JP2019204039A - Method for forming translucent member and method for manufacturing light-emitting device, and light-emitting device - Google Patents

Abstract

To provide a new method for imparting a fine uneven shape.SOLUTION: A method for forming a translucent member includes a step of irradiating a main surface 140a of a resin body 140X after curing containing a silicone resin via a photomask 200 having a light-shielding region 200s and a transmission region 200t with ultraviolet rays, and thereby making a height of a first region R1 corresponding to the light-shielding region of the photomask in the main surface and a height of a second region R2 corresponding to the transmission region of the photomask in the main surface different from each other.SELECTED DRAWING: Figure 1

Description

  The present disclosure relates to a method for forming a translucent member and a method for manufacturing a light emitting device. The present disclosure also relates to a light emitting device.

  As a technique for forming a fine uneven shape, an imprint method is known in which a surface shape of a mold having fine unevenness is transferred to a resin material layer. The object whose shape is transferred by the imprint method is a thermoplastic resin or an ultraviolet curable resin. In the former, after a mold is pressed against a thermoplastic resin and the thermoplastic resin is cured by heating, the mold is separated from the thermoplastic resin. In the latter, a mold that transmits ultraviolet light is pressed against the ultraviolet curable resin, and the mold is separated from the ultraviolet curable resin after the ultraviolet curable resin is cured by irradiation of ultraviolet rays through the mold.

  The imprint method is used for forming an antireflection film for a display device, for example, as disclosed in Patent Document 1 below. Alternatively, the imprint method can be used for manufacturing a polarizing film or the like. The imprint method may be applied to the formation of a resist pattern used for etching. In Patent Document 2 below, the imprint method can be applied to the formation of a mask for forming a frustum-shaped or pyramidal pattern on the surface of a semiconductor stacked portion including an n-type semiconductor layer and a p-type semiconductor layer. Explain that there is. As described above, the imprint method is also expected to be applied to the provision of uneven shapes for improving light extraction efficiency in light emitting elements typified by light emitting diodes (LEDs) and organic EL light emitting devices.

JP 2017-032806 A JP, 2006-001639, A

  According to the imprint method, it is possible to form a fine uneven shape. However, at present, there is a restriction that the object to which the shape can be imparted is either an uncured thermoplastic resin or an ultraviolet curable resin.

  According to an embodiment of the present disclosure, a method for forming a translucent member includes a main surface, and the main surface of the cured resin body including a silicone resin is irradiated with ultraviolet light through a photomask having a light shielding region and a transmission region. The height of the first region corresponding to the light-shielding region of the photomask on the main surface and the height of the second region corresponding to the transmission region of the photomask on the main surface Including different steps.

  A method of manufacturing a light emitting device according to another embodiment of the present disclosure includes a light emitting element having an upper surface and a translucent resin body having a main surface and formed by curing an uncured silicone resin raw material. A step (a) of preparing a light emitter having a resin body covering at least the upper surface of the light emitting element, and a translucent member having an uneven pattern on the surface and covering at least the upper surface of the light emitting element The step (b) includes irradiating the main surface of the resin body with ultraviolet light through a photomask having a light shielding region and a transmission region. A step (b1) of making the height of the first region corresponding to the light shielding region of the photomask different from the height of the second region corresponding to the transmission region of the photomask on the main surface.

  According to still another embodiment of the present disclosure, a method of manufacturing a light emitting device includes a step (a) of preparing a light emitting element having a top surface and having a positive electrode and a negative electrode provided on a side opposite to the top surface, And (b) forming a translucent member that covers at least the upper surface of the light emitting element, and the step (b) is formed by curing an uncured silicone resin raw material. By irradiating the surface of the translucent resin body with ultraviolet rays through a photomask having a light-shielding region and a light-transmitting region, the height of the first region corresponding to the light-shielding region of the photomask on the surface is increased. And (b1) including making the heights of the second regions corresponding to the transmission regions of the photomask different from each other on the surface.

  According to still another embodiment of the present disclosure, a method of manufacturing a light emitting device includes a step (a) of preparing a light emitting element having a top surface and having a positive electrode and a negative electrode provided on a side opposite to the top surface, And (b) forming a translucent member that covers at least the upper surface of the light emitting element, and the step (b) is formed by curing an uncured silicone resin raw material. By irradiating the main surface of the translucent sheet with ultraviolet light through a photomask having a light-shielding region and a light-transmitting region, the height of the first region corresponding to the light-shielding region of the photomask in the main surface, The step (b1) of making the height of the second region corresponding to the transmissive region of the photomask different from each other on the main surface, and the translucent sheet irradiated with ultraviolet light on the upper surface side of the light emitting element And a location for step (b2).

According to still another embodiment of the present disclosure, a light-emitting device includes a light-emitting element having an upper surface, and a translucent member that covers at least the upper surface of the light-emitting element and is located above the upper surface of the light-emitting element. with the door, the main surface of the transparent member has a pattern of irregularity is obtained by infrared spectroscopy, the absorption spectrum for the light-transmitting member wavenumber 3700 cm ^-1 of less than super 3000 cm ^-1 absorption of Si-OH caused appearing in range is greater than the absorption in the range of the absorption spectrum for silicone resin, Si-CH ₃ appearing in the vicinity of wave number 2960 cm ^-1 and around 800 cm ^-1 of the absorption spectrum for the light transmissive member absorption peak attributed, respectively, the wave number 2960 cm ^-1 and around 800 of the absorption spectra for silicone resin m ^-1 small compared with the absorption peak in the vicinity.

  According to still another embodiment of the present disclosure, a light-emitting device includes a light-emitting element having an upper surface, and a translucent member that covers at least the upper surface of the light-emitting element and is located above the upper surface of the light-emitting element. The main surface of the translucent member has an uneven pattern, and the instantaneous adhesive force of the main surface of the translucent member is lower than the instantaneous adhesive force of silicone resin.

  According to an embodiment of the present disclosure, a novel method for providing a fine uneven shape is provided.

It is a flowchart which shows the outline | summary of the manufacturing method of the translucent member by 1st Embodiment. It is a flowchart which shows the other example of the manufacturing method of the translucent member by 1st Embodiment. It is typical sectional drawing for demonstrating the exemplary manufacturing method of the translucent member by 1st Embodiment. It is typical sectional drawing for demonstrating the exemplary manufacturing method of the translucent member by 1st Embodiment. 2 is a schematic plan view showing an example of a photomask 200. FIG. 4 is a schematic cross-sectional view showing an example of a light transmissive member 140. FIG. FIG. 5 is a perspective view showing an example of a translucent member 140. It is sectional drawing which shows typically the structure of the illustrative light-emitting device obtained by the manufacturing method of the light-emitting device by 2nd Embodiment. It is a flowchart which shows an example of the manufacturing method of the light-emitting device by 2nd Embodiment. It is a figure for demonstrating the step which may be included in step S22 shown in FIG. It is typical sectional drawing which shows the exemplary structure of the light-emitting body 100U which has the light emitting element 110A and the translucent resin body 140U. It is a figure for demonstrating the step which may be included in step S21 shown in FIG. It is typical sectional drawing for demonstrating the exemplary manufacturing method of the light-emitting body 100U. It is typical sectional drawing for demonstrating the exemplary manufacturing method of the light-emitting body 100U. It is typical sectional drawing for demonstrating the exemplary manufacturing method of the light-emitting body 100U. It is typical sectional drawing for demonstrating the exemplary manufacturing method of the light-emitting body 100U. It is typical sectional drawing for demonstrating the exemplary manufacturing method of the light-emitting body 100U. It is typical sectional drawing for demonstrating the exemplary manufacturing method of the light-emitting body 100U. It is typical sectional drawing for demonstrating the manufacturing method of the light-emitting device by 2nd Embodiment. It is typical sectional drawing for demonstrating the manufacturing method of the light-emitting device by 2nd Embodiment. It is typical sectional drawing for demonstrating the manufacturing method of the light-emitting device by 2nd Embodiment. It is typical sectional drawing for demonstrating the other exemplary manufacturing method of the light-emitting body 100U. It is typical sectional drawing for demonstrating the other example of the manufacturing method of the light-emitting device by 2nd Embodiment. It is typical sectional drawing for demonstrating the other example of the manufacturing method of the light-emitting device by 2nd Embodiment. It is a schematic top view showing an example of a composite substrate 400A having a substrate 410A and a first conductive portion 411A and a second conductive portion 412A provided on the substrate 410A. It is a perspective view which shows an example of the external appearance of the light-emitting device 100B. FIG. 27 is a diagram schematically showing a cross section when the light emitting device 100B shown in FIG. 26 is cut in parallel with the YZ plane in FIG. 26 at a position near the center of the light emitting device 100B. It is a flowchart which shows another example of the manufacturing method of the light-emitting device by 2nd Embodiment. It is a figure for demonstrating the step which may be included in step S24 shown in FIG. It is typical sectional drawing for demonstrating another example of the manufacturing method of the light-emitting device by 2nd Embodiment. It is typical sectional drawing for demonstrating another example of the manufacturing method of the light-emitting device by 2nd Embodiment. It is typical sectional drawing for demonstrating another example of the manufacturing method of the light-emitting device by 2nd Embodiment. It is typical sectional drawing for demonstrating another example of the manufacturing method of the light-emitting device by 2nd Embodiment. It is typical sectional drawing for demonstrating another example of the manufacturing method of the light-emitting device by 2nd Embodiment. It is sectional drawing which shows typically another example of the light-emitting device obtained by the manufacturing method of the light-emitting device by 2nd Embodiment. FIG. 29 is a diagram for explaining another example of steps that can be included in step S24 shown in FIG. 28. It is typical sectional drawing for demonstrating another example of the manufacturing method of the light-emitting device by 2nd Embodiment. It is typical sectional drawing for demonstrating another example of the manufacturing method of the light-emitting device by 2nd Embodiment. It is typical sectional drawing for demonstrating another example of the manufacturing method of the light-emitting device by 2nd Embodiment. It is typical sectional drawing for demonstrating another example of the manufacturing method of the light-emitting device by 2nd Embodiment. It is a top view which shows typically the external appearance of the exemplary light-emitting device obtained by the manufacturing method of the light-emitting device by 3rd Embodiment. It is sectional drawing which shows typically the structure of the illustrative light-emitting device obtained by the manufacturing method of the light-emitting device by 3rd Embodiment. It is sectional drawing which shows typically the other example of the cross section of the light-emitting device obtained by the manufacturing method of the light-emitting device by 3rd Embodiment. It is a figure for demonstrating the other example of the step which may be included in step S21 shown in FIG. It is a typical top view which shows an example of the composite substrate 300F. It is a typical top view for explaining a manufacturing method of a light emitting device by a 3rd embodiment of this indication. It is typical sectional drawing for demonstrating the manufacturing method of the light-emitting device by 3rd Embodiment. It is typical sectional drawing for demonstrating the manufacturing method of the light-emitting device by 3rd Embodiment. It is typical sectional drawing for demonstrating the manufacturing method of the light-emitting device by 3rd Embodiment. It is sectional drawing which shows typically the structure of the other illustrative light-emitting device obtained by the manufacturing method of the light-emitting device by 3rd Embodiment. It is sectional drawing which shows typically the structure of the further another light-emitting device obtained by the manufacturing method of the light-emitting device by 3rd Embodiment. It is sectional drawing which shows typically the structure of the further another light-emitting device obtained by the manufacturing method of the light-emitting device by 3rd Embodiment. It is sectional drawing which shows typically the structure of the further another light-emitting device obtained by the manufacturing method of the light-emitting device by 3rd Embodiment. It is a figure which expands and shows the surface of the sample of Example 1-1. It is a figure which shows the surface shape of the sample of Example 1-1. It is a figure which shows the cross-sectional profile of the sample of Example 1-1. It is a figure which expands and shows the surface of the sample of Example 1-2. It is a figure which shows the surface shape of the sample of Example 1-2. It is a figure which expands and shows the surface of the sample of Example 1-3. It is a figure which shows the surface shape of the sample of Example 1-3. It is a figure which shows the surface shape of the resin sheet after isolation | separation of a type | mold. It is a figure which shows the surface shape of the sample of the reference example 2-1. It is a figure which shows the surface shape of the sample of the reference example 2-2. The infrared spectrum of the transmitted light regarding the sample of the reference example 3 obtained by the Fourier-transform type infrared spectrophotometer is shown. 64 is an enlarged view of a part of FIG. 64, and shows an infrared spectrum of transmitted light related to the sample of Reference Example 3. FIG. 64 is an enlarged view of a part of FIG. 64, and shows an infrared spectrum of transmitted light related to the sample of Reference Example 3. FIG. It is a figure which shows the measurement result regarding the tackiness of the surface of each sample of the reference example 3-1, reference example 3-2, and a comparative example.

  Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. The following embodiment is an exemplification, and the method for forming a light transmissive member and the method for manufacturing a light emitting device according to the present disclosure are not limited to the following embodiment. For example, the numerical values, shapes, materials, steps, order of the steps, and the like shown in the following embodiments are merely examples, and various modifications are possible as long as no technical contradiction arises.

  The dimensions, shapes, and the like of the components shown in the drawings may be exaggerated for the sake of clarity, and the size, shape, and size of the components in the actual translucent member, light-emitting device, and manufacturing device may be large or small. The relationship may not be reflected. In addition, in order to avoid the drawing from becoming excessively complicated, illustration of some elements may be omitted.

  In the following description, components having substantially the same function are denoted by common reference numerals, and description thereof may be omitted. In the following description, terms indicating a specific direction or position (eg, “up”, “down”, “right”, “left” and other terms including those terms) may be used. However, these terms only use relative directions or positions in the referenced drawings for clarity. If the relative direction or positional relationship in terms of “upper”, “lower”, etc. in the referenced drawing is the same, it is the same as the referenced drawing in drawings, actual products, manufacturing apparatuses, etc. other than this disclosure. It may not be an arrangement. In the present disclosure, “parallel” includes a case where two straight lines, sides, surfaces, and the like are in a range of about 0 ° to ± 5 ° unless otherwise specified. Further, in the present disclosure, “vertical” or “orthogonal” includes a case where two straight lines, sides, surfaces, and the like are in a range of about 90 ° to ± 5 ° unless otherwise specified.

(First embodiment)
FIG. 1 and FIG. 2 are flowcharts showing an outline of a method for manufacturing a translucent member according to the first embodiment of the present disclosure. The method for producing a translucent member illustrated in FIG. 1 is generally a process of irradiating a main surface of a resin body containing a silicone resin with ultraviolet rays through a photomask having a light shielding region and a transmission region (step). S11). As will be described later, by selectively irradiating a part of the main surface of the resin body containing the silicone resin with ultraviolet rays, the height of the region irradiated with the ultraviolet rays of the main surface and the ultraviolet rays of the main surface do not hit. The heights of the areas can be different from each other. That is, it is possible to form irregularities on the main surface of the resin body basically in a non-contact manner.

  Here, the resin body that is the target of irradiation with ultraviolet rays is basically in a cured state, and refers to a resin in a main curing state (also referred to as C-stage or total curing). However, as will be described in an embodiment described later, a resin in a pre-cured (also referred to as B-stage or semi-cured) state can be used as the resin body that is the target of ultraviolet irradiation. FIG. 1 shows a flow of an example using a resin body after main curing, and does not have a further curing step after ultraviolet irradiation. The resin body may be temporarily cured after it is once cured, and then irradiated with ultraviolet rays. On the other hand, FIG. 2 shows an example using a semi-cured resin body, and further includes a step (step S12) of curing the resin body after irradiation with ultraviolet rays, as compared with the example of FIG. As shown in FIG. 2, when a precured resin body is used, the curing process is performed in a subsequent process following the process of irradiating the main surface of the resin body with ultraviolet rays. In the case of using a resin body in a fully cured state, a further curing step is not essential in the subsequent steps. Unless otherwise specified, when only “curing” is described in this specification, “curing” refers to main curing.

  Hereinafter, an embodiment of a method for producing a translucent member will be described in detail with reference to the drawings.

  First, as shown in FIG. 3, a resin body 140X is prepared. In the example shown in FIG. 3, the resin body 140X is plate-like as a whole and has a planar main surface 140a. Here, the resin body 140X is a plate-like member. The shape of the resin body 140X is not limited to a plate shape, and may be an arbitrary shape. In FIG. 3, the shape of the main surface 140a corresponding to the upper surface of the resin body 140X may be a flat surface or a curved surface. The resin body 140X may have a thickness of about 10 μm or more and 500 μm or less, for example.

  After the resin body 140X has translucency and is provided with unevenness, the resin body 140X can be disposed as an optical member such as a protective member or a light diffusing member on the light emitting side of a light emitting element, a light emitting device, or the like. Note that the terms “translucent” and “translucent” in this specification are interpreted to include diffusibility with respect to incident light, and are not limited to being “transparent”.

  The resin body 140X is a member containing a silicone resin. The silicone resin in the resin body 140X contains an organic polysiloxane having at least one phenyl group in the molecule. Alternatively, the silicone resin in the resin body 140X contains an organic polysiloxane having a D unit in which two methyl groups are bonded to a silicon atom. The resin body 140X may contain both of these two types of organic polysiloxanes. The silicone resin in the resin body 140X may contain, for example, an organic polysiloxane having a phenyl group and having a D unit. The silicone resin composition constituting the resin body 140X may contain a modified silicone into which groups other than methyl groups and phenyl groups are introduced.

  The resin body 140X is not limited to a member substantially made of a silicone resin, and may be a composite member containing a material other than the silicone resin. For example, the resin body 140X may be a member in which a resin material containing a silicone resin is used as a base material and a light scattering filler is dispersed. As the light-scattering filler, particles of an inorganic material or an organic material having a refractive index higher than that of the base material can be used. Examples of light scattering fillers include titanium dioxide, zirconium dioxide, potassium titanate, aluminum oxide, aluminum nitride, boron nitride, mullite, niobium oxide, barium sulfate, silicon oxide, various rare earth oxides (eg, yttrium oxide, oxide) Gadolinium) and the like. The base material constituting the resin body 140X may include a resin other than the silicone resin.

  The resin body 140X may include a wavelength conversion member dispersed in the resin. When the resin body 140X includes the wavelength conversion member, the resin body 140X can absorb at least part of the incident light and emit light having a wavelength different from the wavelength of the incident light. A typical example of the wavelength conversion member is a particle such as a phosphor. A known material can be applied to the phosphor. Examples of the phosphor include a fluoride phosphor such as a YAG phosphor and a KSF phosphor, a nitride phosphor such as CASN, a β sialon phosphor, and the like. The YAG phosphor is an example of a wavelength conversion material that converts blue light into yellow light, and the KSF phosphor and CASN are examples of a wavelength conversion material that converts blue light into red light, and a β sialon phosphor Is an example of a wavelength converting material that converts blue light into green light. The phosphor may be a quantum dot phosphor.

  The resin body 140X can be prepared by purchase or production. The resin body 140X may be obtained by curing the silicone resin raw material applied on the support. For example, a cured resin body can be obtained by placing a silicone resin raw material molded into a predetermined shape such as a plate shape at a temperature of, for example, 150 ° C. for 4 hours. Transfer molding, compression molding, or the like may be applied to the formation of the resin body 140X. The range of the heating temperature of the silicone resin raw material for obtaining a cured resin body is preferably 100 ° C. or higher and 200 ° C. or lower, and more preferably 120 ° C. or higher and 180 ° C. or lower. The range of the heating time is preferably 60 minutes or more and 480 minutes or less, and more preferably 120 minutes or more and 300 minutes or less. In addition, these heating conditions are the same when either obtaining a fully cured resin body using an uncured silicone resin raw material or when obtaining a fully cured resin body using a precured silicone resin. .

  The silicone resin in the resin body 140X may be in a precured state. For example, a silicone resin material containing a silicone resin is applied onto a support such as a substrate by a coating method such as a spray method, a casting method, or a potting method, or a screen printing method, and then placed at a temperature of 150 ° C. for 0.5 hours, for example. As a result, a pre-cured resin body is obtained. The heating temperature range of the silicone resin raw material for obtaining a precured resin body is preferably 80 ° C. or higher and 200 ° C. or lower, more preferably 120 ° C. or higher and 180 ° C. or lower. The range of the heating time is preferably from 0.1 minutes to 120 minutes, and more preferably from 15 minutes to 45 minutes.

  Next, as schematically shown in FIG. 4, the ultraviolet irradiation device 500 irradiates the main surface 140a of the resin body 140X with ultraviolet rays through a photomask (step S11 in FIG. 1 and step S11 in FIG. 2). At this time, as shown in FIG. 4, a photomask 200 having a light shielding region 200s and a transmission region 200t is used. In FIG. 4, the hatched area of the photomask 200 indicates the light shielding area 200 s of the photomask 200. In FIG. 4, the white area in the photomask 200 indicates the transmission area 200 t of the photomask 200. In this example, ultraviolet irradiation is performed in a state where the photomask 200 is disposed on the main surface 140a of the resin body 140X. That is, FIG. 4 illustrates a case where the photomask 200 and the resin body 140X are in direct contact. However, it is not essential that the photomask 200 and the resin body 140X are in contact with each other. That is, the photomask 200 and the resin body 140X may be separated from each other, or another translucent member may be interposed between them.

  FIG. 5 shows an example of the photomask 200. In this example, the photomask 200 has a plurality of circular light shielding regions 200s. In the configuration illustrated in FIG. 5, the plurality of light shielding regions 200 s has a two-dimensional arrangement in which the center of each region is located on a lattice point of a triangular lattice. The photomask 200 can be manufactured in the same manner as a known reticle (or photomask) used in a semiconductor process. For example, after a light shielding film such as a chromium film is formed on the surface of a glass (typically quartz glass) sheet or a polymer film, the light shielding film is patterned by, for example, photolithography to form a light shielding region 200s. A mask 200 can be obtained. That is, the transmissive region 200t is a region in which a light shielding layer made of chromium or the like is not formed in a glass sheet or a polymer film as a support, and is a region configured to transmit ultraviolet rays.

  The arrangement pitch of the light shielding regions 200s illustrated in FIG. 5, that is, the distance between the centers of two light shielding regions 200s adjacent to each other is, for example, in the range of 0.1 μm to 3000 μm, preferably 2 μm to 100 μm, and more preferably. Is 3 μm or more and 30 μm or less. The radius of the light shielding region 200s is, for example, in the range of 0.05 μm to 1000 μm, preferably 1 μm to 50 μm, and more preferably 2 μm to 10 μm. Of course, the arrangement of the light shielding regions 200s and the shape of each of the light shielding regions 200s are not limited to the example shown in FIG. 5, and any arrangement and shape can be adopted. The distance between the centers of the two light shielding regions 200s adjacent to each other can be constant over the entire photomask 200. Alternatively, the distance between the centers of the light shielding regions 200s may be arbitrarily changed according to the light distribution characteristics to be obtained. In addition, these shapes may be the same in common among the plurality of light shielding regions 200s, or light shielding regions having different shapes or sizes may be mixed in the plurality of light shielding regions 200s. Good. The shape of the plurality of light shielding regions 200s can be set to an arbitrary shape and size according to a desired light distribution characteristic or the like.

  In FIG. 5, the photomask 200 has a rectangular outer shape. However, the outer shape of the photomask 200 is not limited to this example, and may be, for example, a square shape. Moreover, the dimension of the photomask 200 can be matched with the dimension of the resin body 140X. However, the present invention is not limited thereto, and the photomask 200 may have a larger area than the main surface 140a of the resin body 140X, or may have a smaller area than the main surface 140a. In the former case, a plurality of resin bodies 140X can be collectively irradiated with ultraviolet rays through a single photomask 200. In the latter case, the main surface 140a may be irradiated a plurality of times by a step-and-repeat method.

The irradiation amount in the ultraviolet irradiation step is, for example, 20 J / cm ² or more. There is no limitation in particular in the wavelength of the ultraviolet-ray irradiated, For example, the ultraviolet irradiation device which emits the ultraviolet-ray which has a spectrum over the wavelength range of UVA (400-315 nm)-UVC (280-140 nm) can be used. Here, a light source having a main peak wavelength of light emission of 365 nm is used.

  As schematically shown in FIG. 6, by irradiation with ultraviolet rays, the height of the first region R1 corresponding to the light shielding region 200s in the main surface 140a and the second region R2 corresponding to the transmission region 200t in the main surface 140a. It is possible to obtain the translucent member 140 having a plurality of recesses 140d on the main surface 140a with different heights. The first region R1 is a region that is shielded from the irradiation of ultraviolet rays by being covered with the light shielding region 200s in the main surface 140a. The second region R2 is a region irradiated with ultraviolet rays through the transmission region 200t in the main surface 140a. When the resin body 140X includes a pre-cured silicone resin, the resin body 140X is cured by heating (step S12 in FIG. 2) after performing the ultraviolet irradiation process, thereby transmitting a plurality of concave portions 140d. The light member 140 is obtained. In FIG. 6, the recessed portion 140d is exaggerated and drawn for convenience of explanation.

