JP2020026374A5 - - Google Patents
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- JP2020026374A5 JP2020026374A5 JP2018152319A JP2018152319A JP2020026374A5 JP 2020026374 A5 JP2020026374 A5 JP 2020026374A5 JP 2018152319 A JP2018152319 A JP 2018152319A JP 2018152319 A JP2018152319 A JP 2018152319A JP 2020026374 A5 JP2020026374 A5 JP 2020026374A5
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- 238000005259 measurement Methods 0.000 description 7
- 239000013078 crystal Substances 0.000 description 4
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018152319A JP7149767B2 (ja) | 2018-08-13 | 2018-08-13 | SiC単結晶の貼合方法、SiCインゴットの製造方法及びSiC単結晶成長用台座 |
| PCT/JP2019/031803 WO2020036167A1 (ja) | 2018-08-13 | 2019-08-13 | SiC単結晶の貼合方法、SiCインゴットの製造方法及びSiC単結晶成長用台座 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018152319A JP7149767B2 (ja) | 2018-08-13 | 2018-08-13 | SiC単結晶の貼合方法、SiCインゴットの製造方法及びSiC単結晶成長用台座 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020026374A JP2020026374A (ja) | 2020-02-20 |
| JP2020026374A5 true JP2020026374A5 (enExample) | 2021-07-26 |
| JP7149767B2 JP7149767B2 (ja) | 2022-10-07 |
Family
ID=69525346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018152319A Active JP7149767B2 (ja) | 2018-08-13 | 2018-08-13 | SiC単結晶の貼合方法、SiCインゴットの製造方法及びSiC単結晶成長用台座 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7149767B2 (enExample) |
| WO (1) | WO2020036167A1 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7433586B2 (ja) * | 2018-08-13 | 2024-02-20 | 株式会社レゾナック | SiC単結晶の加工方法、SiCインゴットの製造方法及びSiC単結晶 |
| EP4060098A1 (de) * | 2021-03-19 | 2022-09-21 | SiCrystal GmbH | Herstellungsverfahren für einen sic-volumeneinkristall inhomogener schraubenversetzungsverteilung und sic-substrat |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6373104A (ja) * | 1986-09-17 | 1988-04-02 | Toshiba Corp | 格子彎曲測定用x線回折装置 |
| JPH07101679B2 (ja) * | 1988-11-01 | 1995-11-01 | 三菱電機株式会社 | 電子デバイス用ウエハ,ウエハ用棒状基材および電子デバイス |
| JP3239884B2 (ja) * | 1989-12-12 | 2001-12-17 | ソニー株式会社 | 半導体基板の製造方法 |
| CN102543718A (zh) * | 2010-12-14 | 2012-07-04 | 北京天科合达蓝光半导体有限公司 | 一种降低碳化硅晶片翘曲度、弯曲度的方法 |
| JP6241254B2 (ja) * | 2013-12-17 | 2017-12-06 | 住友電気工業株式会社 | 単結晶の製造方法 |
| JP6390628B2 (ja) * | 2016-01-12 | 2018-09-19 | トヨタ自動車株式会社 | SiC単結晶の製造方法及び製造装置 |
| JP7433586B2 (ja) * | 2018-08-13 | 2024-02-20 | 株式会社レゾナック | SiC単結晶の加工方法、SiCインゴットの製造方法及びSiC単結晶 |
-
2018
- 2018-08-13 JP JP2018152319A patent/JP7149767B2/ja active Active
-
2019
- 2019-08-13 WO PCT/JP2019/031803 patent/WO2020036167A1/ja not_active Ceased
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