JP2006339459A - Dividing method of microwave circuit substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a dividing method of a microwave circuit substrate capable of dividing the microwave circuit substrate with high accuracy without the need for highly accurately positioning the microwave circuit substrate and a dividing member. <P>SOLUTION: The dividing method of the microwave circuit substrate includes steps of: forming a first groove 11 of nearly a trapezoidal shape wherein the cross-sectional shape of the groove 11 is opened toward one side of the substrate to the one side 1a of the microwave circuit substrate 1; forming a notch 12 of nearly a V-shape to the bottom face 11b of the first groove 11; locating the part of the microwave circuit substrate 1 formed with the first groove 11 between the dividing member 4A and a support base 5A; covering the first groove 11 of the one side 1a of the microwave circuit substrate 1 with a first resilient body 2, and applying a second resilient body 3 to the side of the other side 1b opposite to the first groove 11; and clamping the part of the microwave circuit substrate 1 formed with the first groove 11 between the dividing member 4A and the support base 5A. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for dividing a three-dimensional circuit board.

Conventionally, as a method of dividing a circuit board in which a circuit is formed on one surface or both surfaces of an insulating substrate having flat surfaces, one disclosed in, for example, Patent Document 1 is known. In this dividing method, a circuit is first formed on one surface of a circuit board, and then a slit is provided on the other surface of the circuit board. Next, a groove is formed at a position opposite to the slit on one surface of the circuit board, and the circuit board is placed on a cradle made of an elastic body so that one surface of the circuit board is an upper surface. In this state, the circuit board is warped so as to protrude downward by pressing the dividing member having a sharp pointed tip so that the tip of the dividing member enters the groove, and the circuit board at that time The circuit board is divided by the slits due to the tensile stress generated on the other surface.
JP-A-2-36094

  However, in the dividing method, if the position of the tip of the dividing member and the position of the slit do not coincide with each other, the tensile stress generated on the other surface of the circuit board is not maximized at the position of the slit, and the circuit board is not the slit. Therefore, in order to divide the circuit board by the slit, it is necessary to align the dividing member and the circuit board with high accuracy.

  In recent years, so-called three-dimensional circuit boards have been developed in which one surface or both surfaces of an insulating substrate are formed in an uneven shape and a circuit is formed on the uneven surface. When the substrate is divided by the dividing method, since the concave portion of the three-dimensional circuit board is thin, when the three-dimensional circuit board is warped, it is thin without being divided by the slit. There is a risk of being divided in parts.

  In view of such circumstances, the present invention provides a method for dividing a three-dimensional circuit board that can divide the three-dimensional circuit board with high precision without aligning the three-dimensional circuit board and the dividing member with high precision. With the goal.

  In order to achieve the above-mentioned object, according to a first means of the present invention, in a method for dividing a three-dimensional circuit board, a substantially trapezoidal second shape whose cross-sectional shape opens on one surface side of the three-dimensional circuit board is provided. Forming a first groove, forming a substantially V-shaped notch extending in a direction in which the first groove extends in the bottom surface of the first groove, and forming a first groove of the three-dimensional circuit board. And the first groove portion on one surface of the three-dimensional circuit board with the first elastic body. The step of positioning the portion between the support base and the divided member having a shape capable of expanding the first groove portion. A step of covering, a step of assigning the second elastic body to the opposite side of the first groove portion on the other surface of the three-dimensional circuit board, and a portion where the first groove portion of the three-dimensional circuit board is formed as a divided member The three-dimensional circuit is configured by pressing the first elastic body against both side surfaces of the first groove portion with the divided member by sandwiching the support base with the support base. And a step of dividing the plate in the notch.

  In order to prevent the divided three-dimensional circuit board from falling apart after dividing the three-dimensional circuit board, the step of covering the first groove on one surface of the three-dimensional circuit board with the first elastic body and the other of the three-dimensional circuit board The step of assigning the second elastic body to the opposite side of the first groove portion of the surface is three-dimensional with the first elastic body and the second elastic body each having substantially the same size as the three-dimensional circuit board. This is performed by sandwiching the circuit board from one surface side and the other surface side, and thereafter, a step of positioning the portion of the three-dimensional circuit board where the first groove is formed between the dividing member and the support base is performed. It is preferable.