  Here, the recess 140d formed by the irradiation of ultraviolet rays through the photomask 200 has a structure formed by reducing the thickness of the portion of the resin body 140X in the first region R1. Or it is a structure formed when the thickness of the part which exists in 2nd area | region R2 among the resin bodies 140X increases, and height becomes relatively small. It should be noted that there is a difference in height (irregularities are formed) between the region irradiated with ultraviolet rays and the region not irradiated with ultraviolet rays. As will be described later with reference to the embodiment, the height difference d between the first region R1 and the second region R2 along the normal direction of the main surface 140a may be 0.1 μm or more. . The height difference d is, for example, less than 10 μm.

  FIG. 7 schematically shows an example of the translucent member 140. As shown in FIG. 7, in this example, corresponding to the fact that the light shielding regions 200 s of the photomask 200 have an arrangement in which the respective centers are located on the lattice points of the triangular lattice, the recess 140 d also has the triangular lattice lattice. It has an arrangement in which each center is located on a point. In FIG. 7, as in FIG. 6, the concave portion 140d is exaggerated and drawn for convenience of explanation. In other drawings of the present disclosure, the concave portion 140d may be exaggerated and drawn for convenience of explanation.

  Translucency with respect to light having a light emission peak wavelength of a light emitting element such as an LED or a light emitting device that can be disposed on the main surface 140a side of the translucent member 140 or the main surface 140b (the lower surface in this example) opposite to the main surface 140a. The transmittance of the member 140 is, for example, 60% or more. It is beneficial if the transmissivity of the translucent member 140 with respect to the light having the above-mentioned emission peak wavelength is 70% or more, and more advantageously 80% or more. The translucent member 140 may have a haze value of 50% or more. The haze value can be measured by a measuring method based on JIS K7136: 2000.

  As described above, according to the embodiment of the present disclosure, it is possible to impart a shape such as an uneven pattern to the main surface 140a of the resin body 140X basically in a non-contact manner without using a mold such as a mold. It is. According to the embodiment of the present disclosure, unlike a general imprint method, it is not necessary to press a mold against an object to which a shape is applied, so that occurrence of damage due to physical contact with the object to which a shape is applied can be avoided. . Further, since etching is not required for imparting the shape, no damage is caused by etching. The silicone resin in the translucent member 140 is basically in a state after being cured (after the main curing). Therefore, even when the translucent member 140 is exposed to a high temperature environment of, for example, about 300 ° C., it is possible to maintain the shape of the recess 140 d formed on the main surface 140 a. Therefore, after obtaining the translucent member 140, the translucent member 140 can be put into a process involving a high temperature.

(Second Embodiment)
FIG. 8 schematically illustrates a cross-section of an exemplary light emitting device obtained by the method for manufacturing a light emitting device according to the second embodiment of the present disclosure. A light emitting device 100A illustrated in FIG. 8 includes a light emitting element 110A, a wavelength conversion member 120A, a light guide member 130A, a light transmissive member 140A, and a light reflective member 150A.

  The light emitting element 110A is, for example, an LED, and in this example, the light emitting element 110A includes an element body 111, and a positive electrode 112A and a negative electrode 114A located on the lower surface side of the light emitting element 110A. In the configuration illustrated in FIG. 8, the upper surface of the light emitting element 110A coincides with the upper surface 111a of the element body 111, and the positive electrode 112A and the negative electrode 114A are on the lower surface 111b of the element body 111 on the opposite side of the upper surface of the light emitting element 110A. Is arranged.

The element body 111 includes, for example, a support substrate such as sapphire or gallium nitride and a semiconductor multilayer structure on the support substrate. The semiconductor stacked structure includes an active layer and an n-type semiconductor layer and a p-type semiconductor layer that sandwich the active layer. The semiconductor laminated structure may include a light emitting capable nitride semiconductor of ultraviolet to visible range _{(In x Al y Ga 1-} xy N, 0 ≦ x, 0 ≦ y, x + y ≦ 1). The positive electrode 112A and the negative electrode 114A described above have a function of supplying a predetermined current to the semiconductor stacked structure. As shown in FIG. 8, the lower surface of the positive electrode 112A and the lower surface of the negative electrode 114A are exposed from the lower surface 100b of the light emitting device 100A. Therefore, it can be said that the light emitting device 100A has a configuration suitable for mounting by flip chip connection. .

  In the configuration illustrated in FIG. 8, the light emitting device 100A includes a laminated structure of the wavelength conversion member 120A and the translucent member 140A above the upper surface 111a of the element body 111. The wavelength conversion member 120A has a side surface 120c positioned between the upper surface 120a and the lower surface 120b, and the translucent member 140A has a side surface 140c positioned between the upper surface 140a and the lower surface 140b. As illustrated, in this example, the side surface 120c of the wavelength conversion member 120A and the side surface 140c of the translucent member 140A are covered with the light reflective member 150A. The light guide member 130A has a portion located between the lower surface 120b of the wavelength conversion member 120A and the upper surface 111a of the element body 111, and another part of the light guide member 130A is the upper surface 111a and the lower surface of the element body 111. At least a part of the side surface 111c of the element body 111 located between the element body 111 and the element body 111b is covered.

  Here, the translucent member 140A has a plate-like structure similar to that of the translucent member 140 of the first embodiment. For example, as schematically illustrated in FIG. 8, for example, above the upper surface of the light emitting element 110A. The upper surface 140a located at has a plurality of recesses 140d. The thickness of the translucent member 140A is, for example, in the range of 5 μm to 100 μm, and the depth of the recess 140d is, for example, 0.1 μm or more. As will be described later, the plurality of recesses 140d can be formed in the translucent member 140A by a method substantially similar to that of the first embodiment. As will be described later with reference to examples, the instantaneous adhesive force of the translucent member 140 obtained based on the probe method described later is, for example, the instantaneous adhesive force on the surface of the silicone resin that is not intentionally irradiated with ultraviolet rays. It is in the range of 50% or less.

  The transmissivity of the translucent member 140A with respect to light having the emission peak wavelength of the light emitting element 110A is typically 60% or more. From the viewpoint of effectively using light, it is beneficial that the transmissivity of the translucent member 140A at the light emission peak wavelength of the light emitting element 110A is 70% or more, and more beneficial if it is 80% or more.

  Here, the wavelength conversion member 120A has a plate-like shape like the translucent member 140A. The wavelength conversion member 120A contains, for example, a base material such as a silicone resin and a wavelength conversion member such as a phosphor, and absorbs at least a part of the light from the light emitting element 110A and is different from the wavelength of the incident light. Emits light of wavelength.

  The light reflective member 150A has a shape surrounding the wavelength conversion member 120A, the light transmissive member 140A, and the light guide member 130A, and covers at least the side surface 111c of the element body 111. In the illustrated example, a part of the light reflective member 150A covers a region of the lower surface 111b of the element body 111 excluding the positive electrode 112A and the negative electrode 114A. In addition, the term “covering” in this specification is not limited to a mode in which a member to be covered and a member to be covered are in direct contact with each other, for example, when another member is interposed between these members. It is construed to include such an embodiment that includes a portion that is not in direct contact. In this specification, “light reflectivity” means that the reflectance at the light emission peak wavelength of the light emitting element is 60% or more. The reflectance of the light reflective member 150A at the light emission peak wavelength of the light emitting element 110A is more useful when it is 70% or more, and it is further useful when it is 80% or more. In addition, it is beneficial if the light reflective member 150A has a white color.

  FIG. 9 is a flowchart illustrating an example of a method for manufacturing a light emitting device according to the second embodiment of the present disclosure. The manufacturing method of the light-emitting device illustrated in FIG. 9 schematically includes a step of preparing a light-emitting body having a light-emitting element and a light-transmitting resin body (step S21), and a surface having an uneven pattern, Forming a translucent member that covers at least the upper surface of the light emitting element (step S22). In the example described here, the step of forming the translucent member includes a step of irradiating the main surface of the resin body with ultraviolet rays through a photomask having a light shielding region and a transmission region (step S221). The resin body to be irradiated with ultraviolet rays is, for example, a resin sheet formed by curing a silicone resin material or a resin sheet in which a silicone resin material is precured. If necessary, a step of curing the resin body (step S222) is performed after the irradiation with ultraviolet rays, as illustrated in FIG. Hereinafter, details of an exemplary manufacturing method of the light emitting device 100A shown in FIG. 8 will be described with reference to the drawings.

[Process for preparing phosphor]
First, a light emitter having a light emitting element and a translucent resin body is prepared (step S21 in FIG. 9). Here, a light emitting body 100U including a sheet-like resin body 140U disposed above the upper surface of the light emitting element 110A as illustrated in FIG. 11 is prepared. FIG. 11 schematically shows a cross section when the light emitter 100U is cut perpendicularly to the upper surface 100Ua of the light emitter 100U.

  The light emitter 100U shown in FIG. 11 further includes a wavelength conversion member 120A, a light guide member 130A, and a light reflective member 150A in addition to the light emitting element 110A and the resin body 140U. As shown in FIG. 11, the light emitter 100U includes a laminated structure of the wavelength conversion member 120A and the resin body 140U in a part thereof, and the light reflective member 150A includes the side surface 140c of the resin body 140U and the side surface of the wavelength conversion member 120A. 120c is covered. The light emitter 100U may be prepared by purchase or may be prepared by manufacturing. The light emitter 100U shown in FIG. 11 is obtained as follows, for example.

  FIG. 12 is a flowchart for explaining an exemplary manufacturing method of the light emitter 100U. The steps of preparing the light emitter 100U include, for example, a step of preparing a light emitting element having an upper surface (step S211), a step of applying an uncured translucent resin material to the upper surface of the light emitting element (step S212), And a step of arranging a resin body above the upper surface of the light emitting element by curing the light-sensitive resin material (step S213).

  First, a light emitting element 110A having an upper surface and having a positive electrode 112A and a negative electrode 114A on the lower surface 111b side opposite to the upper surface is prepared (step S211 in FIG. 12). The light emitting element 110A may be prepared by purchase.

  Next, a support 50 such as a heat-resistant adhesive sheet or substrate is prepared, and the light emitting element 110A is disposed on the support 50 with the positive electrode 112A and the negative electrode 114A facing the support 50. Here, as shown in FIG. 13, the plurality of light emitting elements 110 </ b> A are temporarily fixed to the upper surface 50 a of the support 50. For the sake of simplicity, FIG. 13 shows three light emitting elements 110A arranged along the left-right direction of the paper surface. However, the light emitting elements 110A may be two-dimensionally arranged on the upper surface 50a.

  Next, as shown in FIG. 14, a translucent first resin material 130r is applied to the upper surface 111a which is the upper surface of the light emitting element 110A by a dispenser or the like (step S212 in FIG. 12). The first resin material 130r includes, as a base material, a silicone resin, a silicone-modified resin, an epoxy resin, a phenol resin, a polycarbonate resin, an acrylic resin, a trimethylpentene resin, a polynorbornene resin, or a material containing two or more of these. Can do.

  Next, as schematically shown in FIG. 15, the wavelength conversion member 120A and the resin body 140U are disposed on the first resin material 130r, and the first resin material 130r is cured. Here, a laminated sheet of the wavelength conversion member 120A and the resin body 140U is prepared, cut into a laminated sheet piece LB of a predetermined size, and then the laminated sheet piece LB is disposed on the first resin material 130r of each light emitting element 110A. To do. After the arrangement of the laminated sheet pieces LB, the first resin material 130r is cured to form the light guide member 130A and the resin body 140U is arranged above the upper surface of the light emitting element 110A as shown in FIG. (Step S213 in FIG. 12). After the first resin material 130r is cured, the side surface 120c of the wavelength conversion member 120A and the side surface 140c of the resin body 140U may be trimmed using a dicing apparatus or the like. Thus, a plurality of light emitters each having a resin body 140U that covers at least the upper surface of the light emitting element 110A is obtained.

  The laminated sheet piece LB is prepared, for example, by preparing a phosphor sheet in which a resin in a resin material in which phosphor particles are dispersed is in a B-stage state, and a translucent resin sheet, which are heated. It can be prepared by obtaining a cut piece of a predetermined size by bonding, ultrasonic cutter or the like. The phosphor sheet can be formed from a second resin material containing a phosphor, a resin material such as a silicone resin, filler particles, and a solvent. As the phosphor, known phosphors such as the above-mentioned YAG phosphor, KSF phosphor, CASN, and β sialon phosphor can be used.

