JP2019523557A - 回路基板アセンブリ - Google Patents
回路基板アセンブリ Download PDFInfo
- Publication number
- JP2019523557A JP2019523557A JP2019504046A JP2019504046A JP2019523557A JP 2019523557 A JP2019523557 A JP 2019523557A JP 2019504046 A JP2019504046 A JP 2019504046A JP 2019504046 A JP2019504046 A JP 2019504046A JP 2019523557 A JP2019523557 A JP 2019523557A
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- Prior art keywords
- circuit board
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- board assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000000926 separation method Methods 0.000 claims abstract description 60
- 239000003566 sealing material Substances 0.000 claims abstract description 16
- 239000008393 encapsulating agent Substances 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 37
- 239000011888 foil Substances 0.000 claims description 10
- 238000005520 cutting process Methods 0.000 claims description 8
- 239000004033 plastic Substances 0.000 claims description 6
- 229920003023 plastic Polymers 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 5
- 238000003801 milling Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims 1
- 239000000463 material Substances 0.000 description 25
- 238000004382 potting Methods 0.000 description 12
- 238000004458 analytical method Methods 0.000 description 6
- 230000000712 assembly Effects 0.000 description 6
- 238000000429 assembly Methods 0.000 description 6
- 230000007547 defect Effects 0.000 description 3
- 230000009897 systematic effect Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- ORQBXQOJMQIAOY-UHFFFAOYSA-N nobelium Chemical compound [No] ORQBXQOJMQIAOY-UHFFFAOYSA-N 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/288—Removal of non-metallic coatings, e.g. for repairing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0091—Housing specially adapted for small components
- H05K5/0095—Housing specially adapted for small components hermetically-sealed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
10、11、12 回路基板領域
101 回路基板のフレキシブル領域
102 電気接続素子
2 電気部品
3 コネクタ
4 封止材
5 分離素子
6 ヒートシンク
L 長さ
B 幅
F 露出
T‐T 分離面
Claims (10)
- 部品(2、3)が実装されて積み重ねられた又は折りたたまれた少なくとも1つの回路基板を備える回路基板アセンブリ(1)であって、回路基板領域(10、11、12)は、対向し、前記回路基板領域(10、11、12)の縁部領域のうちの少なくとも1つの縁部領域で電気的に相互に接続され、前記回路基板及び前記部品(2、3)が封止材(4)で包囲され、少なくとも1つの分離素子(5)は、前記封止材(4)の内部で、電気的に相互に接続された対向する2つの回路基板領域(10、11、12)のそれぞれの間に配置されている回路基板アセンブリ(1)。
- 請求項1に記載の回路基板アセンブリ(1)であって、前記分離素子(5)が完全に前記封止材(4)中に埋め込まれている回路基板アセンブリ(1)。
- 請求項1又は2に記載の回路基板アセンブリ(1)であって、前記回路基板が折りたたまれた回路基板であり、前記回路基板領域(10、11)が、フレキシブル回路基板領域(101)を用いて、電気的に相互に接続されている回路基板アセンブリ(1)。
- 請求項3に記載の回路基板アセンブリ(1)であって、前記フレキシブル回路基板領域(101)が、前記回路基板から深く削られた領域である回路基板アセンブリ(1)。
- 請求項1〜4の何れか一項に記載の回路基板アセンブリ(1)であって、前記回路基板が折りたたまれた回路基板であり、前記回路基板領域(10、11、12)がそれぞれ電気接続素子(102)を用いて、前記回路基板領域(10、11、12)の縁部領域のうちの少なくとも1つの縁部領域で電気的に相互に接続されている回路基板アセンブリ(1)。
- 請求項1〜5の何れか一項に記載の回路基板アセンブリ(1)であって、前記分離素子(5)が、中空体と、2つのプラスチック部分又は2つの隣接する箔と、を備える回路基板アセンブリ(1)。
- 請求項1〜6の何れか一項に記載の回路基板アセンブリ(1)であって、前記回路基板アセンブリ(1)が、積み重ねられた回路基板及び折りたたまれた回路基板を備える回路基板アセンブリ(1)。
- 請求項1〜7の何れか一項に記載の回路基板アセンブリ(1)の回路基板領域(10、11、12)を分離する方法であって、前記回路基板領域(10、11、12)を分離するために、分離素子(5)を分離面(T‐T)に沿って分割するステップ(S1)と、前記分離素子(5)によって分離させた前記回路基板(10、11、12)をアプローチ可能とするステップ(S2)と、を含む方法。
- 請求項8に記載の方法であって、前記分離素子(5)の分割を、レーザ方法、フライス方法、又は切断方法を用いて行なう方法。
- 請求項8又は9に記載の方法であって、回路基板上で前記分離素子(5)に向いた部品(2、3)を、レーザ方法又は化学的方法又はそれらの組み合わせを用いて露出(F)させるステップ(S3)を含む方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102016213697.6A DE102016213697A1 (de) | 2016-07-26 | 2016-07-26 | Leiterplattenanordnung |
DE102016213697.6 | 2016-07-26 | ||
PCT/EP2017/065685 WO2018019500A1 (de) | 2016-07-26 | 2017-06-26 | Leiterplattenanordnung |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019523557A true JP2019523557A (ja) | 2019-08-22 |
JP6990693B2 JP6990693B2 (ja) | 2022-01-12 |
Family