  In order to facilitate alignment between the molded circuit board and the divided member, after the step of positioning the portion of the molded circuit board where the first groove is formed between the support base and the divided member, It is preferable to perform the step of covering the first groove on one surface with the first elastic body.

  According to a second means of the present invention, in the method of dividing a three-dimensional circuit board, a step of forming a substantially trapezoidal first groove portion whose cross-sectional shape opens on the one surface side on one surface of the three-dimensional circuit board; A step of forming a substantially V-shaped notch extending in a direction in which the first groove portion extends on the bottom surface of the first groove portion, a portion where the first groove portion of the three-dimensional circuit board is formed, and a support base; A step in which the tip is positioned between the first elastic member and a split member configured to expand the first groove portion, and the first groove portion on the other side of the three-dimensional circuit board is opposed to the first groove portion. The step of applying the elastic body 2 and the portion where the first groove portion of the three-dimensional circuit board is formed are sandwiched between the dividing member and the support base, so that the tip of the dividing member is placed on both side surfaces of the first groove portion. And pressing to divide the three-dimensional circuit board at the notch.

  In order to apply a pressing force evenly to both side surfaces of the first groove part, it is preferable that the tip of the dividing member has substantially the same shape as the first groove part.

  In order to be able to divide the molded circuit board with a low load, a substantially trapezoidal second groove part whose cross-sectional shape opens to the other surface side on the opposite side of the first groove part on the other surface of the molded circuit board It is preferable that the support base has a shape capable of expanding the second groove portion.

  In order to enable division with high accuracy, it is preferable that the support base has an arc convex shape toward the division member.

  In order to cut out each substrate piece with high accuracy, the three-dimensional circuit board is formed by connecting a plurality of substrate pieces to each other by a connecting portion in a state of being arranged vertically and horizontally, and in the step of forming the first groove portion The first groove portion is preferably formed along the outline of each substrate piece, and the dividing member is provided for each substrate piece, and they can be controlled independently.

  According to the first means of the present invention, since the notch is formed in the bottom surface of the first groove portion formed on one surface of the three-dimensional circuit board, the first elastic body is separated from the both side surfaces of the first groove portion by the divided members. Since the stress concentration occurs at the tip of the notch and the three-dimensional circuit board is broken and divided from the tip, the notch is prevented from being divided at portions other than the notch. A highly accurate division along the extending line becomes possible. In addition, since the first groove on one surface of the molded circuit board is covered with the first elastic body and the second elastic body is applied to the other surface of the molded circuit board, the molded circuit board is molded. Even if there is an upper distortion or a distortion in processing of the first groove, a uniform pressing force can be applied to each of both side surfaces of the first groove over the entire length of the first groove. Further, since the cross-sectional shape of the first groove portion is substantially trapezoidal, the divided member is drawn into the first groove portion, so that the alignment between the divided member and the three-dimensional circuit board is performed with high accuracy. You do n’t have to.

  According to the second means of the present invention, since the notch is formed in the bottom surface of the first groove portion formed on one surface of the three-dimensional circuit board, the front end of the dividing member is pressed against both side surfaces of the first groove portion. In addition, stress concentration occurs at the tip of the notch, and the three-dimensional circuit board is broken and divided from the tip, so that the three-dimensional circuit board is prevented from being divided at portions other than the notch, and along the line in which the notch extends. High-precision division is possible. In addition, since the tip of the split member is formed of the first elastic body and the second elastic body is assigned to the other surface of the three-dimensional circuit board, the distortion in molding of the three-dimensional circuit board or the first Even if there is distortion in processing of the groove, a uniform pressing force can be applied to each of both side surfaces of the first groove over the entire length of the first groove. In addition, since the tip of the dividing member itself is formed of the first elastic body, the step of covering the first groove portion on one surface of the three-dimensional circuit board with the first elastic body is not necessary, so that the dividing step is simplified. Can be Further, since the cross-sectional shape of the first groove portion is substantially trapezoidal, the divided member is drawn into the first groove portion, so that the alignment between the divided member and the three-dimensional circuit board is performed with high accuracy. You do n’t have to.

