetermined amount and puts a figure in the measurement area. Then, the height of the figure is measured from the image.

  When the figure and the imaging area are moved relative to the measurement area, the measurable range can be moved in the height direction. For this reason, even if the measurement area on the substrate is narrow, the altitude of the substrate can be measured over a wide range.

  (8) Preferably, in the configuration of (7), when the relative position of the measurement area in the imaging area is at a predetermined position, a reference for searching for the figure within a reference altitude range corresponding to the measurement area When the shape is not found in the search step and the reference search step, the relative position of the measurement area in the imaging area is offset with respect to the reference search step, and the measurement area after the offset is handled A first altitude range search step for searching for the image in one of the upper altitude range and the lower altitude range, and when the shape is not found in the first altitude range search step, for the reference search step, The relative position of the measurement area in the imaging area is offset in the direction opposite to the offset direction in the first altitude range search step, and the measurement error after the offset is set. Corresponding to A, the other of the the high range and said lower said upper altitude range, it is better to adopt a configuration having a second altitude range searching step to search the transformant elephant, a.

  The substrate height measurement method of this configuration includes a reference search step, a first height range search step, and a second height range search step. For this reason, when a figure is not found within the reference altitude range, the figure can be searched for within the upper altitude range or the lower altitude range. That is, the height of the image can be measured over a relatively wide altitude range centered on the reference altitude range.

  (9) Preferably, in the configuration of (8), when the altitudes of the n (n is a natural number) substrates are sequentially measured, for the first substrate, the reference search step, the first The steps are executed in the order of the first altitude range search step and the second altitude range search step, and for the kth substrate (k is a natural number of 2 to n), the reference search step, the Of the first altitude range search step and the second altitude range search step, it is better to configure the step in which the figure is found when the altitude of the (k-1) th substrate is measured first. .

  That is, the substrate height measuring method of this configuration searches for a figure using the substrate height measuring method of the above configuration (8) in the first measurement (that is, the height measurement of the first substrate). In addition, in the second and subsequent measurements (that is, the second and subsequent substrate altitude measurements), the process in which the figure is found in the previous measurement is preferentially executed. When the altitudes of a plurality of substrates are sequentially measured, there are many cases in which the tendency of deformation (such as warping) is similar in a substrate in which the measurement order is continuous. In view of this point, the substrate height measuring method of this configuration sets the altitude range in which a figure is first searched in the k-th search with reference to the k-1th figure search result. For this reason, a figure can be found in a shorter time. As a result, the time spent for measuring the altitude of the substrate can be shortened.

  (10) Preferably, in the configuration of (8) or (9), the first altitude range search step is an upper search step for searching for the image within the upper altitude range, and the second altitude range search step Is preferably a downward search process for searching for the image within the lower altitude range.

  When the substrate is deformed, the substrate is often warped upward so as to be convex upward and concave downward. For this reason, when a figure is not found within the reference altitude range, it is easier to find a figure by first searching within the upper altitude range.

  In this regard, in the substrate height measuring method of this configuration, after searching for a figure within the reference altitude range, the figure is searched for in the order of the upper altitude range → the lower altitude range. For this reason, according to the substrate height measuring method of the present configuration, a figure can be found in a shorter time. As a result, the time spent for measuring the altitude of the substrate can be shortened.

  (11) Preferably, in any one of the above configurations (7) to (10), a measured value based on the position of the figure and a measured value of a plurality of horizontal planes having different altitudes from each other are compared. An offset amount calculating step of calculating an offset amount of the measured value with respect to the actually measured value, and correcting the measured value of the height of the shape formed on the upper surface of the substrate by using the offset amount. Is better.

  According to the substrate height measuring system of this configuration, the offset amount calculating step is executed prior to the measurement of the substrate height. For this reason, the altitude of the substrate can be measured in a wide range and with high accuracy.

  According to the board height measuring system, the electronic component mounting machine, and the board height measuring method of the present invention, the board height can be measured over a wide range even when the measurement area on the board is narrow.

  Hereinafter, embodiments of a board height measuring system, an electronic component mounting machine, and a board height measuring method according to the present invention will be described. Note that the board height measuring system of this embodiment is incorporated in the electronic component mounting machine of this embodiment. Therefore, the description of the electronic component mounting machine also serves as the description of the board height measuring system.

<Electronic component mounting machine>
[Mechanical configuration of electronic component mounting machine]
First, the mechanical configuration of the electronic component mounting machine of this embodiment will be described. FIG. 1 shows a transparent perspective view of the electronic component mounting machine of the present embodiment. As shown in FIG. 1, the electronic component mounting machine 1 according to the present embodiment includes a large number of modules 2 (only two are illustrated, but a large number are arranged in the X direction (substrate transport direction)). A large number of modules 2 are arranged in the X direction. The module 2 includes a component supply device 3, a board transfer device 4, a component mounting device 5, and a frame 6.

