JP2020015307A - 基材相溶化粒子を用いた新規接着剤 - Google Patents
基材相溶化粒子を用いた新規接着剤 Download PDFInfo
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- JP2020015307A JP2020015307A JP2019120881A JP2019120881A JP2020015307A JP 2020015307 A JP2020015307 A JP 2020015307A JP 2019120881 A JP2019120881 A JP 2019120881A JP 2019120881 A JP2019120881 A JP 2019120881A JP 2020015307 A JP2020015307 A JP 2020015307A
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- Prior art keywords
- particles
- substrates
- adhesive
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- 239000000853 adhesive Substances 0.000 claims description 51
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 27
- 229910021389 graphene Inorganic materials 0.000 claims description 24
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- 239000000126 substance Substances 0.000 claims description 13
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- 125000003700 epoxy group Chemical group 0.000 claims description 7
- 229910052729 chemical element Inorganic materials 0.000 claims description 6
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- 229920002430 Fibre-reinforced plastic Polymers 0.000 claims description 5
- 239000000395 magnesium oxide Substances 0.000 claims description 5
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 5
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 5
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- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
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- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
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- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
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- 229910052749 magnesium Inorganic materials 0.000 claims 1
- 239000011777 magnesium Substances 0.000 claims 1
- 238000001259 photo etching Methods 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims 1
- 238000010168 coupling process Methods 0.000 abstract description 7
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- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 4
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- 238000005299 abrasion Methods 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 125000004067 aliphatic alkene group Chemical group 0.000 description 1
- VRAIHTAYLFXSJJ-UHFFFAOYSA-N alumane Chemical compound [AlH3].[AlH3] VRAIHTAYLFXSJJ-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical group C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 1
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- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
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- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
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- 239000002608 ionic liquid Substances 0.000 description 1
- HZZOEADXZLYIHG-UHFFFAOYSA-N magnesiomagnesium Chemical compound [Mg][Mg] HZZOEADXZLYIHG-UHFFFAOYSA-N 0.000 description 1
- 238000003760 magnetic stirring Methods 0.000 description 1
- 238000010907 mechanical stirring Methods 0.000 description 1
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- 230000003647 oxidation Effects 0.000 description 1
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- 238000003825 pressing Methods 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 238000007655 standard test method Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 238000006557 surface reaction Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- NMJKIRUDPFBRHW-UHFFFAOYSA-N titanium Chemical compound [Ti].[Ti] NMJKIRUDPFBRHW-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C09J5/04—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving separate application of adhesive ingredients to the different surfaces to be joined
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- C—CHEMISTRY; METALLURGY
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J1/00—Adhesives based on inorganic constituents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
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- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
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- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
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- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
- B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
- B29C65/485—Multi-component adhesives, i.e. chemically curing as a result of the mixing of said multi-components
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
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- Chemical & Material Sciences (AREA)
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- Laminated Bodies (AREA)
Abstract
Description
Claims (20)
- 一対の結合基材であって、
第一材料の第一基材と、
前記第一材料の第二基材と、及び
前記第一基材と前記第二基材を結合する接着剤であって、前記第一及び第二基材と相溶性のある化学結合相溶化粒子を有する、接着剤と、を含む、一対の結合基材。 - 前記化学結合相溶化粒子が対応する前記第一及び第二基材に類似している化学元素を有する粒子を含む、請求項1に記載の一対の結合基材。
- 前記化学結合相溶化粒子が前記第一及び第二基材の熱機械的特性に一致する熱機械的特性を有する粒子を含む、請求項1に記載の一対の結合基材。
- 前記化学結合粒子が前記第一材料の金属酸化物からなる粒子を含む、請求項1に記載の一対の結合基材。
- 前記第一材料が炭素繊維強化ポリマー(CFRP)からなり、かつ前記粒子が酸化グラフェン官能化粒子又はグラフェン官能化粒子のいずれかからなる、請求項1に記載の一対の結合基材。
- 前記第一材料がアルミニウムからなり、かつ前記粒子が酸化アルミニウムからなる、請求項1に記載の一対の結合基材。
- 前記第一材料がガラス繊維強化ポリマー(FRP)又はガラスのいずれかからなり、前記粒子が酸化ケイ素からなる、請求項1に記載の一対の結合基材。
- 前記第一材料がチタンからなり、かつ前記粒子が酸化チタンからなる、請求項1に記載の一対の結合基材。
- 前記第一材料がマグネシウムからなり、かつ前記粒子が酸化マグネシウムからなる、請求項1に記載の一対の結合基材。
- 前記相溶化粒子がエポキシ基で表面が官能化され、かつリンカー材料がアミノ基又はエポキシ基のいずれかを含む、請求項1に記載の一対の結合基材。
- 前記相溶化粒子がビニル結合で表面が官能化され、かつリンカー材料がビニル基を含む、請求項1に記載の一対の結合基材。
- 第一基材と第二基材との間に結合を形成する化学結合粒子ネットワークを有する接着剤であって、前記粒子ネットワーク中の相溶化粒子は前記第一及び第二基材と相溶性がある、接着剤を含む、組成物。
- 前記化学結合粒子が、対応する前記第一及び第二基材に類似している化学元素を有する粒子を含む、請求項12に記載の組成物。
- 前記化学結合粒子が前記第一及び第二基材の熱機械的特性に一致する熱機械的特性を有する粒子を含む、請求項12に記載の組成物。
- 前記化学結合粒子が前記第一材料の金属酸化物からなる粒子を含む、請求項12に記載の組成物。
- 前記相溶化粒子がエポキシ基で表面が官能化され、かつリンカー材料がアミノ基又はエポキシ基のいずれかを含む、請求項12に記載の組成物。
- 前記相溶化粒子がビニル結合で表面が官能化され、かつリンカー物質がビニル基を含む、請求項12に記載の組成物。
- 同一材料の二つの構造を接合する方法であって、
第一構造及び第二構造を製造することによってベア材を露出させることと、
前記第一及び第二構造上で前記ベア材に接着剤を塗布し、前記接着剤が前記ベア材と相溶性がある相溶化粒子を含み、かつ前記製造によって前記ベア材と前記相溶化粒子との相互作用を可能にすることと、
二つの基材を結合することと、及び
前記接着剤を硬化させることと、を含む、方法。 - 前記第一及び第二構造を製造することが、前記接着剤が適用される前記第一及び第二構造の一部の機械的な摩耗を含む、請求項18に記載の方法。
- 前記第一及び第二構造を製造することが、前記接着剤が適用される前記第一及び第二構造の一部のエッチングを含み、前記エッチングが化学エッチング、電気化学陽極酸化、UV/オゾン処理による光化学エッチング、又はプラズマエッチングであってもよい、請求項18に記載の方法。
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KR20050040275A (ko) | 2003-10-28 | 2005-05-03 | 삼성전자주식회사 | 절연막 형성용 조성물 및 이를 이용한 절연막 또는 절연막패턴의 형성방법 |
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WO2013080708A1 (ja) * | 2011-11-29 | 2013-06-06 | 東レ株式会社 | 樹脂組成物、樹脂組成物シート、半導体装置およびその製造方法 |
JP2017532409A (ja) * | 2014-05-29 | 2017-11-02 | アダマ・マテリアルズ・インコーポレーテッド | オリゴマーグラフトナノフィラーを含む積層体、および先進複合材料 |
JP2017535447A (ja) * | 2014-09-22 | 2017-11-30 | サイテック インダストリーズ インコーポレイテッド | 高いz方向電気伝導率をもつ複合材料 |
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US20200024494A1 (en) | 2020-01-23 |
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