JP2019158074A - 密閉設備 - Google Patents
密閉設備 Download PDFInfo
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- JP2019158074A JP2019158074A JP2018048421A JP2018048421A JP2019158074A JP 2019158074 A JP2019158074 A JP 2019158074A JP 2018048421 A JP2018048421 A JP 2018048421A JP 2018048421 A JP2018048421 A JP 2018048421A JP 2019158074 A JP2019158074 A JP 2019158074A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16J—PISTONS; CYLINDERS; SEALINGS
- F16J15/00—Sealings
- F16J15/02—Sealings between relatively-stationary surfaces
- F16J15/06—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces
- F16J15/10—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with non-metallic packing
- F16J15/108—Special methods for making a non-metallic packing
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16J—PISTONS; CYLINDERS; SEALINGS
- F16J15/00—Sealings
- F16J15/02—Sealings between relatively-stationary surfaces
- F16J15/021—Sealings between relatively-stationary surfaces with elastic packing
- F16J15/022—Sealings between relatively-stationary surfaces with elastic packing characterised by structure or material
- F16J15/024—Sealings between relatively-stationary surfaces with elastic packing characterised by structure or material the packing being locally weakened in order to increase elasticity
- F16J15/025—Sealings between relatively-stationary surfaces with elastic packing characterised by structure or material the packing being locally weakened in order to increase elasticity and with at least one flexible lip
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16J—PISTONS; CYLINDERS; SEALINGS
- F16J15/00—Sealings
- F16J15/02—Sealings between relatively-stationary surfaces
- F16J15/021—Sealings between relatively-stationary surfaces with elastic packing
- F16J15/022—Sealings between relatively-stationary surfaces with elastic packing characterised by structure or material
- F16J15/024—Sealings between relatively-stationary surfaces with elastic packing characterised by structure or material the packing being locally weakened in order to increase elasticity
- F16J15/027—Sealings between relatively-stationary surfaces with elastic packing characterised by structure or material the packing being locally weakened in order to increase elasticity and with a hollow profile
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16J—PISTONS; CYLINDERS; SEALINGS
- F16J15/00—Sealings
- F16J15/02—Sealings between relatively-stationary surfaces
- F16J15/06—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces
- F16J15/10—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with non-metallic packing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67376—Closed carriers characterised by sealing arrangements
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Gasket Seals (AREA)
- Magnetic Resonance Imaging Apparatus (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Separation By Low-Temperature Treatments (AREA)
Abstract
Description
まず、EFEM1(本発明の密閉設備)及びその周辺の概略構成について、図1及び図2を用いて説明する。図1は、本実施形態に係るEFEM1及びその周辺の概略的な平面図である。図2は、EFEM1の電気的構成を示す図である。図1に示すように、EFEM1は、筐体2と、搬送ロボット3と、複数のロードポート4と、制御装置5とを備える。EFEM1の後方には、半導体基板であるウェハWに所定の処理を施す基板処理装置6が配置されている。EFEM1は、筐体2内に配置された搬送ロボット3によって、ロードポート4に載置されているFOUP(Front-Opening Unified Pod)100と基板処理装置6との間でウェハWの受渡しを行う。FOUP100は、複数のウェハWを上下方向に並べて収容可能な容器であり、後端部(前後方向における筐体2側の端部)に蓋101が取り付けられている。FOUP100は、例えば、ロードポート4の上方に設けられた不図示のレールに吊り下げられて走行する、不図示のOHT(天井走行式無人搬送車)によって搬送される。OHTとロードポート4との間で、FOUP100の受渡しが行われる。