  The component supply device 3 is disposed in front of the frame 6. The component supply device 3 includes a plurality of cassette type feeders 30. The cassette type feeder 30 includes a supply reel 300 and a component take-out unit 301. The supply reel 300 is formed by winding an elongated tape, and has a disk shape. A plurality of electronic components are sealed in the tape of the supply reel 300 at predetermined intervals in the longitudinal direction. The electronic component is taken out from the component take-out unit 301 by a suction nozzle 501a described later.

  The substrate transfer device 4 is disposed inside the frame 6. The substrate transfer device 4 includes a front conveyor 40 and a rear conveyor 41. The front conveyor 40 includes a pair of front and rear guide rails 400 and 401. Each of the pair of guide rails 400 and 401 has a thin plate shape extending in the X direction. The pair of guide rails 400 and 401 are disposed substantially parallel to each other.

  The upper end of the guide rail 400 protrudes backward. A belt conveyor (not shown) is disposed on the rear surface of the guide rail 400. The belt conveyor extends in the X direction. On the other hand, the upper end of the guide rail 401 protrudes forward. A belt conveyor (not shown) is disposed on the front surface of the guide rail 401. The belt conveyor extends in the X direction. A substrate 9 (indicated by a dotted line in FIG. 1) is installed between the pair of belt conveyors. The substrate 9 is conveyed in the X direction by a pair of belt conveyors.

  When an electronic component is mounted on the substrate 9, it is supported from below by a backup pin (not shown), and the substrate 9 rises from a pair of belt conveyors. The substrate 9 is sandwiched between a pair of guide rails 400 and 401 from the front-rear direction. Further, both front and rear edges of the substrate 9 are sandwiched from above and below by the protruding ends of the upper guide rails 400 and 401 and the lower backup pin. When mounting the electronic component, the substrate 9 is held in this way. The configuration and movement of the rear conveyor 41 are the same as the configuration and movement of the front conveyor 40. Therefore, the description is omitted here.

  The component mounting device 5 is disposed above the substrate transfer device 4 inside the frame 6. The component mounting device 5 includes an X-direction moving unit 50, a Y-direction moving unit 51, and a pair of Y-direction guide rails 52 and 53. In FIG. 2, the permeation | transmission upper surface schematic diagram of the module of the electronic component mounting machine of this embodiment is shown. As shown in FIG. 2, the pair of Y-direction guide rails 52 and 53 extends in the Y direction. The pair of Y-direction guide rails 52 and 53 are arranged substantially in parallel.

  The Y-direction moving unit 51 can move in the Y direction in the upper space of the substrate transport apparatus 4 along the pair of Y-direction guide rails 52 and 53 by a driving force of a motor (not shown). The Y-direction moving unit 51 includes a pair of X-direction guide rails (not shown). The pair of X direction guide rails extends in the X direction. The pair of X direction guide rails are arranged substantially in parallel.

  The X direction moving part 50 is movable in the X direction along a pair of X direction guide rails of the Y direction moving part 51 by a driving force of a motor (not shown). FIG. 3A is a schematic right side view of the X-direction moving unit of the module of the electronic component mounting machine according to the present embodiment. FIG. 3B shows an imaging area of the imaging device of the X-direction moving unit.

  As shown in FIG. 3A, the X-direction moving unit 50 includes an X-direction slider 500, a component mounting head 501, an irradiation device 502, and an imaging device 503. The X direction slider 500 is engaged with a pair of X direction guide rails. The component mounting head 501 is disposed on the X direction slider 500. The component mounting head 501 includes a suction nozzle 501a. The suction nozzle 501a can suck and release electronic components.

  The irradiation device 502 is disposed behind the component mounting head 501 in the X-direction slider 500. The irradiation device 502 includes an LED. The irradiation device 502 can irradiate light 45 ° behind the Z axis.

  The imaging device 503 is disposed behind the irradiation device 502 in the X direction slider 500. The imaging device 503 includes a light guide tube 503a and a mark camera 503b. The light guide tube 503 a is disposed behind the irradiation device 502. The light guide tube 503a opens downward. The mark camera 503b is disposed behind the light guide tube 503a. The mark camera 503b is continuous with the side peripheral wall of the light guide tube 503a.

[Electrical configuration of electronic component mounting machine]
Next, the electrical configuration of the electronic component mounting machine of this embodiment will be described. FIG. 4 shows a block diagram of a module of the electronic component mounting machine of this embodiment. As shown in FIG. 4, the electronic component mounting machine 1 includes a control unit 70, an image processing device 71, a component mounting head moving motor 72, an irradiation device 502, and an imaging device 503.

  The control unit 70 includes a computer 700, an input / output port 701, and a drive circuit 702. The computer 700 includes a CPU 700a, a ROM 700b, and a RAM 700c.

  The drive circuit 702 is connected to the computer 700 via the input / output port 701. The component mounting head moving motor 72 is connected to the drive circuit 702. The component mounting head moving motor 72 is a motor for moving the Y-direction moving unit 51 in FIG. 1 in the Y direction and the X-direction moving unit 50 in the X direction.

