KR20180109965A - 압축가능 개스킷, 이를 제조하기 위한 방법, 및 이를 포함하는 전자 제품 - Google Patents

압축가능 개스킷, 이를 제조하기 위한 방법, 및 이를 포함하는 전자 제품 Download PDF

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Publication number
KR20180109965A
KR20180109965A KR1020187024598A KR20187024598A KR20180109965A KR 20180109965 A KR20180109965 A KR 20180109965A KR 1020187024598 A KR1020187024598 A KR 1020187024598A KR 20187024598 A KR20187024598 A KR 20187024598A KR 20180109965 A KR20180109965 A KR 20180109965A
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KR
South Korea
Prior art keywords
open
compressible gasket
micrometer particles
cell
particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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KR1020187024598A
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English (en)
Korean (ko)
Inventor
웨이 웨이
리앙 첸
징 팡
제프리 더블유 맥커천
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
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Publication of KR20180109965A publication Critical patent/KR20180109965A/ko
Withdrawn legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16J—PISTONS; CYLINDERS; SEALINGS
    • F16J15/00—Sealings
    • F16J15/02—Sealings between relatively-stationary surfaces
    • F16J15/06—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces
    • F16J15/064—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces the packing combining the sealing function with other functions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/044—Forming conductive coatings; Forming coatings having anti-static properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/05—Forming flame retardant coatings or fire resistant coatings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/08—Heat treatment
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
    • G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
    • G11B33/1446—Reducing contamination, e.g. by dust, debris
    • G11B33/1466—Reducing contamination, e.g. by dust, debris sealing gaskets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/069—Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • B32B2255/102—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer synthetic resin or rubber layer being a foamed layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/20—Inorganic coating
    • B32B2255/205—Metallic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2266/00—Composition of foam
    • B32B2266/06—Open cell foam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/212—Electromagnetic interference shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Thermal Sciences (AREA)
  • Electromagnetism (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Sealing Material Composition (AREA)
  • Gasket Seals (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Powder Metallurgy (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020187024598A 2016-02-02 2017-01-27 압축가능 개스킷, 이를 제조하기 위한 방법, 및 이를 포함하는 전자 제품 Withdrawn KR20180109965A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201610072990.9 2016-02-02
CN201610072990.9A CN107027254B (zh) 2016-02-02 2016-02-02 可压缩衬垫、其制备方法和包含其的电子产品
PCT/US2017/015269 WO2017136230A1 (en) 2016-02-02 2017-01-27 Compressible gasket, method for preparing same and electronic product comprising same

Publications (1)

Publication Number Publication Date
KR20180109965A true KR20180109965A (ko) 2018-10-08

Family

ID=59500100

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187024598A Withdrawn KR20180109965A (ko) 2016-02-02 2017-01-27 압축가능 개스킷, 이를 제조하기 위한 방법, 및 이를 포함하는 전자 제품

Country Status (5)

Country Link
US (1) US20190040954A1 (https=)
JP (1) JP2019513203A (https=)
KR (1) KR20180109965A (https=)
CN (1) CN107027254B (https=)
WO (1) WO2017136230A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022053560A (ja) * 2019-02-19 2022-04-06 Ａｇｃ株式会社 ウェアラブルデバイス用基材
CN110213951A (zh) * 2019-05-14 2019-09-06 苏州铂韬新材料科技有限公司 一种电磁屏蔽泡棉及其制备工艺
US11483948B2 (en) 2019-08-28 2022-10-25 Laird Technologies, Inc. Thermal interface materials including memory foam cores
US12209664B2 (en) 2020-12-10 2025-01-28 Laird Technologies (Shenzhen) Ltd. Electrically and thermally conductive gaskets
EP4013203B1 (en) 2020-12-10 2024-07-31 Laird Technologies (Shenzhen) Ltd. Electrically and thermally conductive gaskets
US11276436B1 (en) * 2021-01-05 2022-03-15 Seagate Technology Llc Corrosive gas reduction for electronic devices
CN114133740B (zh) * 2021-11-23 2022-11-08 华南理工大学 一种导热吸波硅橡胶复合材料及其制备方法
CN119885613B (zh) * 2024-12-27 2025-10-10 同济大学 一种碱性电解槽的工装垫圈厚度最优化设计方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5753358A (en) * 1994-08-25 1998-05-19 W. L. Gore & Associates, Inc. Adhisive-filler polymer film composite
US6784363B2 (en) * 2001-10-02 2004-08-31 Parker-Hannifin Corporation EMI shielding gasket construction
US7060348B2 (en) * 2002-03-08 2006-06-13 Laird Technologies, Inc. Flame retardant, electrically conductive shielding materials and methods of making the same
WO2007083822A1 (ja) * 2006-01-17 2007-07-26 Seiren Co., Ltd. 導電性ガスケット材料
CN101472455A (zh) * 2007-12-29 2009-07-01 3M创新有限公司 电磁屏蔽衬垫和用于填充电磁屏蔽系统中的间隙的方法
EP2352786A1 (en) * 2008-08-05 2011-08-10 World Properties, Inc. Conductive polymer foams, method of manufacture, and articles thereof
MX2011008921A (es) * 2009-05-05 2011-11-18 Parker Hannifin Corp Producto de espuma termicamente conductor.
WO2012159258A1 (zh) * 2011-05-23 2012-11-29 3M创新有限公司 电磁屏蔽衬垫及其制备方法
US20130005843A1 (en) * 2011-06-30 2013-01-03 Yeung K C Ricky Self-adhesive silicone rubber compositions and articles comprising same
KR20160099651A (ko) * 2013-12-19 2016-08-22 쓰리엠 이노베이티브 프로퍼티즈 컴파니 전기 전도성 접착 테이프 및 그로부터의 물품
KR101466589B1 (ko) * 2014-01-24 2014-12-01 조인셋 주식회사 전도성 탄성부재

Also Published As

Publication number Publication date
WO2017136230A1 (en) 2017-08-10
CN107027254B (zh) 2020-12-25
JP2019513203A (ja) 2019-05-23
US20190040954A1 (en) 2019-02-07
CN107027254A (zh) 2017-08-08

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PA0105 International application

Patent event date: 20180827

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20220127

Comment text: Request for Examination of Application

PC1202 Submission of document of withdrawal before decision of registration

Comment text: [Withdrawal of Procedure relating to Patent, etc.] Withdrawal (Abandonment)

Patent event code: PC12021R01D

Patent event date: 20220908

WITB Written withdrawal of application