JP2019532165A - 速硬化性光学接着剤 - Google Patents

速硬化性光学接着剤 Download PDF

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Publication number
JP2019532165A
JP2019532165A JP2019535190A JP2019535190A JP2019532165A JP 2019532165 A JP2019532165 A JP 2019532165A JP 2019535190 A JP2019535190 A JP 2019535190A JP 2019535190 A JP2019535190 A JP 2019535190A JP 2019532165 A JP2019532165 A JP 2019532165A
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JP
Japan
Prior art keywords
adhesive
adhesive composition
silica
epoxy resin
epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2019535190A
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English (en)
Japanese (ja)
Other versions
JP2019532165A5 (https=
Inventor
ウェンディ エル． トンプソン，
ウェンディ エル． トンプソン，
ウェイン エス． マホーニー，
ウェイン エス． マホーニー，
ドナルド ケー． ラーション，
ドナルド ケー． ラーション，
ダニエル ジェイ． トレッドウェル，
ダニエル ジェイ． トレッドウェル，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
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3M Innovative Properties Co
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Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2019532165A publication Critical patent/JP2019532165A/ja
Publication of JP2019532165A5 publication Critical patent/JP2019532165A5/ja
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/255—Splicing of light guides, e.g. by fusion or bonding
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/264—Optical coupling means with optical elements between opposed fibre ends which perform a function other than beam splitting
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/01—Hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/02—Halogenated hydrocarbons
    • C08K5/03—Halogenated hydrocarbons aromatic, e.g. C6H5-CH2-Cl
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/07—Aldehydes; Ketones
    • C08K5/08—Quinones

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
JP2019535190A 2016-09-14 2017-09-06 速硬化性光学接着剤 Pending JP2019532165A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201662394562P 2016-09-14 2016-09-14
US62/394,562 2016-09-14
US201762541864P 2017-08-07 2017-08-07
US62/541,864 2017-08-07
PCT/US2017/050255 WO2018052777A1 (en) 2016-09-14 2017-09-06 Fast curing optical adhesive

Publications (2)

Publication Number Publication Date
JP2019532165A true JP2019532165A (ja) 2019-11-07
JP2019532165A5 JP2019532165A5 (https=) 2020-10-15

Family

ID=59895406

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019535190A Pending JP2019532165A (ja) 2016-09-14 2017-09-06 速硬化性光学接着剤

Country Status (4)

Country Link
US (1) US10329460B2 (https=)
JP (1) JP2019532165A (https=)
CN (1) CN109689826B (https=)
WO (1) WO2018052777A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021531389A (ja) * 2018-07-25 2021-11-18 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング 高速硬化エポキシアクリル液体シム

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US10386589B2 (en) 2017-02-01 2019-08-20 3M Innovation Properties Company Hybrid cable-to-board connector
CN212915694U (zh) 2017-08-11 2021-04-09 3M创新有限公司 用于拼接多根第一光纤和多根第二光纤的多光纤拼接装置
CN212460103U (zh) 2017-10-18 2021-02-02 3M创新有限公司 光纤连接系统
WO2019077471A1 (en) 2017-10-18 2019-04-25 3M Innovative Properties Company FIBER OPTIC CONNECTION SYSTEM
US10324260B1 (en) 2018-10-15 2019-06-18 Corning Research & Development Corporation Optical assembly using low DN/DT optical adhesive
US20230242774A1 (en) * 2020-06-01 2023-08-03 Polymer Gvulot Ltd A photopolymer epoxy composition and a photoinitiator for curing same
WO2023039916A1 (en) * 2021-09-19 2023-03-23 Dow Global Technologies Llc Cure of anhydride functionalized polymers with multifunctional epoxy compounds or oxetane compounds
CN121773366A (zh) * 2023-09-06 2026-03-31 3M创新有限公司 光学套圈组件和光学粘合剂制剂
WO2025086130A1 (en) * 2023-10-25 2025-05-01 Henkel Ag & Co. Kgaa Radiation curable epoxy-based composition
CN118006268B (zh) * 2024-02-02 2024-10-29 广东弘擎电子材料科技有限公司 一种蓝光波段光固化环氧密封胶及其制备方法
CN120010187B (zh) * 2025-04-19 2025-11-28 河南师范大学 一种基于飞秒激光双光子聚合的pdms光刻胶的制备方法及应用