ID=59285162
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019504046A Active JP6990693B2 (ja) | 2016-07-26 | 2017-06-26 | 回路基板アセンブリ |
Country Status (5)
Country | Link |
---|---|
US (1) | US10856419B2 (ja) |
JP (1) | JP6990693B2 (ja) |
CN (1) | CN109479376A (ja) |
DE (1) | DE102016213697A1 (ja) |
WO (1) | WO2018019500A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3534121B1 (de) * | 2018-03-02 | 2021-01-27 | Dr. Johannes Heidenhain GmbH | Multiturn-drehgeber |
GB201910805D0 (en) * | 2019-07-29 | 2019-09-11 | Leonardo Mw Ltd | Circuit board assembly |
CN114554718B (zh) * | 2022-03-21 | 2023-10-24 | 四川九洲空管科技有限责任公司 | 一种安装板置于外壳内只露插针的灌封工艺 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006234985A (ja) * | 2005-02-22 | 2006-09-07 | Sumitomo Bakelite Co Ltd | 光導波路形成基板 |
JP2009081325A (ja) * | 2007-09-27 | 2009-04-16 | Sanyo Electric Co Ltd | 回路装置 |
US20150098196A1 (en) * | 2012-05-18 | 2015-04-09 | Advanced Bionics Ag | Printed circuit board apparatus and methods of making the same |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1458965A (en) | 1972-12-20 | 1976-12-22 | Hawker Siddeley Dynamics Ltd | Protection of boards carrying components especially electrical circuit boards carrying electronic components |
US4729062A (en) | 1986-06-16 | 1988-03-01 | Hughes Aircraft Company | Reworkable encapsulated electronic assembly |
US6303860B1 (en) * | 1999-11-30 | 2001-10-16 | Bombardier Motor Corporation Of America | Bladder insert for encapsulant displacement |
CN100459123C (zh) * | 2005-09-08 | 2009-02-04 | 南茂科技股份有限公司 | 堆叠型芯片封装结构、芯片封装体及其制造方法 |
US20070158799A1 (en) * | 2005-12-29 | 2007-07-12 | Chin-Tien Chiu | Interconnected IC packages with vertical SMT pads |
DE102008016133B4 (de) * | 2008-03-28 | 2013-12-19 | Continental Automotive Gmbh | Leiterplatte und Verfahren zum Herstellen einer Leiterplatte |
DE102011105346A1 (de) * | 2011-06-21 | 2012-12-27 | Schweizer Electronic Ag | Elektronische Baugruppe und Verfahren zu deren Herstellung |
DE102012214721A1 (de) * | 2012-08-20 | 2014-02-20 | Zf Friedrichshafen Ag | Verfahren zum Herstellen einer dreidimensionalen Leiterplattenanordnung und dreidimensionale Leiterplattenanordnung |
DE102013209296B4 (de) * | 2013-05-21 | 2024-04-18 | Vitesco Technologies GmbH | Elektronisches Modul, insbesondere Steuergerät für ein Fahrzeug |
EP2882268A1 (de) | 2013-12-05 | 2015-06-10 | Taurob GmbH | Schutz von Elektronik |
EP2911486B1 (en) * | 2014-02-19 | 2024-07-31 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | PCB-based connector device |
US9841548B2 (en) * | 2015-06-30 | 2017-12-12 | Apple Inc. | Electronic devices with soft input-output components |
CN105390477B (zh) * | 2015-12-11 | 2018-08-17 | 苏州捷研芯纳米科技有限公司 | 一种多芯片3d二次封装半导体器件及其封装方法 |
-
2016
- 2016-07-26 DE DE102016213697.6A patent/DE102016213697A1/de active Pending
-
2017
- 2017-06-26 US US16/320,815 patent/US10856419B2/en active Active
- 2017-06-26 CN CN201780043238.4A patent/CN109479376A/zh active Pending
- 2017-06-26 JP JP2019504046A patent/JP6990693B2/ja active Active
- 2017-06-26 WO PCT/EP2017/065685 patent/WO2018019500A1/de active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006234985A (ja) * | 2005-02-22 | 2006-09-07 | Sumitomo Bakelite Co Ltd | 光導波路形成基板 |
JP2009081325A (ja) * | 2007-09-27 | 2009-04-16 | Sanyo Electric Co Ltd | 回路装置 |
US20150098196A1 (en) * | 2012-05-18 | 2015-04-09 | Advanced Bionics Ag | Printed circuit board apparatus and methods of making the same |
Also Published As
Publication number | Publication date |
---|---|
DE102016213697A1 (de) | 2018-02-01 |
WO2018019500A1 (de) | 2018-02-01 |
CN109479376A (zh) | 2019-03-15 |
US20190174628A1 (en) | 2019-06-06 |
JP6990693B2 (ja) | 2022-01-12 |
US10856419B2 (en) | 2020-12-01 |
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