JP2020021800A5 - - Google Patents
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- Publication number
- JP2020021800A5 JP2020021800A5 JP2018143468A JP2018143468A JP2020021800A5 JP 2020021800 A5 JP2020021800 A5 JP 2020021800A5 JP 2018143468 A JP2018143468 A JP 2018143468A JP 2018143468 A JP2018143468 A JP 2018143468A JP 2020021800 A5 JP2020021800 A5 JP 2020021800A5
- Authority
- JP
- Japan
- Prior art keywords
- injection
- rg1b
- sealing material
- region
- injection step
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 1
Description
具体的には、注入工程では、注入装置が、液状の封止材4がs個の排出経路H1aから領域Rg1bへ排出されるように、各貫通孔H1の注入口In1に当該封止材4を注入する。注入工程は、領域Rg1(領域Rg1a,Rg1b)全体に、液状の封止材4が充填されるまで継続して行われる。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018143468A JP7065722B2 (ja) | 2018-07-31 | 2018-07-31 | 半導体装置、電力変換装置及び半導体装置の製造方法 |
US16/447,569 US10861758B2 (en) | 2018-07-31 | 2019-06-20 | Semiconductor device, power conversion apparatus, and method of manufacturing semiconductor device |
DE102019210588.2A DE102019210588A1 (de) | 2018-07-31 | 2019-07-18 | Halbleitervorrichtung, Leistungsumwandlungsgerät und Verfahren zum Herstellen einer Halbleitervorrichtung |
CN201910683205.7A CN110854078B (zh) | 2018-07-31 | 2019-07-26 | 半导体装置、电力变换装置以及半导体装置的制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018143468A JP7065722B2 (ja) | 2018-07-31 | 2018-07-31 | 半導体装置、電力変換装置及び半導体装置の製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2020021800A JP2020021800A (ja) | 2020-02-06 |
JP2020021800A5 true JP2020021800A5 (ja) | 2020-09-10 |
JP7065722B2 JP7065722B2 (ja) | 2022-05-12 |
Family
ID=69168288
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018143468A Active JP7065722B2 (ja) | 2018-07-31 | 2018-07-31 | 半導体装置、電力変換装置及び半導体装置の製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10861758B2 (ja) |
JP (1) | JP7065722B2 (ja) |
CN (1) | CN110854078B (ja) |
DE (1) | DE102019210588A1 (ja) |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09252062A (ja) | 1996-03-18 | 1997-09-22 | Hitachi Ltd | 半導体集積回路装置およびその製造方法 |
JPH11121487A (ja) * | 1997-10-14 | 1999-04-30 | Oki Electric Ind Co Ltd | 半導体素子の樹脂封止装置 |
JPH11297727A (ja) * | 1998-04-10 | 1999-10-29 | Dexter Kk | 半導体チップの樹脂封着用ノズルと光センサーチップの製造方法 |
JP2009147030A (ja) | 2007-12-13 | 2009-07-02 | Panasonic Corp | 半導体装置 |
JP5148445B2 (ja) | 2008-10-06 | 2013-02-20 | シャープ株式会社 | 半導体装置の製造方法及び半導体装置の製造装置 |
JP5056717B2 (ja) | 2008-10-16 | 2012-10-24 | 株式会社デンソー | モールドパッケージの製造方法 |
JP2014082233A (ja) | 2012-10-12 | 2014-05-08 | Sumitomo Electric Ind Ltd | 半導体装置及びその製造方法 |
JP6001473B2 (ja) * | 2013-02-12 | 2016-10-05 | トヨタ自動車株式会社 | 半導体装置の製造方法 |
JP2016025154A (ja) * | 2014-07-17 | 2016-02-08 | 三菱電機株式会社 | 高耐電圧樹脂封止型半導体装置及び金型 |
-
2018
- 2018-07-31 JP JP2018143468A patent/JP7065722B2/ja active Active
-
2019
- 2019-06-20 US US16/447,569 patent/US10861758B2/en active Active
- 2019-07-18 DE DE102019210588.2A patent/DE102019210588A1/de active Pending
- 2019-07-26 CN CN201910683205.7A patent/CN110854078B/zh active Active
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