  Hereinafter, the best mode for carrying out the present invention will be described in detail with reference to the drawings.

  With reference to FIG. 1, the division | segmentation method of the three-dimensional circuit board based on 1st Embodiment of this invention is demonstrated.

  The three-dimensional circuit board 1 is made of a fragile material such as glass or ceramic, for example, and as shown in FIG. 2A, the connecting portions 15 in a state where a plurality of rectangular board pieces 10 are arranged vertically and horizontally in a plan view. Are connected to each other to form a single plate. One surface 1a of the three-dimensional circuit board 1 is flat, but the other surface 1b is provided with a recess 14 that is recessed in two steps at a position corresponding to each substrate piece 10. A circuit (not shown) is formed on the inner surface of the recess 14 and one surface 1 a of the three-dimensional circuit board 1. The circuit may be formed on both the one surface 1a and the other surface 1b. The method for dividing the three-dimensional circuit board 1 includes the following four steps.

1) 1st groove part formation process As shown in Fig.1 (a), on one surface 1a of the three-dimensional circuit board 1, the cross-sectional shape is a substantially trapezoid shape that opens to the first surface 1a side, in other words, A first groove portion 11 having a bottom surface 11b and a side surface 11a inclined so as to be separated from the bottom surface 11b toward the one surface 1a is formed.

  Specifically, as shown in FIG. 2B, the first groove portion 11 is formed on the three-dimensional circuit board 1 along a dividing line L that extends on the same straight line as a line constituting the outline of each board piece 10. It is formed over the entire length and width. In the present embodiment, each substrate piece 10 is connected by the connecting portion 15 in a state in which a predetermined distance is provided between the adjacent substrate pieces 10, and therefore, the first piece is provided between the substrate pieces 10. Two groove portions 11 are formed. In addition, if each board | substrate piece 10 is connected by the connection part 15 in the state in which there is no clearance gap between adjacent board | substrate pieces 10, one 1st groove part 11 is formed between each board | substrate piece 10. FIG. do it.

  This first groove forming step can be performed before forming the circuit on the three-dimensional circuit board 1 or can be performed simultaneously with the formation of the three-dimensional circuit board 1.

2) Notch formation step After the first groove portion 11 is formed, as shown in FIGS. 1B and 3, the bottom surface 11 b of the first groove portion 11 is substantially extended along the dividing line L by the laser 6 or the like. A V-shaped notch 12 is formed over the entire length of the first groove 11. The notches 12 may not be formed continuously but may be formed intermittently. When circuits are formed on both the one surface 1a and the other surface 1b, a notch (not shown) similar to the notch 12, for example, is also formed on the symmetric side of the notch 12 on the other surface 1b. It is preferable to keep it.

3) Setting process After forming the notch 12, as shown in FIG.1 (c), the part in which the 1st groove part 11 of the three-dimensional circuit board 1 was formed is supported with the division | segmentation member 4A which opposes along with an up-down direction. It is located between the base 5A. The split member 4A is formed in an arc convex shape whose tip 41 can enter the first groove 11 and can be expanded and moved up and down. Yes, the support 5A has a flat upper surface 51.

  Specifically, the second elastic body 3 is placed on the upper surface 51 of the support base 5A, and the other surface 1b of the three-dimensional circuit board 1 is formed on the second elastic body 3 on the first groove 11. Is placed so as to be located directly below the dividing member 4A. As a result, the second elastic body 3 is addressed to the opposite side of the first groove 11 of the other surface 1b of the three-dimensional circuit board 1. Further, the first elastic body 2 is placed on one surface 1 a of the three-dimensional circuit board 1, and the first groove 11 is covered with the first elastic body 2.

  Instead of placing the second elastic body 3 on the upper surface 51 of the support base 5A, the support base 5A in which the second elastic body 3 is attached to the upper surface 51 in advance may be used.