  The imaging device 503 is connected to the input / output port 701 via the image processing device 71. An image captured by the imaging device 503 is processed by the image processing device 71 and input to the input / output port 701. The irradiation device 502 is also connected to the input / output port 701. The irradiation instruction 502 is transmitted to the irradiation device 502 from the CPU 700a.

[Movement of electronic component mounting machines]
Next, the movement of the electronic component mounting machine of this embodiment will be described. The substrate 9 is relayed to the substrate transfer devices 4 of many modules 2 arranged in the X direction, and transferred from the left side (upstream side) to the right side (downstream side). In the transfer process, electronic components are sequentially mounted on the substrate 9. That is, each module 2 is assigned an electronic component to be mounted on the substrate 9.

  When mounting electronic components in the module 2, first, the pair of belt conveyors disposed on the opposing surfaces of the pair of guide rails 400 and 401 are stopped, and the substrate 9 is stopped at a predetermined position. Next, the substrate is held from the Y direction and the Z direction by the substrate transfer device 4. Then, the holding position of the substrate 9 is confirmed by the mark camera 503b. Thereafter, the component mounting apparatus 5 is driven to mount the electronic component at a predetermined position on the substrate 9. Specifically, by moving the X direction moving unit 50 and the Y direction moving unit 51, the suction nozzle 501 a is moved to the component extraction unit 301 of the component supply device 3. And the electronic component of the component extraction part 301 is adsorbed by the adsorption nozzle 501a. Thereafter, the suction nozzle 501a is moved to the upper part of the predetermined portion of the substrate 9 by moving the X direction moving unit 50 and the Y direction moving unit 51 again. Then, the component mounting head 501 is lowered, and the electronic component is pushed into the predetermined portion by the suction nozzle 501a. In this way, electronic components are mounted in the module 2.

<Principle measurement principle>
Next, the substrate height measurement principle of the substrate height measurement method of this embodiment will be briefly described. As shown in FIG. 3A, the light irradiated by the irradiation device 502 is reflected by the upper surface of the substrate 9. Of the reflected light, the reflected light irregularly reflected above the substrate 9 enters the light guide tube 503a from the axial direction. The reflected light is refracted backward by the mirror 503c in the light guide tube 503a. The refracted reflected light is received by the mark camera 503b. As shown in FIG. 3B, an elliptical shape S1 that is long in the Y direction is formed in the imaging area B1.

  Incidentally, the substrate 9 is held by the substrate transfer device 4 as shown in FIG. The substrate 9 may be warped upward or downward by the holding force. For this reason, the altitude of the substrate 9 may partially change. When light is irradiated onto the substantially central portion in the Y direction of the substrate 9U along the upper side, the shape S1U is formed in front of the shape S1 formed on the flat substrate 9 in the imaging area B1. On the other hand, when light is irradiated onto the substantially central portion in the Y direction of the substrate 9D along the lower side, the shape S1D is formed behind the shape S1 formed on the flat substrate 9 in the imaging area B1. .

  As described above, the formation positions of the shapes S1, S1U, and S1D in the imaging area B1 are shifted due to the deformation of the substrate 9, that is, the altitude. The substrate height measuring method according to the present embodiment measures the height of each part of the substrate 9 based on the displacement of the formation positions of the shapes S1, S1U, and S1D.

<Measurement area setting method>
Next, a measurement area setting method used in the substrate height measurement method of this embodiment will be described. FIG. 5 shows a top view of the substrate. As shown in FIG. 5, a total of nine measurement areas A <b> 1 (shown by a solid line for convenience of explanation) are arranged on the substrate 9. The measurement area A1 has a square shape of several millimeters square.

  FIG. 6 shows a partial cross-sectional view of the substrate. As shown in FIG. 6, the substrate 9 includes a resist layer 90, a glass epoxy layer 91, a pattern 92, a land 93, and a silk print portion 94. The resist layer 90 and the glass epoxy layer 91 are laminated in the order of resist layer 90 → glass epoxy layer 91 → glass epoxy layer 91 → resist layer 90. The pattern 92 is interposed between these layers. The land 93 is disposed on the surface of the pattern 92. The land 93 is exposed from the opening of the resist layer 90. The silk print portion 94 is disposed on the surface of the resist layer 90.

  On the upper surface of the substrate 9, the part where the electronic component is mounted, the part where the silk printing portion 94 is arranged, the part where the land 93 is arranged, and the part where the colors are not the same color are set as the measurement area A1. It is not preferable.

  On the other hand, a preferable site for setting as the measurement area A1 is a site where the pattern 92 is laminated directly under the resist layer 90. Even when the pattern 92 is not laminated directly under the resist layer 90, it may be set as the measurement area A1 with some conditions. Thus, the part which can be set as measurement area A1 is very limited.

<Board height measurement method>
Next, the substrate height measuring method of this embodiment will be described. The substrate height measuring method according to the present embodiment includes an offset amount calculating step, a reference searching step, an upward searching step, and a downward searching step. The substrate height measuring method of the present embodiment is executed after the substrate 9 is held by the substrate transfer device 4. In other words, it is executed immediately before the electronic component is mounted on the substrate 9. However, the offset amount calculation step is executed only when the irradiation device 502 is reattached. The offset amount calculation step will be described in detail later.

