JP2019168328A5 - - Google Patents
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- JP2019168328A5 JP2019168328A5 JP2018056309A JP2018056309A JP2019168328A5 JP 2019168328 A5 JP2019168328 A5 JP 2019168328A5 JP 2018056309 A JP2018056309 A JP 2018056309A JP 2018056309 A JP2018056309 A JP 2018056309A JP 2019168328 A5 JP2019168328 A5 JP 2019168328A5
- Authority
- JP
- Japan
- Prior art keywords
- metal member
- semiconductor chip
- inspection
- image
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 claims 22
- 238000007689 inspection Methods 0.000 claims 17
- 239000002184 metal Substances 0.000 claims 16
- 238000000034 method Methods 0.000 claims 12
- 239000000758 substrate Substances 0.000 claims 5
- 230000001678 irradiating effect Effects 0.000 claims 3
- 239000011347 resin Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 claims 2
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018056309A JP2019168328A (ja) | 2018-03-23 | 2018-03-23 | 半導体装置の検査方法及び半導体装置の製造方法 |
| US16/030,924 US10483173B2 (en) | 2018-03-23 | 2018-07-10 | Semiconductor device inspection method and semiconductor device manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018056309A JP2019168328A (ja) | 2018-03-23 | 2018-03-23 | 半導体装置の検査方法及び半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2019168328A JP2019168328A (ja) | 2019-10-03 |
| JP2019168328A5 true JP2019168328A5 (enExample) | 2020-03-05 |
Family
ID=67985643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018056309A Pending JP2019168328A (ja) | 2018-03-23 | 2018-03-23 | 半導体装置の検査方法及び半導体装置の製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US10483173B2 (enExample) |
| JP (1) | JP2019168328A (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112117251B (zh) * | 2020-09-07 | 2022-11-25 | 矽磐微电子(重庆)有限公司 | 芯片封装结构及其制作方法 |
| JP2023038765A (ja) * | 2021-09-07 | 2023-03-17 | 株式会社東芝 | 検査方法、検査装置、検査システム、プログラム、及び記憶媒体 |
| JP7700071B2 (ja) * | 2022-03-19 | 2025-06-30 | 株式会社東芝 | 半導体装置 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6411377B1 (en) * | 1991-04-02 | 2002-06-25 | Hitachi, Ltd. | Optical apparatus for defect and particle size inspection |
| JPH07139926A (ja) * | 1993-11-19 | 1995-06-02 | Hitachi Ltd | 半導体装置の封止半田突起検査方法及びその実施装置 |
| US5877859A (en) * | 1996-07-24 | 1999-03-02 | Therma-Wave, Inc. | Broadband spectroscopic rotating compensator ellipsometer |
| EP1287482A4 (en) * | 2000-04-28 | 2007-07-11 | Orametirix Inc | METHOD AND SYSTEM FOR SCANNING A SURFACE AND PRODUCING A THREE-DIMENSIONAL OBJECT |
| JP2002139453A (ja) * | 2000-11-06 | 2002-05-17 | Matsushita Electric Ind Co Ltd | 実装検査装置および実装検査方法 |
| JP4803568B2 (ja) | 2001-03-30 | 2011-10-26 | ルネサスエレクトロニクス株式会社 | 半導体集積回路の検査装置および検査方法 |
| JP4596422B2 (ja) | 2005-05-20 | 2010-12-08 | キヤノンマシナリー株式会社 | ダイボンダ用撮像装置 |
| FR2892188B1 (fr) | 2005-10-14 | 2007-12-28 | Nanotec Solution Soc Civ Ile | Procede et dispositif de mesure de hauteurs de motifs |
| JP2010112910A (ja) * | 2008-11-10 | 2010-05-20 | Nikon Corp | 形状測定装置 |
| KR101158323B1 (ko) * | 2010-10-14 | 2012-06-26 | 주식회사 고영테크놀러지 | 기판 검사방법 |
| KR101295760B1 (ko) * | 2011-03-10 | 2013-08-13 | 주식회사 미르기술 | 다중 격자 무늬를 이용한 비전검사장치 |
| JP2015148481A (ja) * | 2014-02-05 | 2015-08-20 | 株式会社 コアーズ | Bgaの平坦度計測装置およびbgaの平坦度計測方法 |
| CN104949631B (zh) * | 2014-03-27 | 2017-12-15 | 纽富来科技股份有限公司 | 曲率测定装置以及曲率测定方法 |
| JP2016146457A (ja) * | 2015-02-02 | 2016-08-12 | 株式会社東芝 | 半導体装置およびその製造方法 |
-
2018
- 2018-03-23 JP JP2018056309A patent/JP2019168328A/ja active Pending
- 2018-07-10 US US16/030,924 patent/US10483173B2/en active Active
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