JP2019509631A - 光エミッタのための薄型相互接続子 - Google Patents
光エミッタのための薄型相互接続子 Download PDFInfo
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- 230000003287 optical effect Effects 0.000 claims abstract description 63
- 239000000758 substrate Substances 0.000 claims abstract description 52
- 238000010146 3D printing Methods 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims description 34
- 238000000151 deposition Methods 0.000 claims description 20
- 230000008878 coupling Effects 0.000 claims description 13
- 238000010168 coupling process Methods 0.000 claims description 13
- 238000005859 coupling reaction Methods 0.000 claims description 13
- 238000005286 illumination Methods 0.000 claims description 10
- 239000003989 dielectric material Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 238000002347 injection Methods 0.000 abstract description 3
- 239000007924 injection Substances 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 66
- 238000012545 processing Methods 0.000 description 17
- 230000008569 process Effects 0.000 description 15
- 230000006870 function Effects 0.000 description 12
- 230000004308 accommodation Effects 0.000 description 9
- 239000000843 powder Substances 0.000 description 9
- 230000003190 augmentative effect Effects 0.000 description 7
- 230000008901 benefit Effects 0.000 description 6
- 230000007423 decrease Effects 0.000 description 6
- 238000004891 communication Methods 0.000 description 5
- 239000004020 conductor Substances 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 230000008447 perception Effects 0.000 description 5
- 230000011514 reflex Effects 0.000 description 5
- 238000000926 separation method Methods 0.000 description 5
- 230000000007 visual effect Effects 0.000 description 5
- 210000004556 brain Anatomy 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 4
- 230000004927 fusion Effects 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000013459 approach Methods 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 210000000613 ear canal Anatomy 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 230000001902 propagating effect Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 241000256837 Apidae Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004983 Polymer Dispersed Liquid Crystal Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000002730 additional effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000109 continuous material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000006855 networking Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 210000001747 pupil Anatomy 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 210000001525 retina Anatomy 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000001131 transforming effect Effects 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- 230000016776 visual perception Effects 0.000 description 1
- 238000012800 visualization Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/01—Head-up displays
- G02B27/017—Head mounted
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/01—Head-up displays
- G02B27/017—Head mounted
- G02B27/0172—Head mounted characterised by optical features
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0005—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being of the fibre type