  In addition, the reference search process, the upward search process, and the downward search process are always executed in this order in the case of the first board 9 among n (n is a natural number) boards 9. is there. That is, when an arbitrary module 2 is considered as a reference, n substrates 9 are successively carried into the module 2 and electronic components are mounted and carried out. Of these n substrates 9, the first substrate 9 is always executed in the order of the reference search step → the upper search step → the lower search step. On the other hand, for the second and subsequent boards 9, the search for the figure S1 is started preferentially from the altitude range where the figure S1 was found in the previous measurement of the board 9. Hereinafter, a substrate height measuring method for the first substrate 9 will be described.

[Reference search process]
First, the reference search process will be described. In the reference search process, the module 2 is switched to the reference search mode by the computer 700. FIG. 7A is a schematic diagram of an image when there is a figure in the measurement area in the reference search step of the substrate height measurement method of the present embodiment. FIG. 7B shows a schematic view seen from the X direction of the substrate when there is a figure in the measurement area in the same process.

  In each module 2, a substrate height reference eigenvalue Z0 of the substrate transport apparatus 4 is set in advance. That is, the upper surface height of the substrate 9 in the state of being held by the substrate transfer device 4 is set to Z0 in advance. Further, in this state, when light is irradiated on the upper surface of the substrate 9 from an angle of 45 ° with respect to the Z axis, the center PA (= the imaging area B1) of the measurement area A1 (square of several millimeters square) of the image. The shape S1 is set to be formed on the center PB). Thus, the altitude of the substrate 9 held by the substrate transfer apparatus 4 is associated with the center PA. For this reason, the altitude of the figure S1 can be measured from the amount of shift in the Y direction of the figure S1 with respect to the center PB of the imaging area B1 in the image.

  In the same process, when the figure S1 is found in the measurement area A1, that is, when the figure S1 is located in the reference height range C1, the height of the figure S1 is measured in this way.

  However, the figure S1 may not be found in the measurement area A1. FIG. 8A is a schematic diagram of an image when there is a figure in front of the measurement area in the reference search step of the substrate height measurement method of the present embodiment. FIG. 8B shows a schematic view seen from the X direction of the substrate when there is a figure in front of the measurement area in the same process. As shown in FIG. 8A, when the figure S1 is in front of the measurement area A1 (that is, on the irradiation device 502 side), as shown in FIG. 8B, the figure S1 is above the reference altitude range C1. positioned.

  FIG. 9A is a schematic diagram of an image when there is a figure behind the measurement area in the reference search step of the substrate height measurement method of the present embodiment. FIG. 9B shows a schematic view of the substrate viewed from the X direction when there is a figure behind the measurement area in the same process. As shown in FIG. 9A, when there is a figure S1 behind the measurement area A1 (that is, on the side opposite to the irradiation device 502), as shown in FIG. 9B, the figure is displayed below the reference altitude range C1. S1 is located.

  Thus, when the figure S1 is in front of the measurement area A1, the figure S1 is located above the reference altitude range C1, and when the figure S1 is behind the measurement area A1, the figure S1 is located below the reference altitude range C1. ing.

  Therefore, in the case of the substrate height measuring method of the present embodiment, after the reference search step, the upward search step and the downward search step are continuously executed to search for the figure S1 above and below the reference height range C1. Yes.

[Upward search process]
Next, the upward search process will be described. As described above, when the figure S1 is not found in the reference search process, the process proceeds to the upward search process. In the upward search process, the module 2 is switched to the upward search mode by the computer 700. FIG. 10A is a schematic diagram of an image when a figure is moved into the measurement area in the upward search process of the substrate height measurement method of the present embodiment. FIG. 10B shows a schematic view seen from the X direction of the substrate when the figure is moved into the measurement area in the same process.

  In this step, from the state shown in FIGS. 8A and 8B, the imaging area B1 and the figure S1 are moved backward by ΔYR while the measurement area A1 is fixed. That is, the imaging device 503 and the irradiation device 502 are moved backward by ΔYR while the substrate 9 is fixed. By this movement, the figure S1 enters the measurement area A1. In this case, the figure S1 is located in the upper altitude range C2. The height of the figure S1 can be measured from the amount of deviation of the figure S1 in the Y direction with respect to the center PB of the imaging area B1 in the image.

[Downward search process]
Next, the downward search process will be described. As described above, when the figure S1 is not found in the upward search process, the process proceeds to the downward search process. In the downward search process, the module 2 is switched to the downward search mode by the computer 700. FIG. 11A is a schematic diagram of an image when a figure is moved into the measurement area in the downward search process of the substrate height measurement method of the present embodiment. FIG. 11B shows a schematic view of the substrate viewed from the X direction when the figure is moved into the measurement area in the same process.