次に、筐体2及びその内部の構成について、図3〜図6を用いて説明する。図3は、筐体2の正面図である。図4は、図3のIV−IV断面図である。図5は、図3のV−V断面図である。図6は、筐体2の前面に配置された後述のシール部材61を示す図である。なお、図3においては、隔壁の図示を省略している。また、図5においては、搬送ロボット3等の図示を省略している。
シール部材61及びその周辺の詳細構成について、図6及び図7を用いて説明する。図7(a)は、図6のVII−VII断面図であり、隔壁33が柱21に取り付けられる前の状態を示す図である。図7(b)は、図7(a)に示された隔壁33が、柱21に取り付けられた後の状態を示す図である。以下の説明では、シール部材61の延びる方向を延在方向(図6参照)とする。延在方向と直交し、且つ、柱21の、シール部材61と接触する接触面21b(図7参照)と平行な方向を、シール部材61の幅方向とする。幅方向において、図7の紙面左方を外部空間7側とし、図7の紙面右方を内部空間40側とする。延在方向及び幅方向の両方と直交する方向を、シール部材61の厚み方向とする。なお、以下の説明では、例として、シール部材61の、柱21と隔壁33との間に挟まれた部分について説明するが、他の柱と隔壁との間に挟まれた部分も同様の構成を有する。
2 筐体
5 制御装置(制御部)
7 外部空間
21〜26 柱(フレーム部材)
31、32 隔壁(フレーム部材)
33〜36 隔壁(カバー部材)
37 支持板(フレーム部材)
38 開口
40 内部空間
61 シール部材
66a 中空部
66b ガス抜き穴
67 突出部
77 スペーサ
112 供給バルブ(ガス供給手段)
113 排出バルブ(ガス排出手段)
Claims (7)
- 筐体の内部空間と外部空間との間に所定値以下の圧力差が存在する密閉設備であって、
前記筐体は、
開口が形成されるように組まれたフレーム部材と、
前記開口を覆うように前記フレーム部材に取り付けられたカバー部材と、
前記フレーム部材と前記カバー部材との間に挟まれ、前記開口を囲むように延びているシール部材と、を有し、
前記フレーム部材及び前記カバー部材は、板金で形成されており、
前記シール部材は、その延在方向に直交する断面が中空形状を有する弾性部材であることを特徴とする密閉設備。 - 前記シール部材には、前記シール部材の中空部と前記外部空間とを連通させるガス抜き穴が形成されていることを特徴とする請求項1に記載の密閉設備。
- 前記フレーム部材と前記カバー部材との間に、スペーサが配置されていることを特徴とする請求項1又は2に記載の密閉設備。
- 前記シール部材は、
前記フレーム部材及び前記カバー部材のうち一方との接触部分に形成された突出部を有し、
前記突出部は、
前記延在方向と直交し、且つ、前記一方における前記シール部材との接触面に平行な、前記シール部材の幅方向に延びていることを特徴とする請求項1〜3のいずれかに記載の密閉設備。 - 前記突出部は、前記幅方向において、前記内部空間及び前記外部空間のうち圧力が低い空間側にのみ形成されていることを特徴とする請求項4に記載の密閉設備。
- 筐体の内部空間と外部空間との間に3000Pa以下の圧力差が存在する密閉設備であって、
前記筐体は、
開口が形成されるように組まれたフレーム部材と、
前記開口を覆うように前記フレーム部材に取り付けられたカバー部材と、
前記フレーム部材と前記カバー部材との間に挟まれ、前記開口を囲むように延びているシール部材と、を有し、
前記フレーム部材及び前記カバー部材の少なくとも一方は、厚さ6mm以下の板金で形成されており、
前記フレーム部材とカバー部材の前記シール部材と接触する接触面は、0.5mm/m〜5mm/mの平坦度を有し、
前記シール部材は、その延在方向に直交する断面が中空形状を有する弾性部材であることを特徴とする密閉設備。 - 不活性ガスを供給可能なガス供給手段と、
前記内部空間内のガスを排出するガス排出手段と、
前記ガス供給手段及び前記ガス排出手段を制御する制御部と、を備え、
前記制御部は、
前記ガス供給手段により前記内部空間200L/min以下の前記不活性ガスを供給するとともに、前記ガスの供給量又は前記内部空間の圧力に応じて前記ガス排出手段により前記ガスを排出することで、前記内部空間の酸素濃度を100ppm未満にすることを特徴とする請求項1〜6のいずれかに記載の密閉設備。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018048421A JP7132483B2 (ja) | 2018-03-15 | 2018-03-15 | 密閉設備 |
TW107128713A TWI785096B (zh) | 2018-03-15 | 2018-08-17 | 密閉設備 |
CN201980019550.9A CN111989512B (zh) | 2018-03-15 | 2019-03-13 | 密封设备 |
US16/980,638 US12055220B2 (en) | 2018-03-15 | 2019-03-13 | Sealing equipment |
KR1020207026452A KR20200130305A (ko) | 2018-03-15 | 2019-03-13 | 밀폐 설비 |
PCT/JP2019/010351 WO2019177047A1 (ja) | 2018-03-15 | 2019-03-13 | 密閉設備 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018048421A JP7132483B2 (ja) | 2018-03-15 | 2018-03-15 | 密閉設備 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019158074A true JP2019158074A (ja) | 2019-09-19 |
JP7132483B2 JP7132483B2 (ja) | 2022-09-07 |
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ID=67906755
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2018048421A Active JP7132483B2 (ja) | 2018-03-15 | 2018-03-15 | 密閉設備 |
Country Status (6)
Country | Link |
---|---|
US (1) | US12055220B2 (ja) |
JP (1) | JP7132483B2 (ja) |
KR (1) | KR20200130305A (ja) |
CN (1) | CN111989512B (ja) |
TW (1) | TWI785096B (ja) |
WO (1) | WO2019177047A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11049740B1 (en) * | 2019-12-05 | 2021-06-29 | Applied Materials, Inc. | Reconfigurable mainframe with replaceable interface plate |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007046657A (ja) * | 2005-08-08 | 2007-02-22 | Kurabe Ind Co Ltd | パッキン |
