JP2019502803A5 - - Google Patents

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Publication number
JP2019502803A5
JP2019502803A5 JP2018533247A JP2018533247A JP2019502803A5 JP 2019502803 A5 JP2019502803 A5 JP 2019502803A5 JP 2018533247 A JP2018533247 A JP 2018533247A JP 2018533247 A JP2018533247 A JP 2018533247A JP 2019502803 A5 JP2019502803 A5 JP 2019502803A5
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Japan
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composition
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JP2018533247A
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Japanese (ja)
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JP2019502803A (ja
JP6949846B2 (ja
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Priority claimed from PCT/EP2016/081847 external-priority patent/WO2017108743A1/en
Publication of JP2019502803A publication Critical patent/JP2019502803A/ja
Publication of JP2019502803A5 publication Critical patent/JP2019502803A5/ja
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JP2018533247A 2015-12-22 2016-12-20 化学機械研磨後の洗浄組成物 Active JP6949846B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP15201910 2015-12-22
EP15201910.5 2015-12-22
PCT/EP2016/081847 WO2017108743A1 (en) 2015-12-22 2016-12-20 Composition for post chemical-mechanical-polishing cleaning

Publications (3)

Publication Number Publication Date
JP2019502803A JP2019502803A (ja) 2019-01-31
JP2019502803A5 true JP2019502803A5 (https=) 2020-01-16
JP6949846B2 JP6949846B2 (ja) 2021-10-13

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ID=55023982

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018533247A Active JP6949846B2 (ja) 2015-12-22 2016-12-20 化学機械研磨後の洗浄組成物

Country Status (8)

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US (1) US10844325B2 (https=)
EP (1) EP3394234B1 (https=)
JP (1) JP6949846B2 (https=)
KR (1) KR102870073B1 (https=)
CN (1) CN108473918B (https=)
SG (1) SG11201804637UA (https=)
TW (1) TWI794152B (https=)
WO (1) WO2017108743A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6886469B2 (ja) * 2015-12-22 2021-06-16 ビーエイエスエフ・ソシエタス・エウロパエアBasf Se 化学機械研磨後の洗浄組成物
WO2019105777A1 (en) * 2017-11-29 2019-06-06 Basf Se A process for styling human hair
CN109576090A (zh) * 2018-12-13 2019-04-05 中国科学院上海光学精密机械研究所 氧化物光学元件化学机械抛光后残留物清洗剂及其制备方法
KR20260046540A (ko) * 2020-03-19 2026-04-07 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. 세정 조성물과 이를 사용하는 방법
JP2022144640A (ja) * 2021-03-19 2022-10-03 メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツング 基板処理液、これを用いる基板の製造方法およびデバイスの製造方法
MX2023011631A (es) 2021-04-01 2023-12-15 Sterilex LLC Desinfectante/higienizante en polvo sin compuesto de amonio cuaternario (quat).
CN119325501A (zh) 2022-05-31 2025-01-17 巴斯夫欧洲公司 用于清洁包含钴和铜的衬底的组合物、其用途及方法
CN121548628A (zh) 2023-06-20 2026-02-17 巴斯夫欧洲公司 用于清洁包含钴和铜的衬底的碱性组合物、其用途及方法
CN121399239A (zh) 2023-06-20 2026-01-23 巴斯夫欧洲公司 用于清洁包含钴和铜的衬底的碱性组合物、其用途及方法
WO2026057376A1 (en) 2024-09-11 2026-03-19 Basf Se Alkaline composition, its use and a process for cleaning substrates comprising cobalt and copper

Family Cites Families (16)

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Publication number Priority date Publication date Assignee Title
US3907985A (en) * 1973-07-27 1975-09-23 Burton Parsons And Company Inc Polystyrene sulfonate containing opthalmic solutions
EP0734434A1 (en) * 1993-12-14 1996-10-02 The Procter & Gamble Company Liquid laundry detergents containing polyamino acid and polyalkylene glycol
DE60006135T2 (de) * 1999-08-24 2004-07-08 Rodel Holdings, Inc., Wilmington Zusammensetzung und verfahren zum chemisch-mechanischen polieren von isolatoren und metallen
WO2008023215A1 (en) * 2006-08-23 2008-02-28 Freescale Semiconductor, Inc. Post chemical mechanical polishing rinse formulation
JP4777197B2 (ja) 2006-09-11 2011-09-21 富士フイルム株式会社 洗浄液及びそれを用いた洗浄方法
US8685909B2 (en) * 2006-09-21 2014-04-01 Advanced Technology Materials, Inc. Antioxidants for post-CMP cleaning formulations
JP5647517B2 (ja) * 2007-05-17 2014-12-24 アドバンスド テクノロジー マテリアルズ,インコーポレイテッド Cmp後洗浄配合物用の新規な酸化防止剤
CA2692254C (en) 2007-08-28 2013-12-31 Ecolab Inc. Paste-like detergent formulation comprising branched alkoxylated fatty alcohols as non-ionic surfactants
US20090056744A1 (en) 2007-08-29 2009-03-05 Micron Technology, Inc. Wafer cleaning compositions and methods
JP2009069505A (ja) 2007-09-13 2009-04-02 Tosoh Corp レジスト除去用洗浄液及び洗浄方法
KR101846597B1 (ko) * 2010-10-01 2018-04-06 미쯔비시 케미컬 주식회사 반도체 디바이스용 기판의 세정액 및 세정 방법
KR102105381B1 (ko) * 2012-02-15 2020-04-29 엔테그리스, 아이엔씨. 조성물을 이용한 cmp-후 제거 방법 및 그의 이용 방법
TWI573864B (zh) * 2012-03-14 2017-03-11 卡博特微電子公司 具有高移除率及低缺陷率之對氧化物及氮化物有選擇性之cmp組成物
EP3022280B1 (en) * 2013-07-19 2019-01-02 Ecolab USA Inc. Mild alkaline solid instrument cleaner
KR102040050B1 (ko) * 2013-08-02 2019-11-05 동우 화인켐 주식회사 웨이퍼 다이싱용 세정제 조성물
JP2015181079A (ja) * 2014-03-05 2015-10-15 三洋化成工業株式会社 磁気ディスク基板用洗浄剤組成物

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