CN107027254B - 可压缩衬垫、其制备方法和包含其的电子产品 - Google Patents

可压缩衬垫、其制备方法和包含其的电子产品 Download PDF

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Publication number
CN107027254B
CN107027254B CN201610072990.9A CN201610072990A CN107027254B CN 107027254 B CN107027254 B CN 107027254B CN 201610072990 A CN201610072990 A CN 201610072990A CN 107027254 B CN107027254 B CN 107027254B
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CN
China
Prior art keywords
compressible pad
microparticles
compressible
open
cell foam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201610072990.9A
Other languages
English (en)
Chinese (zh)
Other versions
CN107027254A (zh
Inventor
魏嵬
陈良
方敬
杰弗里·W·麦卡琴
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
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3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Priority to CN201610072990.9A priority Critical patent/CN107027254B/zh
Priority to US16/074,784 priority patent/US20190040954A1/en
Priority to KR1020187024598A priority patent/KR20180109965A/ko
Priority to JP2018540101A priority patent/JP2019513203A/ja
Priority to PCT/US2017/015269 priority patent/WO2017136230A1/en
Publication of CN107027254A publication Critical patent/CN107027254A/zh
Application granted granted Critical
Publication of CN107027254B publication Critical patent/CN107027254B/zh
Expired - Fee Related legal-status Critical Current
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/0217Mechanical details of casings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16JPISTONS; CYLINDERS; SEALINGS
    • F16J15/00Sealings
    • F16J15/02Sealings between relatively-stationary surfaces
    • F16J15/06Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces
    • F16J15/064Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces the packing combining the sealing function with other functions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04Coating
    • C08J7/044Forming conductive coatings; Forming coatings having anti-static properties
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04Coating
    • C08J7/05Forming flame retardant coatings or fire resistant coatings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/08Heat treatment
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B33/00Constructional parts, details or accessories not provided for in the other groups of this subclass
    • G11B33/14Reducing influence of physical parameters, e.g. temperature change, moisture, dust
    • G11B33/1446Reducing contamination, e.g. by dust, debris
    • G11B33/1466Reducing contamination, e.g. by dust, debris sealing gaskets
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/06Hermetically-sealed casings
    • H05K5/069Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00Coating on the layer surface
    • B32B2255/10Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • B32B2255/102Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer synthetic resin or rubber layer being a foamed layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00Coating on the layer surface
    • B32B2255/20Inorganic coating
    • B32B2255/205Metallic coating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00Coating on the layer surface
    • B32B2255/26Polymeric coating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2266/00Composition of foam
    • B32B2266/06Open cell foam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/212Electromagnetic interference shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Thermal Sciences (AREA)
  • Electromagnetism (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Sealing Material Composition (AREA)
  • Gasket Seals (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Powder Metallurgy (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN201610072990.9A 2016-02-02 2016-02-02 可压缩衬垫、其制备方法和包含其的电子产品 Expired - Fee Related CN107027254B (zh)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN201610072990.9A CN107027254B (zh) 2016-02-02 2016-02-02 可压缩衬垫、其制备方法和包含其的电子产品
US16/074,784 US20190040954A1 (en) 2016-02-02 2017-01-27 Compressible Gasket, Method for Preparing Same and Electronic Product Comprising Same
KR1020187024598A KR20180109965A (ko) 2016-02-02 2017-01-27 압축가능 개스킷, 이를 제조하기 위한 방법, 및 이를 포함하는 전자 제품
JP2018540101A JP2019513203A (ja) 2016-02-02 2017-01-27 圧縮性ガスケット、その製造方法、及びそれを備える電子製品
PCT/US2017/015269 WO2017136230A1 (en) 2016-02-02 2017-01-27 Compressible gasket, method for preparing same and electronic product comprising same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610072990.9A CN107027254B (zh) 2016-02-02 2016-02-02 可压缩衬垫、其制备方法和包含其的电子产品

