JP2019536660A5 - - Google Patents
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- Publication number
- JP2019536660A5 JP2019536660A5 JP2019517917A JP2019517917A JP2019536660A5 JP 2019536660 A5 JP2019536660 A5 JP 2019536660A5 JP 2019517917 A JP2019517917 A JP 2019517917A JP 2019517917 A JP2019517917 A JP 2019517917A JP 2019536660 A5 JP2019536660 A5 JP 2019536660A5
- Authority
- JP
- Japan
- Prior art keywords
- adhesive layer
- circuit board
- printed
- printed circuit
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012790 adhesive layer Substances 0.000 claims 11
- 238000000034 method Methods 0.000 claims 6
- 239000004020 conductor Substances 0.000 claims 2
- 239000010410 layer Substances 0.000 claims 2
- 230000001737 promoting effect Effects 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP16192224 | 2016-10-04 | ||
| EP16192224.0 | 2016-10-04 | ||
| PCT/EP2017/074990 WO2018065369A1 (en) | 2016-10-04 | 2017-10-02 | 3d printing method and product |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2019536660A JP2019536660A (ja) | 2019-12-19 |
| JP2019536660A5 true JP2019536660A5 (enExample) | 2020-11-12 |
Family
ID=57068017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019517917A Pending JP2019536660A (ja) | 2016-10-04 | 2017-10-02 | ３ｄ印刷方法及び製品 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20200045832A1 (enExample) |
| EP (1) | EP3523114A1 (enExample) |
| JP (1) | JP2019536660A (enExample) |
| CN (1) | CN109803810B (enExample) |
| WO (1) | WO2018065369A1 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110421839B (zh) * | 2019-07-26 | 2021-09-28 | 成都职业技术学院 | 基于3d打印的二极管及其打印方法 |
| CN110481013B (zh) * | 2019-09-27 | 2024-11-26 | 西安增材制造国家研究院有限公司 | 一种大尺寸防翘曲易取件聚合物三维打印底板及打印方法 |
| EP4144192A4 (en) * | 2020-04-30 | 2024-09-04 | Dujud LLC | METHODS AND PROCESSES FOR FORMING ELECTRICAL CIRCUITS ON THREE-DIMENSIONAL GEOMETRIES |
| CN114126242B (zh) * | 2021-10-20 | 2022-05-20 | 哈尔滨工业大学（威海） | 一种3d打印共形电路制备方法 |
| WO2025191863A1 (ja) * | 2024-03-15 | 2025-09-18 | 株式会社Fuji | 印刷装置、情報処理装置、印刷システム、製造方法及び情報処理方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6549821B1 (en) * | 1999-02-26 | 2003-04-15 | Micron Technology, Inc. | Stereolithographic method and apparatus for packaging electronic components and resulting structures |
| GB0323462D0 (en) * | 2003-10-07 | 2003-11-05 | Fujifilm Electronic Imaging | Providing a surface layer or structure on a substrate |
| CN1329179C (zh) * | 2004-07-12 | 2007-08-01 | 英华达股份有限公司 | 结合柱的热压方法 |
| US8491830B2 (en) * | 2008-07-11 | 2013-07-23 | Eoplex Limited | Boundary configurations for multi-material print-forming |
| US9099575B2 (en) * | 2013-07-16 | 2015-08-04 | Cree, Inc. | Solid state lighting devices and fabrication methods including deposited light-affecting elements |
| EP2916151B1 (en) * | 2014-03-05 | 2020-01-01 | Corning Optical Communications LLC | Method of forming a fiber coupling device |
| DE102014110156A1 (de) * | 2014-07-18 | 2016-01-21 | Harting Electric Gmbh & Co. Kg | Verfahren zur Bereitstellung von Daten |
| US10449698B2 (en) * | 2014-08-22 | 2019-10-22 | Omron Corporation | Bonded structure and method for producing bonded structure |
| CN204674026U (zh) * | 2015-04-16 | 2015-09-30 | 江苏比微曼智能科技有限公司 | 柔性电路板板起料落料装置 |
| DE102015115796A1 (de) * | 2015-09-18 | 2017-03-23 | Osram Opto Semiconductors Gmbh | Verfahren zum Ausbilden eines oder mehrerer dreidimensionaler Objekte |
-
2017
- 2017-10-02 CN CN201780061654.7A patent/CN109803810B/zh not_active Expired - Fee Related
- 2017-10-02 JP JP2019517917A patent/JP2019536660A/ja active Pending
- 2017-10-02 US US16/339,046 patent/US20200045832A1/en not_active Abandoned
- 2017-10-02 EP EP17784235.8A patent/EP3523114A1/en not_active Withdrawn
- 2017-10-02 WO PCT/EP2017/074990 patent/WO2018065369A1/en not_active Ceased
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