JP2004247342A - Mounting board, semiconductor integrated circuit substrate, scribing device, and semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting board which is capable of preventing fissures from spreading when it is divided and also reducing its warpage and distortion caused by stress induced when it is bent so as to get very reliable by improving the structure of dividing grooves; and to provide a semiconductor integrated circuit board, a scribing device, and a semiconductor device. <P>SOLUTION: A laminated wiring board 11 is a multilayered copper-plated laminated wiring board which is, for instance, composed of a glass epoxy resin as a mother material and a five or more-layered copper wiring pattern formed on the glass epoxy resin. The laminated wiring board 11 has such a structure where the same wiring board regions are provided or several sets of wiring board regions of various sizes and shapes are provided on the same board. Therefore, a wiring pattern non-forming region 12 used for division is provided, and a cut region 13 where grooves are cut is provided as a scribe region 13. The cut region 13 is composed of a groove side face 131 having a maximum width W1 and a V-shaped groove 132 having a maximum width W2 smaller than the width W1 and located near at the center of the bottom of the groove side faces 131. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to the manufacture of semiconductor devices, and more particularly to a mounting board, a semiconductor integrated circuit board, a groove cutting blade, and a semiconductor device involving scribing of a multilayer printed wiring board.
[0002]
[Prior art]
2. Description of the Related Art In recent years, the functions of LSIs have been advanced in electronic devices, and the functions of silicon chips have been improved, the semiconductor devices have been extremely miniaturized, and the integration has been advanced. Accordingly, it is necessary for the mounting side to configure an electronic circuit using a printed circuit, a printed wiring board, or the like so that input / output signals from the fine circuit can be actually used without deteriorating the performance. Such a printed wiring board has a multi-layered and high-density wiring, and if there is a warp, distortion, or the like, there is a concern about long-term reliability.
[0003]
The printed wiring board is formed in various shapes and sizes depending on the application. In order to increase the efficiency in manufacturing, there are not a few configurations in which a single printed wiring board has a plurality of the same wiring board regions, and a configuration in which sets for attaching to a plurality of locations are prepared. Therefore, there is a scribe area in one printed wiring board, and the printed wiring board is bent and divided along the division groove. In this case, conventionally, the cut shape of the dividing groove is a V-shaped groove. However, if the V-shaped groove is only cut, there is a concern that the substrate may be cracked by the bending operation. If the crack spreads to the wiring area, there is a risk of disconnection. Such a problem with respect to a printed circuit board has been conventionally known, and there is an example in which one side of the groove is improved by a V-shaped groove and the other side is formed by a rectangular groove (for example, Utility Model Document 1).
[0004]
[Utility model document 1]
58-127666 (Fig. 4)
[0005]
[Problems to be solved by the invention]
However, in a printed wiring board having a multi-layered and high-density wiring, a large force is likely to be applied by the bending operation at the time of division. Due to warpage or distortion due to stress, concerns about the reliability of fine through holes or vias cannot be wiped out, and concerns such as widespread cracks near the division cannot be solved.
[0006]
The present invention has been made in consideration of the above-described circumstances, and by improving the structure of the dividing groove, not only preventing crack diffusion at the time of dividing, but also significantly reducing warpage due to stress in bending operation, distortion, and achieving high reliability. It is an object of the present invention to provide a mounting substrate, a semiconductor integrated circuit substrate, a scribing device, and a semiconductor device using the same, which can obtain the property.
[0007]
[Means for Solving the Problems]
The mounting substrate according to the present invention,
A multilayer wiring board having a predetermined planar shape in which a plurality of wiring patterns are stacked including a connection portion between the layers,
A V-shape having a groove side face having a first dimension width and a second dimension width smaller than the first dimension width near the center of the bottom between the groove side faces in a region where the wiring pattern is not formed in the laminated wiring board; A cut area composed of a groove and
It is characterized by having.
[0008]
According to the mounting substrate according to the present invention as described above, the cut region has a two-stage structure. By having the groove side surface having the first dimension width wider than the V-shaped groove in the first stage, the stress at the time of the bending operation is more concentrated on the V-shaped groove in the second stage. As a result, it is easy to divide, and the spread of the crack is absorbed by the V-shaped groove portion of the second stage, and does not enter the inside of the substrate.
[0009]
Preferred embodiments of the mounting board according to the present invention will be described below.
The cut region has a shape similar to a rectangular short side with respect to the groove side surface.