  In this step, from the state shown in FIGS. 9A and 9B, the imaging area B1 and the figure S1 are moved forward by ΔYF while the measurement area A1 is fixed. That is, the imaging device 503 and the irradiation device 502 are moved forward by ΔYF while the substrate 9 is fixed. By this movement, the figure S1 enters the measurement area A1. In this case, the figure S1 is located in the lower altitude range C3. The height of the figure S1 can be measured from the amount of deviation of the figure S1 in the Y direction with respect to the center PB of the imaging area B1 in the image.

  According to the substrate height measuring method of the present embodiment, by executing the reference search step, the upward search step, and the downward search step, not only the height of the figure S1 located in the reference height range C1, but also within the upper height range C2, Even the height of the figure S1 located in the lower altitude range C3 can be measured. If the figure S1 is not found even in the lower altitude range C3, it is determined that the warpage amount of the substrate 9 is out of the standard, and the substrate 9 is processed as a defective product.

  The substrate height measuring method of the present embodiment is executed for each of the nine measurement areas A1 shown in FIG. The mounting position of the electronic component on the substrate 9 is approximated by the image processing apparatus 71 based on the distance ratio from a plurality of (for example, four) measurement areas A1 in the vicinity surrounding the mounting position to the mounting position. That is, the altitude of the mounting position of the electronic component is calculated by linear interpolation based on the altitudes of a plurality of nearby measurement areas A1. The stroke amount of the suction nozzle 501a is adjusted for each electronic component mounting position of the substrate 9 according to the deformation data of the substrate 9 obtained in this way. Note that the substrate height measuring method of the present embodiment is executed for each module 2.

  As described above, when the altitudes of the second and subsequent substrates 9 are measured, the process in which the previous shape S1 was found is preferentially executed. For example, when the shape S1 is found in the downward search process as a result of the altitude measurement of the first substrate 9, the downward search process is first executed when the altitude measurement of the second substrate 9 is performed. That is, which of the reference search process, the upward search process, and the downward search process was the process in which the figure S1 was found in the k-1 (k is a natural number from 2 to n) -th substrate height measurement. Is stored in the RAM 700c of FIG. Based on this stored data, the height measurement of the kth substrate is executed.

<Offset amount calculation process>
Next, the offset amount calculating step of the substrate height measuring method of the present embodiment will be described. The offset amount calculation step is executed only when the irradiation device 502 is reattached. In the offset amount calculating step, the altitude of the reference block to which the actual measured value of altitude is input in advance is measured using the substrate height measuring method of the present embodiment, and the offset amount between the actual value and the measured value is set.

  FIG. 12A shows a top view of a reference block used in the offset amount calculating step of the substrate height measuring method of the present embodiment. FIG. 12B shows a front view of the reference block. As indicated by hatching in FIG. 2, the reference block 8 is disposed near the upper edge of the front surface of the guide rail 400.

  The reference block 8 has a three-step shape. The reference block 8 includes a reference stage 80, an upper stage 81, and a lower stage 82. The altitudes of the upper surface of the reference stage 80, the upper surface of the upper stage 81, and the upper surface of the lower stage 82 are measured in advance, and the measured values are printed as 2D codes on the surface of the reference block 8. By reading the 2D code with the imaging device 503, altitudes on the upper surface of the reference stage 80, the upper surface of the upper stage 81, and the upper surface of the lower stage 82 are input to the image processing apparatus 71. Here, for convenience of explanation, the actual measured value of the altitude on the upper surface of the reference stage 80 is 0 mm, the actual measured value of the altitude on the upper surface of the upper stage 81 is 2 mm, and the actual measured value of the altitude on the upper surface of the lower stage 82 is −2 mm.

  A measurement area A80 is set on the upper surface of the reference stage 80, a measurement area A81 is set on the upper surface of the upper stage 81, and a measurement area A82 is set on the upper surface of the lower stage 82. Each of the measurement areas A80 to A82 has a square shape of several millimeters square. The irradiation device 502 is disposed in front of the reference block 8. In the case of irradiating light from the same position, the higher the height of the surface, the more forward the shape is formed. Therefore, when light is irradiated from the same position in the Y direction as in the case of forming the shape S80 near the center P80 of the measurement area A80 on the upper surface of the reference stage 80, measurement is performed on the upper surface of the upper stage 81 in front of the measurement area A81 and on the upper surface of the lower stage 82. The shapes S81 and S82 (that is, the center P80 of the measurement area A80) are respectively formed behind the area A82.

  Therefore, when the figure S81 is formed on the upper surface of the upper stage 81, the irradiation device 502 is moved backward by 2 mm (that is, the rise of the upper surface of the upper stage 81 with respect to the upper surface of the reference stage 80). The figure S81 is formed near the center of the measurement area A81.

  On the other hand, when forming the figure S82 on the upper surface of the lower stage 82, the irradiation device 502 is moved forward by 2 mm (that is, the lowering of the upper surface of the lower stage 82 with respect to the upper surface of the reference stage 80). The figure S82 is formed near the center of the measurement area A82.

