JP2019513203A5 - - Google Patents
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- Publication number
- JP2019513203A5 JP2019513203A5 JP2018540101A JP2018540101A JP2019513203A5 JP 2019513203 A5 JP2019513203 A5 JP 2019513203A5 JP 2018540101 A JP2018540101 A JP 2018540101A JP 2018540101 A JP2018540101 A JP 2018540101A JP 2019513203 A5 JP2019513203 A5 JP 2019513203A5
- Authority
- JP
- Japan
- Prior art keywords
- open
- cell foam
- particles
- compressible gasket
- micrometer particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000002245 particle Substances 0.000 claims 7
- 239000006260 foam Substances 0.000 claims 6
- 239000011159 matrix material Substances 0.000 claims 4
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims 1
- 238000010521 absorption reaction Methods 0.000 claims 1
- 239000013536 elastomeric material Substances 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- 239000003063 flame retardant Substances 0.000 claims 1
- 238000005187 foaming Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 229920002725 thermoplastic elastomer Polymers 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610072990.9 | 2016-02-02 | ||
| CN201610072990.9A CN107027254B (zh) | 2016-02-02 | 2016-02-02 | 可压缩衬垫、其制备方法和包含其的电子产品 |
| PCT/US2017/015269 WO2017136230A1 (en) | 2016-02-02 | 2017-01-27 | Compressible gasket, method for preparing same and electronic product comprising same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2019513203A JP2019513203A (ja) | 2019-05-23 |
| JP2019513203A5 true JP2019513203A5 (https=) | 2020-03-05 |
Family
ID=59500100
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018540101A Ceased JP2019513203A (ja) | 2016-02-02 | 2017-01-27 | 圧縮性ガスケット、その製造方法、及びそれを備える電子製品 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20190040954A1 (https=) |
| JP (1) | JP2019513203A (https=) |
| KR (1) | KR20180109965A (https=) |
| CN (1) | CN107027254B (https=) |
| WO (1) | WO2017136230A1 (https=) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022053560A (ja) * | 2019-02-19 | 2022-04-06 | Ａｇｃ株式会社 | ウェアラブルデバイス用基材 |
| CN110213951A (zh) * | 2019-05-14 | 2019-09-06 | 苏州铂韬新材料科技有限公司 | 一种电磁屏蔽泡棉及其制备工艺 |
| US11483948B2 (en) | 2019-08-28 | 2022-10-25 | Laird Technologies, Inc. | Thermal interface materials including memory foam cores |
| US12209664B2 (en) | 2020-12-10 | 2025-01-28 | Laird Technologies (Shenzhen) Ltd. | Electrically and thermally conductive gaskets |
| EP4013203B1 (en) | 2020-12-10 | 2024-07-31 | Laird Technologies (Shenzhen) Ltd. | Electrically and thermally conductive gaskets |
| US11276436B1 (en) * | 2021-01-05 | 2022-03-15 | Seagate Technology Llc | Corrosive gas reduction for electronic devices |
| CN114133740B (zh) * | 2021-11-23 | 2022-11-08 | 华南理工大学 | 一种导热吸波硅橡胶复合材料及其制备方法 |
| CN119885613B (zh) * | 2024-12-27 | 2025-10-10 | 同济大学 | 一种碱性电解槽的工装垫圈厚度最优化设计方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5753358A (en) * | 1994-08-25 | 1998-05-19 | W. L. Gore & Associates, Inc. | Adhisive-filler polymer film composite |
| US6784363B2 (en) * | 2001-10-02 | 2004-08-31 | Parker-Hannifin Corporation | EMI shielding gasket construction |
| US7060348B2 (en) * | 2002-03-08 | 2006-06-13 | Laird Technologies, Inc. | Flame retardant, electrically conductive shielding materials and methods of making the same |
| WO2007083822A1 (ja) * | 2006-01-17 | 2007-07-26 | Seiren Co., Ltd. | 導電性ガスケット材料 |
| CN101472455A (zh) * | 2007-12-29 | 2009-07-01 | 3M创新有限公司 | 电磁屏蔽衬垫和用于填充电磁屏蔽系统中的间隙的方法 |
| EP2352786A1 (en) * | 2008-08-05 | 2011-08-10 | World Properties, Inc. | Conductive polymer foams, method of manufacture, and articles thereof |
| MX2011008921A (es) * | 2009-05-05 | 2011-11-18 | Parker Hannifin Corp | Producto de espuma termicamente conductor. |
| WO2012159258A1 (zh) * | 2011-05-23 | 2012-11-29 | 3M创新有限公司 | 电磁屏蔽衬垫及其制备方法 |
| US20130005843A1 (en) * | 2011-06-30 | 2013-01-03 | Yeung K C Ricky | Self-adhesive silicone rubber compositions and articles comprising same |
| KR20160099651A (ko) * | 2013-12-19 | 2016-08-22 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 전기 전도성 접착 테이프 및 그로부터의 물품 |
| KR101466589B1 (ko) * | 2014-01-24 | 2014-12-01 | 조인셋 주식회사 | 전도성 탄성부재 |
-
2016
- 2016-02-02 CN CN201610072990.9A patent/CN107027254B/zh not_active Expired - Fee Related
-
2017
- 2017-01-27 JP JP2018540101A patent/JP2019513203A/ja not_active Ceased
- 2017-01-27 US US16/074,784 patent/US20190040954A1/en not_active Abandoned
- 2017-01-27 WO PCT/US2017/015269 patent/WO2017136230A1/en not_active Ceased
- 2017-01-27 KR KR1020187024598A patent/KR20180109965A/ko not_active Withdrawn
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