The cut region is characterized in that the groove side surface is an inverted trapezoidal tapered surface.
The cut region has a shape in which the corner of a step forming the groove side surface and the V-shaped groove is rounded.
[0010]
The semiconductor integrated circuit board according to the present invention is
A multilayer wiring board in which a plurality of wiring patterns are stacked including a connection portion between the layers and the exposed surface is a mounting area,
A semiconductor device mounted in the mounting area;
A V-shape having a groove side face having a first dimension width and a second dimension width smaller than the first dimension width near the center of the bottom between the groove side faces in a region where the wiring pattern is not formed in the laminated wiring board; A cut area composed of a groove and
It is characterized by having.
[0011]
According to the semiconductor integrated circuit substrate of the present invention, the cut region has a two-stage structure, similarly to the mounting substrate described above. By having the groove side surface having the first dimension width wider than the V-shaped groove in the first stage, the stress at the time of the bending operation is more concentrated on the V-shaped groove in the second stage. As a result, it is easy to divide, and the spread of the crack is absorbed by the V-shaped groove portion of the second stage, and does not enter the inside of the substrate.
Each of the more preferred embodiments described for the mounting substrate can be applied to the semiconductor integrated circuit substrate as it is.
[0012]
The scribing device according to the present invention,
With respect to the divided region in the laminated wiring board, both the groove side surface having the first dimension width from the front and back and the V-shaped groove having the second dimension width smaller than the first dimension width near the center of the bottom between the groove side surfaces. It is characterized by having a grinding machine capable of simultaneously giving a cut shape.
[0013]
According to the scribing apparatus according to the present invention as described above, the cut regions on the front and back of the laminated wiring board have a two-stage structure. The first step is a groove side surface having a first dimension width wider than the V-shaped groove, and the second step is a V-shaped groove and is positioned so as to face each other.
The grinding machine is characterized in that grooves are formed deeper into the front and back surfaces of the laminated wiring board in several steps.
Further, the grinding machine has a feature that the corners of the steps forming the groove side surface and the V-shaped groove are rounded.
Alternatively, the grinding machine may have a configuration in which the groove side surface is equivalent to a rectangular short side. In the grinding machine, the groove side surface may have an inverted trapezoidal tapered surface.
[0014]
Further, a semiconductor device according to the present invention is formed using the mounting substrate as described above. Alternatively, a semiconductor device formed using the above-described semiconductor integrated circuit substrate, or a semiconductor device formed using the above-described scribing device is also related to the present invention.
[0015]
BEST MODE FOR CARRYING OUT THE INVENTION
FIG. 1 is a sectional view showing a main part of a mounting board according to the first embodiment of the present invention. The multilayer wiring board 11 is a multilayer copper-clad multilayer wiring board in which five or more copper wiring patterns are formed using, for example, a glass epoxy resin as a base material. The laminated wiring board 11 has a configuration in which a plurality of the same wiring board area is provided in one piece, or a configuration in which various shapes and sizes for mounting at several places are arranged in a set. For this reason, there is a non-formation area 12 of the wiring pattern for division, and a cut area 13 in which a groove is cut as a scribe area. In this embodiment, the cut region 13 includes a groove side surface 131 having a maximum dimension width W1, and a V-shaped groove 132 having a maximum dimension width W2 smaller than the dimension width W1 near the bottom center between the groove side faces.
[0016]
The cut regions 13 are provided on the front and back surfaces of the laminated wiring board 11 such that at least the bottoms of the V-shaped grooves 132 face each other or are aligned. The depth D1 × 2 of both cut regions 13 occupies 40 to 60% of the entire laminated wiring board 11. The groove side surface 131 has a form equivalent to the short side of the rectangle, and is shallower than the depth of the V-shaped groove 132. The acute angle of the V-shaped groove 132 is preferably in a range of 30 ° to 60 °. Thereby, the laminated wiring board 11 is divided by the bending force at the cut region 13, that is, at the bottom of the V-shaped groove 132.
[0017]
According to the above embodiment, the cut area 13 has a two-stage structure. By having the groove side surface 131 having the dimension width W1 wider than the V-shaped groove 132 at the first stage, the stress at the time of the bending operation is more concentrated on the V-shaped groove 132 at the second stage. As a result, it is easy to divide, and the spread of cracks is absorbed by the V-shaped groove 132 at the second stage, and does not enter the inside of the multilayer wiring board 11 where the wiring pattern exists. Furthermore, since warpage and distortion due to stress in the bending operation are greatly reduced, the reliability of fine through holes or vias is greatly improved.
