JP2019167628A5 - - Google Patents

Download PDF

Info

Publication number
JP2019167628A5
JP2019167628A5 JP2019105194A JP2019105194A JP2019167628A5 JP 2019167628 A5 JP2019167628 A5 JP 2019167628A5 JP 2019105194 A JP2019105194 A JP 2019105194A JP 2019105194 A JP2019105194 A JP 2019105194A JP 2019167628 A5 JP2019167628 A5 JP 2019167628A5
Authority
JP
Japan
Prior art keywords
process fluid
channel
distribution
distribution portion
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2019105194A
Other languages
Japanese (ja)
Other versions
JP7161445B2 (en
JP2019167628A (en
Filing date
Publication date
Priority claimed from GB1712064.3A external-priority patent/GB2564893B/en
Application filed filed Critical
Publication of JP2019167628A publication Critical patent/JP2019167628A/en
Publication of JP2019167628A5 publication Critical patent/JP2019167628A5/ja
Application granted granted Critical
Publication of JP7161445B2 publication Critical patent/JP7161445B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Claims (14)

プロセス流体中における基板（３０）の化学および電解の少なくとも一方の表面処理のための分布システム（１０）であって、
分布部（２１）と、
少なくとも１つのプロセス流体入口（２３）と、
チャンネル（２４）と
を備え、
前記分布部（２１）は、前記プロセス流体および電流の少なくとも一方の流れを前記基板（３０）へ導くように構成され、
前記チャンネル（２４）は、前記分布部（２１）の外周を少なくとも部分的に囲み、
前記チャンネル（２４）の断面のサイズは、前記分布部（２１）の外周に沿って変化し、
前記分布部（２１）は、ノズルアレイ（２５）を含み、
前記チャンネル（２４）は、前記プロセス流体を前記プロセス流体入口（２３）から前記ノズルアレイ（２５）へ分布させるように構成された、
分布システム（１０）。 A distribution system (10) for the surface treatment of at least one of the chemical and electrolysis of the substrate (30) in the process fluid.
Distribution part (21) and
With at least one process fluid inlet (23),
With channel (24)
The distribution portion (21) is configured to guide at least one flow of the process fluid and the current to the substrate (30).
The channel (24) at least partially surrounds the outer circumference of the distribution portion (21).
The size of the cross section of the channel (24) varies along the outer circumference of the distribution portion (21).
The distribution portion (21) includes a nozzle array (25).
The channel (24) is configured to distribute the process fluid from the process fluid inlet (23) to the nozzle array (25).
Distribution system (10). 前記プロセス流体入口（２３）は、前記分布部（２１）に分散して配置された、請求項１に記載の分布システム（１０）。 The distribution system (10) according to claim 1, wherein the process fluid inlet (23) is dispersedly arranged in the distribution portion (21). 前記プロセス流体入口（２３）は、前記分布部（２１）に非対称に配置された、請求項１〜２のうちの何れか一項に記載の分布システム（１０）。 The distribution system (10) according to any one of claims 1 to 2, wherein the process fluid inlet (23) is asymmetrically arranged in the distribution portion (21). 前記分布部（２１）の１つの側面のみに配置された少なくとも２つの前記プロセス流体入口（２３）を備える、請求項１〜３の何れか一項に記載の分布システム（１０）。 The distribution system (10) according to any one of claims 1 to 3, comprising at least two process fluid inlets (23) arranged on only one side surface of the distribution portion (21). 前記チャンネル（２４）は、前記プロセス流体を前記分布部（２１）におけるプロセス流体の基本的に均一な流れへ分布させるように構成された、請求項１〜４のうちの何れか一項に記載の分布システム（１０）。 The channel (24) according to any one of claims 1 to 4, wherein the channel (24) is configured to distribute the process fluid in a basically uniform flow of the process fluid in the distribution section (21). Distribution system (10). 前記チャンネル（２４）は、前記プロセス流体を前記ノズルアレイ（２５）から出ていくプロセス流体の基本的に均一な出口速度へ分布させるように構成された、請求項１〜５のうちの何れか一項に記載の分布システム（１０）。 The channel (24) is any of claims 1-5 configured to distribute the process fluid to a essentially uniform outlet velocity of the process fluid exiting the nozzle array (25). The distribution system (10) according to one item. 前記チャンネル（２４）は、前記分布部（２１）の前記外周を全体的に囲む、請求項１〜６のうちの何れか一項に記載の分布システム（１０）。 