- G02B6/001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being of the fibre type the light being emitted along at least a portion of the lateral surface of the fibre
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
- G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
- G02B6/0028—Light guide, e.g. taper
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0075—Arrangements of multiple light guides
- G02B6/0076—Stacked arrangements of multiple light guides of the same or different cross-sectional area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/01—Head-up displays
- G02B27/0101—Head-up displays characterised by optical features
- G02B2027/0118—Head-up displays characterised by optical features comprising devices for improving the contrast of the display / brillance control visibility
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/01—Head-up displays
- G02B27/0101—Head-up displays characterised by optical features
- G02B2027/0132—Head-up displays characterised by optical features comprising binocular systems
- G02B2027/0134—Head-up displays characterised by optical features comprising binocular systems of stereoscopic type
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/01—Head-up displays
- G02B27/017—Head mounted
- G02B2027/0178—Eyeglass type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
- H01L2224/241—Disposition
- H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/24221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/24225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
- H01L33/385—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape the electrode extending at least partially onto a side surface of the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
- Planar Illumination Modules (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Optical Integrated Circuits (AREA)
- Optical Couplings Of Light Guides (AREA)
- Testing, Inspecting, Measuring Of Stereoscopic Televisions And Televisions (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
本出願は、35U.S.C.§119(e)の下で2016年2月24日に出願された「LOW PROFILE INTERCONNECT FOR LIGHT EMITTER」という題目の米国仮出願第62/299,163号の優先利益を主張する。上記文献の開示内容は、その全体として参照することによって本明細書において援用される。
本開示は、光源に関し、より具体的には、基板上に搭載される光エミッタを伴う、光源に関する。いくつかの実施形態では、光エミッタは、発光ダイオードであってもよい。
(関連技術の説明)
基板上に搭載される光エミッタ(回路基板上に搭載される発光ダイオード等)は、光源として使用され、照明を種々の電子デバイス内に提供する。基板は、電力を光エミッタに提供するために、光エミッタを基板上の配線と接続する配線接合を含んでもよい。現代のデバイスに関する仕様が変化するにつれて、例えば、効率、ロバスト性、および/またはコンパクト性に関する要件が増加するにつれて、これらの現代のデバイスの必要性を満たすことができる、光源を開発する継続的必要がある。
いくつかの実施形態では、照明システムが、提供される。照明システムは、基板接合パッドを備える、基板を備える。光エミッタが、基板に取り付けられ、光エミッタは、光エミッタ接合パッドを備える。電気相互接続子が、光エミッタにわたってある。電気相互接続子は、電気相互接続子の一端において、光エミッタ接合パッドに接触し、電気相互接続子の他端において、基板接合パッドに接触する。電気相互接続子の断面形状は、電気相互接続子の伸長軸に対して横切る平面において見ると、高さより大きい幅を有する。光エミッタの上方の電気相互接続子の最大高さは、いくつかの実施形態では、50μm以下であってもよい。電気相互接続子は、いくつかの実施形態では、光エミッタの輪郭に共形状に追従してもよい。
光エミッタは、光エミッタから光を受信し、例えば、さらに、その光を伝送し、および/または光を修正する、上層光学構造(例えば、光パイプ)に結合されてもよい。光エミッタから光学構造の中への光の投入の効率は、光エミッタと光学構造を分離する距離に大きく依存することを理解されたい。分離が小さいほど、より高い効率を提供し、光学構造の中に投入される放出される光の割合も高くなる。より小さい分離の影響は、光学構造および光エミッタの幅または横寸法における減少に伴って増加し得る。すなわち、横寸法が減少するにつれて、より多くの電力が、光学構造から逸失する光によって縁の周囲で喪失される。例えば、横方向における光学構造および光エミッタ寸法が、1.5mmより小さい場合、効率に及ぼす分離の影響は、容易に明白となる。したがって、光エミッタと光エミッタから光を受信する光学構造との間の分離の影響は、光エミッタおよび光学構造の表面の断面積が減少するにつれて増加する。
ここで、同様の参照番号が全体を通して同様の部品を指す、図面を参照する。