[0018]
FIG. 2 is a cross-sectional view showing a main part of a mounting board according to a second embodiment of the present invention. In the same multilayer wiring board 21 as in the first embodiment, a non-formation area 22 of a wiring pattern exists and a cut area 23 is provided. The cut region 23 has a groove side surface 231 having a maximum dimension width W3 and having an inverted trapezoidal tapered surface, and a V-shaped groove having a maximum dimension width W5 smaller than the inverted trapezoidal bottom dimension width W4 near the bottom center between the groove side faces. 232. The V-shaped groove 232 has the same configuration as in the first embodiment. The cut regions 23 are provided on the front and back surfaces of the multilayer wiring board 21 so as to be aligned with each other, similarly to the first embodiment. The depth D2 × 2 of both cut regions 23 occupies 40 to 60% of the entire laminated wiring board 21. Thus, the laminated wiring board 21 is divided by the bending force at the cut region 23, that is, at the bottom of the V-shaped groove 232.
[0019]
According to the above-described embodiment, the cut region 13 has a two-stage structure as in the first embodiment, and the stress during the bending operation is more concentrated on the V-shaped groove 232 of the second stage. . As a result, it is easy to divide, and the spread of the crack is absorbed by the V-shaped groove 232 of the second stage, and does not enter the inside of the laminated wiring board 21 where the wiring pattern exists.
[0020]
FIG. 3 is a sectional view showing a main part of a mounting board according to a third embodiment of the present invention. In the same multilayer wiring board 31 as in the first embodiment, a non-formed area 32 of a wiring pattern is present and a cut area 33 is provided. The cut area 33 has a maximum dimension width W6, a groove side surface 331 having a gentle slope with rounded corners of a step, and a V having an approximate dimension width W7 also having a rounded corner near the bottom center between the groove side faces. And a groove 332. The cut regions 33 are provided on the front and back surfaces of the multilayer wiring board 31 so as to be aligned with each other, similarly to the first embodiment. The depth D3 × 2 of both cut regions 33 occupies 40 to 60% of the entire laminated wiring board 31. Thus, the multilayer wiring board 31 is divided by the bending force at the cut region 33, that is, at the bottom of the V-shaped groove 332.
[0021]
According to the above-described embodiment, the cut region 33 has a two-stage structure as in the first embodiment, and the stress during the bending operation is more concentrated on the V-shaped groove 332 of the second stage. . As a result, it is easy to divide, and the spread of the crack is absorbed by the V-shaped groove 332 in the second stage, and does not enter the inside of the multilayer wiring board 31 where the wiring pattern exists. In addition, although one of the groove side surfaces 33 of the cut region 33 has a gentle slope, the basic shape may be a square as shown in FIG. 1 and the corner may be rounded.
FIG. 4 shows an application example of the third embodiment, in which the above-described basic shape of the inverted trapezoid is changed to a square as shown in FIG. 1 and the corners are rounded. The same parts as in the third embodiment are denoted by the same reference numerals, and description thereof is omitted.
[0022]
FIG. 5 is a schematic diagram showing a configuration of a semiconductor integrated circuit substrate according to a fourth embodiment of the present invention. In the laminated wiring board 41, a plurality of wiring patterns are overlapped with each other including a connection portion between layers, and a predetermined semiconductor device is mounted on the mounting area S on the exposed surface. In a semiconductor device, each element chip such as a semiconductor integrated circuit chip, a transistor, a resistor, and a capacitor is mounted in a predetermined region. The laminated wiring board 41 has a non-formation area 42 of the wiring pattern for division and a cut area 43 in which a groove is cut as a scribe area. As the cut area 43, for example, any of the cut areas 13, 23, and 33 shown in FIGS. This makes it easy to divide and prevent the crack from spreading, and does not penetrate into the inside of the laminated wiring board 41 where the wiring pattern exists.
[0023]
FIGS. 6A and 6B are schematic views showing a main part of a scribing device according to a fifth embodiment of the present invention. The laminated wiring board 51 is positioned and transported in the scribing device 50. Both cut shapes of a groove side face having a first dimension width and a V-shaped groove having a second dimension width smaller than the first dimension width near the center of the bottom between the groove side faces facing each other from the front and back sides with respect to the divided area. (See FIG. 6 (b)). Thereby, the shape of the cut region 33 as shown in FIG. 3 is realized. The grinder 52 may cut the groove deeper into the front and back surfaces of the laminated wiring board 51 several times to realize the cut region 33 having a desired depth. In addition, if the shape of the grinder 52 is changed, the cut regions 13, 23, and 33 shown in FIGS. 1, 2, and 4 are realized.