The distribution system (10) according to any one of claims 1 to 6, wherein the channel (24) totally surrounds the outer circumference of the distribution portion (21). 前記チャンネル（２４）は、前記プロセス流体を少なくとも１つのプロセス流体入口（２３）から前記ノズルアレイ（２５）へ均等に分布させるように構成された、請求項１〜７のうちの何れか一項に記載のシステム（１０）。 The channel (24) is any one of claims 1 to 7, configured to evenly distribute the process fluid from at least one process fluid inlet (23) to the nozzle array (25). The system according to (10). 前記分布部（２１）および前記チャンネル（２４）は、上面図において、角のある形状を有する、請求項１〜８のうちの何れか一項に記載のシステム（１０）。 The system (10) according to any one of claims 1 to 8, wherein the distribution portion (21) and the channel (24) have an angular shape in the top view. 上面図において前記分布部（２１）は、円形状を有し、前記チャンネル（２４）は、リング形状を有する、請求項１〜８のうちの何れか一項に記載のシステム（１０）。 The system (10) according to any one of claims 1 to 8, wherein the distribution portion (21) has a circular shape and the channel (24) has a ring shape in the top view. 前記チャンネル（２４）は、矩形断面を有する、請求項１〜１０のうちの何れか一項に記載のシステム（１０）。 The system (10) according to any one of claims 1 to 10, wherein the channel (24) has a rectangular cross section. 前記チャンネル（２４）は、前記ノズルアレイ（２５）の幅の１〜２０％の範囲内、好
ましくは３〜１５％の範囲内、より好ましくは５〜１０％の範囲内の幅を有する、請求項１〜１１のうちの何れか一項に記載のシステム（１０）。 The channel (24) has a width in the range of 1 to 20%, preferably in the range of 3 to 15%, and more preferably in the range of 5 to 10% of the width of the nozzle array (25). Item 10. The system (10) according to any one of Items 1 to 11. プロセス流体中における基板（３０）の化学および電解の少なくとも一方の表面処理のためのデバイス（１００）であって、
請求項１〜１２のうちの何れか一項に記載の分布システム（１０）と、
基板ホルダ（２０）と
を備え、
前記基板ホルダ（２０）は、前記基板（３０）を保持するように構成された、デバイス（１００）。 A device (100) for surface treatment of at least one of the chemistry and electrolysis of the substrate (30) in a process fluid.
The distribution system (10) according to any one of claims 1 to 12, and the distribution system (10).
Equipped with a board holder (20)
The substrate holder (20) is a device (100) configured to hold the substrate (30). プロセス流体中における基板（３０）の化学および電解の少なくとも一方の表面処理のための分布方法であって、
前記プロセス流体および電流の少なくとも一方の流れを前記基板（３０）に導くように構成された分布部（２１）を設け、
少なくとも１つのプロセス流体入口（２３）を設け、
前記分布部（２１）の外周を少なくとも部分的に囲むチャンネル（２４）を設け、前記チャンネル（２４）の断面のサイズは、前記分布部（２１）の外周に沿って変化し、
前記チャンネル（２４）を用いて前記プロセス流体を前記プロセス流体入口（２３）から前記分布部（２１）のノズルアレイ（２５）へ分布させる
ことを含む、分布方法。 A distribution method for the surface treatment of at least one of the chemical and electrolysis of the substrate (30) in the process fluid.
A distribution portion (21) configured to guide at least one flow of the process fluid and the current to the substrate (30) is provided.
At least one process fluid inlet (23) is provided
A channel (24) is provided that at least partially surrounds the outer circumference of the distribution portion (21), and the size of the cross section of the channel (24) changes along the outer circumference of the distribution portion (21).
A distribution method comprising distributing the process fluid from the process fluid inlet (23) to the nozzle array (25) of the distribution portion (21) using the channel (24).
JP2019105194A 2017-07-27 2019-06-05 Distribution system for chemical and/or electrolytic surface treatment Active JP7161445B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB1712064.3 2017-07-27
GB1712064.3A GB2564893B (en) 2017-07-27 2017-07-27 Distribution system for chemical and/or electrolytic surface treatment

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2018139053A Division JP6539390B2 (en) 2017-07-27 2018-07-25 Distribution system for surface treatment of at least one of chemistry and electrolysis

Publications (3)

Publication Number Publication Date
JP2019167628A JP2019167628A (en) 2019-10-03
JP2019167628A5 true JP2019167628A5 (en) 2021-07-26
JP7161445B2 JP7161445B2 (en) 2022-10-26

