JP2019513203A - 圧縮性ガスケット、その製造方法、及びそれを備える電子製品 - Google Patents

圧縮性ガスケット、その製造方法、及びそれを備える電子製品 Download PDF

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Publication number
JP2019513203A
JP2019513203A JP2018540101A JP2018540101A JP2019513203A JP 2019513203 A JP2019513203 A JP 2019513203A JP 2018540101 A JP2018540101 A JP 2018540101A JP 2018540101 A JP2018540101 A JP 2018540101A JP 2019513203 A JP2019513203 A JP 2019513203A
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JP
Japan
Prior art keywords
compressible gasket
cell foam
micrometer
open
particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2018540101A
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English (en)
Japanese (ja)
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JP2019513203A5 (https=
Inventor
ウエイ ウエイ，
ウエイ ウエイ，
リヤーン チェン，
リヤーン チェン，
ジーン ファーン，
ジーン ファーン，
ジェフリー タブリュー． マカッチョン，
ジェフリー タブリュー． マカッチョン，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2019513203A publication Critical patent/JP2019513203A/ja
Publication of JP2019513203A5 publication Critical patent/JP2019513203A5/ja
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16J—PISTONS; CYLINDERS; SEALINGS
    • F16J15/00—Sealings
    • F16J15/02—Sealings between relatively-stationary surfaces
    • F16J15/06—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces
    • F16J15/064—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces the packing combining the sealing function with other functions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/044—Forming conductive coatings; Forming coatings having anti-static properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/05—Forming flame retardant coatings or fire resistant coatings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/08—Heat treatment
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
    • G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
    • G11B33/1446—Reducing contamination, e.g. by dust, debris
    • G11B33/1466—Reducing contamination, e.g. by dust, debris sealing gaskets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/069—Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • B32B2255/102—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer synthetic resin or rubber layer being a foamed layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/20—Inorganic coating
    • B32B2255/205—Metallic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2266/00—Composition of foam
    • B32B2266/06—Open cell foam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/212—Electromagnetic interference shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Thermal Sciences (AREA)
  • Electromagnetism (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Sealing Material Composition (AREA)
  • Gasket Seals (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Powder Metallurgy (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2018540101A 2016-02-02 2017-01-27 圧縮性ガスケット、その製造方法、及びそれを備える電子製品 Ceased JP2019513203A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201610072990.9 2016-02-02
CN201610072990.9A CN107027254B (zh) 2016-02-02 2016-02-02 可压缩衬垫、其制备方法和包含其的电子产品
PCT/US2017/015269 WO2017136230A1 (en) 2016-02-02 2017-01-27 Compressible gasket, method for preparing same and electronic product comprising same

Publications (2)

Publication Number Publication Date
JP2019513203A true JP2019513203A (ja) 2019-05-23
JP2019513203A5 JP2019513203A5 (https=) 2020-03-05

Family

ID=59500100

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018540101A Ceased JP2019513203A (ja) 2016-02-02 2017-01-27 圧縮性ガスケット、その製造方法、及びそれを備える電子製品

Country Status (5)

Country Link
US (1) US20190040954A1 (https=)
JP (1) JP2019513203A (https=)
KR (1) KR20180109965A (https=)
CN (1) CN107027254B (https=)
WO (1) WO2017136230A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020170989A1 (ja) * 2019-02-19 2020-08-27 Ａｇｃ株式会社 ウェアラブルデバイス用基材、ウェアラブルデバイス、ウェアラブルデバイス用基材製造用の含フッ素共重合体組成物、ウェアラブルデバイス用基材の製造方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110213951A (zh) * 2019-05-14 2019-09-06 苏州铂韬新材料科技有限公司 一种电磁屏蔽泡棉及其制备工艺
US11483948B2 (en) 2019-08-28 2022-10-25 Laird Technologies, Inc. Thermal interface materials including memory foam cores
US12209664B2 (en) 2020-12-10 2025-01-28 Laird Technologies (Shenzhen) Ltd. Electrically and thermally conductive gaskets
EP4013203B1 (en) 2020-12-10 2024-07-31 Laird Technologies (Shenzhen) Ltd. Electrically and thermally conductive gaskets
US11276436B1 (en) * 2021-01-05 2022-03-15 Seagate Technology Llc Corrosive gas reduction for electronic devices
CN114133740B (zh) * 2021-11-23 2022-11-08 华南理工大学 一种导热吸波硅橡胶复合材料及其制备方法
CN119885613B (zh) * 2024-12-27 2025-10-10 同济大学 一种碱性电解槽的工装垫圈厚度最优化设计方法

Citations (1)

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Publication number Priority date Publication date Assignee Title
JP2011530426A (ja) * 2008-08-05 2011-12-22 ワールド プロパティーズ インク． 導電性ポリマー発泡体、その製造方法、およびその物品

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US5753358A (en) * 1994-08-25 1998-05-19 W. L. Gore & Associates, Inc. Adhisive-filler polymer film composite
US6784363B2 (en) * 2001-10-02 2004-08-31 Parker-Hannifin Corporation EMI shielding gasket construction
US7060348B2 (en) * 2002-03-08 2006-06-13 Laird Technologies, Inc. Flame retardant, electrically conductive shielding materials and methods of making the same
WO2007083822A1 (ja) * 2006-01-17 2007-07-26 Seiren Co., Ltd. 導電性ガスケット材料
CN101472455A (zh) * 2007-12-29 2009-07-01 3M创新有限公司 电磁屏蔽衬垫和用于填充电磁屏蔽系统中的间隙的方法
MX2011008921A (es) * 2009-05-05 2011-11-18 Parker Hannifin Corp Producto de espuma termicamente conductor.
WO2012159258A1 (zh) * 2011-05-23 2012-11-29 3M创新有限公司 电磁屏蔽衬垫及其制备方法
US20130005843A1 (en) * 2011-06-30 2013-01-03 Yeung K C Ricky Self-adhesive silicone rubber compositions and articles comprising same
KR20160099651A (ko) * 2013-12-19 2016-08-22 쓰리엠 이노베이티브 프로퍼티즈 컴파니 전기 전도성 접착 테이프 및 그로부터의 물품
KR101466589B1 (ko) * 2014-01-24 2014-12-01 조인셋 주식회사 전도성 탄성부재

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011530426A (ja) * 2008-08-05 2011-12-22 ワールド プロパティーズ インク． 導電性ポリマー発泡体、その製造方法、およびその物品

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020170989A1 (ja) * 2019-02-19 2020-08-27 Ａｇｃ株式会社 ウェアラブルデバイス用基材、ウェアラブルデバイス、ウェアラブルデバイス用基材製造用の含フッ素共重合体組成物、ウェアラブルデバイス用基材の製造方法

Also Published As

Publication number Publication date
WO2017136230A1 (en) 2017-08-10
KR20180109965A (ko) 2018-10-08
CN107027254B (zh) 2020-12-25
US20190040954A1 (en) 2019-02-07
CN107027254A (zh) 2017-08-08

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