CN107027254B - 可压缩衬垫、其制备方法和包含其的电子产品 - Google Patents
可压缩衬垫、其制备方法和包含其的电子产品 Download PDFInfo
- Publication number
- CN107027254B CN107027254B CN201610072990.9A CN201610072990A CN107027254B CN 107027254 B CN107027254 B CN 107027254B CN 201610072990 A CN201610072990 A CN 201610072990A CN 107027254 B CN107027254 B CN 107027254B
- Authority
- CN
- China
- Prior art keywords
- compressible pad
- microparticles
- compressible
- open
- cell foam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- 239000011159 matrix material Substances 0.000 claims abstract description 36
- 238000010521 absorption reaction Methods 0.000 claims abstract description 25
- 239000003063 flame retardant Substances 0.000 claims abstract description 24
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 21
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Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16J—PISTONS; CYLINDERS; SEALINGS
- F16J15/00—Sealings
- F16J15/02—Sealings between relatively-stationary surfaces
- F16J15/06—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces
- F16J15/064—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces the packing combining the sealing function with other functions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/044—Forming conductive coatings; Forming coatings having anti-static properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/05—Forming flame retardant coatings or fire resistant coatings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/08—Heat treatment
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
- G11B33/1446—Reducing contamination, e.g. by dust, debris
- G11B33/1466—Reducing contamination, e.g. by dust, debris sealing gaskets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/069—Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
- B32B2255/102—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer synthetic resin or rubber layer being a foamed layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/20—Inorganic coating
- B32B2255/205—Metallic coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2266/00—Composition of foam
- B32B2266/06—Open cell foam
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/212—Electromagnetic interference shielding
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Thermal Sciences (AREA)
- Electromagnetism (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Sealing Material Composition (AREA)
- Gasket Seals (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Powder Metallurgy (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610072990.9A CN107027254B (zh) | 2016-02-02 | 2016-02-02 | 可压缩衬垫、其制备方法和包含其的电子产品 |
| US16/074,784 US20190040954A1 (en) | 2016-02-02 | 2017-01-27 | Compressible Gasket, Method for Preparing Same and Electronic Product Comprising Same |
| KR1020187024598A KR20180109965A (ko) | 2016-02-02 | 2017-01-27 | 압축가능 개스킷, 이를 제조하기 위한 방법, 및 이를 포함하는 전자 제품 |
| JP2018540101A JP2019513203A (ja) | 2016-02-02 | 2017-01-27 | 圧縮性ガスケット、その製造方法、及びそれを備える電子製品 |
| PCT/US2017/015269 WO2017136230A1 (en) | 2016-02-02 | 2017-01-27 | Compressible gasket, method for preparing same and electronic product comprising same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610072990.9A CN107027254B (zh) | 2016-02-02 | 2016-02-02 | 可压缩衬垫、其制备方法和包含其的电子产品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107027254A CN107027254A (zh) | 2017-08-08 |
| CN107027254B true CN107027254B (zh) | 2020-12-25 |
Family
ID=59500100
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610072990.9A Expired - Fee Related CN107027254B (zh) | 2016-02-02 | 2016-02-02 | 可压缩衬垫、其制备方法和包含其的电子产品 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20190040954A1 (https=) |
| JP (1) | JP2019513203A (https=) |
| KR (1) | KR20180109965A (https=) |
| CN (1) | CN107027254B (https=) |
| WO (1) | WO2017136230A1 (https=) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022053560A (ja) * | 2019-02-19 | 2022-04-06 | Agc株式会社 | ウェアラブルデバイス用基材 |
| CN110213951A (zh) * | 2019-05-14 | 2019-09-06 | 苏州铂韬新材料科技有限公司 | 一种电磁屏蔽泡棉及其制备工艺 |
| US11483948B2 (en) | 2019-08-28 | 2022-10-25 | Laird Technologies, Inc. | Thermal interface materials including memory foam cores |
| US12209664B2 (en) | 2020-12-10 | 2025-01-28 | Laird Technologies (Shenzhen) Ltd. | Electrically and thermally conductive gaskets |
| EP4013203B1 (en) | 2020-12-10 | 2024-07-31 | Laird Technologies (Shenzhen) Ltd. | Electrically and thermally conductive gaskets |
| US11276436B1 (en) * | 2021-01-05 | 2022-03-15 | Seagate Technology Llc | Corrosive gas reduction for electronic devices |
| CN114133740B (zh) * | 2021-11-23 | 2022-11-08 | 华南理工大学 | 一种导热吸波硅橡胶复合材料及其制备方法 |
| CN119885613B (zh) * | 2024-12-27 | 2025-10-10 | 同济大学 | 一种碱性电解槽的工装垫圈厚度最优化设计方法 |
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| CN104802465A (zh) * | 2014-01-24 | 2015-07-29 | 卓英社有限公司 | 传导性弹性部件 |
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| US6784363B2 (en) * | 2001-10-02 | 2004-08-31 | Parker-Hannifin Corporation | EMI shielding gasket construction |
| US7060348B2 (en) * | 2002-03-08 | 2006-06-13 | Laird Technologies, Inc. | Flame retardant, electrically conductive shielding materials and methods of making the same |
| WO2007083822A1 (ja) * | 2006-01-17 | 2007-07-26 | Seiren Co., Ltd. | 導電性ガスケット材料 |
| CN101472455A (zh) * | 2007-12-29 | 2009-07-01 | 3M创新有限公司 | 电磁屏蔽衬垫和用于填充电磁屏蔽系统中的间隙的方法 |
| EP2352786A1 (en) * | 2008-08-05 | 2011-08-10 | World Properties, Inc. | Conductive polymer foams, method of manufacture, and articles thereof |
| MX2011008921A (es) * | 2009-05-05 | 2011-11-18 | Parker Hannifin Corp | Producto de espuma termicamente conductor. |
| WO2012159258A1 (zh) * | 2011-05-23 | 2012-11-29 | 3M创新有限公司 | 电磁屏蔽衬垫及其制备方法 |
| US20130005843A1 (en) * | 2011-06-30 | 2013-01-03 | Yeung K C Ricky | Self-adhesive silicone rubber compositions and articles comprising same |
| KR20160099651A (ko) * | 2013-12-19 | 2016-08-22 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 전기 전도성 접착 테이프 및 그로부터의 물품 |
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- 2017-01-27 JP JP2018540101A patent/JP2019513203A/ja not_active Ceased
- 2017-01-27 US US16/074,784 patent/US20190040954A1/en not_active Abandoned
- 2017-01-27 WO PCT/US2017/015269 patent/WO2017136230A1/en not_active Ceased
- 2017-01-27 KR KR1020187024598A patent/KR20180109965A/ko not_active Withdrawn
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US5753358A (en) * | 1994-08-25 | 1998-05-19 | W. L. Gore & Associates, Inc. | Adhisive-filler polymer film composite |
| CN104802465A (zh) * | 2014-01-24 | 2015-07-29 | 卓英社有限公司 | 传导性弹性部件 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017136230A1 (en) | 2017-08-10 |
| KR20180109965A (ko) | 2018-10-08 |
| JP2019513203A (ja) | 2019-05-23 |
| US20190040954A1 (en) | 2019-02-07 |
| CN107027254A (zh) | 2017-08-08 |
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