JP2019504534A5 - - Google Patents

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JP2019504534A5
JP2019504534A5 JP2018528001A JP2018528001A JP2019504534A5 JP 2019504534 A5 JP2019504534 A5 JP 2019504534A5 JP 2018528001 A JP2018528001 A JP 2018528001A JP 2018528001 A JP2018528001 A JP 2018528001A JP 2019504534 A5 JP2019504534 A5 JP 2019504534A5
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bias
ultrasonic transducers
group
ultrasonic
substrate
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JP2018528001A
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JP2019504534A (ja
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Priority claimed from US14/957,098 external-priority patent/US9987661B2/en
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JP2018528001A 2015-12-02 2016-12-01 容量型微細加工超音波トランスデューサ(cmut)のバイアス印加並びに関連する装置及び方法 Pending JP2019504534A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/957,098 2015-12-02
US14/957,098 US9987661B2 (en) 2015-12-02 2015-12-02 Biasing of capacitive micromachined ultrasonic transducers (CMUTs) and related apparatus and methods
PCT/US2016/064325 WO2017095988A1 (en) 2015-12-02 2016-12-01 Biasing of capacitive micromachined ultrasonic transducers (cmuts) and related apparatus and methods

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JP2019504534A JP2019504534A (ja) 2019-02-14
JP2019504534A5 true JP2019504534A5 (https=) 2019-12-12

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JP2018528001A Pending JP2019504534A (ja) 2015-12-02 2016-12-01 容量型微細加工超音波トランスデューサ(cmut)のバイアス印加並びに関連する装置及び方法

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US (2) US9987661B2 (https=)
EP (1) EP3383277B1 (https=)
JP (1) JP2019504534A (https=)
KR (1) KR102121137B1 (https=)
CN (1) CN108366774A (https=)
AU (1) AU2016365309B2 (https=)
CA (1) CA3006505A1 (https=)
ES (1) ES2909488T3 (https=)
TW (1) TWI705858B (https=)
WO (1) WO2017095988A1 (https=)

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