Family

ID=59778879

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2018139053A Active JP6539390B2 (en) 2017-07-27 2018-07-25 Distribution system for surface treatment of at least one of chemistry and electrolysis
JP2019105194A Active JP7161445B2 (en) 2017-07-27 2019-06-05 Distribution system for chemical and/or electrolytic surface treatment

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2018139053A Active JP6539390B2 (en) 2017-07-27 2018-07-25 Distribution system for surface treatment of at least one of chemistry and electrolysis

Country Status (4)

Country Link
JP (2) JP6539390B2 (en)
CN (1) CN109306474A (en)
GB (1) GB2564893B (en)
TW (2) TWI759514B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3825445A1 (en) * 2019-11-22 2021-05-26 Semsysco GmbH Distribution body for a process fluid for chemical and/or electrolytic surface treatment of a substrate
EP3828316B1 (en) * 2019-11-26 2023-09-13 Semsysco GmbH Distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrate
EP4286560A1 (en) * 2022-05-31 2023-12-06 Semsysco GmbH Module kit for a chemical and/or electrolytic surface treatment of a substrate

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59208092A (en) * 1983-05-11 1984-11-26 Hitachi Ltd Plating method of noble metal
JPS6393897A (en) * 1986-10-03 1988-04-25 C Uyemura & Co Ltd Plating liquid injection type plating device
ES2114319T3 (en) * 1994-05-11 1998-05-16 Siemens Sa DEVICE FOR THE TREATMENT OF PRINTED CIRCUIT BOARDS.
JP4560181B2 (en) * 2000-06-30 2010-10-13 アイシン高丘株式会社 Method and apparatus for manufacturing fuel cell separator
JP3924537B2 (en) * 2001-03-28 2007-06-06 富士通株式会社 Electrolytic plating tank
WO2004009879A1 (en) * 2002-07-18 2004-01-29 Ebara Corporation Plating device
DE10255884B4 (en) * 2002-11-29 2006-05-11 Atotech Deutschland Gmbh nozzle assembly
CN100436643C (en) * 2003-03-11 2008-11-26 株式会社荏原制作所 Plating apparatus
JP4624738B2 (en) * 2003-08-21 2011-02-02 株式会社荏原製作所 Plating equipment
JP2006111976A (en) * 2006-01-19 2006-04-27 Ebara Udylite Kk Acid copper plating method and acid copper plating device
KR100906662B1 (en) * 2007-09-14 2009-07-07 강원대학교산학협력단 System for thrust magnetic bearing
US8366884B2 (en) * 2008-04-30 2013-02-05 Alcatel Lucent Plating apparatus with direct electrolyte distribution system
US8043434B2 (en) * 2008-10-23 2011-10-25 Lam Research Corporation Method and apparatus for removing photoresist
EP2746433B1 (en) * 2012-12-20 2016-07-20 ATOTECH Deutschland GmbH Device for vertical galvanic metal, preferably copper, deposition on a substrate and a container suitable for receiving such a device
CH710741A2 (en) * 2015-01-30 2016-08-15 Acrom S A Ecological procedure for continuous chrome plating of bars and relative equipment.
CN104862767B (en) * 2015-05-29 2017-05-10 东莞市开美电路板设备有限公司 Copper plating tank

Similar Documents

Publication Publication Date Title
JP2019167628A5 (en)
KR101775318B1 (en) Semiconductor processing reactor and components thereof
JP2010535618A5 (en)
CN109385620A (en) Substrate support with edge purification more evenly
JP2014070249A5 (en)
US9741575B2 (en) CVD apparatus with gas delivery ring
JP2014147990A5 (en)
US8297219B2 (en) Spray apparatus and coating system using same
JP2015534283A5 (en)
JP2018501405A5 (en)
JP2012524416A5 (en)
JP2009543338A5 (en)
JP2017157678A5 (en)
WO2009047668A3 (en) Device for photocatalytic treatment of fluids
EP2213762A3 (en) Coating device and deposition apparatus
JP2016195247A5 (en)
JP2016164973A5 (en)
JP2018526214A5 (en)
DE602007009105D1 (en) sprayer
JP2010051959A5 (en)
US9744539B2 (en) Container cleaning device
JP2005526884A5 (en)
JP2005086208A (en) Plasma etching apparatus
RU2481160C1 (en) Ultrasound sprayer
US20120199168A1 (en) Apparatus for cleaning a painting tool