  As described above, in each module 2, the substrate height reference eigenvalue Z0 of the substrate transport apparatus 4 is set in advance. The heights of the shapes S80 to S82 are measured with reference to the height Z0. Here, for convenience of explanation, the height measurement value of the figure S80 is -0.2 mm, the height measurement value of the figure S81 is 1.9 mm, and the height measurement value of the figure S82 is -2.1 mm.

  FIG. 13 is a graph showing the relationship between measured values and measured values. As shown in FIG. 13, by approximating the relationship between the measured value and the actually measured value by the least square method, the slope of the correction line indicating the relationship is calculated, and a correction line passing through Z0 is obtained. The image processing apparatus 71 corrects the height measurement value of the shape S1 acquired in the reference search process, the upward search process, and the downward search process by the correction straight line.

<Effect>
In the electronic component mounting machine 1 and the board height measuring method of the present embodiment, when the figure S1 is not formed in the measurement area A1, that is, the height of the figure S1 exceeds the measurable range (reference height range C1). In this case, the figure S1 and the imaging area B1 are moved by the predetermined amounts ΔYR and ΔYF relative to the measurement area A1, and the figure S1 is placed in the measurement area A1. Then, the altitude of the shape S1 is measured from the image.

  When the figure S1 and the imaging area B1 are moved relative to the measurement area A1, the measurable range can be moved in the height direction. For this reason, as shown in FIG. 6, the parts that can be set as the measurement area A1 are limited, and even when the measurement area A1 is narrow, the altitude of the substrate 9 can be measured over a wide range. .

  Moreover, the electronic component mounting machine 1 of this embodiment can be switched to the reference search mode, the upward search mode, and the downward search mode. And the board | substrate height measuring method of this embodiment has a reference | standard search process, an upper search process, and a downward search process. For this reason, when the figure S1 is not found in the reference altitude range C1, the figure S1 can be searched for in the upper altitude range C2 or the lower altitude range C3. That is, the altitude of the figure S1 can be measured over a relatively wide altitude range centered on the reference altitude range C1.

  Further, the substrate 9 is sandwiched between a pair of guide rails 400 and 401 from the front-rear direction as shown in FIG. Moreover, it is supported by a backup pin from below. For this reason, the substrate 9 is often warped upward. Therefore, when the figure S1 is not found in the reference altitude range C1, it is easier to find the figure S1 by first searching in the upper altitude range C2.

  In this regard, the electronic component mounting machine 1 and the board height measuring method of the present embodiment search for the shape S1 in the reference height range C1, and then search for the shape S1 in the order from the upper height range C2 to the lower height range C3. ing. For this reason, according to the electronic component mounting machine 1 and board | substrate height measuring method of this embodiment, figure S1 can be found in a shorter time. As a result, the time spent for measuring the altitude of the substrate 9 can be shortened.

  Moreover, the electronic component mounting machine 1 and the board height measuring method of the present embodiment execute an offset amount calculation step prior to the reference search step, the upper search step, and the lower search step. That is, the reference block 8 is used to calculate the offset amount of the measurement value with respect to the actual measurement value. And the measured value of the height of the figure S1 formed on the upper surface of the substrate 9 is corrected using the offset amount. For this reason, the altitude of the substrate 9 can be measured in a wide range and with high accuracy.

  Moreover, according to the electronic component mounting machine 1 of this embodiment, even if the deformation | transformation of the board | substrate 9 is large, the height of the said deformation | transformation location can be measured. Therefore, the defective product can be easily identified.

  Further, according to the electronic component mounting machine 1 of the present embodiment, the stroke amount when mounting the electronic components on the board 9 can be adjusted according to the deformation data of the board 9. For example, when the distance from the suction nozzle 501a to the substrate 9 is short, the stroke amount can be shortened. When the distance from the suction nozzle 501a to the substrate 9 is long, the stroke amount can be increased. For this reason, it can suppress that the pushing force of the electronic component with respect to the board | substrate 9 varies.

  Further, according to the electronic component mounting machine 1 of the present embodiment, a large number of modules 2 individually calculate deformation data of the substrate 9. Therefore, even when the substrate 9 is deformed while being transported from the upstream side to the downstream side, the stroke amount when mounting the electronic components is adjusted for each module 2 following the deformation. can do.

  Further, even when the substrate 9 is deformed while being transported from the upstream side to the downstream side and becomes a defective product, the downstream module 2 determines the substrate 9 as a defective product. be able to.

  Moreover, the brightness | luminance of the light irradiated from the irradiation apparatus 502, ie, the brightness | luminance of figure S1, can be adjusted suitably. For this reason, it is possible to search for the figure S1 without being influenced by the color of the measurement area A1.

<Others>
The embodiment of the board height measuring system, the electronic component mounting machine 1 and the board height measuring method of the present invention has been described above. However, the embodiment is not particularly limited to the above embodiment. Various modifications and improvements that can be made by those skilled in the art are also possible.

  For example, in the above-described embodiment, the deformation data of the substrate 9 is individually calculated by a large number of modules 2. However, the deformation data of the substrate 9 is calculated only by an arbitrary single module 2 (for example, the first module 2). The deformation data may be shared by all modules 2. If it carries out like this, the time which the electronic component mounting machine 1 spends for the high measurement of the board | substrate 9 can be shortened.