薄型相互接続子は、光エミッタにわたる薄型が所望される、種々の照明用途において利用されてもよいことを理解されたい。本明細書に議論されるように、薄型は、光エミッタと光パイプ等の上層光学構造との間の緊密間隔を提供することができる。本緊密間隔は、光エミッタから光パイプの中への光の非常に効率的伝達を可能にすることができる。別の利点は、配線接合を排除することによって、相互接続子が、衝撃および振動ならびに環境懸念に対してよりロバストとなることができることである。加えて、これらの相互接続子は、光源がともにより近接して設置されることを可能にし得、これは、所与のレベルの出力のために、光学システムをより小型かつより軽量にすることができる。そのような高効率、ロバスト性、および小サイズは、有利には、ディスプレイデバイス内に利用され、明るさおよび可搬性を増加させ、および/またはディスプレイの電力使用を低減させ得る。
Claims (26)
- 照明システムであって、
基板接合パッドを備える基板と、
前記基板に取り付けられた光エミッタであって、前記光エミッタは、光エミッタ接合パッドを備える、光エミッタと、
前記光エミッタにわたる電気相互接続子であって、前記電気相互接続子は、前記電気相互接続子の一端において前記光エミッタ接合パッドに接触し、前記電気相互接続子の他端において前記基板接合パッドに接触する、電気相互接続子と
を備え、
前記電気相互接続子の断面形状は、前記電気相互接続子の伸長軸に対して横切る平面において見ると、前記断面形状の高さより大きい幅を有する、照明システム。 - 前記光エミッタの上方の前記電気相互接続子の最大高さは、50μm以下である、請求項1に記載の照明システム。
- 前記電気相互接続子は、前記光エミッタの輪郭に共形状に追従する、請求項1に記載の照明システム。
- 前記光エミッタは、前記基板にわたって段を画定し、前記電気相互接続子は、前記段の輪郭に追従する、請求項3に記載の照明システム。
- 前記断面形状は、長方形である、請求項1に記載の照明システム。
- 前記電気相互接続子は、金属を備える、請求項1に記載の照明システム。
- 前記光エミッタは、LEDチップである、請求項1に記載の照明システム。
- 前記基板は、印刷回路基板である、請求項1に記載の照明システム。
- 前記光エミッタと前記電気相互接続子との間に誘電層をさらに備える、請求項1に記載の照明システム。
- 前記光エミッタはさらに、他の光エミッタ接合パッドと、他の電気相互接続子とを備え、
前記他の電気相互接続子は、前記他の電気相互接続子の一端において前記他の光エミッタ接合パッドに接触し、前記電気相互接続子の他端において他の基板接合パッドに接触し、
前記他の電気相互接続子の断面形状は、前記電気相互接続子の伸長軸に対して横切る平面において見ると、高さより大きい幅を有する、請求項1に記載の照明システム。 - 前記光エミッタの暴露表面にわたる光パイプをさらに備える、請求項1に記載の照明システム。
- 前記光パイプから光を受信するように構成された光変調デバイスと、
導波管のスタックであって、各導波管は、前記光変調デバイスから光を受信するように構成された光内部結合光学要素を備える、導波管のスタックと
をさらに備える、請求項11に記載の照明システム。 - 複数の前記光パイプをさらに備え、各光パイプは、光を前記光変調デバイスに伝送するように構成されている、請求項12に記載の照明システム。
- 前記光エミッタの暴露表面にわたる反射体をさらに備える、請求項1に記載の照明システム。
- 前記反射体から光を受信するように構成された光変調デバイスと、
導波管のスタックであって、各導波管は、前記光変調デバイスから光を受信するように構成された光内部結合光学要素を備える、導波管のスタックと
をさらに備える、請求項14に記載の照明システム。 - 複数の前記反射体をさらに備え、各反射体は、光を前記光変調デバイスに指向するように構成されている、請求項14に記載の照明システム。
- 照明デバイスを作製するための方法であって、
基板接合パッドを備える基板にわたって、光エミッタを提供することであって、前記光エミッタは、光エミッタ接合パッドを備える、ことと、
前記光エミッタにわたって、かつ前記光エミッタ接合パッドおよび前記基板接合パッドと接触するように、電気相互接続子を堆積させることと
を含む、方法。 - 前記電気相互接続子を堆積させることは、前記電気相互接続子を3D印刷することを含む、請求項17に記載の方法。
- 前記電気相互接続子を堆積させる前に、誘電材料を前記光エミッタにわたって堆積させることをさらに含む、請求項17に記載の方法。
- 前記誘電材料を堆積させることは、前記誘電材料を3D印刷することを含む、請求項17に記載の方法。
- 前記電気相互接続子を堆積させることは、金属を堆積させることを含む、請求項17に記載の方法。
- 前記光エミッタは、LEDチップである、請求項17に記載の方法。
- 前記光エミッタの上方の前記電気相互接続子の最大高さは、50μm以下である、請求項17に記載の方法。
- 光パイプを前記光エミッタに結合することをさらに含み、前記光パイプの光入力表面は、前記光エミッタの暴露表面に面する、請求項17に記載の方法。
- 反射体を前記光エミッタに結合することをさらに含み、前記反射体の光入力表面は、前記光エミッタの暴露表面に面する、請求項17に記載の方法。
- 前記光エミッタを提供することは、前記光エミッタを前記基板の表面上の電気接点上に取り付けることを含む、請求項17に記載の方法。
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IL261102B2 (en) | 2023-10-01 |
US11264548B2 (en) | 2022-03-01 |
US11811011B2 (en) | 2023-11-07 |
EP3420270A4 (en) | 2020-02-19 |
TW201800801A (zh) | 2018-01-01 |
JP7301116B2 (ja) | 2023-06-30 |
EP3420270A1 (en) | 2019-01-02 |
CA3015077A1 (en) | 2017-08-31 |
US20240021774A1 (en) | 2024-01-18 |
TWI720140B (zh) | 2021-03-01 |
CN114898675A (zh) | 2022-08-12 |
JP6991981B2 (ja) | 2022-01-13 |
IL303148A (en) | 2023-07-01 |
WO2017147322A1 (en) | 2017-08-31 |
KR20180116347A (ko) | 2018-10-24 |
AU2017223716B2 (en) | 2021-11-18 |
IL261102A (en) | 2018-10-31 |
JP2022033155A (ja) | 2022-02-28 |
NZ745229A (en) | 2019-12-20 |
US20220173295A1 (en) | 2022-06-02 |
CN108700275A (zh) | 2018-10-23 |
US20170244013A1 (en) | 2017-08-24 |
CN108700275B (zh) | 2022-05-31 |
AU2017223716A1 (en) | 2018-08-30 |
IL261102B1 (en) | 2023-06-01 |
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AU2022201031A1 (en) | 2022-03-10 |
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