4) Dividing Step In the state where the setting has been made, as shown in FIG. 1 (d), the dividing member 4A is moved downward, and the portion where the first groove 11 of the three-dimensional circuit board 1 is formed is divided into the dividing member. The first elastic body 2 is pressed against both side surfaces 11a of the first groove portion 11 by the divided member 4A by being sandwiched between 4A and the support base 5A. As a result, tensile stress in the direction of increasing the groove width of the first groove portion 11 is generated in the portion between the bottom surface 11b of the first groove portion 11 and the other surface 1b of the three-dimensional circuit board 1. And since the notch 12 is formed in the 1st groove part 11, stress concentration arises in the front-end | tip of the notch 12, the 3D circuit board 1 is fractured | ruptured from the said front end, and the 3D circuit board 1 is divided | segmented by the notch 12 Will come to be.

  As described above, in the dividing method according to the present embodiment, the notch 12 is formed along the dividing line L on the bottom surface 11b of the first groove portion 11 formed on the one surface 1a of the three-dimensional circuit board 1, so High-precision division along the division line L is possible while preventing the molded circuit board 1 from being divided at portions. Further, the first groove 11 of one surface 1a of the three-dimensional circuit board 1 is covered with the first elastic body 2, and the second elastic body 3 is assigned to the other surface 1b of the three-dimensional circuit board 1. Therefore, even if there is distortion in molding of the three-dimensional circuit board 1 or distortion in processing of the first groove 11, each of the both side surfaces 11 a of the first groove 11 over the entire length of the first groove 11. A uniform pressing force can be applied to the surface. Further, since the cross-sectional shape of the first groove portion 11 is substantially trapezoidal, the divided member 4A is drawn into the first groove portion 11, so that the alignment between the divided member 4A and the three-dimensional circuit board 1 is performed. Need not be performed with high accuracy.

  In the present embodiment, the split member 4A is used in which the tip 41 is formed in an arc convex shape that can enter the first groove portion 11. However, as shown in FIG. In other words, a divided member 4B formed in a shape having a tapered surface 41a parallel to both side surfaces 11a of the first groove portion 11 at the tip 41 may be used.

  If it does in this way, as shown in Drawing 4 (b), since tip 41 of division member 4B comes to be in surface contact via both sides 11a of the 1st slot 11, and 1st elastic body 2, Even if the both side surfaces 11a of the first groove 11 have some unevenness, the pressing force F can be applied to the both side surfaces 11a evenly.

  Furthermore, as shown in FIG. 5A, it is possible to use a split member 4 </ b> C configured by the first elastic body 2 in a shape in which the tip 41 can push and spread the first groove 11. In this divided member 4C, the elastic body 2 that is convex downward and has the tapered surface 41a is bonded to the lower surface of a rectangular parallelepiped body portion 42 extending in the left-right direction. The elastic body 2 does not need to be bonded to the lower surface of the main body portion 42. As shown in FIG. 5B, the elastic body 2 has a substantially U-shape that opens downward in a side view. 2 can be fixed with bolts 43 in a state of being sandwiched between the main body portions 42. Further, the split member 4C can be configured by sticking the flat elastic body 2 so as to cover the tips of the split member 4A shown in FIG. 1 or the split member 4B shown in FIG.

  Thus, if the front end 41 itself of the dividing member 4C is configured by the first elastic body 2, the step of covering the first groove 11 of the one surface 1a of the three-dimensional circuit board 1 with the first elastic body 2 is unnecessary. Therefore, the dividing process can be simplified.

  Next, with reference to FIG. 6, a method for dividing a three-dimensional circuit board according to the second embodiment of the present invention will be described. The dividing method of the present embodiment includes a second groove forming step in addition to the four steps shown in the first embodiment.

  In the second groove portion forming step, as shown in FIG. 6A, the first groove portion is formed on the other surface 1b of the three-dimensional circuit board 1 along the dividing line L as in the first groove portion forming step. 11, a substantially trapezoidal second groove portion 13 whose cross-sectional shape opens to the other surface 1b side is formed. This second groove portion forming step can also be performed before the first groove portion forming step.