[0024]
FIGS. 7A to 7F are cross-sectional shapes of a grinding machine capable of separately giving a cutting shape for a groove side surface and a V-shaped groove. 7A to 7D, 521a to 521d are used for the first groove side surface, and 522a and 522b in FIGS. 7E and 7F are used for the V-shaped groove. According to such a configuration, there is a cut region in which the depth of each of the groove side surface and the V-shaped groove can be easily and freely set.
[0025]
As described above, according to the configuration of each of the above embodiments, the cut region has a two-stage structure. By having the groove side surface having the first dimension width wider than the V-shaped groove at the first stage, the stress at the time of the bending operation is more concentrated on the V-shaped groove at the second stage. As a result, it is easy to divide, and the spread of the crack is absorbed by the V-shaped groove portion of the second stage, and does not enter the inside of the substrate. As a result, the mounting substrate, the semiconductor integrated circuit substrate, and the scribing, which improve the structure of the dividing groove to prevent crack diffusion at the time of dividing, as well as significantly reduce warpage and distortion due to stress in bending operation and obtain high reliability. A device and a semiconductor device using the same can be provided.
[Brief description of the drawings]
FIG. 1 is a sectional view showing a main part of a mounting board according to a first embodiment.
FIG. 2 is a sectional view showing a main part of a mounting board according to a second embodiment.
FIG. 3 is a sectional view showing a main part of a mounting board according to a third embodiment.
FIG. 4 is a sectional view showing a main part of an application example of the third embodiment.
FIG. 5 is a schematic diagram showing a configuration of a semiconductor integrated circuit substrate according to a fourth embodiment.
FIG. 6 is a schematic view showing a main part of a scribing device according to a fifth embodiment.
FIG. 7 is a sectional view of a grinding machine.
[Explanation of symbols]
11, 21, 31, 41, 51: laminated wiring board; 12, 22, 32, 42: non-forming area (scribe area) of wiring pattern; 13, 23, 33: cut area; 131, 231, 331: groove side face , 132, 232, 332 ... V-shaped groove, 50 ... scribing device, 52, 521a-d, 522a, b ... grinding machine.

Claims (10)

A multilayer wiring board having a predetermined planar shape in which wiring patterns of a plurality of layers are stacked including connection portions between the layers,
A V-shape having a groove side face having a first dimension width and a second dimension width smaller than the first dimension width near a center of a bottom between groove side faces in a region where the wiring pattern is not formed in the laminated wiring board; A cut area composed of a groove and
A mounting substrate, comprising: 2. The mounting substrate according to claim 1, wherein the cut region is provided on both sides of the laminated wiring board so that at least bottom portions of the V-shaped grooves face each other. The mounting substrate according to claim 1, wherein the cut region has a shape equivalent to a rectangular short side with respect to the groove side surface. The mounting substrate according to claim 1, wherein the cut region has an inverted trapezoidal tapered surface on the side surface of the groove. The mounting substrate according to claim 1, wherein the cut region has a shape in which a corner of a step forming the groove side surface and the V-shaped groove is rounded. A multilayer wiring board in which a plurality of wiring patterns are stacked including a connection portion between the layers and an exposed surface is a mounting area,
A semiconductor device mounted in the mounting area;
A V-shape having a groove side face having a first dimension width and a second dimension width smaller than the first dimension width near a center of a bottom between groove side faces in a region where the wiring pattern is not formed in the laminated wiring board; A cut area composed of a groove and
A semiconductor integrated circuit substrate, comprising: A groove side face having a first dimension width opposed to the divided region in the laminated wiring board from the front and back, and a V-shaped groove having a second dimension width smaller than the first dimension width near a bottom center between the groove side faces. A scribing device having a grinding machine capable of simultaneously giving both cut shapes. 8. The scribing apparatus according to claim 7, wherein the grinder cuts the groove deeper into the front and back of the laminated wiring board several times. 9. The scribing apparatus according to claim 7, wherein the grinding machine has a shape in which corners of a step forming the groove side surface and the V-shaped groove are rounded. A semiconductor device formed using the mounting substrate according to claim 1.

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