  The translucent resin sheet can be obtained, for example, by bringing the uncured silicone resin raw material containing a silicone resin as a base material into a B-stage state. The translucent resin sheet may be a sheet formed by permanently curing an uncured silicone resin raw material. The silicone resin raw material may additionally contain a light scattering filler or the like. The silicone resin as a base material typically contains an organic polysiloxane having at least one phenyl group in the molecule and / or an organic polysiloxane having a D unit. The phosphor sheet and the translucent resin can also be obtained by applying the second resin material described above onto the main surface of the translucent sheet by a coating method such as spraying, casting, or potting, and curing the second resin material. A laminated sheet of sheets can be obtained. Or you may prepare a lamination sheet or lamination sheet piece LB by purchase. A phosphor sheet and / or a translucent sheet may be prepared by purchase. The silicone resin in the translucent resin sheet may be cured in the process of curing the first resin material 130r.

  After the light guide member 130A is formed, a light reflective member that covers the side surface 111c of the element body 111 corresponding to the side surface of the light emitting element 110A is formed. For example, as shown in FIG. 17, the structure on the support 50 is covered with a light reflective resin layer 150T.

  The light reflective resin layer 150T can be formed by, for example, applying a third resin material in which a light reflective filler is dispersed to the upper surface 50a of the support 50 and then curing the third resin material. As the third resin material, a material including a silicone resin, a phenol resin, an epoxy resin, a BT resin, polyphthalamide (PPA), or the like as a base material can be used. As the light-reflective filler, the above-described light scattering particles represented by titanium dioxide particles can be used. For example, transfer molding can be applied to the formation of the light reflective resin layer 150T. In the state shown in FIG. 17, the upper surface 140a of the resin body 140U is covered with the light reflective resin layer 150T. When the translucent resin sheet constituting the laminated sheet piece LB is in a B-stage state, the silicone resin in the translucent resin sheet may be fully cured in the process of forming the light reflective resin layer 150T. Absent.

  Next, as shown in FIG. 18, the upper surface 140a of the resin body 140U is exposed by applying a grinding process or the like to remove a part of the light reflective resin layer 150T from the upper surface side of the light reflective resin layer 150T. . By executing the grinding process, a plurality of structures having the same configuration as the light emitter 100U shown in FIG. 11 is obtained on the upper surface 50a of the support 50. At this time, a part of the resin body 140U may be removed by grinding together with a part of the light reflective resin layer 150T. In this case, strictly speaking, it can be said that the upper surface 140a exposed by grinding is a surface different from the upper surface 140a before the grinding is performed, but the newly formed surface is also the upper surface 140a in the embodiment. Interpreted as included.

[Process of forming translucent member]
After the preparation of the light emitting body 100U, a translucent member having an uneven pattern on the surface and covering the upper surface of the light emitting element 110A is formed (step S22 in FIG. 9). In the present embodiment, a plurality of recesses are formed on the surface of the resin body, here, the upper surface 140a of the resin body 140U by irradiation with ultraviolet rays through a photomask.

  For example, as shown in FIG. 19, with the photomask 200 disposed on the upper surface 140a side of the resin body 140U, the upper surface 140a of the resin body 140U (for example, the resin body 140X) The main surface 140a is irradiated with ultraviolet rays (step S221 in FIG. 10). The step of forming the recesses on the surface of the resin body is the same as the example of forming the plurality of recesses 140d on the main surface 140a of the resin body 140X by partial irradiation of ultraviolet rays described with reference to FIGS. Can be executed.

  Similar to the example illustrated in FIG. 4, the photomask 200 includes a light shielding region 200 s and a transmission region 200 t. Similar to the example shown in FIG. 6, the irradiation with the ultraviolet rays through the photomask 200 positioned the height of the first region R1 covered with the light shielding region 200s in the upper surface 140a and directly below the transmission region 200t. The height of the second region R2 can be different from each other. In other words, a plurality of concave portions 140d can be formed on the upper surface 140a of the resin body 140U at positions corresponding to the light shielding regions 200s of the photomask 200 by partial irradiation with ultraviolet rays. As already described, the photomask 200 may or may not be in contact with the upper surface 140a of the resin body 140U.

  By irradiating with ultraviolet rays, as shown in FIG. 20, an assembly having a plurality of structures in which a plurality of recesses are formed on the surface of the resin body, here, the upper surface 140a of the resin body 140U is formed. That is, a translucent member 140A having a plurality of recesses 140d and covering the upper surface of the light emitting element 110A is obtained. In the case where the resin body 140U is in a pre-cured state, for example, after irradiation with ultraviolet rays, the resin body 140U is cured by heating (step S222 in FIG. 10). For example, the silicone resin in the resin body 140U can be brought into a fully cured state by placing the structure obtained on the support 50 at a temperature of 150 ° C. for 4 hours. The heating of the structure obtained on the support body 50 should just be performed as needed, and step S222 shown in FIG. 10 may be skipped.

  Further, the structure on the support 50 is cut into a desired shape by a dicing apparatus or the like. For example, as shown in FIG. 21, the light reflective resin layer 150T is cut at the positions of two light emitting elements 110A adjacent to each other. By the process of grinding and cutting the light reflective resin layer 150T, the light reflective member 150A can be formed as shown in FIG. Thereafter, the structure on the support 50 is separated from the support 50, whereby the light emitting device 100A shown in FIG. 8 is obtained.

  In the above-described example, each of the structures each including the light emitting element 110A and the resin body 140U is singulated after being irradiated with ultraviolet rays. However, the structure aggregate is singulated to emit light as follows. You may irradiate an ultraviolet-ray after obtaining the body 100U.

  As described with reference to FIG. 18, after exposing the upper surface 140a of the resin body 140U from the light-reflective resin layer 150T by grinding, for example, the assembly of the structure on the support 50 is formed into a desired shape by a dicing apparatus or the like. Cut into For example, the light reflective member 150A can be formed as shown in FIG. 22 by cutting the ground light reflective resin layer 150T at the positions of two light emitting elements 110A adjacent to each other. Thereafter, by separating the structure on the support 50 from the support 50, a light emitter 100U shown in FIG. 11 is obtained.

  After obtaining the separated luminous body 100U, a translucent member that covers the upper surface of the light emitting element 110A is formed (step S22). For example, as schematically shown in FIG. 23, in a state where the light emitter 100U is disposed on a support 60 such as an adhesive sheet or a substrate and the photomask 200 is disposed on the upper surface 100Ua, the photomask is used by the ultraviolet irradiation device 500. The upper surface 140a of the resin body 140U (for example, corresponding to the main surface 140a of the resin body 140X) is irradiated with ultraviolet rays through 200 (step S221 in FIG. 10). Also in this example, it is not essential that the photomask 200 is in contact with the upper surface 140a of the resin body 140U. As illustrated in FIG. 23, the ultraviolet irradiation may be performed on the resin bodies 140U of the plurality of light emitters 100U at once, or may be performed individually on each of the plurality of light emitters 100U. Also good.

  By irradiating with ultraviolet rays through the photomask 200, a plurality of concave portions 140d are formed on the upper surface 140a of the resin body 140U, and a translucent member 140A covering the upper surface of the light emitting element 110A is obtained. When the resin body 140U is in a pre-cured state, the resin body 140U is cured by heating (step S222 in FIG. 10). Through the above steps, a plurality of light emitting devices 100A are obtained on the support 60 as shown in FIG.

  According to the second embodiment of the present disclosure, the light extraction efficiency can be improved by providing fine irregularities on the surface of the translucent member covering the light emitting element. In the case where a light-transmitting member is disposed on the light emitting side of the light emitting element 110A as in the light emitting device 100A described above, in consideration of deterioration due to light from the light emitting element 110A, thermosetting as a material of the light transmitting member. It is beneficial to use a functional resin. According to the embodiment of the present disclosure, it is possible to form a concavo-convex pattern on the surface of the thermosetting resin basically in a non-contact manner, which is advantageous in improving the light extraction efficiency. Moreover, it is possible to form a concavo-convex pattern on the surface of a structure that can be substantially used as a light-emitting device (for example, the light-emitting body 100U). Patent Document 2 does not focus on covering the light emitting element with a resin material and further forming a concavo-convex pattern on the surface of the resin after being cured or after being cured.

  In the above-described example, after the laminated sheet piece LB is disposed on the first resin material 130r applied to the upper surface of the light emitting element 110A, the first resin material 130r is cured, and the laminated sheet piece LB is bonded above the light emitting element 110A. doing. At this time, the light guide member 130A can be formed from the first resin material 130r. The light guide member 130A has a function of reflecting light emitted from the side surface 111c of the element body 111, which is the side surface of the light emitting element 110A, toward the upper side of the light emitting device 100A. Therefore, the use efficiency of light can be improved by forming the light guide member 130A.

  Further, in the above-described example, the light-emitting device 100A is provided with the light-reflecting member 150A that surrounds the light guide member 130A and covers the region of the lower surface 111b of the element body 111 excluding the positive electrode 112A and the negative electrode 114A. Therefore, leakage of light from the side surface or the lower surface 100b of the light emitting device 100A can be suppressed, and the light use efficiency can be further improved.

  It should be noted that the resin body 140U is once embedded in the light-reflective resin layer 150T, and then the upper surface 140a of the resin body 140U is exposed from the light-reflective resin layer 150T, thereby forming irregularities on the upper surface 140a. It is. Conventionally, in a manufacturing method in which a light-transmitting member such as the resin body 140U is embedded in the light-reflective resin layer 150T, unevenness is subsequently added to the surface of the light-transmitting member that appears on the ground surface. It was difficult to do. On the other hand, according to the embodiment of the present disclosure, it is possible to give a shape to the surface of the pre-cured state or the cured resin body 140U. Therefore, after obtaining a light-emitting device that can be used as a product, it is possible to give a shape to the light-transmitting member afterwards, and the effect of improving the light extraction efficiency from the light-emitting device can be expected.

  As described with reference to FIG. 8, here, the positive electrode 112A and the negative electrode 114A are exposed from the lower surface 100b of the light emitting device 100A, and the light emitting device 100A can be mounted on a wiring board or the like by reflow, for example. In the present embodiment, similarly to the first embodiment, the shape of the recess 140d can be maintained even when the translucent member 140A is exposed to a high temperature environment. That is, the embodiment of the present disclosure is advantageous for application of a process involving a high temperature such as reflow. For example, when the light emitting device 100A is heated at a temperature of 300 ° C. for 40 minutes, the change in the depth of the recess 140d before and after heating can be within a range of 25% or less. Here, the change in the depth of the concave portion 140d is the average value of the depth of the arbitrary ten concave portions 140d before the heating is performed by Dp, and the depth of the arbitrary ten concave portions 140d after the heating is performed. Can be defined by | Dq−Dp | / Dp.

  Instead of the support 50 described above, a composite substrate 400A having a substrate 410A and a first conductive portion 411A and a second conductive portion 412A provided on the substrate 410A as illustrated in FIG. 25 is used. Also good. FIG. 25 shows an example of the appearance when the composite substrate 400A is viewed from the upper surface 400a side. The substrate 410A has a through hole 414 as schematically shown in FIG. Although not shown in FIG. 25, a part of the first conductive part 411A and a part of the second conductive part 412A extend to the lower surface opposite to the upper surface 400a through the through hole 414.

  When the substrate 410A is used, instead of temporarily fixing the plurality of light emitting elements 110A to the support 50 (see FIG. 13), for example, the plurality of light emitting elements 110A are placed on the upper surface 400a side of the composite substrate 400A by flip chip connection. Fixed. At this time, the positive electrode 112A and the negative electrode 114A of each light emitting element 110A are connected to the first conductive portion 411A and the second conductive portion 412A of the composite substrate 400A by a joining member such as solder, respectively. In addition, the rectangle drawn with the thin broken line in FIG. 25 has shown the position where 110 A of light emitting elements are arrange | positioned. After the formation of the light guide member 130A and the arrangement of the translucent resin body 140U, the structure on the upper surface 400a of the composite substrate 400A is covered with the light reflective resin layer 150T in the same manner as the process described with reference to FIG. .

