JP2019167628A5 - - Google Patents

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Publication number
JP2019167628A5
JP2019167628A5 JP2019105194A JP2019105194A JP2019167628A5 JP 2019167628 A5 JP2019167628 A5 JP 2019167628A5 JP 2019105194 A JP2019105194 A JP 2019105194A JP 2019105194 A JP2019105194 A JP 2019105194A JP 2019167628 A5 JP2019167628 A5 JP 2019167628A5
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JP
Japan
Prior art keywords
process fluid
channel
distribution
distribution portion
substrate
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Application number
JP2019105194A
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English (en)
Japanese (ja)
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JP2019167628A (ja
JP7161445B2 (ja
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Priority claimed from GB1712064.3A external-priority patent/GB2564893B/en
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Publication of JP2019167628A publication Critical patent/JP2019167628A/ja
Publication of JP2019167628A5 publication Critical patent/JP2019167628A5/ja
Application granted granted Critical
Publication of JP7161445B2 publication Critical patent/JP7161445B2/ja
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JP2019105194A 2017-07-27 2019-06-05 化学および電解の少なくとも一方の表面処理のための分布システム Active JP7161445B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB1712064.3A GB2564893B (en) 2017-07-27 2017-07-27 Distribution system for chemical and/or electrolytic surface treatment
GB1712064.3 2017-07-27

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2018139053A Division JP6539390B2 (ja) 2017-07-27 2018-07-25 化学および電解の少なくとも一方の表面処理のための分布システム

Publications (3)

Publication Number Publication Date
JP2019167628A JP2019167628A (ja) 2019-10-03
JP2019167628A5 true JP2019167628A5 (enrdf_load_stackoverflow) 2021-07-26
JP7161445B2 JP7161445B2 (ja) 2022-10-26

Family

ID=59778879

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2018139053A Active JP6539390B2 (ja) 2017-07-27 2018-07-25 化学および電解の少なくとも一方の表面処理のための分布システム
JP2019105194A Active JP7161445B2 (ja) 2017-07-27 2019-06-05 化学および電解の少なくとも一方の表面処理のための分布システム

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2018139053A Active JP6539390B2 (ja) 2017-07-27 2018-07-25 化学および電解の少なくとも一方の表面処理のための分布システム

Country Status (4)

Country Link
JP (2) JP6539390B2 (enrdf_load_stackoverflow)
CN (1) CN109306474A (enrdf_load_stackoverflow)
GB (1) GB2564893B (enrdf_load_stackoverflow)
TW (2) TWI800356B (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3825445B1 (en) * 2019-11-22 2025-08-20 Semsysco GmbH Distribution body for a process fluid for chemical and/or electrolytic surface treatment of a substrate
EP3828316B1 (en) * 2019-11-26 2023-09-13 Semsysco GmbH Distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrate
EP3929332B1 (en) * 2020-06-25 2023-08-30 Semsysco GmbH Shield body system for a process fluid for chemical and/or electrolytic surface treatment of a substrate
EP4286560A1 (en) * 2022-05-31 2023-12-06 Semsysco GmbH Module kit for a chemical and/or electrolytic surface treatment of a substrate

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59208092A (ja) * 1983-05-11 1984-11-26 Hitachi Ltd 貴金属メツキ法
JPS6393897A (ja) * 1986-10-03 1988-04-25 C Uyemura & Co Ltd めつき液噴射式めつき処理装置
WO1995031590A1 (de) * 1994-05-11 1995-11-23 Siemens S.A. Vorrichtung zur behandlung von leiterplatten
JP4560181B2 (ja) * 2000-06-30 2010-10-13 アイシン高丘株式会社 燃料電池セパレータの製造方法および製造装置
JP3924537B2 (ja) * 2001-03-28 2007-06-06 富士通株式会社 電解めっき槽
JP4434948B2 (ja) * 2002-07-18 2010-03-17 株式会社荏原製作所 めっき装置及びめっき方法
DE10255884B4 (de) * 2002-11-29 2006-05-11 Atotech Deutschland Gmbh Düsenanordnung
CN100436643C (zh) * 2003-03-11 2008-11-26 株式会社荏原制作所 镀覆装置
JP4624738B2 (ja) * 2003-08-21 2011-02-02 株式会社荏原製作所 めっき装置
JP2006111976A (ja) * 2006-01-19 2006-04-27 Ebara Udylite Kk 酸性銅めっき方法および酸性銅めっき装置
KR100906662B1 (ko) * 2007-09-14 2009-07-07 강원대학교산학협력단 스러스트 자기베어링 시스템
US8366884B2 (en) * 2008-04-30 2013-02-05 Alcatel Lucent Plating apparatus with direct electrolyte distribution system
US8043434B2 (en) * 2008-10-23 2011-10-25 Lam Research Corporation Method and apparatus for removing photoresist
EP2746433B1 (en) * 2012-12-20 2016-07-20 ATOTECH Deutschland GmbH Device for vertical galvanic metal, preferably copper, deposition on a substrate and a container suitable for receiving such a device
CH710741A2 (it) * 2015-01-30 2016-08-15 Acrom S A Procedimento ecologico per la cromatura in continuo di barre e relativa apparecchiatura.
CN104862767B (zh) * 2015-05-29 2017-05-10 东莞市开美电路板设备有限公司 镀铜槽

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