JP2019503406A - 改善された破壊モードを備えた構造用接着剤 - Google Patents

改善された破壊モードを備えた構造用接着剤 Download PDF

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Publication number
JP2019503406A
JP2019503406A JP2018526102A JP2018526102A JP2019503406A JP 2019503406 A JP2019503406 A JP 2019503406A JP 2018526102 A JP2018526102 A JP 2018526102A JP 2018526102 A JP2018526102 A JP 2018526102A JP 2019503406 A JP2019503406 A JP 2019503406A
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JP
Japan
Prior art keywords
structural adhesive
adhesive film
adhesive composition
metal
thermosetting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2018526102A
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English (en)
Japanese (ja)
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JP2019503406A5 (cg-RX-API-DMAC7.html
Inventor
エリザベス クーラ，
エリザベス クーラ，
ソハイブ エルギミャビ，
ソハイブ エルギミャビ，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
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3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
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Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2019503406A publication Critical patent/JP2019503406A/ja
Publication of JP2019503406A5 publication Critical patent/JP2019503406A5/ja
Priority to JP2022023342A priority Critical patent/JP2022065120A/ja
Priority to JP2024019129A priority patent/JP2024056831A/ja
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
    • C08G2650/56—Polyhydroxyethers, e.g. phenoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Epoxy Resins (AREA)
JP2018526102A 2015-11-19 2016-11-17 改善された破壊モードを備えた構造用接着剤 Pending JP2019503406A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2022023342A JP2022065120A (ja) 2015-11-19 2022-02-18 改善された破壊モードを備えた構造用接着剤
JP2024019129A JP2024056831A (ja) 2015-11-19 2024-02-13 改善された破壊モードを備えた構造用接着剤

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP15195469.0A EP3170877B1 (en) 2015-11-19 2015-11-19 Structural adhesive with improved failure mode
EP15195469.0 2015-11-19
PCT/US2016/062498 WO2017087651A1 (en) 2015-11-19 2016-11-17 Structural adhesive with improved failure mode

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022023342A Division JP2022065120A (ja) 2015-11-19 2022-02-18 改善された破壊モードを備えた構造用接着剤

Publications (2)

Publication Number Publication Date
JP2019503406A true JP2019503406A (ja) 2019-02-07
JP2019503406A5 JP2019503406A5 (cg-RX-API-DMAC7.html) 2019-12-26

Family

ID=54754439

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2018526102A Pending JP2019503406A (ja) 2015-11-19 2016-11-17 改善された破壊モードを備えた構造用接着剤
JP2022023342A Pending JP2022065120A (ja) 2015-11-19 2022-02-18 改善された破壊モードを備えた構造用接着剤
JP2024019129A Pending JP2024056831A (ja) 2015-11-19 2024-02-13 改善された破壊モードを備えた構造用接着剤

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2022023342A Pending JP2022065120A (ja) 2015-11-19 2022-02-18 改善された破壊モードを備えた構造用接着剤
JP2024019129A Pending JP2024056831A (ja) 2015-11-19 2024-02-13 改善された破壊モードを備えた構造用接着剤

Country Status (9)

Country Link
US (1) US20180273811A1 (cg-RX-API-DMAC7.html)
EP (2) EP3170877B1 (cg-RX-API-DMAC7.html)
JP (3) JP2019503406A (cg-RX-API-DMAC7.html)
KR (1) KR20180083413A (cg-RX-API-DMAC7.html)
CN (1) CN108291130B (cg-RX-API-DMAC7.html)
BR (1) BR112018010315A2 (cg-RX-API-DMAC7.html)
CA (1) CA3005870A1 (cg-RX-API-DMAC7.html)
MX (1) MX2018006138A (cg-RX-API-DMAC7.html)
WO (1) WO2017087651A1 (cg-RX-API-DMAC7.html)

Cited By (17)

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EP3718471A1 (en) 2019-04-03 2020-10-07 Shin-Etsu Chemical Co., Ltd. Bio-electrode composition, bio-electrode, and method for manufacturing bio-electrode
EP3854303A1 (en) 2020-01-22 2021-07-28 Shin-Etsu Chemical Co., Ltd. Bio-electrode composition, bio-electrode, and method for manufacturing bio-electrode
EP3881766A1 (en) 2020-03-19 2021-09-22 Shin-Etsu Chemical Co., Ltd. Bio-electrode, method for manufacturing bio-electrode, and method for measuring biological signal
EP3984456A1 (en) 2020-10-13 2022-04-20 Shin-Etsu Chemical Co., Ltd. Bio-electrode composition, bio-electrode, method for manufacturing bio-electrode, polymer compound, and composite
EP3995544A1 (en) 2020-11-05 2022-05-11 Shin-Etsu Chemical Co., Ltd. Bio-electrode composition, bio-electrode, and method for manufacturing bio-electrode
EP3995548A1 (en) 2020-11-05 2022-05-11 Shin-Etsu Chemical Co., Ltd. Bio-electrode composition, bio-electrode, method for manufacturing bioelectrode, and reaction composite
EP4006921A2 (en) 2020-11-26 2022-06-01 Shin-Etsu Chemical Co., Ltd. Bio-electrode composition, bio-electrode, method for manufacturing bio-electrode, and reaction composite
US11369299B2 (en) 2019-04-03 2022-06-28 Shin-Etsu Chemical Co., Ltd. Bio-electrode composition, bio-electrode, and method for manufacturing bio-electrode
EP4026860A1 (en) 2021-01-06 2022-07-13 Shin-Etsu Chemical Co., Ltd. Bio-electrode composition, bio-electrode, and method for manufacturing bio-electrode
WO2022190575A1 (ja) 2021-03-12 2022-09-15 信越化学工業株式会社 生体電極、生体電極の製造方法、及び生体信号の測定方法
EP4074754A1 (en) 2021-04-16 2022-10-19 Shin-Etsu Chemical Co., Ltd. Bio-electrode composition, bio-electrode, and method for manufacturing bio-electrode
WO2023190322A1 (ja) * 2022-03-28 2023-10-05 三菱ケミカル株式会社 接着シート
EP4309582A1 (en) 2022-07-21 2024-01-24 Shin-Etsu Chemical Co., Ltd. Bio-electrode composition, bio-electrode, and method for manufacturing the same
US11965095B2 (en) 2020-04-01 2024-04-23 Shin-Etsu Chemical Co., Ltd. Bio-electrode composition, bio-electrode, and method for manufacturing bio-electrode
EP4435803A1 (en) 2023-03-23 2024-09-25 Shin-Etsu Chemical Co., Ltd. Bio-electrode composition, bio-electrode, and method for manufacturing the same
EP4492406A1 (en) 2023-07-10 2025-01-15 Shin-Etsu Chemical Co., Ltd. Bio-electrode composition, bio-electrode, method for manufacturing bio-electrode
EP4651157A1 (en) 2024-05-16 2025-11-19 Shin-Etsu Chemical Co., Ltd. Bio-electrode composition, bio-electrode, and method for producing bio-electrode

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CN115678475A (zh) * 2022-11-17 2023-02-03 上海希奈新材料科技有限公司 一种阻燃耐水煮耐高低温冲击的双组份环氧灌封胶及制备方法和应用

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