JP2010084927A (ja) * | 2008-10-02 | 2010-04-15 | Espec Corp | ガスケット |
JP2010256311A (ja) * | 2009-04-28 | 2010-11-11 | Espec Corp | 試験方法及び試験装置 |
JP2010276620A (ja) * | 2010-09-14 | 2010-12-09 | Espec Corp | 密閉構造及び冷熱衝撃装置 |
JP2013170956A (ja) * | 2012-02-22 | 2013-09-02 | Espec Corp | 環境試験装置 |
JP2014232078A (ja) * | 2013-05-30 | 2014-12-11 | エスペック株式会社 | 環境試験装置及びパッキン |
JP2015146349A (ja) * | 2014-01-31 | 2015-08-13 | シンフォニアテクノロジー株式会社 | Efem |
JP2016137151A (ja) * | 2015-01-28 | 2016-08-04 | 株式会社東芝 | 密閉部材及び磁気共鳴イメージング装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4829158A (en) * | 1988-01-06 | 1989-05-09 | Sunbeam Corporation | Portable electric oven utilizing recirculating high speed air for cooking |
JPH10129258A (ja) | 1996-10-31 | 1998-05-19 | Nishikawa Rubber Co Ltd | ウェザストリップ |
US20040099332A1 (en) * | 2002-11-26 | 2004-05-27 | Kieck Timothy Adam | Appliance for the universal storage of baked goods with a built in vacuum pump |
JP4101248B2 (ja) * | 2004-04-16 | 2008-06-18 | キヤノン株式会社 | プロセスカートリッジの再生産方法 |
JP2007157678A (ja) * | 2005-05-23 | 2007-06-21 | Matsushita Electric Ind Co Ltd | ラミネート電池の安全機構 |
JP4936730B2 (ja) | 2006-01-16 | 2012-05-23 | 東京エレクトロン株式会社 | 減圧容器および減圧処理装置 |
JP5779957B2 (ja) * | 2011-04-20 | 2015-09-16 | 東京エレクトロン株式会社 | ローディングユニット及び処理システム |
US20150311100A1 (en) * | 2014-04-23 | 2015-10-29 | Tdk Corporation | Load port unit and efem system |
DE202014102002U1 (de) * | 2014-04-29 | 2015-07-31 | Zumtobel Lighting Gmbh | Dichtung |
JP2016178133A (ja) * | 2015-03-19 | 2016-10-06 | シンフォニアテクノロジー株式会社 | ドア開閉装置、搬送装置、ソータ装置、収納容器のドッキング方法 |
US20170224431A1 (en) * | 2015-05-05 | 2017-08-10 | beteSTRONGCASES, LLC | Medical Device Case |
TWI708309B (zh) * | 2015-08-04 | 2020-10-21 | 日商昕芙旎雅股份有限公司 | 門開閉系統及具備門開閉系統之載入埠 |
JP6632403B2 (ja) * | 2016-02-02 | 2020-01-22 | 東京エレクトロン株式会社 | 基板収納容器の連結機構および連結方法 |
JP2017166208A (ja) * | 2016-03-16 | 2017-09-21 | 株式会社神戸製鋼所 | 建設機械 |
-
2018
- 2018-03-15 JP JP2018048421A patent/JP7132483B2/ja active Active
- 2018-08-17 TW TW107128713A patent/TWI785096B/zh active
-
2019
- 2019-03-13 CN CN201980019550.9A patent/CN111989512B/zh active Active
- 2019-03-13 WO PCT/JP2019/010351 patent/WO2019177047A1/ja active Application Filing
- 2019-03-13 US US16/980,638 patent/US12055220B2/en active Active
- 2019-03-13 KR KR1020207026452A patent/KR20200130305A/ko not_active Application Discontinuation
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007046657A (ja) * | 2005-08-08 | 2007-02-22 | Kurabe Ind Co Ltd | パッキン |
JP2010084927A (ja) * | 2008-10-02 | 2010-04-15 | Espec Corp | ガスケット |
JP2010256311A (ja) * | 2009-04-28 | 2010-11-11 | Espec Corp | 試験方法及び試験装置 |
JP2010276620A (ja) * | 2010-09-14 | 2010-12-09 | Espec Corp | 密閉構造及び冷熱衝撃装置 |
JP2013170956A (ja) * | 2012-02-22 | 2013-09-02 | Espec Corp | 環境試験装置 |
JP2014232078A (ja) * | 2013-05-30 | 2014-12-11 | エスペック株式会社 | 環境試験装置及びパッキン |
JP2015146349A (ja) * | 2014-01-31 | 2015-08-13 | シンフォニアテクノロジー株式会社 | Efem |
JP2016137151A (ja) * | 2015-01-28 | 2016-08-04 | 株式会社東芝 | 密閉部材及び磁気共鳴イメージング装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20200130305A (ko) | 2020-11-18 |
CN111989512A (zh) | 2020-11-24 |
CN111989512B (zh) | 2024-03-26 |
WO2019177047A1 (ja) | 2019-09-19 |
US20210010598A1 (en) | 2021-01-14 |
TW201939651A (zh) | 2019-10-01 |
JP7132483B2 (ja) | 2022-09-07 |
US12055220B2 (en) | 2024-08-06 |
TWI785096B (zh) | 2022-12-01 |
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