JP2019518499A5 - - Google Patents

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Publication number
JP2019518499A5
JP2019518499A5 JP2018555676A JP2018555676A JP2019518499A5 JP 2019518499 A5 JP2019518499 A5 JP 2019518499A5 JP 2018555676 A JP2018555676 A JP 2018555676A JP 2018555676 A JP2018555676 A JP 2018555676A JP 2019518499 A5 JP2019518499 A5 JP 2019518499A5
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JP
Japan
Prior art keywords
ultrasonic
electrode
ultrasonic device
elastomer layer
layer
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JP2018555676A
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English (en)
Japanese (ja)
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JP6873156B2 (ja
JP2019518499A (ja
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Priority claimed from PCT/EP2017/059907 external-priority patent/WO2017186781A1/en
Publication of JP2019518499A publication Critical patent/JP2019518499A/ja
Publication of JP2019518499A5 publication Critical patent/JP2019518499A5/ja
Application granted granted Critical
Publication of JP6873156B2 publication Critical patent/JP6873156B2/ja
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JP2018555676A 2016-04-26 2017-04-26 接触する超音波装置 Active JP6873156B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201662327500P 2016-04-26 2016-04-26
US62/327,500 2016-04-26
EP16181692 2016-07-28
EP16181692.1 2016-07-28
PCT/EP2017/059907 WO2017186781A1 (en) 2016-04-26 2017-04-26 Ultrasound device contacting

Publications (3)

Publication Number Publication Date
JP2019518499A JP2019518499A (ja) 2019-07-04
JP2019518499A5 true JP2019518499A5 (enExample) 2020-06-11
JP6873156B2 JP6873156B2 (ja) 2021-05-19

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ID=66326500

Family Applications (1)

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JP2018555676A Active JP6873156B2 (ja) 2016-04-26 2017-04-26 接触する超音波装置

Country Status (2)

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US (1) US11529120B2 (enExample)
JP (1) JP6873156B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3586093A4 (en) * 2017-02-27 2021-01-06 Butterfly Network, Inc. CAPACITIVE MICRO-MACHINED ULTRASONIC TRANSDUCERS (CMUT), EQUIPMENT AND ASSOCIATED PROCESSES
WO2019055699A1 (en) * 2017-09-13 2019-03-21 Ultra HOM LLC MEDIUM NETWORK MEDICAL DEVICE AND SOLID-STATE COOLING, AND METHODS AND SYSTEMS THEREOF
EP4478014A1 (en) 2017-12-19 2024-12-18 The University of British Columbia Layered structure and method for fabricating same
JP2023504383A (ja) * 2019-11-26 2023-02-03 グラフオーディオ・インコーポレイテッド グラフェン変換器
WO2022076770A1 (en) * 2020-10-09 2022-04-14 The Johns Hopkins University Impedance-matched acoustic transducer
WO2022258561A1 (en) * 2021-06-07 2022-12-15 Koninklijke Philips N.V. Sensor assembly with set acoustic matching layer thickness for intraluminal sensing device
TWI819775B (zh) * 2021-10-13 2023-10-21 台亞半導體股份有限公司 矽化物電容式微機電結構及其製造方法

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