  Further, in the setting step, as shown in FIG. 6B, the split member 4 </ b> B in which the tip 41 is formed in substantially the same shape as the first groove portion 11, and the tip is formed in substantially the same shape as the second groove portion 13. Thus, the second groove portion 13 can be expanded and the support base 5B configured to be movable up and down is used. Note that the tip of the support base 5B only needs to have a shape that allows the second groove to be expanded, and for example, it may have a circular arc shape like the split member 4A shown in FIG. Furthermore, the first elastic body 2 and the second elastic body 3 are arranged between the divided member 4B and the support base 5A, and between the first elastic body 2 and the second elastic body 3 and the three-dimensional circuit board 1. It is arranged in advance at a position where a gap slightly larger than the thickness of this is secured. Then, the three-dimensional circuit board 1 is fed between the first elastic body 2 and the second elastic body 3 by the conveying means 8 such as a conveyor or a robot, and the three-dimensional circuit board 1 is positioned. Thereby, the 1st groove part 11 of the one surface 1a of the three-dimensional circuit board 1 is covered with the 1st elastic body 2, and the 2nd elastic body 3 is formed in the opposing side of the 1st groove part 11 of the other surface 1b. Will be addressed.

  In the dividing step, as shown in FIG. 6C, the divided member 4B is moved downward and the support base 5B is moved upward, and the three-dimensional circuit board 1 is sandwiched between them, as shown in FIG. The circuit board 1 is divided at the notch 12.

  In this way, since the tensile stress can be generated in the three-dimensional circuit board 1 from both the one surface 1a side and the other surface 1b side of the three-dimensional circuit board 1, the three-dimensional circuit board 1 is divided with a low load. be able to.

  Also in the present embodiment, the first elastic body 2 can be obtained by using the divided member 4A shown in FIG. 1 instead of the divided member 4B, or using the divided member 4C shown in FIG. 5 instead of the divided member 4B. It is also possible to omit the arrangement. In addition, the 2nd groove part 13 may be provided with the notch (not shown) similar to the notch 12, for example.

  Next, with reference to FIG.7 and FIG.8, the division | segmentation method of the 3D circuit board based on 3rd Embodiment of this invention is demonstrated. In the dividing method of the present embodiment, after forming the first groove 11 and the notch 12 in the three-dimensional circuit board 1, as shown in FIG. 1 and the second elastic body 3 having substantially the same size as the three-dimensional circuit board 1, and the three-dimensional circuit board 1 is placed on the one surface 1a side and the other with these elastic bodies 2 and 3. From the surface 1b side. The first elastic body 2 has a thin portion 22 that extends across the board pieces 10 in a direction orthogonal to a direction in which the three-dimensional circuit board 1 is conveyed by, for example, a conveyance means 8 described later, for weight reduction and material saving. Is provided. This thin portion 22 may be provided at a position corresponding to each substrate piece 10 as shown in FIG. The thin portion 22 may be a window that penetrates the first elastic body 2 in the thickness direction.

  Then, while the molded circuit board 1 is sandwiched between the first elastic body 2 and the second elastic body 3, as shown in FIGS. Positioning is performed by sending it to the support 5C. The support base 5C is formed in an arc convex shape toward the dividing member 4B, and the upper end point thereof is located on substantially the same plane as the work transfer surface 8a of the transfer means 8. If the support base 5C having such a shape is used, the support base 5C comes into line contact with the other surface 1b of the three-dimensional circuit board 1 via the second elastic body 3, and therefore, as shown in FIG. As described above, when the divided member 4B is moved downward, a bending moment is generated in the three-dimensional circuit board 1 due to the spreading effect by the divided member 4B. As a result, the stress concentration at the tip of the notch 12 is further increased, and more accurate division can be performed.

  Further, since the three-dimensional circuit board 1 is sandwiched between the first elastic body 2 and the second elastic body 3 having substantially the same size, the divided three-dimensional circuit board 1 is separated after the three-dimensional circuit board 1 is divided. Can be prevented.

