JP2019174254A5 - - Google Patents

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JP2019174254A5
JP2019174254A5 JP2018062008A JP2018062008A JP2019174254A5 JP 2019174254 A5 JP2019174254 A5 JP 2019174254A5 JP 2018062008 A JP2018062008 A JP 2018062008A JP 2018062008 A JP2018062008 A JP 2018062008A JP 2019174254 A5 JP2019174254 A5 JP 2019174254A5
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Japan
Prior art keywords
sensor element
resonator
grooves
back surface
groove
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JP2018062008A
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Japanese (ja)
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JP2019174254A (en
JP7030331B2 (en
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Claims (10)

板状の水晶材によって形成されるベース部及びベース部から延びる複数の共振子を備え、
前記複数の共振子は、それぞれ異なる周波数の振動波に対して共振するように寸法設定されると共に溝部を有し、この溝部の内周面に各共振子の共振強度を検出する電極膜が形成されているAEセンサ素子。
It has a base part formed of a plate-shaped quartz material and a plurality of resonators extending from the base part.
The plurality of resonators are sized so as to resonate with vibration waves of different frequencies and have a groove portion, and an electrode film for detecting the resonance intensity of each resonator is formed on the inner peripheral surface of the groove portion. The AE sensor element that has been used.
前記溝部は、少なくとも共振子の表面及び裏面の長手方向に形成される請求項1に記載のAEセンサ素子。 The AE sensor element according to claim 1, wherein the groove is formed at least in the longitudinal direction of the front surface and the back surface of the resonator. 前記溝部は、少なくとも共振子の表面及び裏面の長手方向に一又は二以上形成される請求項1又は2に記載のAEセンサ素子。 The AE sensor element according to claim 1 or 2, wherein the groove portion is formed at least one or more in the longitudinal direction of the front surface and the back surface of the resonator. 前記AEセンサ素子が第1のAEセンサ素子と第2のAEセンサ素子とを備え、
第1のAEセンサ素子と第2のAEセンサ素子は、それぞれのベース部から延びる複数の共振子が互いに向かい合わせの状態で配置される請求項1に記載のAEセンサ素子。
The AE sensor element includes a first AE sensor element and a second AE sensor element.
The AE sensor element according to claim 1, wherein the first AE sensor element and the second AE sensor element are arranged with a plurality of resonators extending from their respective bases facing each other.
請求項1乃至4のいずれかに記載のAEセンサ素子と、AEセンサ素子を収容するケースと、を有するAEセンサ。 An AE sensor comprising the AE sensor element according to any one of claims 1 to 4 and a case accommodating the AE sensor element. 前記AEセンサ素子及びケースがウエハレベルパッケージからなる請求項5に記載のAEセンサ。 The AE sensor according to claim 5, wherein the AE sensor element and the case are made of a wafer level package. 前記AEセンサ素子及びケースが板状の水晶材からなる請求項5又は6に記載のAEセンサ。 The AE sensor according to claim 5 or 6 , wherein the AE sensor element and the case are made of a plate-shaped quartz material. 表面と裏面にそれぞれ2本ずつの溝部が対向するように設けられた共振子を備え、各溝部の内周面には電極膜が形成され、表面の2本の溝部に形成された一対の電極膜は互いに極性が異なり、裏面の2本の溝部に形成された一対の電極膜は対向する表面の溝部に形成された電極膜とは極性が異なるAEセンサ素子。A pair of electrodes having a resonator provided on the front surface and the back surface so that two grooves face each other, an electrode film is formed on the inner peripheral surface of each groove, and two grooves on the front surface are formed. The films have different polarities from each other, and the pair of electrode films formed in the two grooves on the back surface are AE sensor elements having different polarities from the electrode films formed in the grooves on the opposite surface. 表面と裏面にそれぞれ2本ずつの溝部が対向するように設けられた共振子を備え、各溝部の内周面および共振子の裏面に近い両側面にはそれぞれ電極膜が形成され、表面の2本の溝部に形成された一対の電極膜は互いに極性が異なり、裏面の2本の溝部に形成された一対の電極膜は同じ極性からなり、両側面に形成された一対の電極膜と裏面の2本の溝部に形成された一対の電極膜とは互いに極性が異なるAEセンサ素子。A resonator is provided so that two grooves are opposed to each other on the front surface and the back surface, and electrode films are formed on the inner peripheral surface of each groove portion and both side surfaces close to the back surface of the resonator. The pair of electrode films formed in the groove of the book have different polarities from each other, and the pair of electrode films formed in the two grooves on the back surface have the same polarity. An AE sensor element having different polarities from the pair of electrode films formed in the two grooves. 前記共振子の表面と裏面に設けられたそれぞれ2本ずつの溝部に隣接して1本の電界遮断溝が設けられ、該電界遮断溝は内周面に電極膜を有しない請求項8に記載のAEセンサ素子。The eighth aspect of the present invention, wherein one electric field blocking groove is provided adjacent to each of two groove portions provided on the front surface and the back surface of the resonator, and the electric field blocking groove does not have an electrode film on the inner peripheral surface. AE sensor element.
JP2018062008A 2018-03-28 2018-03-28 AE sensor element and AE sensor Active JP7030331B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2018062008A JP7030331B2 (en) 2018-03-28 2018-03-28 AE sensor element and AE sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018062008A JP7030331B2 (en) 2018-03-28 2018-03-28 AE sensor element and AE sensor

Publications (3)

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JP2019174254A JP2019174254A (en) 2019-10-10
JP2019174254A5 true JP2019174254A5 (en) 2021-04-30
JP7030331B2 JP7030331B2 (en) 2022-03-07

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Publication number Priority date Publication date Assignee Title
CN110793620B (en) * 2019-11-28 2024-01-26 长安大学 Noise detection device and detection method
JP2021124469A (en) * 2020-02-07 2021-08-30 多摩川精機株式会社 Sound piece array arrangement structure for ae sensor, arrangement construction method thereof, sound piece array for ae sensor, and ae sensor
JP7476149B2 (en) 2021-09-14 2024-04-30 株式会社東芝 Cantilever Array

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3348686B2 (en) 1998-05-22 2002-11-20 住友金属工業株式会社 Vibration wave detection method and device
WO2000044092A1 (en) 1999-01-20 2000-07-27 Seiko Epson Corporation Vibrator and electronic device with vibrator
JP2004085419A (en) 2002-08-28 2004-03-18 Matsushita Electric Ind Co Ltd Resonator, resonator array, and acoustical sensor
JP4539920B2 (en) 2006-05-12 2010-09-08 国立大学法人 東京大学 Vibration wave detection method and apparatus
JP2008008683A (en) 2006-06-27 2008-01-17 Univ Of Tokyo Oscillating wave detection method and device
JP2011232264A (en) 2010-04-29 2011-11-17 Seiko Epson Corp Piezoelectric sensor, piezoelectric sensor element and piezoelectric vibration chip
JP2014240789A (en) 2013-06-12 2014-12-25 ソニー株式会社 Piezoelectric device and electronic apparatus
JP2017200014A (en) 2016-04-26 2017-11-02 セイコーエプソン株式会社 Vibration piece substrate, manufacturing method for vibration piece, vibrator, oscillator, electronic apparatus, and movable body

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