JP2019522114A - 湿式加工システムのためのワークピースローダ - Google Patents
湿式加工システムのためのワークピースローダ Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/005—Contacting devices
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- Condensed Matter Physics & Semiconductors (AREA)
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Abstract
Description
本願は、参照によってそのすべての内容が本明細書に組み込まれる、2016年6月27日出願の米国特許出願第15/193,890号に関するものであり、またその優先権を主張するものである。
107 ワークピースホルダ
115a 平行板
115b 平行板
116 ガス出口
119 リフトピン
121 ワークピースコンベア
127 締付け機構
W ワークピース
Claims (20)
- ワークピースを処理するための装置であって、
平行板を有するローダモジュールを備えており、前記平行板は、互いを向いた平面状表面を有し、前記平行板の各平面状表面はガス出口の配列を含み、前記ローダモジュールは、対向する平面状表面を有するワークピースを受容するように構成され、前記ローダモジュールは、前記ワークピースを前記ローダモジュールの前記平行板の間に配置するように構成され、それにより、前記ワークピースの前記対向する平面状表面が前記平行板の前記平面状表面に面し、
前記平行板の各々は、前記ワークピースを前記平行板の平面状表面と接触させることなく、前記ワークピースを平坦化し、且つ前記ワークピースを前記平行板の間に保持するのに十分なエアクッションを供給するように構成され、
前記ローダモジュールはワークピースホルダと位置合わせされるように構成され、前記ワークピースホルダは、前記ローダモジュールが前記ワークピースを運搬しているときに前記ワークピースの対向する縁部を受容するために十分に開放されるように構成された締付け機構を含み、
前記締付け機構は、前記ワークピースの縁部において前記ワークピースの前記対向する平面状表面上で閉鎖するように構成され、そのため、前記ワークピースは前記ワークピースホルダの第1の脚部材と第2の脚部材との間に保持され、
前記ワークピースホルダは前記ローダモジュールから分離されるように構成されている装置。 - 前記ローダモジュールは、前記エアクッションを供給するために、前記平行板の各平面状表面のガス出口の前記配列を通じてガスを流動させるように構成される、請求項1に記載の装置。
- 前記平行板の各平面状表面のガス出口の前記配列は、前記ワークピースを2ミリメートル未満の撓曲へと平坦化するために十分な空気圧を供給するように構成され、前記ワークピースは軟質ワークピースである、請求項2に記載の装置。
- 前記平行板は、前記ワークピースのワークピース幅よりも短いプレート幅を有し、そのため、前記ワークピースが前記ローダモジュール内に配置されたとき、前記ワークピースの前記対向する縁部は各平行板の対向する縁部を越えて延びる、請求項1に記載の装置。
- 前記ローダモジュールは、前記エアクッションを供給するときに、前記平行板の間の距離を短縮するように構成され、前記平行板は、前記平行板のワークピース受容縁部上に配置された支持体を含み、前記平行板の間の所定の間隙距離を維持するように構成される、請求項1に記載の装置。
- 前記ローダモジュール内の前記ワークピースと整列するように構成された空気圧バンパをさらに備える、請求項1に記載の装置。
- 前記ローダモジュールは、旋回され、且つ前記ワークピースを垂直位置に保持し、前記ワークピースホルダと位置合わせされるように構成される、請求項1に記載の装置。
- 所与の平行板を通じて突出するように構成された複数のリフトピンをさらに備え、前記複数のリフトピンは、前記平行板の間に前記ワークピースを受容し、前記エアクッションを供給するときに前記ワークピースとの接触から外されるように配置される、請求項1に記載の装置。
- 前記締付け機構を開放するように配置可能な空気圧ブラダをさらに備え、前記締付け機構は、前記ローダモジュールを前記ワークピースホルダと位置合わせするのに先立って開放されるように構成される、請求項1に記載の装置。
- 前記ワークピースホルダは、ヘッダ部材内にテンショナを含み、前記ヘッダ部材は前記ワークピースホルダの第1の脚部材と第2の脚部材とを結合し、前記テンショナは、前記締付け機構の閉鎖に先立って、圧縮力を受容するように構成され、前記テンショナは、前記締付け機構が前記ワークピース上で閉鎖した後に、前記ワークピースに引張力を及ぼすように構成される、請求項1に記載の装置。
- 前記締付け機構は、各々が弾性締付け機構を有する前記第1の脚部材と前記第2の脚部材を含む、請求項1に記載の装置。
- 前記弾性締付け機構は対向する軟質部材を含み、前記対向する軟質部材は、互いに対して対向する締付け力をもたらすように装着される、請求項11に記載の装置。
- 前記ローダモジュールは、前記ワークピースが位置合わせされているときに、前記ワークピースの少なくとも1つの縁部を支持するように配置された縁部支持部材を含む、請求項1に記載の装置。
- 前記締付け機構は、導電性である締付け接点を含み、前記締付け接点は周囲シールを含み、そのため、前記締付け機構が前記ワークピース上で閉鎖されたとき、前記周囲シールが前記締付け接点を液体の侵入に対してシールする、請求項1に記載の装置。
- 前記締付け機構を閉鎖するために収縮されるように構成された空気圧ブラダをさらに備える、請求項1に記載の装置。
- 前記ローダモジュールは、前記ワークピースを前記ローダモジュール内へと機械的に移動させるように構成されたコンベアを介して、前記平行板の間に前記ワークピースを受容させるように構成される、請求項1に記載の装置。
- 前記ローダモジュールは、前記ワークピースを前記ローダモジュール内へと機械的に移動させるように構成されたエアのクッションを介して、前記平行板の間に前記ワークピースを受容させるように構成される、請求項1に記載の装置。
- 前記ワークピースは、4ミリメートル未満の厚さを有する矩形の薄型パネルである、請求項1に記載の装置。
- 前記ワークピースホルダは、前記ローダモジュールから上向きに持ち上げられるように構成される、請求項1に記載の装置。