  Next, with reference to FIG.9 and FIG.10, the division | segmentation method of the 3D circuit board based on 4th Embodiment of this invention is demonstrated. In the present embodiment, as shown in FIG. 10, the first elastic body 2 is suspended by a pair of suspension members 21 spaced apart from each other by a predetermined interval, and the divided member 4 </ b> B enters between the suspension members 21. It is possible. The suspension member 21 is configured to be movable in the conveyance direction of the three-dimensional circuit board 1, whereby the first elastic body 2 is retracted from the division member 4 </ b> B shown in FIG. 9A. And a use position located below the dividing member 4B shown in FIG. 9C. The second elastic body 3 is adhered to the upper surface 51 of the support base 5A.

  In the dividing method of the present embodiment, as shown in FIG. 9A, first, the three-dimensional circuit board 1 is separated from the divided member 4B and the divided member 4B by the conveying means 8 with the first elastic body 3 positioned at the retracted position. Positioning is performed by feeding between the support bases 5A to which the second elastic body 3 is adhered. Next, as shown in FIG. 9B, the first elastic body 2 is moved to the use position, and the first groove portion 11 on the one surface 1 a of the three-dimensional circuit board 1 is covered with the first elastic body 2. . In this state, the divided member 4B is moved downward to divide the three-dimensional circuit board 1. After the division is completed, as shown in FIG. 9D, the dividing member 4B is moved up and the first elastic body 2 is moved to the retracted position.

  In this way, when the portion of the molded circuit board 1 where the first groove 11 is formed is positioned between the dividing member 4B and the support 5A, the first groove 11 is the first elastic body 2. Since it is not covered, alignment with the three-dimensional circuit board 1 and the division | segmentation member 4B becomes easy.

  In each of the above-described embodiments, as the divided members 4A to 4C, it is possible to use a member having a length dimension larger than the width dimension of the three-dimensional circuit board 1, but as shown in FIG. It is also possible to provide 4C for each substrate piece 10. When the plurality of divided members 4A to 4C are provided in this way, a holder 7 that holds the plurality of divided members 4A to 4C together is provided, and the holder 7 is moved up and down by an actuator (not shown). The plurality of divided members 4A to 4C can be moved up and down with one actuator. Further, as shown in FIGS. 12A and 12B, the spring members 71 are arranged above and in the front-rear direction and in the left-right direction of the divided members 4A-4C so that the divided members 4A-4C can be controlled independently. The split members 4 </ b> A to 4 </ b> C are held by the holder 7 via the spring member 71. In addition, in FIG. 12, the division | segmentation method when using the division member 4B is illustrated.

  If it does in this way, as shown, for example in FIG.12 (c), the position of the division member 4A-4C and the part in which the 1st groove part 11 of the three-dimensional circuit board 1 was formed in the conveyance direction of the three-dimensional circuit board 1 is. Even when there is a slight shift, or as shown in FIG. 12D, even when the bottom surface 11b of the first groove 11 is not parallel to the other surface 1b of the three-dimensional circuit board 1, each divided member 4A. -4C can press the 1st elastic body 2 to the both-sides 11a of the groove part 11 in the optimal state for every board | substrate piece 10, Therefore The cutting of each board | substrate piece 10 can be performed with high precision.

  In order to control each of the divided members 4A to 4C independently, each of the divided members 4A to 4C may be individually moved by an actuator (not shown) as shown in FIG.

It is explanatory drawing of the division | segmentation method of the molded circuit board which concerns on 1st Embodiment of this invention. (A) is the perspective view which looked at the 3D circuit board from the other surface side, (b) is the perspective view which looked at the 3D circuit board after forming the 1st groove part from one surface side. It is a principal part enlarged view of the three-dimensional circuit board after forming a notch in the bottom face of the 1st groove part. (A) is the principal part enlarged view which shows the state before pressing a 1st elastic body to a 1st groove part with the division member of a modification, (b) is a principal part enlarged view which shows a state when pressing. (A) is a perspective view of the division member of a modification, (b) is a perspective view of the division member which changed the structure further. It is explanatory drawing of the division | segmentation method of the molded circuit board which concerns on 2nd Embodiment of this invention. (A) is a perspective view of the 1st elastic body and 2nd elastic body which concern on 3rd Embodiment of this invention, (b) is a perspective view of the 1st elastic body of a modification. It is explanatory drawing of the division | segmentation method of the molded circuit board which concerns on 3rd Embodiment of this invention. It is explanatory drawing of the division | segmentation method of the molded circuit board which concerns on 4th Embodiment of this invention. It is a perspective view of the 1st elastic body and division member which concern on 4th Embodiment of this invention. It is a perspective view of the division member of a modification. (A) is a side view which shows the state before pressing a 1st elastic body to a 1st groove part with a division member, (b) is the front sectional drawing, (c) is a division member and a 1st elastic body The side view which shows a state when pressing to the 1st groove part, (d) is the front sectional drawing. Furthermore, it is a perspective view of the division member of the modification which changed the structure.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 3D circuit board 1a One surface 1b The other surface 10 Substrate piece 11 1st groove part 12 Notch 13 2nd groove part 2 1st elastic body 3 2nd elastic body 4A-4C Dividing member 41 Tip 5A-5C Support Stand