Citations (5)

* Cited by examiner, † Cited by third party
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JP2000297263A (ja) * 1999-02-12 2000-10-24 Shiima Denshi Kk 高密度半導体用の接着剤
JP2005523348A (ja) * 2002-01-15 2005-08-04 スリーエム イノベイティブ プロパティズ カンパニー カチオン重合性樹脂のための三元光開始剤システム
JP2009540060A (ja) * 2006-06-09 2009-11-19 スリーエム イノベイティブ プロパティズ カンパニー 流動性接着剤組成物を用いた結着方法
WO2011045855A1 (ja) * 2009-10-15 2011-04-21 株式会社アシックス レーザー接着用ゴム部材、及びシューズ
JP2012074623A (ja) * 2010-09-29 2012-04-12 Sekisui Chem Co Ltd 半導体加工用接着フィルム及び半導体チップ実装体の製造方法

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US4900125A (en) 1988-07-21 1990-02-13 Abbott Laboratories Optical coupling method
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US5648407A (en) 1995-05-16 1997-07-15 Minnesota Mining And Manufacturing Company Curable resin sols and fiber-reinforced composites derived therefrom
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US5998495A (en) 1997-04-11 1999-12-07 3M Innovative Properties Company Ternary photoinitiator system for curing of epoxy/polyol resin compositions
US6187836B1 (en) 1998-06-05 2001-02-13 3M Innovative Properties Company Compositions featuring cationically active and free radically active functional groups, and methods for polymerizing such compositions
US6196730B1 (en) * 1998-06-22 2001-03-06 3M Innovative Properties Company Fiber optic connector containing a curable adhesive composition
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US6395124B1 (en) 1999-07-30 2002-05-28 3M Innovative Properties Company Method of producing a laminated structure
JP4907821B2 (ja) 1999-12-07 2012-04-04 スリーエム イノベイティブ プロパティズ カンパニー 加水分解性ハロゲン化物および他の高分子量材料を含有する材料をエピハロヒドリン誘導エポキシ樹脂から除去する方法
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KR20100056452A (ko) * 2007-08-09 2010-05-27 코니카 미놀타 옵토 인코포레이티드 광학용 수지 재료 및 그것을 사용한 광학 소자
US8394977B2 (en) 2008-03-28 2013-03-12 3M Innovative Properties Company Process for the surface modification of particles
WO2009152296A1 (en) 2008-06-12 2009-12-17 3M Innovative Properties Company End-capped curable resin sols
TWI443169B (zh) * 2008-10-24 2014-07-01 Cheil Ind Inc 黏著劑組成物以及光學零件
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Patent Citations (5)

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Publication number Priority date Publication date Assignee Title
JP2000297263A (ja) * 1999-02-12 2000-10-24 Shiima Denshi Kk 高密度半導体用の接着剤
JP2005523348A (ja) * 2002-01-15 2005-08-04 スリーエム イノベイティブ プロパティズ カンパニー カチオン重合性樹脂のための三元光開始剤システム
JP2009540060A (ja) * 2006-06-09 2009-11-19 スリーエム イノベイティブ プロパティズ カンパニー 流動性接着剤組成物を用いた結着方法
WO2011045855A1 (ja) * 2009-10-15 2011-04-21 株式会社アシックス レーザー接着用ゴム部材、及びシューズ
JP2012074623A (ja) * 2010-09-29 2012-04-12 Sekisui Chem Co Ltd 半導体加工用接着フィルム及び半導体チップ実装体の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021531389A (ja) * 2018-07-25 2021-11-18 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング 高速硬化エポキシアクリル液体シム
JP7259006B2 (ja) 2018-07-25 2023-04-17 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 高速硬化エポキシアクリル液体シム

Also Published As

Publication number Publication date
WO2018052777A1 (en) 2018-03-22
US10329460B2 (en) 2019-06-25
CN109689826A (zh) 2019-04-26
US20180072924A1 (en) 2018-03-15
CN109689826B (zh) 2021-10-29

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