- 前記平行板は、前記ワークピースホルダを前記ローダモジュールから持ち上げるときに、互いから分離されるように構成される、請求項19に記載の装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/193,890 | 2016-06-27 | ||
US15/193,890 US10074554B2 (en) | 2016-06-27 | 2016-06-27 | Workpiece loader for a wet processing system |
PCT/US2017/038188 WO2018005154A1 (en) | 2016-06-27 | 2017-06-19 | Workpiece loader for a wet processing system |
Publications (2)
Publication Number | Publication Date |
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JP2019522114A true JP2019522114A (ja) | 2019-08-08 |
JP7001625B2 JP7001625B2 (ja) | 2022-01-19 |
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Application Number | Title | Priority Date | Filing Date |
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JP2018569097A Active JP7001625B2 (ja) | 2016-06-27 | 2017-06-19 | 湿式加工システムのためのワークピースローダ |
Country Status (7)
Country | Link |
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US (1) | US10074554B2 (ja) |
JP (1) | JP7001625B2 (ja) |
KR (1) | KR102154994B1 (ja) |
CN (1) | CN109690752A (ja) |
DE (1) | DE112017003210T5 (ja) |
TW (1) | TWI649834B (ja) |
WO (1) | WO2018005154A1 (ja) |
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US10283396B2 (en) | 2016-06-27 | 2019-05-07 | Asm Nexx, Inc. | Workpiece holder for a wet processing system |
WO2021194780A1 (en) * | 2020-03-27 | 2021-09-30 | Corning Incorporated | Substrate holder for use with interferometer |
PT3989270T (pt) * | 2020-10-20 | 2022-11-10 | Semsysco Gmbh | Mecanismo de retenção para fixar um substrato para um tratamento da superfície do substrato |
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2016
- 2016-06-27 US US15/193,890 patent/US10074554B2/en active Active
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2017
- 2017-06-19 CN CN201780040079.2A patent/CN109690752A/zh active Pending
- 2017-06-19 DE DE112017003210.5T patent/DE112017003210T5/de not_active Ceased
- 2017-06-19 JP JP2018569097A patent/JP7001625B2/ja active Active
- 2017-06-19 WO PCT/US2017/038188 patent/WO2018005154A1/en active Application Filing
- 2017-06-19 KR KR1020197002544A patent/KR102154994B1/ko active IP Right Grant
- 2017-06-22 TW TW106120822A patent/TWI649834B/zh active
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JPH03247798A (ja) * | 1990-02-23 | 1991-11-05 | Asahi Eng Co Ltd | 鍍金装置における鍍金枠のワーク着脱装置 |
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Also Published As
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US20170372938A1 (en) | 2017-12-28 |
KR102154994B1 (ko) | 2020-09-14 |
TW201812991A (zh) | 2018-04-01 |
CN109690752A (zh) | 2019-04-26 |
JP7001625B2 (ja) | 2022-01-19 |
DE112017003210T5 (de) | 2019-04-25 |
WO2018005154A1 (en) | 2018-01-04 |
TWI649834B (zh) | 2019-02-01 |
KR20190020136A (ko) | 2019-02-27 |
US10074554B2 (en) | 2018-09-11 |
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