  After the upper surface 140a of the resin body 140U is exposed from the light reflective resin layer 150T by grinding or the like, a plurality of recesses 140d are formed in the upper surface 140a in the same manner as the example described with reference to FIG. Thereafter, the light-reflecting resin layer 150T and the composite substrate 400A are collectively cut at a position indicated by a thick broken line CT in FIG. 25 using a dicing device or the like, whereby a plurality of light-emitting devices 100B are obtained.

  FIG. 26 shows an example of the appearance of the light emitting device 100B. FIG. 27 schematically shows a cross section of the light emitting device 100B when cut in parallel with the YZ plane in FIG. 26 at a position near the center of the light emitting device 100B. As shown in FIGS. 26 and 27, the light emitting device 100B includes a light reflective member 150B that covers the side surface 140c of the light transmissive member 140A, and a composite substrate 400B. The composite substrate 400B includes a substrate 410B, a first conductive portion 411B, and a second conductive portion 412B. As shown in FIG. 27, the first conductive portion 411B and the second conductive portion 412B emit light by the bonding member 420. The element 110A is electrically connected to the positive electrode 112A and the negative electrode 114A, respectively. In the configuration illustrated in FIG. 27, the light reflective member 150 </ b> B reaches the composite substrate 400 </ b> B and also covers the bonding member 420.

  Here, the substrate 410B, the first conductive portion 411B, and the second conductive portion 412B are part of the substrate 410A, the first conductive portion 411A, and the second conductive portion 412A shown in FIG. 25, respectively. In the configuration illustrated in FIGS. 26 and 27, the light-emitting device 100B has a shape that is longer in the Y-axis direction than the X-axis direction in the drawing, and is used as a so-called side-view type light-emitting device.

  The light emitting device 100A shown in FIG. 8 can also be obtained as follows. FIG. 28 is a flowchart illustrating yet another example of the method for manufacturing the light emitting device according to the second embodiment of the present disclosure. The manufacturing method of the light emitting device illustrated in FIG. 28 schematically includes a step of preparing a light emitting element (step S23), and a translucent member that has an uneven pattern on the surface and covers at least the upper surface of the light emitting element. (Step S24). In this example, as shown in FIG. 29, the step of forming the translucent member (step S24 in FIG. 28) uses a photomask having a light shielding region and a transmissive region on the surface of the translucent resin body. The process of irradiating with an ultraviolet ray through (step S241). The resin body to be irradiated with ultraviolet rays through the photomask is a resin sheet that includes a translucent part formed by, for example, curing a silicone resin raw material. After execution of the ultraviolet irradiation step, a step of curing the resin body (step S242) may be further executed as necessary.

  First, as shown in FIG. 30, the 1st resin layer 170 which has the translucent part 172 is prepared. The resin layer 170 may have two or more light transmitting portions 172. In the configuration illustrated in FIG. 30, the resin layer 170 includes a light reflecting resin portion 174, and the light transmitting portions 172 are separated from each other by the light reflecting resin portion 174. In this example, each light transmitting portion 172 includes a light transmitting layer 140L and a wavelength conversion layer 120L. The resin layer 170 can be obtained as follows, for example.

  First, a light reflective resin sheet is prepared. As the material of the light-reflective resin sheet, the above-described third resin material can be used. For example, the light-reflective resin sheet may be a resin sheet in which about 60% by weight of titanium dioxide and silicon oxide particles are dispersed in a silicone resin. For the formation of the light-reflective resin sheet, compression molding, transfer molding or injection molding, or molding using a printing method or a spray method can be used.

  Next, a through hole is provided in the resin sheet by punching or the like. The shape of the through hole in the top view is, for example, a rectangular shape. After the through hole is formed, the inside of the through hole is filled with, for example, the above-described second resin material containing an uncured silicone resin as a base material by a potting method, a printing method, a spray method, or the like. At this time, in the second resin material filled in the through hole, the phosphor particles are settled to cure the second resin material, thereby forming a light-transmitting portion having a phosphor concentration difference in the thickness direction. Is possible. For example, it is possible to form a translucent part in which many phosphor particles are distributed on the lower surface side. Or after arrange | positioning and hardening a transparent resin material inside a through-hole, you may provide a 2nd resin material on a transparent resin material, and you may fill a through-hole with these materials.

  If the phosphor particles are allowed to settle and the top and bottom are inverted after the second resin material is cured, a resin layer 170 having a light reflecting resin portion 174 and a plurality of light transmitting portions 172 as shown in FIG. 30 is obtained. . In the configuration illustrated in FIG. 30, the translucent layer 140 </ b> L is a layer in the translucent portion 172 that has a relatively low concentration of phosphor particles. In FIG. 30, these layers are illustrated as if there is a boundary between the wavelength conversion layer 120 </ b> L and the translucent layer 140 </ b> L, but the boundary between these layers cannot be clearly recognized. There is also. The silicone resin in the light transmitting portion 172 may be in a precured state.

  Next, a translucent first resin material 130r is applied to a region of the resin layer 170 where the translucent portion 172 is disposed by a dispenser or the like. Further, the light emitting element 110A is prepared (step S23 in FIG. 28). As shown in FIG. 31, the positive electrode 112A and the negative electrode 114A are directed to the opposite side of the resin layer 170, and the light emitting element 110A is placed on the first resin material 130r. To place. Thereby, the first resin material 130r can be disposed on at least a part of the side surface 111c of the element body 111. By curing the first resin material 130r, the light guide member 130A can be formed from the first resin material 130r.

  Next, as shown in FIG. 32, a light reflective resin layer 150T as a second resin layer covering the structure on the resin layer 170 is formed. As the material of the light reflective resin layer, the above-described third resin material can be used similarly to the material of the above-described light reflective resin sheet, that is, the material of the light reflective resin portion 174 of the resin layer 170. For example, transfer molding can be applied to the formation of the light reflective resin layer 150T.

  Next, by applying a grinding process or the like to remove a part of the light reflective resin layer 150T from the upper surface side of the light reflective resin layer 150T, as shown in FIG. 33, the positive electrodes 112A and 110A of the respective light emitting elements 110A and The negative electrode 114A is exposed from the ground surface.

  Thereafter, the resin layer 170 and the light-reflective resin layer 150T are cut at the positions of the two light emitting elements 110A adjacent to each other by a dicing device or the like, so that the light-reflective resin portion 174 and the light-reflective resin layer 150T are light-reflective. Forming member 150A, as shown in FIG. 34, a plurality of light emitters each having the same configuration as light emitter 100U shown in FIG. 11 is obtained. In this example, the translucent layer 140L and the wavelength conversion layer 120L of the translucent part 172 of the resin layer 170 correspond to the translucent resin body 140U and the wavelength conversion member 120A.

  Next, a translucent member 140A that covers at least the upper surface of the light emitting element 110A is formed from the resin body 140U. The step of forming the translucent member 140A can be performed in the same manner as the example described with reference to FIGS. 23 and 24, for example.

  For example, first, as shown in FIG. 23, the light emitter 100U is disposed on the support 60, and the photomask 200 is disposed on the upper surface 100Ua. Further, the upper surface 140a of the resin body 140U is irradiated with ultraviolet rays through the photomask 200 (step S241 in FIG. 29). This step can also be performed in the same manner as the example of the irradiation of ultraviolet rays onto the main surface 140a of the resin body 140X described with reference to FIG. A plurality of concave portions 140d can be formed on the upper surface 140a by irradiation with ultraviolet rays, and as a result, a translucent member 140A having an uneven pattern on the surface and covering the upper surface of the light emitting element 110A is obtained (FIG. 28). Step S24).

  Note that, at the stage of the resin layer 170 having the light transmitting portion 172, a plurality of concave portions 140d may be formed on the surface of the light transmitting portion 172 by the same method as the example with reference to FIGS. When the silicone resin in the resin body 140U is in the B-stage state, the resin body 140U is cured by, for example, heating (step S242 in FIG. 29) after the formation of the recess 140d, so that the translucent member 140A is provided. A light emitting device 100A is obtained.

  The step of irradiating with ultraviolet rays may be performed at the stage before separation, in other words, at the stage of an assembly of a plurality of light emitters each having the same configuration as that of the light emitter 100U. As shown in FIG. 33, after the positive electrode 112A and the negative electrode 114A are exposed from the light reflective resin layer 150T and before the light reflective resin layer 150T is cut, that is, the plurality of light emitters are light reflective. A plurality of light emitting devices 100A may be obtained by performing a step of irradiating ultraviolet rays while being integrally held by the resin layer 150T, and then cutting the light reflective resin layer 150T.

(Modification of the second embodiment)
FIG. 35 shows still another example of the light emitting device obtained by the method for manufacturing the light emitting device according to the second embodiment. A light emitting device 100C illustrated in FIG. 35 includes a light emitting element 110A, a wavelength conversion member 120A, a light guide member 130A, a light transmissive member 140A, and a light reflective member 150C, as in the example described with reference to FIG. The light-reflecting member 150C surrounds the side surface of the light-emitting element 110A and covers the area of the lower surface 111b of the element body 111 other than the area where the positive electrode 112A and the negative electrode 114A are disposed, as shown in FIG. It is the same as the light reflective member 150A of 100A. However, in this example, the light reflective member 150C does not cover the side surface 120c of the wavelength conversion member 120A and the side surface 140c of the translucent member 140A.

  The light emitting device 100C shown in FIG. 35 can be manufactured generally according to the same process as the flow shown in FIG. 28, as in the example described with reference to FIGS. However, here, as shown in FIG. 36, the step of forming the translucent member is a step of irradiating the main surface of the translucent sheet with ultraviolet rays through a photomask having a light shielding region and a transmissive region (step S243). ) And a step of placing the translucent sheet irradiated with ultraviolet rays on the upper surface side of the light emitting element (step S244). The translucent sheet to be irradiated with ultraviolet rays through a photomask is typically a sheet formed by curing an uncured silicone resin raw material. Hereinafter, details of an exemplary manufacturing method of the light emitting device 100C will be described with reference to the drawings.

  First, a light emitting element is prepared (step S23 in FIG. 28). Further, a translucent member that covers at least the upper surface of the light emitting element 110A is formed (step S24 in FIG. 28). Here, when forming the translucent member, first, a laminated sheet piece 170V having a wavelength conversion layer 120V and a translucent layer 140V as shown in FIG. 37 is prepared. In this example, the translucent layer 140V has a main surface 140Va and a main surface 140Vb, and the main surface 140Vb faces one main surface 120Va of the wavelength conversion layer 120V. As schematically shown in FIG. 37, the translucent layer 140V has a plurality of recesses 140d on the main surface 140Va. The laminated sheet piece 170V can be produced in the same manner as the laminated sheet piece LB described above, for example.

  First, a translucent resin sheet having a main surface (hereinafter simply referred to as “translucent sheet” for simplicity) is prepared. The translucent sheet can be obtained, for example, by curing an uncured silicone resin raw material. The above-described resin body 140X is an example of a translucent sheet. The translucent sheet may be in a B-stage state.

  After preparing the translucent sheet, a photomask 200 is placed on the main surface of the translucent sheet, and the main surface of the translucent sheet is irradiated with ultraviolet rays through the photomask 200 using, for example, an ultraviolet irradiation device 500 (FIG. 36). Step S243). By irradiation with ultraviolet rays through the photomask 200, the height of the first region R1 corresponding to the light-shielding region 200s of the photomask 200 in the main surface of the translucent sheet and the transmission of the photomask 200 in the main surface of the translucent sheet. The plurality of recesses 140d can be formed on the main surface of the light transmitting sheet by making the height of the second region R2 corresponding to the region 200t different from each other. The step of forming the recesses on the main surface of the translucent sheet is performed in the same manner as the example of forming the plurality of recesses 140d on the main surface 140a of the resin body 140X described with reference to FIGS. Can do.

  Through the above steps, a translucent sheet having a plurality of recesses 140d on the main surface 140a, which is similar to the translucent member 140 shown in FIG. 7, is obtained. If necessary, the translucent sheet after irradiation with ultraviolet rays is cut into a predetermined size. Here, the translucent sheet has, for example, a rectangular outer shape in a top view. Further, the wavelength conversion layer 120V is formed on the main surface opposite to the main surface 140a of the translucent sheet. By forming the wavelength conversion layer 120V, a laminated sheet piece 170V including the above-described translucent sheet as the translucent layer 140V is obtained.

