JP2019174254A5 - - Google Patents

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Publication number
JP2019174254A5
JP2019174254A5 JP2018062008A JP2018062008A JP2019174254A5 JP 2019174254 A5 JP2019174254 A5 JP 2019174254A5 JP 2018062008 A JP2018062008 A JP 2018062008A JP 2018062008 A JP2018062008 A JP 2018062008A JP 2019174254 A5 JP2019174254 A5 JP 2019174254A5
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Japan
Prior art keywords
sensor element
resonator
grooves
back surface
groove
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JP2018062008A
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English (en)
Japanese (ja)
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JP7030331B2 (ja
JP2019174254A (ja
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Priority to JP2018062008A priority Critical patent/JP7030331B2/ja
Priority claimed from JP2018062008A external-priority patent/JP7030331B2/ja
Publication of JP2019174254A publication Critical patent/JP2019174254A/ja
Publication of JP2019174254A5 publication Critical patent/JP2019174254A5/ja
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JP2018062008A 2018-03-28 2018-03-28 Ａｅセンサ素子及びａｅセンサ Active JP7030331B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2018062008A JP7030331B2 (ja) 2018-03-28 2018-03-28 Ａｅセンサ素子及びａｅセンサ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018062008A JP7030331B2 (ja) 2018-03-28 2018-03-28 Ａｅセンサ素子及びａｅセンサ

Publications (3)

Publication Number Publication Date
JP2019174254A JP2019174254A (ja) 2019-10-10
JP2019174254A5 true JP2019174254A5 (enrdf_load_stackoverflow) 2021-04-30
JP7030331B2 JP7030331B2 (ja) 2022-03-07

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Family Applications (1)

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JP2018062008A Active JP7030331B2 (ja) 2018-03-28 2018-03-28 Ａｅセンサ素子及びａｅセンサ

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JP (1) JP7030331B2 (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110793620B (zh) * 2019-11-28 2024-01-26 长安大学 一种噪声检测装置及检测方法
JP7508060B2 (ja) * 2020-02-07 2024-07-01 多摩川精機株式会社 Ａｅセンサ用音片アレイ配列構造、その配列構成方法、およびａｅセンサ
JP7557743B2 (ja) * 2021-04-09 2024-09-30 多摩川精機株式会社 Ａｅセンサ素子構造、ａｅセンサ用音片アレイ、およびａｅセンサ
JP7476149B2 (ja) 2021-09-14 2024-04-30 株式会社東芝 カンチレバーアレイ

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3348686B2 (ja) 1998-05-22 2002-11-20 住友金属工業株式会社 振動波検出方法及び装置
WO2000044092A1 (fr) 1999-01-20 2000-07-27 Seiko Epson Corporation Vibreur et dispositif electronique comportant un vibreur
JP2004085419A (ja) 2002-08-28 2004-03-18 Matsushita Electric Ind Co Ltd 共振子、共振子アレイおよび音響センサ
JP4539920B2 (ja) 2006-05-12 2010-09-08 国立大学法人 東京大学 振動波検出方法及び装置
JP2008008683A (ja) 2006-06-27 2008-01-17 Univ Of Tokyo 振動波検出方法及び装置
JP2011232264A (ja) 2010-04-29 2011-11-17 Seiko Epson Corp 圧電センサー、圧電センサー素子及び圧電振動片
JP2014240789A (ja) 2013-06-12 2014-12-25 ソニー株式会社 圧電デバイス及び電子機器
JP2017200014A (ja) 2016-04-26 2017-11-02 セイコーエプソン株式会社 振動片基板、振動片の製造方法、振動子、発振器、電子機器および移動体

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