Claims (8)

A step of forming a substantially trapezoidal first groove portion whose cross-sectional shape opens on the one surface side on one surface of the three-dimensional circuit board;
Forming a substantially V-shaped cutout extending in a direction in which the first groove extends in the bottom surface of the first groove;
A step of positioning the portion of the three-dimensional circuit board where the first groove is formed between the support base and the divided member having a shape capable of expanding the first groove;
Covering the first groove on one surface of the three-dimensional circuit board with a first elastic body;
Assigning the second elastic body to the opposite side of the first groove on the other surface of the molded circuit board;
By sandwiching the portion where the first groove portion of the molded circuit board is formed between the divided member and the support base, the divided member presses the first elastic body against both side surfaces of the first groove portion, and the molded circuit substrate is And a step of dividing by a notch. Covering the first groove on one surface of the molded circuit board with the first elastic body and assigning the second elastic body to the opposite side of the first groove on the other surface of the molded circuit board; Each by sandwiching the three-dimensional circuit board from one surface side and the other surface side between the first elastic body and the second elastic body each having substantially the same size as the three-dimensional circuit board;
2. The method for dividing a three-dimensional circuit board according to claim 1, further comprising a step of positioning a portion of the three-dimensional circuit board where the first groove is formed between the dividing member and the support base.   The process of covering the 1st groove part of one side of a 3D circuit board with the 1st elastic body after the process of positioning the part in which the 1st groove part of the 3D circuit board was formed between a support stand and a division member The method of dividing a three-dimensional circuit board according to claim 1 or 2, wherein: A step of forming a substantially trapezoidal first groove portion whose cross-sectional shape opens on the one surface side on one surface of the three-dimensional circuit board;
Forming a substantially V-shaped cutout extending in a direction in which the first groove extends in the bottom surface of the first groove;
The step of positioning the portion of the three-dimensional circuit board on which the first groove is formed between the support base and the divided member formed of the first elastic body so that the tip can expand the first groove. When,
Assigning the second elastic body to the opposite side of the first groove on the other surface of the molded circuit board;
By sandwiching the portion where the first groove portion of the molded circuit board is formed between the divided member and the support base, the tip of the divided member is pressed against both side surfaces of the first groove portion, and the molded circuit board is divided at the notch. And a step of dividing the three-dimensional circuit board.   The method for dividing a three-dimensional circuit board according to any one of claims 1 to 4, wherein the tip of the dividing member has substantially the same shape as the first groove portion.   A step of forming a substantially trapezoidal second groove portion whose cross-sectional shape opens to the other surface side on the opposite side of the first groove portion on the other surface of the three-dimensional circuit board; The method for dividing a three-dimensional circuit board according to any one of claims 1 to 5, wherein the groove portion has a shape capable of being expanded.   The method for dividing a three-dimensional circuit board according to claim 1, wherein the support base has an arcuate convex shape toward the dividing member. The three-dimensional circuit board is a board in which a plurality of board pieces are arranged vertically and horizontally and connected to each other by a connecting part. In the step of forming the first groove part, the first groove part is formed along the outline of each board piece. Formed,
The method for dividing a three-dimensional circuit board according to any one of claims 1 to 7, wherein the dividing member is provided for each board piece, and they can be independently controlled.

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