  For the formation of the wavelength conversion layer 120V, a method similar to the example of the formation of the laminated sheet piece LB described above can be applied. For example, a phosphor sheet in which a resin in a resin material in which phosphor particles are dispersed is in a B-stage state is disposed on the main surface opposite to the main surface 140a of the translucent sheet, and these sheets are heated by heat. Is laminated to obtain a laminated sheet piece 170V. Or after giving the above-mentioned 2nd resin material on the main surface on the opposite side to the main surface 140a of a translucent sheet | seat, you may form the wavelength conversion layer 120V by hardening a 2nd resin material. The laminated sheet piece 170V may be prepared by purchase. The formation of the plurality of concave portions 140d may be performed after the wavelength conversion layer 120V is disposed on one main surface of the light transmitting layer 140V. For example, after forming the wavelength conversion layer 120V on one main surface of the translucent layer 140V, a plurality of recesses 140d may be formed on the main surface of the translucent sheet opposite to the wavelength conversion layer 120V.

  Thereafter, the translucent sheet irradiated with ultraviolet rays is disposed on the upper surface side of the light emitting element (step S244 in FIG. 36). Here, as schematically shown in FIG. 37, the first resin material 130r is provided on the wavelength conversion layer 120V, and the light emitting element 110A is disposed on the first resin material 130r. At this time, the light emitting element 110A is disposed on the first resin material 130r with the upper surface 111a of the element body 111 facing the laminated sheet piece 170V. Thereby, the first resin material 130r can be disposed on at least a part of the side surface 111c of the element body 111. By curing the first resin material 130r, as shown in FIG. 38, the light guide member 130A is formed, and the above-described light-transmitting sheet is disposed on the upper surface side of the light-emitting element 110A in the form of the light-transmitting layer 140V. Can do. 37 and 38, one light emitting element 110A is illustrated. However, as in the example in which a plurality of light emitting elements 110A are arranged on the resin layer 170 described with reference to FIG. It goes without saying that a plurality of light emitting elements 110A may be arranged on the piece 170V.

  Next, for example, the above-described third resin material is applied to the laminated sheet piece 170V, the structure on the laminated sheet piece 170V is covered with the third resin material, and the third resin material is cured. By curing the third resin material, as shown in FIG. 39, a light reflective resin layer 150T covering the light emitting element 110A and the light guide member 130A can be formed. For example, transfer molding can be applied to the formation of the light reflective resin layer 150T. When the silicone resin in the translucent layer 140V is in a B-stage state, the silicone resin in the translucent layer 140V can be cured in the step of forming the light reflective resin layer 150T.

  Thereafter, the positive electrode 112A and the negative electrode 114A are exposed from the ground surface by grinding or the like, and as shown in FIG. 40, the laminated sheet piece 170V and the light-reflective resin layer 150T are cut into desired shapes using a dicing apparatus or the like. Through the above steps, the translucent member 140A and the wavelength conversion member 120A are formed from the laminated sheet piece 170V, and the light reflective member 150C is formed from the light reflective resin layer 150T, whereby the light emitting device 100C shown in FIG. 35 is obtained. It is done. Here, a translucent sheet in which a plurality of concave portions 140d are formed in the translucent layer 140V of the wavelength conversion layer 120V and the translucent layer 140V of the laminated sheet piece 170V is used. However, the present invention is not limited to this example, and a phosphor sheet in which a plurality of recesses are formed by applying a method similar to the method described with reference to FIGS. 4 to 6 may be used as the wavelength conversion layer 120V. . At this time, the translucent layer 140V may be omitted, and the translucent member positioned above the upper surface of the light emitting element 110A may be formed from the wavelength conversion layer 120V.

  In the present embodiment, an example in which the main surface 140a having the recess 140d constitutes the upper surface (surface) of the light emitting device is illustrated. However, the recess 140d may not be disposed on the surface of the light emitting device. For example, the main surface 140a on which the recess 140d is formed may be opposed to the upper surface of the light emitting element or the light emitter. Alternatively, an uneven pattern may be formed on both the main surface 140a and the main surface 140b opposite to the main surface 140a. The inside of the recess 140d may be filled with air, or may be filled with a material having a refractive index different from that of the material constituting the translucent member 140A. In any case, the point that the uneven pattern is formed on the surface of the translucent member 140A is common among the above-described examples.

(Third embodiment)
41 and 42 show an example of a light emitting device obtained by the method for manufacturing a light emitting device according to the third embodiment. FIG. 41 shows an exemplary appearance of the light emitting device as viewed from the upper surface side, and FIG. 42 shows a XLII-XLII cross section of FIG.

  41 and 42 schematically includes a light emitting element 110B, a base 350 surrounding the light emitting element 110B, and a package 300 having a pair of leads 361 and 362. An element mounting recess 350e is provided in the center of the base 350 of the package 300, and the light emitting element 110B is disposed inside the element mounting recess 350e. The base 350 is formed of, for example, a third resin material in which a light-reflective filler is dispersed, and emits light reflected from the light-emitting element 110B, similarly to the above-described light-reflective members 150A to 150C. The device 100E has a function of emitting light from the upper surface 100a side to the outside. The package in the present embodiment includes a ceramic package or a metal package using ceramic as a base material in addition to the resin package as described above, which has a base made of a resin, which is an insulating material, and conductive leads. A known package for electronic components such as can be used.

  As shown in FIG. 42, a part of the upper surface 361a of the lead 361 and a part of the upper surface 362a of the lead 362 constitute a part of the bottom surface 350f of the element mounting recess 350e, and the lower surface 361b of the lead 361 and the lead 362 The lower surface 362b is exposed from the lower surface 100b of the light emitting device 100E. Here, the light emitting element 110 </ b> B is fixed on the lead 361 by the bonding member 360. The material constituting the bonding member 360 is an insulating material such as a resin material such as an epoxy resin or a silicone resin, or a conductive material such as an Ag paste.

  41 and 42, the light emitting element 110B has a positive electrode 112B and a negative electrode 114B on the upper surface 110a opposite to the lower surface 110b. Conductive wires 372 and 371 such as Au, Ag, Al, and Cu are connected to the positive electrode 112B and the negative electrode 114B, respectively. In this example, the positive electrode 112 </ b> B is electrically connected to the lead 362 by the wire 372, and the negative electrode 114 </ b> B is electrically connected to the lead 361 by the wire 371.

  The light emitting device 100E further includes a translucent member 340 located inside the element mounting recess 350e. As schematically shown in FIG. 42, the translucent member 340 covers the light emitting element 110B and the wires 371 and 372. Further, as schematically shown in FIG. 42, the translucent member 340 has a plurality of recesses 340d, for example, two-dimensionally arranged on the upper surface 340a located above the upper surface 110a of the light emitting element 110B. In this example, the upper surface 340a of the translucent member 340 is substantially aligned with the upper surface 350a of the base 350, and the upper surface 340a of the translucent member 340 constitutes the upper surface 100a of the light emitting device 100E together with the upper surface 350a. To do.

  It is not essential that the upper surface 340a of the translucent member 340 is substantially aligned with the upper surface 350a of the base 350. As schematically shown in FIG. 43, the upper surface 340a of the translucent member 340 may have a concave shape whose center is lower than that of the peripheral edge. Although not shown, the upper surface 340a of the translucent member 340 may have a convex shape with a raised center.

  Hereinafter, an exemplary manufacturing method of the light emitting device 100E will be described. The light emitting device 100E shown in FIGS. 41 and 42 can be manufactured generally according to the same process as the flow shown in FIG. However, here, in the step of preparing the light emitter, as shown in FIG. 44, the step of preparing the light emitting element having the upper surface (step S214), the light emitting element is covered with the silicone resin raw material, and the silicone resin raw material is cured. And a step of forming a resin body (step S215). The process of forming the translucent member may be the same as the example described with reference to FIG.

  When preparing the light emitter (step S21 in FIG. 9), first, the light emitting element 110B and the package 300 are prepared (step S214 in FIG. 44). Here, the package 300 can be prepared in the form of a composite substrate that includes a plurality of units each constituting the package 300. FIG. 45 shows an example of a composite substrate. A composite substrate 300F illustrated in FIG. 45 includes a conductive lead frame 360F and a base 350F provided with a plurality of element mounting recesses 350e. In FIG. 45, four of a plurality of units each including the element mounting recess 350e are extracted and shown.

  As schematically shown in FIG. 45, the lead frame 360F is disposed between a plurality of sets of the lead 361 serving as the first conductive member and the lead 362 serving as the second conductive member, and the sets adjacent to each other, and And a plurality of connecting portions 363 connecting the sets to each other. The leads 361 and 362 may have, for example, a base material made of Cu and a metal layer that covers the base material. The metal layer covering the substrate is, for example, a plating layer containing Ag, Al, Ni, Pd, Rh, Au, Cu, or an alloy thereof. The metal layer covering the substrate may be formed in the form of a laminate in which each layer includes one or more of these metal materials.

  A part of the lead 361 and a part of the lead 362 are exposed at the bottom of each element mounting recess 350e of the base 350F. Each of the sets of leads 361 and 362 facing each other in the element mounting recess 350e has a gap Gp formed by spatially separating the leads 361 and 362 from each other. The composite substrate 300F can be obtained by integrally forming the base 350F on the lead frame 360F by transfer molding or the like. The gap Gp is filled with the material constituting the base 350F.

  Next, as shown in FIG. 46, the light emitting element 110B is disposed in each element mounting recess 350e, and the positive electrode 112B and the negative electrode 114B are electrically connected to the leads 361 and 362 by wires 371 and 372, respectively.

  Furthermore, each element mounting recess 350e is filled with a silicone resin raw material containing an uncured silicone resin, and the silicone resin raw material is cured, thereby forming a translucent resin body 340Z that covers the light emitting element 110B (FIG. 44). Step S215). The silicone resin raw material for forming the resin body 340Z may be a material similar to the material of the resin body 140X described above. That is, the silicone resin in the resin body 340Z is typically an organic polysiloxane having at least one phenyl group in the molecule and / or an organic polysiloxane having a D unit in which two methyl groups are bonded to a silicon atom. Contains siloxane. The silicone resin raw material may be a raw material in which a light-scattering filler or the like is further dispersed.

  Through the above steps, as shown in FIG. 46, a repetitive structure in which a plurality of light emitters 100Y each having a light emitting element 110B and a translucent resin body 340Z as a unit is obtained. Here, in the same manner as in the example described with reference to FIGS. 19 and 23, an uneven pattern is formed on the upper surface of the resin body 340Z.

  For example, as schematically shown in FIG. 47, the light emitter 100Y is disposed on the support 60, and the photomask 200 is disposed on the opening side of the element mounting recess 350e. At this time, as shown in FIG. 47, the photomask 200 may be in contact with the resin body 340Z. When the upper surface of the resin body 340Z is concave, the photomask 200 can be disposed so as to be separated from the resin body 340Z while being in contact with the base 350F, as shown in FIG.

  Further, the upper surface 340a of the resin body 340Z (for example, corresponding to the upper surface 140a of the resin body 140U in FIGS. 19 and 23) is irradiated with ultraviolet rays through the photomask 200 by, for example, the ultraviolet irradiation device 500 (step S221 in FIG. 10). . 49, as schematically shown in FIG. 49, the height of the first region R1 corresponding to the light shielding region 200s of the photomask 200 in the upper surface 340a and the transmission region 200t of the photomask 200 in the upper surface 340a are schematically illustrated. The height of the second region R2 can be made different from each other. As a result, the translucent member 340 that covers the upper surface 110a of the light emitting element 110B and has a plurality of recesses 340d on the upper surface 340a can be formed from the resin body 340Z. Thereafter, a plurality of light emitting devices 100E can be obtained by cutting the base 350F and the connecting portion 363 of the lead frame 360F at a position between the two adjacent light emitters 100Y by a dicing device or the like.

  Prior to the formation of the resin body 340Z, a wavelength conversion member that covers the light emitting element 110B may be formed. For example, the second resin material, which is a resin material containing a phosphor, is applied inside each element mounting recess 350e so that the light emitting element 110B is covered, and the second resin material is cured to thereby change the wavelength conversion member. Form. Further, a resin body 340Z is formed on the wavelength conversion member.

  Thereafter, when the steps described with reference to FIGS. 47 and 48 are executed, the light emitting device 100F illustrated in FIG. 50 or the light emitting device 100G illustrated in FIG. 51 is obtained. The light emitting device 100F and the light emitting device 100G have a wavelength conversion member 320A that covers the light emitting element 110B and a translucent member 340 that covers the wavelength conversion member 320A inside the element mounting recess 350e. 50 and 51, the upper surface 340a of the translucent member 340 is provided with a plurality of recesses 340d. Compared with the example shown in FIG. 50, in the example shown in FIG. 51, the upper surface 340a of the translucent member 340 has a shape in which the center is depressed, and many portions of the upper surface 340a are formed on the base 350. It is in a position lower than the upper surface 350a.