  In the above embodiment, the measurement area A1 is fixed and the imaging area A2 and the figure S1 are moved. However, the imaging area A2 and the figure S1 may be fixed and the measurement area A1 may be moved. Further, all of the measurement area A1, the imaging area A2, and the figure S1 may be moved.

  In the above embodiment, the reference altitude range C1, the upper altitude range C2, and the lower altitude range C3 are set so as not to overlap. However, these altitude ranges may overlap. For example, the lower limit value of the upper altitude range C2 may be lower than the upper limit value of the reference altitude range C1. Further, the upper limit value of the lower altitude range C3 may be higher than the lower limit value of the reference altitude range C1.

  Moreover, in the said embodiment, although the irradiation apparatus 502 was moved to the Y direction, you may move it to a Z direction. That is, the shape S <b> 1 may move on the substrate 9. In the above embodiment, the shape S1 is circular (elliptical), but it may be polygonal such as a triangle or a quadrangle, a straight line, or a cross. Moreover, in the said embodiment, although the search of the figure S1 was stopped after the downward search process, you may continue a search until the figure S1 is found. Moreover, in the said embodiment, although the number of arrangement | positioning of measurement area A1 in the board | substrate 9 was nine places, the number of arrangement | positioning of measurement area A1 is not specifically limited. For example, three or four locations may be used. In other words, it is sufficient if the altitude of the mounting position of the electronic component on the board 9 can be calculated by linear interpolation.

  In the above embodiment, the irradiation device 502 and the imaging device 503 are moved by the same XY drive mechanism. However, the irradiation device 502 and the imaging device 503 may be moved separately. Further, the irradiation angle of the light irradiated from the irradiation device 502 to the substrate 9 and the light receiving angle of the imaging device 503 with respect to the substrate 9 are not particularly limited. Moreover, in the said embodiment, although the board | substrate height measuring system of this invention was integrated in the electronic component mounting machine 1, you may incorporate in other apparatuses which handle a board | substrate, such as a screen printing machine, for example.

It is a see-through | perspective perspective view of the electronic component mounting machine which is one Embodiment of this invention. It is a permeation | transmission upper surface schematic diagram of the module of the same electronic component mounting machine. (A) is a right surface schematic diagram of the X direction moving part of the module. (B) is an imaging area of the imaging device of the X-direction moving unit. It is a block diagram of the module. It is a top view of a substrate. It is a fragmentary sectional view of the board | substrate. (A) is a schematic diagram of an image when there is a figure in the measurement area in the reference search step of the substrate height measurement method of the present embodiment. (B) is the schematic diagram seen from the X direction of the board | substrate when there exists a figure in the measurement area in the same process. (A) is a schematic diagram of an image when there is a figure in front of the measurement area in the same process. (B) is the schematic diagram seen from the X direction of the board | substrate when there exists a figure in the measurement area front in the same process. (A) is a schematic diagram of an image when there is a figure behind the measurement area in the same process. (B) is the schematic diagram seen from the X direction of the board | substrate when there exists a figure behind the measurement area in the process. (A) is a schematic diagram of an image when a figure is moved into a measurement area in an upward search process of the substrate height measurement method. (B) is the schematic diagram seen from the X direction of the board | substrate at the time of moving a figure in the measurement area in the process. (A) is a schematic diagram of an image when a figure is moved into a measurement area in a downward search process of the substrate height measurement method. (B) is the schematic diagram seen from the X direction of the board | substrate at the time of moving a figure in the measurement area in the process. (A) is a top view of the reference | standard block used for the offset amount calculation process of the board | substrate height measuring method. (B) is a front view of the reference block. It is a graph which shows the relationship between a measured value and an actual value. (A) is a schematic diagram of the image of the conventional board | substrate height measuring method. (B) is a schematic diagram of a measurable range in the same method.

Explanation of symbols

1: electronic component mounting machine, 2: module, 3: component supply device, 4: substrate transfer device, 5: component mounting device, 6: frame, 8: reference block, 9: substrate, 9D: substrate, 9U: substrate.
30: Cassette type feeder, 40: Front conveyor, 41: Rear conveyor, 50: X direction moving part, 51: Y direction moving part, 52: Y direction guide rail, 53: Y direction guide rail, 70: Control part, 71 : Image processing apparatus, 72: motor for moving component mounting head, 80: reference stage, 81: upper stage, 82: lower stage, 90: resist layer, 91: glass epoxy layer, 92: pattern, 93: land, 94: silk printing Department.
300: supply reel, 301: component take-out section, 400: guide rail, 401: guide rail, 500: X direction slider, 501: component mounting head, 501a: suction nozzle, 502: irradiation device, 503: imaging device, 503a: Light guide tube, 503b: mark camera, 503c: mirror, 700: computer, 700a: CPU, 700b: ROM, 700c: RAM, 701: input / output port, 702: drive circuit.
A1: measurement area, A2: imaging area, A80 to A82: measurement area, B1: imaging area, C1: reference altitude range, C2: upper altitude range, C3: lower altitude range, S1: figure, S1D: figure, S1U: Figure, S80-S82: Figure.