Publications (2)

Publication Number Publication Date
CN107027254A CN107027254A (zh) 2017-08-08
CN107027254B true CN107027254B (zh) 2020-12-25

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CN201610072990.9A Expired - Fee Related CN107027254B (zh) 2016-02-02 2016-02-02 可压缩衬垫、其制备方法和包含其的电子产品

Country Status (5)

Country Link
US (1) US20190040954A1 (https=)
JP (1) JP2019513203A (https=)
KR (1) KR20180109965A (https=)
CN (1) CN107027254B (https=)
WO (1) WO2017136230A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022053560A (ja) * 2019-02-19 2022-04-06 Agc株式会社 ウェアラブルデバイス用基材
CN110213951A (zh) * 2019-05-14 2019-09-06 苏州铂韬新材料科技有限公司 一种电磁屏蔽泡棉及其制备工艺
US11483948B2 (en) 2019-08-28 2022-10-25 Laird Technologies, Inc. Thermal interface materials including memory foam cores
US12209664B2 (en) 2020-12-10 2025-01-28 Laird Technologies (Shenzhen) Ltd. Electrically and thermally conductive gaskets
EP4013203B1 (en) 2020-12-10 2024-07-31 Laird Technologies (Shenzhen) Ltd. Electrically and thermally conductive gaskets
US11276436B1 (en) * 2021-01-05 2022-03-15 Seagate Technology Llc Corrosive gas reduction for electronic devices
CN114133740B (zh) * 2021-11-23 2022-11-08 华南理工大学 一种导热吸波硅橡胶复合材料及其制备方法
CN119885613B (zh) * 2024-12-27 2025-10-10 同济大学 一种碱性电解槽的工装垫圈厚度最优化设计方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5753358A (en) * 1994-08-25 1998-05-19 W. L. Gore & Associates, Inc. Adhisive-filler polymer film composite
CN104802465A (zh) * 2014-01-24 2015-07-29 卓英社有限公司 传导性弹性部件

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6784363B2 (en) * 2001-10-02 2004-08-31 Parker-Hannifin Corporation EMI shielding gasket construction
US7060348B2 (en) * 2002-03-08 2006-06-13 Laird Technologies, Inc. Flame retardant, electrically conductive shielding materials and methods of making the same
WO2007083822A1 (ja) * 2006-01-17 2007-07-26 Seiren Co., Ltd. 導電性ガスケット材料
CN101472455A (zh) * 2007-12-29 2009-07-01 3M创新有限公司 电磁屏蔽衬垫和用于填充电磁屏蔽系统中的间隙的方法
EP2352786A1 (en) * 2008-08-05 2011-08-10 World Properties, Inc. Conductive polymer foams, method of manufacture, and articles thereof
MX2011008921A (es) * 2009-05-05 2011-11-18 Parker Hannifin Corp Producto de espuma termicamente conductor.
WO2012159258A1 (zh) * 2011-05-23 2012-11-29 3M创新有限公司 电磁屏蔽衬垫及其制备方法
US20130005843A1 (en) * 2011-06-30 2013-01-03 Yeung K C Ricky Self-adhesive silicone rubber compositions and articles comprising same
KR20160099651A (ko) * 2013-12-19 2016-08-22 쓰리엠 이노베이티브 프로퍼티즈 컴파니 전기 전도성 접착 테이프 및 그로부터의 물품

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5753358A (en) * 1994-08-25 1998-05-19 W. L. Gore & Associates, Inc. Adhisive-filler polymer film composite
CN104802465A (zh) * 2014-01-24 2015-07-29 卓英社有限公司 传导性弹性部件

Also Published As

Publication number Publication date
WO2017136230A1 (en) 2017-08-10
KR20180109965A (ko) 2018-10-08
JP2019513203A (ja) 2019-05-23
US20190040954A1 (en) 2019-02-07
CN107027254A (zh) 2017-08-08

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