  Or you may fill each element mounting recessed part 350e with a 2nd resin material using the 2nd resin material containing a silicone resin as a silicone resin raw material. After the second resin material in the element mounting recess 350e is cured to obtain a light emitter, the light emitting device illustrated in FIG. 52 can be obtained by performing the same process as described with reference to FIGS. 100H or the light emitting device 100I illustrated in FIG. 53 is obtained. The light emitting device 100H and the light emitting device 100I include a wavelength conversion member 320B that covers the light emitting element 110B in the element mounting recess 350e. As schematically shown in FIGS. 52 and 53, the wavelength conversion member 320B has a plurality of recesses 340d on the upper surface 320a. Similar to the example described with reference to FIG. 61, in the example shown in FIG. 53, the upper surface 320 a of the wavelength conversion member 320 </ b> B has a shape in which the center is recessed as compared with the example shown in FIG. 52. Many portions of the upper surface 320 a are positioned lower than the upper surface 350 a of the base 350. Thus, you may form the some recessed part 320d in the wavelength conversion member 320B as a translucent member by partial irradiation of an ultraviolet-ray.

  Similar to the second embodiment described above, according to the third embodiment of the present disclosure, it is possible to give fine irregularities to the surface of the translucent resin body covering the light emitting element, and The effect of improving the extraction efficiency can be expected. According to the third embodiment, it is possible to form a concavo-convex pattern basically in a non-contact manner on the surface of the translucent member covering the light emitting element after sealing the light emitting element with resin. Also in the present embodiment, the resin constituting the translucent member after imparting the uneven shape is in a cured state. Therefore, even when a process involving high temperature such as reflow is performed, the uneven shape on the surface of the translucent member can be maintained.

  As described above, according to the embodiment of the present disclosure, after sealing the light emitting element, it is possible to impart fine irregularities basically in a non-contact manner to the surface of the light transmitting structure that covers the light emitting element. . As is clear from the examples described with reference to FIGS. 41 to 49, the object of shape imparting by ultraviolet irradiation is not limited to a member having a plate shape. The object to be given a shape by irradiation with ultraviolet rays may be a member having a curved surface such as a dome shape. According to the embodiment of the present disclosure, after forming a translucent structure that covers the light emitting element by potting, compression molding, or the like, fine irregularities can be subsequently added to the surface of the structure.

(Example 1-1)
Samples of Example 1-1 to Example 1-3 were prepared according to the following procedure, and the surface shapes of the samples were compared before and after irradiation with ultraviolet rays.

  First, a translucent sheet formed by pre-curing a silicone resin containing an organopolysiloxane having a phenyl group in the molecule was prepared. Here, as a translucent sheet, a silicone resin (model number: KE-1011) sold by Shin-Etsu Chemical Co., Ltd. is shaped into a sheet by screen printing, and then heated at a temperature of 150 ° C. for 0.5 hours. As a result, the silicone resin was pre-cured to obtain a translucent sheet having a thickness of 100 μm.

  In addition, a photomask having a plurality of light shielding regions formed of chrome was prepared. Each shape of the light shielding region was a circular shape having a diameter of 9 μm. Further, these light shielding regions are two-dimensionally arranged on the main surface of the photomask so that the respective centers are located on the lattice points of the triangular lattice, and the center-to-center distance between two light shielding regions adjacent to each other is It was 15 μm.

Next, a photomask is disposed on one main surface of the translucent sheet, and an ultraviolet irradiation apparatus having an ultraviolet light source having a wavelength of the strongest peak at a position of 365 nm is used. The surface was irradiated with ultraviolet light. The irradiated ultraviolet rays had a spectrum over the wavelength range of UVA to UVC. At this time, the irradiation amount of ultraviolet rays was 210 J / cm ² , and the irradiation time was about 300 seconds.

  FIG. 54 is a microscopic image showing the enlarged surface of the translucent sheet after irradiation with ultraviolet rays. FIG. 55 and FIG. 56 are images obtained by a laser microscope showing the surface shape of the translucent sheet after irradiation with ultraviolet rays. FIG. 56 shows a cross-sectional profile of the translucent sheet.

  Although the detailed mechanism is unknown, when the present inventors examined these results, it was found that the surface of the region irradiated with ultraviolet rays was raised by irradiation with ultraviolet rays through a photomask. As shown in FIGS. 54 and 55, a plurality of concave portions corresponding to the pattern of the light-shielding region of the photomask are formed on the main surface of the light-transmitting sheet by raising the surface of the region irradiated with the ultraviolet rays. From FIG. 56, it was found that the portion of the surface of the translucent sheet other than the concave portion was generally flat, and the concave portion was also constituted by a generally smooth curved surface. That is, an edge is formed on a shoulder portion that connects a relatively high portion of the surface of the translucent sheet and the concave portion. In addition, the depth of the recessed part of the translucent sheet | seat surface after ultraviolet irradiation was the range of about 0.24-0.43 micrometer.

(Example 1-2)
Example 1 was performed in the same manner as the sample of Example 1-1 except that an uncured silicone resin raw material (LPS-3541 manufactured by Shin-Etsu Chemical Co., Ltd.) containing an organic polysiloxane having a D unit was used. -2 sample was produced. Here, LPS-3541 contains an organic polysiloxane having a phenyl group in the molecule, similar to the above-described KE-1011. The thickness of the translucent sheet obtained at this time was approximately 100 μm.

  FIG. 57 shows an enlarged surface of the sample of Example 1-2. FIG. 58 is an image obtained by a laser microscope, showing the surface shape of the sample of Example 1-2. From FIG. 57 and FIG. 58, it was found that a recess can be formed at a position corresponding to the light-shielding region of the photomask by partial irradiation with ultraviolet rays, as in the sample of Example 1-1. The depth of the concave portion on the surface of the translucent sheet after the ultraviolet irradiation was in the range of about 0.10 to 0.12 μm.

(Example 1-3)
A YAG phosphor powder (average particle size: 10.5 μm) was mixed in a silicone resin to prepare a silicone resin raw material in which the YAG phosphor powder was dispersed. As the silicone resin, LPS-3541 described above was used. The content of the YAG phosphor powder in the silicone resin raw material was 46% by mass. Example 1-3 is the same as the sample of Example 1-1 except that a light-transmitting sheet is formed by shaping a silicone resin raw material in which powder of YAG phosphor is dispersed into a sheet and pre-curing it. A sample of was prepared. The thickness of the translucent sheet obtained at this time was approximately 100 μm.

  FIG. 59 shows an enlarged surface of the sample of Example 1-3. FIG. 60 is an image obtained by a laser microscope and showing the surface shape of the sample of Example 1-3. 59 and 60, even in the case of a sheet formed from a raw material in which phosphor particles are dispersed, as in the sample of Example 1-1 and the sample of Example 1-2, a partial ultraviolet ray is obtained. It was found that a recess can be formed at a position corresponding to the light shielding region of the photomask by irradiation. The depth of the concave portion on the surface of the translucent sheet after the ultraviolet irradiation was in the range of about 0.45 to 0.92 μm.

  Next, the effect of heat on the shape applied to the surface of the resin sheet was verified by the following procedure.

(Reference Example 2-1 and Reference Example 2-2)
First, the above-described silicone resin LPS-3541 was shaped into a sheet by a screen printing method, and then heated at 150 ° C. for 4 hours to prepare a resin sheet having a thickness of 150 μm. Next, a mold having a plurality of convex portions on the surface was prepared. The mold is pressed against the main surface of the resin sheet with a pressure of 5 MPa using a heat press device in a state where the one main surface of the resin sheet faces the convex portion of the mold and the ambient temperature is raised to 300 ° C. Thereby, the several recessed part was formed in the main surface of a resin sheet. Here, a mold in which conical convex portions having a height of 1.5 μm are arranged two-dimensionally was used. These convex portions are two-dimensionally arranged on the surface of the mold so that the respective top portions are located on the lattice points of the triangular lattice, and the distance between the top portions between two adjacent convex portions is 3 μm. there were.

FIG. 61 shows the surface shape of the resin sheet after separation of the mold. The depth of the recess formed on the surface of the resin sheet was in the range of about 0.9 to 1.1 μm. Next, two sheets were obtained by cutting the resin sheet after separation of the mold. About one of the two sheets, the surface on which the concave portion was formed was irradiated with a dose of 22.4 J / cm ² for about 30 seconds using the ultraviolet irradiation apparatus used for the preparation of the sample of Example 1-1. Irradiated with ultraviolet rays for the irradiation time. The other sheet was not irradiated with ultraviolet rays by an ultraviolet irradiation device after forming the recess.

  Two sheets were placed in an electric furnace, placed at a temperature of 300 ° C. for 40 minutes, then taken out of the electric furnace and allowed to cool naturally to room temperature. Among these sheets, the sheet that has been irradiated with ultraviolet rays by the ultraviolet irradiation device is used as a sample of Reference Example 2-1, and the other sheet that has not been irradiated with ultraviolet rays by the ultraviolet irradiation device is referred to as Reference Example 2-2. A sample was used.

  FIG. 62 shows the surface shape of the sample of Reference Example 2-1. From a comparison between FIG. 61 and FIG. 62, it is possible to maintain the shape of the concave portion even by heating at about 300 ° C. by performing ultraviolet irradiation after imparting an uneven pattern to the surface by pressing the mold, for example. I understood. In addition, the depth of the recessed part formed in the surface of the sample of the reference example 2-1 was the range of about 0.9-1.1 micrometers. In other words, before and after heating, the change in the depth of the recess was within a range of approximately 25% or less.

  FIG. 63 shows the surface shape of the sample of Reference Example 2-2. From FIG. 63, it was found that the concave shape formed on the surface was almost lost by heating when the ultraviolet irradiation was not performed. In addition, the depth of the recessed part remaining on the surface of the sample of Reference Example 2-2 was only about 0.03 μm.

As can be seen from the comparison between FIG. 62 and FIG. 63, the surface of the resin sheet having a concave portion on the surface is irradiated with ultraviolet rays at an irradiation dose of about 20 J / cm ² or more, thereby increasing the temperature (for example, the temperature above the glass transition point). The shape of the recess can be maintained even when exposed to. This is presumably because some change occurred on the surface irradiated with ultraviolet rays and in the vicinity thereof.

(Reference Example 3)
Next, a sample of Reference Example 3 in which the resin sheet was partially irradiated with ultraviolet rays was prepared, and a spectrum was measured between a portion irradiated with ultraviolet rays and a portion not irradiated with ultraviolet rays by infrared spectroscopic analysis. A comparison was made. The sample of Reference Example 3 was produced by irradiating a part of the surface of a 150 μm thick translucent sheet formed by precuring the above-described silicone resin LPS-3541 with ultraviolet rays. Thereafter, the silicone resin in the translucent sheet was fully cured.

  FIGS. 64 to 66 show the infrared spectra of transmitted light obtained by the Fourier transform infrared spectrophotometer for the sample of Reference Example 3. FIG. In FIGS. 64 to 66, a curve K1 indicates a spectrum related to a portion not intentionally irradiated with ultraviolet rays, and a curve K2 indicates a spectrum related to a portion intentionally irradiated with ultraviolet rays. Here, a Nicolet iS50 module sold by Thermo Fisher Scientific Co., Ltd. was used for acquisition of the infrared spectrum.

Refer to FIG. FIG. 65 shows an enlarged view of the range of wave numbers from 4000 to 1300 cm ^{−1 in} the spectrum of FIG. FIG. 65 also shows a further enlarged view of the wave number range of 2000 to 1400 cm ⁻¹ . In the spectrum shown in FIG. 65, when attention is paid to the range of wave numbers of 3700 to 3000 cm ⁻¹ related to absorption derived from Si—OH, an absorption peak appears in the vicinity of the wave number of 3400 cm ⁻¹ by irradiation with ultraviolet rays. It was found that the absorption in the range of wave numbers 3700 to 3000 cm ⁻¹ increased.