Claims (11)

An irradiation device for irradiating light to a measurement area set at a predetermined position on the upper surface of the substrate and forming a shape in the measurement area;
An imaging device for imaging an imaging area including the measurement area from a direction intersecting the irradiation direction of the light;
An image processing device that performs image processing on imaging data of the imaging area, and measures the height of the figure based on the position of the figure in the measurement area of the image;
A board altitude measuring system comprising:
When the figure is not formed in the measurement area, the figure and the imaging area are moved by a predetermined amount relative to the measurement area so that the figure enters the measurement area. Substrate height measurement system. When the relative position of the measurement area in the imaging area is at a predetermined position, a reference search mode for searching for the image within a reference altitude range corresponding to the measurement area;
An upper search mode in which the relative position of the measurement area in the imaging area is offset with respect to the reference search mode, and the image is searched for in the upper altitude range corresponding to the measurement area after the offset;
Relative to the reference search mode, the relative position of the measurement area in the imaging area is offset in the direction opposite to the offset direction in the upward search mode, and within the lower altitude range corresponding to the measurement area after the offset A downward search mode for searching for the image at
The substrate height measuring system according to claim 1, which can be switched to In addition, a reference block having a plurality of horizontal planes having different altitudes from each other,
The image processing apparatus compares the measured value that is an altitude measured from the positions of the shapes on a plurality of the horizontal planes with an actual measured value that is an actual altitude of the plurality of horizontal planes , thereby comparing the measured values with respect to the actual measured values. 3. The substrate height measurement system according to claim 1, wherein an offset amount of the measurement value is calculated, and the measurement value of the height of the shape formed on the upper surface of the substrate is corrected using the offset amount. A substrate height measuring system according to any one of claims 1 to 3,
A component mounting head for mounting an electronic component on a predetermined position of the substrate with a stroke amount corresponding to the deformation data of the substrate calculated from the heights of the plurality of shapes measured in the plurality of measurement areas;
An electronic component mounting machine comprising a module having A plurality of the modules are arranged in series from the upstream side to the downstream side in order to mount the plurality of electronic components on the substrate in stages,
The electronic component mounting machine according to claim 4, wherein the deformation data is calculated individually for each of the plurality of modules. A plurality of the modules are arranged in series from the upstream side to the downstream side in order to mount the plurality of electronic components on the substrate in stages,
The electronic component mounting machine according to claim 4, wherein the deformation data is calculated for any single module among the plurality of modules, and the deformation data is shared by all modules. Irradiating light to a measurement area set at a predetermined position on the upper surface of the substrate, forming a shape on the measurement area, imaging an imaging area including the measurement area from a direction intersecting the irradiation direction of the light, A substrate height measuring method that performs image processing on imaging data of the imaging area and measures the height of the figure based on the position of the figure in the measurement area of the image,
When the figure is not formed in the measurement area, the figure and the imaging area are moved by a predetermined amount relative to the measurement area so that the figure enters the measurement area. Substrate height measurement method. When the relative position of the measurement area in the imaging area is at a predetermined position, a reference search step for searching for the figure in a reference altitude range corresponding to the measurement area;
When the shape is not found in the reference search step, the relative position of the measurement area in the imaging area is offset with respect to the reference search step, and the upper altitude range corresponding to the measurement area after the offset A first altitude range searching step for searching for the shape in one of the inner altitude range and the lower altitude range;
If the shape is not found in the first altitude range search step, the relative position of the measurement area in the imaging area is opposite to the offset direction in the first altitude range search step with respect to the reference search step. A second altitude range search step for searching for the figure in the other of the upper altitude range and the lower altitude range corresponding to the measurement area after offset,
The method for measuring a substrate height according to claim 7. When sequentially measuring the height of n (n is a natural number) substrates,
For the first substrate, the reference search step, the first altitude range search step, the second altitude range search step in order,
For the kth (k is a natural number from 2 to n) th substrate, k−1 of the reference search step, the first altitude range search step, and the second altitude range search step The substrate height measuring method according to claim 8, wherein the step of finding the shape when the height of the substrate of the eye is measured is executed first. The first altitude range search step is an upper search step for searching for the shape within the upper altitude range,
10. The substrate height measuring method according to claim 8, wherein the second altitude range searching step is a downward searching step for searching for the shape within the lower altitude range. Comparing a measured value that is an altitude measured from a position of the figure on a plurality of horizontal planes and an actual measured value that is an actual altitude of the plurality of horizontal planes of a reference block having a plurality of horizontal planes having different altitudes from each other; An offset amount calculating step of calculating an offset amount of the measured value with respect to the actually measured value and correcting the measured value of the height of the shape formed on the upper surface of the substrate by using the offset amount. The substrate height measuring method according to any one of claims 7 to 10.

Images