Reference is also made to FIG. FIG. 66 shows an enlarged view of the range of wave numbers 1400 to 400 cm ^{−1 in} the spectrum of FIG. 64. From FIGS. 65 and 66, relating to the absorption derived from Si-CH _3, the wave number is focused on the absorption peak around 2960 cm ^-1 and 800 cm ^-1, by irradiation with ultraviolet rays, the height of each peak is lower I understood it. That is, the infrared absorption of the translucent member of the light emitting device according to the embodiment of the present disclosure basically has a wave number as compared with a silicone resin that is not intentionally irradiated with ultraviolet rays at an irradiation dose of 20 J / cm ² or more. 3700 cm ^-1 increased in a range of less than super 3000 cm ^-1, smaller in the vicinity of wave number 2960 cm ^-1 and 800 cm ^-1. From this, the irradiation of ultraviolet rays causes a change in the very shallow area of the surface of the translucent sheet irradiated with the ultraviolet rays, and the hardness of the translucent sheet is partially improved. The shape change may be suppressed.

  Next, a plurality of samples having different ultraviolet irradiation amounts were prepared, and the influence of ultraviolet irradiation on the instantaneous adhesive force on the surface of the sample was verified. In the present specification, the term “tackiness” is used without being distinguished from the term “instant adhesive force”, and these terms are used in the same meaning. The “instant adhesive force” or “tackiness” in the present specification means a value obtained by measurement by the probe method described below.

First, a resin block having a thickness of 3 mm is prepared, and a plurality of test pieces having a diameter of 16 mm are prepared by cutting from the same resin block. For these test pieces, the probe was brought into contact with the surface of the resin block using a dual column tabletop testing machine 5966 sold by Instron Japan Ltd., and then the probe was moved at a constant speed. Measure the force required to peel the probe from the surface. In the measurement, a stainless steel probe having a flat tip shape and an area of the tip surface of 1800 mm ² is used. The contact time of the probe with the surface of the resin sheet and the tensile speed of the probe are 1 second and 9 mm / min, respectively. The average of the measurement values for the three test pieces obtained by cutting from the same sheet is taken as the tackiness measurement value.

(Reference Example 3-1)
The sample of Reference Example 3-1 and Reference Example 3-2 and the sample of Comparative Example were produced by the following procedure. In the same manner as in the sample of Reference Example 2-1, the silicone resin LPS3541 manufactured by Shin-Etsu Chemical Co., Ltd. was shaped into a sheet by a screen printing method and heated at a temperature of 150 ° C. for 4 hours to obtain a thickness. A 150 μm resin sheet was prepared. However, here, the shape was not imparted by pressing the mold, and a plurality of resin sheet pieces were obtained by cutting the resin sheet. Three resin sheet pieces were extracted at random from these resin sheet pieces, and in the same manner as the sample of Reference Example 2-1, one main surface was irradiated with an irradiation amount of 240 J / cm ² and an irradiation time of about 30 seconds. Irradiated with UV light. The resin sheet piece after irradiation with ultraviolet rays was placed in an electric furnace, placed at a temperature of 300 ° C. for 40 minutes, then taken out of the electric furnace and allowed to cool naturally to room temperature, to obtain a sample of Reference Example 3-1.

(Reference Example 3-2)
A sample of Reference Example 3-2 was produced in the same manner as the sample of Reference Example 3-1, except that the amount of UV irradiation was changed to 22.4 J / cm ² .

(Comparative example)
A sample of a comparative example was produced in the same manner as the sample of Reference Example 3-1, except that ultraviolet irradiation was not performed.

  FIG. 67 shows the measurement results regarding the tackiness of the surface of each sample of Reference Example 3-1, Reference Example 3-2 and Comparative Example. In FIG. 67, the rightmost plot shows the measurement values for the sample of Reference Example 3-1, and the center plot shows the measurement values for the sample of Reference Example 3-2. In FIG. 67, the leftmost plot shows the measured values for the sample of the comparative example.

As shown in FIG. 67, the measured value of the surface tackiness of the sample of the comparative example was approximately in the range of 23 to 32 N · cm ⁻² . On the other hand, the sample of Reference Example 3-2 irradiated with ultraviolet rays at a dose of 22.4 J / cm ² exhibits a tackiness value in the range of approximately 0.1 to 8 N · cm ⁻² , and is 240 J / cm ^2. The sample of Reference Example 3-1 that was irradiated with ultraviolet rays at an irradiation amount of 1 to 10 showed a tackiness value in the range of 0.3 to 0.6 N · cm ⁻² . For this reason, there is a possibility that some change has occurred on the surface and / or in the vicinity of the surface of the resin sheet formed from the silicone resin by intentional ultraviolet irradiation. As a result, it is presumed that the tackiness of the resin surface was lowered by intentional ultraviolet irradiation. From the results shown in FIG. 67, for example, by instantaneously irradiating the surface of a resin body containing a silicone resin with ultraviolet rays at an irradiation dose of about 20 J / cm ² or more, the instantaneous adhesive force on the surface of the resin body is intentionally reduced. It has been found that it can be reduced to, for example, 50% or less of the instantaneous adhesive force on the surface of the silicone resin that has not been irradiated with ultraviolet rays.

  Embodiments of the present disclosure can be applied to, for example, the manufacture of an optical element that is disposed in front of a light source and transmits at least a portion of incident light. The embodiment of the present disclosure is particularly useful for manufacturing a light-emitting device having a light-transmitting member that covers a light-emitting element such as an LED.

100A to 100C, 100E to 100I Light emitting device 100U, 100Y Light emitter 110, 110A, 110B Light emitting element 110a Light emitting element upper surface 110b Light emitting element lower surface 112A, 112B Light emitting element positive electrode 114A, 114B Light emitting element negative electrode 120A Wavelength converting member 120L , 120V wavelength conversion layer 130A light guide member 140, 140A translucent member 140L, 140V translucent layer 140U, 140X, 340Z resin body 140a upper surface 140b lower surface 140d recess 150A-150C light reflective member 170 resin layer 170V, LB laminated sheet Piece 172 Translucent part 174 Light reflective resin part 200 Photomask 200s Photomask light-shielding area 200t Photomask transmissive area 300 Package 300F Composite substrate 320A, 320B Wavelength change Member 340 Translucent member 340Z Resin body 320d, 340d Recess 350 Base 361, 362 Lead 371, 372 Wire 400A, 400B Composite substrate 410A, 410B Substrate 411A, 411B First conductive portion 412A, 412B Second conductive portion 500 Ultraviolet irradiation apparatus

Claims (23)

  By irradiating the main surface of the cured resin body containing a silicone resin with ultraviolet light through a photomask having a light shielding region and a transmission region, the main surface of the photomask is included in the main surface. A method for forming a translucent member, comprising: making a height of a first region corresponding to a light shielding region different from a height of a second region corresponding to the transmission region of the photomask on the main surface. The method for forming a translucent member according to claim 1, wherein the irradiation amount of ultraviolet rays is 20 J / cm ² or more.   3. The method for forming a translucent member according to claim 1, wherein a difference in height between the second region and the first region after irradiation with ultraviolet rays is 0.1 μm or more.   The said silicone resin is a formation method of the translucent member in any one of Claim 1 to 3 containing the organopolysiloxane which has at least 1 phenyl group in a molecule | numerator.   The said silicone resin is a formation method of the translucent member in any one of Claim 1 to 4 containing the organic polysiloxane which has D unit in which two methyl groups couple | bonded with the silicon atom. A light-emitting element having an upper surface, and a translucent resin body having a main surface and formed by curing an uncured silicone resin raw material, the resin body covering at least the upper surface of the light-emitting element. A step (a) of preparing a luminous body having:
Forming a translucent member having an uneven pattern on the surface and covering at least the upper surface of the light emitting element (b),
In the step (b), the main surface of the resin body is irradiated with ultraviolet rays through a photomask having a light-shielding region and a transmission region, thereby corresponding to the light-shielding region of the photomask in the main surface. The manufacturing method of a light-emitting device including the process (b1) which makes the height of a 1st area | region different from the height of the 2nd area | region corresponding to the said transmissive area | region of the said photomask among the said main surfaces. The step (a)
A step of preparing the light emitting element, wherein the light emitting element has a positive electrode and a negative electrode on a side opposite to the upper surface;
A step (a2) of applying an uncured translucent resin material to the upper surface or the resin body of the light emitting element;
The method for manufacturing a light emitting device according to claim 6, further comprising: (a3) arranging the resin body above the upper surface of the light emitting element by curing the light transmissive resin material. A step (a) of preparing a light emitting element having a top surface and provided with a positive electrode and a negative electrode on a side opposite to the top surface;
Forming a translucent member having an uneven pattern on the surface and covering at least the upper surface of the light emitting element (b),
The step (b)
By irradiating the surface of the translucent resin body formed by curing the uncured silicone resin raw material with ultraviolet rays through a photomask having a light shielding region and a transmission region, the photomask of the surface (B1) differentiating the height of the first region corresponding to the light shielding region and the height of the second region corresponding to the transmission region of the photomask on the surface
A method for manufacturing a light emitting device, comprising: The step (a)
Preparing the light emitting element (a1);
The method for manufacturing a light emitting device according to claim 6, further comprising: (a2) forming the resin body by covering the light emitting element with an uncured silicone resin material and curing the silicone resin material.   9. The method according to claim 6, further comprising a step (c) of forming a light reflective member that covers at least a side surface of the light emitting element between the step (a) and the step (b). Manufacturing method of light-emitting device.   The method for manufacturing a light emitting device according to claim 6, wherein the resin body contains an organic polysiloxane having at least one phenyl group in a molecule.   The method for manufacturing a light-emitting device according to claim 6, wherein the resin body contains an organic polysiloxane having a D unit in which two methyl groups are bonded to a silicon atom. A step (a) of preparing a light emitting element having a top surface and provided with a positive electrode and a negative electrode on a side opposite to the top surface;
Forming a translucent member having an uneven pattern on the surface and covering at least the upper surface of the light emitting element (b),
The step (b)
By irradiating the main surface of the translucent sheet formed by curing the uncured silicone resin raw material with ultraviolet rays through a photomask having a light-shielding region and a transmission region, the photomask of the main surface A step (b1) of making the height of the first region corresponding to the light shielding region different from the height of the second region corresponding to the transmission region of the photomask on the main surface;
A step (b2) of disposing the translucent sheet irradiated with ultraviolet light on the upper surface side of the light emitting element.   The method for manufacturing a light emitting device according to claim 13, further comprising a step (c) of forming a light reflective member that covers at least a side surface of the light emitting element after the step (b).   The method for manufacturing a light-emitting device according to claim 13 or 14, wherein the translucent member contains an organic polysiloxane having at least one phenyl group in a molecule.   The method of manufacturing a light emitting device according to claim 13, wherein the translucent member contains an organic polysiloxane having a D unit in which two methyl groups are bonded to a silicon atom.   The method for manufacturing a light-emitting device according to claim 6, wherein a difference in height between the second region and the first region after irradiation with ultraviolet rays is 0.1 μm or more. 18. The method for manufacturing a light emitting device according to claim 6, wherein an irradiation amount of ultraviolet rays in the step (b1) is 20 J / cm ² or more. A light emitting device having an upper surface;
A translucent member covering at least the upper surface of the light emitting element and including a main surface located above the upper surface of the light emitting element;
The main surface of the translucent member has an uneven pattern,
Obtained by infrared spectroscopy, the absorption of the Si-OH caused appearing in a range of less than the wave number 3700 cm ^-1 super 3000 cm ^-1 of the absorption spectrum for the light-transmitting member is greater than the absorption in the range of the absorption spectrum for silicone resin , the absorption peak of the Si-CH ₃ due appearing in the vicinity of wave number 2960 cm ^-1 and around 800 cm ^-1 of the absorption spectrum for the light-transmitting member, respectively, near the wave number 2960 cm ^-1 and around 800 cm ^-1 of the absorption spectrum for silicone resin The light emitting device is small compared to the absorption peak. A light emitting device having an upper surface;
A translucent member covering at least the upper surface of the light emitting element and including a main surface located above the upper surface of the light emitting element;
The main surface of the translucent member has an uneven pattern,
The light emitting device, wherein an instantaneous adhesive force of the main surface of the translucent member is lower than an instantaneous adhesive force of a silicone resin.   21. The light emitting device according to claim 19, wherein a difference in height from the bottom of the concave portion to the top portion of the convex portion in the uneven pattern is 0.1 μm or more. The translucent member includes a silicone resin,
The light emitting device according to any one of claims 19 to 21, wherein the silicone resin contains an organic polysiloxane having at least one phenyl group in a molecule. The translucent member includes a silicone resin,
The light emitting device according to any one of claims 19 to 22, wherein the silicone resin contains an organic polysiloxane having a D unit in which two methyl groups are bonded to a silicon atom.

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